Page 1
HI-SINCERITY
MICROELECTRONICS CORP.
HMBTA13
NPN EPITAXIAL PLANAR TRANSISTOR
Description
Darlington Amplifier Transistor
Spec. No. : HE6842
Issued Date : 1994.07.29
Revised Date : 2002.12.27
Page No. : 1/4
Absolute Maximum Ratings
• Maximum Temperatures
Storage Temperatur e........................................................................................... -55 ~ +150 °C
Junction Temperature.................................................................................... +150 °C Maximum
• Maximum Power Dissipation
Total Power Dissipation (Ta=25°C)............................................................................... 225 mW
• Thermal Resistance
Junction To Ambient Rθja............................................................................................ 556
• Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage......................................................................................... 30 V
VCES Collector to Emitter Voltage...................................................................................... 30 V
VEBO Emitter to Base Voltage............................................................................................ 10 V
IC Collector Current........................................................................................................ 300 mA
SOT-23
o
Characteristics (Ta=25°C)
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO 30 - - V IC=100uA
BVCES 30 - - V IC=100uA
BVEBO 10 - - V IE=10uA
ICBO - - 100 nA VCB=30V
IEBO - - 100 nA VEB=10V
*VCE(sat) - - 1.5 V IC=100mA, IB=0.1mA
VBE(on) - - 2.0 V VCE=5V, IC=100mA
*hFE1 5K - - VCE=5V, IC=10mA
*hFE2 10K - - VCE=5V, IC=100mA
fT 125 - - MHz VCE=5V, IC=10mA, f=100MHz
Cob - - 6 pF VCB=10V, f=1MHz
*Pulse T est: Pulse Width ≤380us, Duty Cycle≤2%
C/W
HMBTA13 HSMC Product Specification
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HI-SINCERITY
V
V
V
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE6842
Issued Date : 1994.07.29
Revised Date : 2002.12.27
Page No. : 2/4
1000k
hFE @ VCE=5
100k
hFE
10k
0.1 1 10 100 1000
Collector Current (mA)
On Voltage & Collect or Cu rren t
10000
Curren t Gain & Collector C urrent
10000
Sat uration Voltage & Collector Current
1000
Saturation Voltage (mV)
100
1 10 100 1000
10
BE(sat)
V
@ IC=1000I
Collector Current (mA)
CE(sat)
V
B
@ IC=1000I
Capacitance & Rev erse-Biased Voltage
B
1000
On Voltage (m V)
100
0.1 1 10 100 1000
1000
100
Cutoff Frequence (MHz)
Cutoff Frequency & Col lector Current
BE(on)
V
@ VCE=5
Collector Current (mA)
VCE=5
Capacitan ce (pF)
1
1 10 100
Reverse-Biase d Vol tage (V)
Cob
Safe Operating Area
10000
PT=1ms
1000
PT=100ms
100
PT=1s
Collector Current (mA)
10
10
1 10 100 1000
Collector Current (mA)
1
1 10 100
Forwar d Voltage ( V)
HMBTA13 HSMC Product Specification
Page 3
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6842
Issued Date : 1994.07.29
Revised Date : 2002.12.27
Page No. : 3/4
250
200
150
100
Power Diss ipat io n-PD (m W )
50
0
0 50 100 150 200
Power Derating Curve
Ambient Temperature-T a (oC)
HMBTA13 HSMC Product Specification
Page 4
HI-SINCERITY
MICROELECTRONICS CORP.
SOT-23 Dimension
Spec. No. : HE6842
Issued Date : 1994.07.29
Revised Date : 2002.12.27
Page No. : 4/4
A
L
3
B
S
21
GV
3-Lead SOT-23 Plastic
Surface Mounted Package
HSMC Package Code: N
1 M
Rank Code
Control Code
C
JK
DIM
Style: Pin 1.Base 2.Emitter 3.Collector
*: Typical
Min. Max. Min. Max.
DIM
D
H
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
A 0.1102 0.1204 2.80 3.04 J 0.0034 0.0070 0.085 0.177
B 0.0472 0.0630 1.20 1.60 K 0.0128 0.0266 0.32 0.67
C 0.0335 0.0512 0.89 1.30 L 0.0335 0.0453 0.85 1.15
D 0.0118 0.0197 0.30 0.50 S 0.0830 0.1083 2.10 2.75
G 0.0669 0.0910 1.70 2.30 V 0.0098 0.0256 0.25 0.65
H 0.0005 0.0040 0.013 0.10
Marking:
Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec . 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HMBTA13 HSMC Product Specification
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