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HI-SINCERITY
MICROELECTRONICS CORP.
HMBT8599
PNP EPITAXIAL PLANAR TRANSISTOR
Description
Amplifier T ransist or
Spec. No. : HE6811
Issued Date : 1997.12.31
Revised Date : 2002.10.25
Page No. : 1/3
Absolute Maximum Ratings
• Maximum Temperatures
Storage Temperatur e........................................................................................... -55 ~ +150 °C
Junction Temperature.................................................................................... +150 °C Maximum
• Maximum Power Dissipation
Total Power Dissipation (Ta=25°C)............................................................................... 225 mW
• Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage........................................................................................ -80 V
VCEO Collector to Emitter Voltage..................................................................................... -80 V
VEBO Emitter to Base Voltage............................................................................................. -5 V
IC Collector Current ...................................................................................................... -500 mA
SOT-23
Characteristics (Ta=25°C)
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO -80 - - V IC=-100uA
BVCEO -80 - - V IC=-10mA
BVEBO 5 - - V IE=-10uA
ICBO - - -100 nA VCB=-80V
ICEO - - -100 nA VCE=-60V
IEBO - - -100 nA VEB=-4V
*VCE(sat)1 - - -400 mV IC=-100mA, IB=-5mA
*VCE(sat)2 - - -300 mV IC=-100mA, IB=-10mA
VBE(on) -600 - -800 mV VCE=-5V, IC=-10mA
*hFE1 100 - 300 VCE=-5V, IC=-1mA
*hFE2 100 - - VCE=-5V, IC=-10mA
*hFE3 75 - - VCE=-5V, IC=-100mA
fT 150 - - MHz VCE=-5V, IC=-10mA
Cob - - 4.5 pF VCB=-10V, f=1MHz
*Pulse T est: Pulse Width ≤380us, Duty Cycle≤2%
HMBT8599 HSMC Product Specification
Page 2
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE6811
Issued Date : 1997.12.31
Revised Date : 2002.10.25
Page No. : 2/3
1000
Cur rent Gain & Collect or Curr ent
100
hFE
10
0.1 1 10 100 1000
100
Capacitance & Reverse-Bia sed Voltage
VCE=10V
Collector Current (mA)
10000
1000
BE(sat)
V
100
Saturation Voltage (mV)
10
0.1 1 10 100 1000
Collector Curren t (mA)
@ IC=10I
B
CE(sat)
V
@ IC=10I
Cutoff Frequen cy & Collector C urrent
1000
Sat uration Vol tage & C ol lector C urrent
B
10
Capacitan ce (pF)
1
0.1 1 10 100
Cob
Reverse Biased Vol t ag e ( V)
On Voltage Collect or Cu rrent
10
1
BE(on)
V
On Voltage ( V)
@ VCE=5V
VCE=20V
100
Cutoff Frequency (MHz)
10
1 10 100
Collector Curren t (mA)
Safe Operati ng Area
10000
PT=1ms
PT=100ms
1000
(mA)
C
Collector Curren t- I
PT=1s
100
10
0.1
1 10 100 1000
Collector Current (mA)
1
1 10 100
Forwar d Biased Vol tage-VCE (V)
HMBT8599 HSMC Product Specification
Page 3
HI-SINCERITY
MICROELECTRONICS CORP.
SOT-23 Dimension
Spec. No. : HE6811
Issued Date : 1997.12.31
Revised Date : 2002.10.25
Page No. : 3/3
A
L
3
B
S
21
GV
3-Lead SOT-23 Plastic
Surface Mounted Package
HSMC Package Code: N
2 W
Rank Code
Control Code
C
JK
DIM
Style: Pin 1.Base 2.Emitter 3.Collector
*: Typical
Min. Max. Min. Max.
DIM
D
H
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
A 0.1102 0.1204 2.80 3.04 J 0.0034 0.0070 0.085 0.177
B 0.0472 0.0630 1.20 1.60 K 0.0128 0.0266 0.32 0.67
C 0.0335 0.0512 0.89 1.30 L 0.0335 0.0453 0.85 1.15
D 0.0118 0.0197 0.30 0.50 S 0.0830 0.1083 2.10 2.75
G 0.0669 0.0910 1.70 2.30 V 0.0098 0.0256 0.25 0.65
H 0.0005 0.0040 0.013 0.10
Marking:
Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec . 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HMBT8599 HSMC Product Specification
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