Datasheet HMBTA06 Datasheet (HSMC)

HI-SINCERITY

MICROELECTRONICS CORP.

HMBTA06

NPN SILICON TRANSISTOR

Description

Amplifier T ransist or

Spec. No. : HE6840
Issued Date : 1994.07.29
Revised Date : 2002.10.25
Page No. : 1/3

Absolute Maximum Ratings

• Maximum Temperatures

Storage Temperatur e........................................................................................... -55 ~ +150 °C

Junction Temperature.................................................................................... +150 °C Maximum

• Maximum Power Dissipation

Total Power Dissipation (Ta=25°C)............................................................................... 225 mW

• Maximum Voltages and Currents (Ta=25°C)

VCBO Collector to Base Voltage......................................................................................... 80 V

VCEO Collector to Emitter Voltage...................................................................................... 80 V

VEBO Emitter to Base Voltage.............................................................................................. 4 V

IC Collector Current........................................................................................................ 500 mA

SOT-23

Characteristics (Ta=25°C)

Symbol Min. Typ. Max. Unit Test Conditions

BVCBO 80 - - V IC=100uA
BVCEO 80 - - V IC=1mA
BVEBO 4 - - V IE=100uA

ICBO - - 100 nA VCB=80V
ICEO - - 100 nA VCE=60V

*VCE(sat) - - 0.25 V IC=100mA, IB=10mA

VBE(on) - - 1.2 V IC=100mA, VCE=1V

*hFE1 50 - - IC=10mA, VCE=1V
*hFE2 50 - - IC=100mA, VCE=1V

fT 100 - - MHz IC=10mA, VCE=2V, f=100MHz

*Pulse T est: Pulse Width ≤380us, Duty Cycle≤2%

HMBTA06 HSMC Product Specification

HI-SINCERITY

MICROELECTRONICS CORP.

Characteristics Curve

Spec. No. : HE6840
Issued Date : 1994.07.29
Revised Date : 2002.10.25
Page No. : 2/3

Curren t Gain & Collector Cur rent

1000

100

hFE

10

0.1 1 10 100 1000

10000

Collector Current (mA)

On Volta ge & Collector Curren t

VCE=1V

1000

100

Satu r ation Vol t age (mV)

CE(sat)

V

@ IC=10I

10

0.1 1 10 100 1000

Collector Current (mA)

Cut o ff Frequency & IC

1000

Sat urati on Voltage & Collector Current

B

1000

On Vo ltage ( mV)

100

0.1 1 10 100 1000

100

10

Capacitan ce ( p F)

Capacitance & Reverse-B iased Voltage

Collector Current (mA)

Cob

BE(on)

V

@ VCE=1V

VCE=2V

100

Cutoff Frequency (MHz)

10

1 10 100 1000

Collector Current (mA)

Safe Operati ng Area

10000

PT=1ms

1000

PT=100ms

100

Collector Current (mA)

10

PT=1s

1

0.1 1 10 100 1000

Reverse Biased Vol t age (V)

1

1 10 100

Forwar d Voltage (V)

HMBTA06 HSMC Product Specification

HI-SINCERITY

MICROELECTRONICS CORP.

SOT-23 Dimension

Spec. No. : HE6840
Issued Date : 1994.07.29
Revised Date : 2002.10.25
Page No. : 3/3

A

Marking:

L

3

B

S

21

GV

3-Lead SOT-23 Plastic

Surface Mounted Package

HSMC Package Code: N

1 G

Rank Code

Control Code

C

JK

DIM

Style: Pin 1.Base 2.Emitter 3.Collector

*: Typical

Min. Max. Min. Max.

DIM

D

H

Inches Millimeters Inches Millimeters

Min. Max. Min. Max.
A 0.1102 0.1204 2.80 3.04 J 0.0034 0.0070 0.085 0.177
B 0.0472 0.0630 1.20 1.60 K 0.0128 0.0266 0.32 0.67
C 0.0335 0.0512 0.89 1.30 L 0.0335 0.0453 0.85 1.15
D 0.0118 0.0197 0.30 0.50 S 0.0830 0.1083 2.10 2.75
G 0.0669 0.0910 1.70 2.30 V 0.0098 0.0256 0.25 0.65
H 0.0005 0.0040 0.013 0.10

Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.

Material:

• Lead: 42 Alloy; solder plating

• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0

2.Controlling dimension: millimeters.

3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.

4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.

• HSMC reserves the right to make changes to its products without notice.

• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.

Head Office And Factory:

• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec . 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: [phone] Fax: [phone]

• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: [phone]~5 Fax: [phone]

HMBTA06 HSMC Product Specification