Page 1
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HN200209
Issued Date : 2000.11.01
Revised Date : 2002.10.25
Page No. : 1/3
HMBTA94
PNP EPITAXIAL PLANAR TRANSISTOR
Description
The HMBTA94 is designed for application that requires high voltage.
Features
• High Breakdown Voltage: VCEO=400(Min.) at IC=1mA
• Complementary to HMBTA44
Absolute Maximum Ratings
• Maximum Temperatures
Stor age Temperature............................................................................................ -55 ~ +150 °C
Junction Temperature.................................................................................... +150 °C Maximum
SOT-23
• Maximum Power Dissipation
Total Power Dissipation (Ta=25°C)................................................................................ 350 mW
• Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage...................................................................................... -400 V
VCEO Collector to Emitter Voltage................................................................................... -400 V
VEBO Emitter to Base Voltage............................................................................................. -6 V
IC Collector Current ...................................................................................................... -150 mA
Characteristics (Ta=25°C)
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO -400 - - V IC=-100uA, IE=0
BVCEO -400 - - V IC=-1mA, IB=0
BVEBO -6 - - V IE=-10uA, IC=0
ICBO - - -100 nA VCB=-400V, IE=0
IEBO - - -100 nA VEB=-6V, IC=0
ICES - - -500 nA VCE=-400V, VBE=0
*VCE(sat)1 - - -200 mV IC=-1mA, IB=-0.1mA
*VCE(sat)2 - - -300 mV IC=-10mA, IB=-1mA
*VCE(sat)3 - - -600 mV IC=-50mA, IB=-5mA
*VBE(sat) - - -900 mV IC=-10mA, IB=-1mA
*hFE1 50 - - VCE=-10V, IC=-1mA
*hFE2 75 - 200 VCE=-10V, IC=-10mA
*hFE3 60 - - VCE=-10V, IC=-50mA
*hFE4 40 - - VCE=-10V, IC=-100mA
Cob - 4 6 pF VCE=-10V, f=1MHz
*Pulse T est: Pulse Width ≤380us, Duty Cycle≤2%
HMBTA94 HSMC Product Specification
Page 2
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HN200209
Issued Date : 2000.11.01
Revised Date : 2002.10.25
Page No. : 2/3
1000
125oC
100
hFE
10
25oC
hFE @ VCE=3V
1
1 10 100 1000
75oC
Collector Current-IC (mA)
Sat urati on Volt age & Collector Current
1000
Current Gain & Collector Current
100
CE(sat)
V
@ IC=10I
25oC
B
75oC
125oC
1000
Current Gain & Collector Current
hFE @ VCE=10V
75oC
125oC
100
hFE
10
1 10 100 1000
1000
Saturation Vol tage & C ollector Cur rent
25oC
Collector Current-IC (mA)
25oC
125oC
75oC
BE(sat)
V
@ IC=10I
B
Saturat ion Volta ge ( m V)
10
1 10 100 1000
Collector Current-I
C
(mA)
Capacitance & R everse-Biased Vol tage
100
10
Capacitance (pF)
1
0.1 1 10 100
Cob
Reverse-Biase d Vol tage (V)
Saturat ion Volta ge ( m V)
100
1 10 100 1000
Collector Current-IC (mA)
HMBTA94 HSMC Product Specification
Page 3
HI-SINCERITY
MICROELECTRONICS CORP.
SOT-23 Dimension
Spec. No. : HN200209
Issued Date : 2000.11.01
Revised Date : 2002.10.25
Page No. : 3/3
A
L
3
B
S
21
GV
3-Lead SOT-23 Plastic
Surface Mounted Package
HSMC Package Code: N
4 Z
Rank Code
Control Code
C
JK
DIM
Style: Pin 1.Base 2.Emitter 3.Collector
*: Typical
Min. Max. Min. Max.
DIM
D
H
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
A 0.1102 0.1204 2.80 3.04 J 0.0034 0.0070 0.085 0.177
B 0.0472 0.0630 1.20 1.60 K 0.0128 0.0266 0.32 0.67
C 0.0335 0.0512 0.89 1.30 L 0.0335 0.0453 0.85 1.15
D 0.0118 0.0197 0.30 0.50 S 0.0830 0.1083 2.10 2.75
G 0.0669 0.0910 1.70 2.30 V 0.0098 0.0256 0.25 0.65
H 0.0005 0.0040 0.013 0.10
Marking:
Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec . 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HMBTA94 HSMC Product Specification
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