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HI-SINCERITY
MICROELECTRONICS CORP.
HMBT8099
NPN EPITAXIAL PLANAR TRANSISTOR
Description
Amplifier T ransist or
Spec. No. : HE6826
Issued Date : 1993.10.27
Revised Date : 2002.10.25
Page No. : 1/3
Absolute Maximum Ratings
• Maximum Temperatures
Storage Temperatur e........................................................................................... -55 ~ +150 °C
Junction Temperature.................................................................................... +150 °C Maximum
• Maximum Power Dissipation
Total Power Dissipation (Ta=25°C)............................................................................... 225 mW
• Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage......................................................................................... 80 V
VCEO Collector to Emitter Voltage...................................................................................... 80 V
VEBO Emitter to Base Voltage.............................................................................................. 6 V
IC Collector Current ....................................................................................................... 500 mA
SOT-23
Characteristics (Ta=25°C)
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO 80 - - V IC=100uA
BVCEO 80 - - V IC=10mA
BVEBO 6 - - V IE=10uA
ICBO - - 100 nA VCB=80V
ICEO - - 100 nA VCE=60V
IEBO - - 100 nA VEB=6V
*VCE(sat)1 - - 400 mV IC=100mA, IB=5mA
*VCE(sat)2 - - 300 mV IC=100mA, IB=10mA
VBE(on) 600 - 800 mV VCE=5V, IC=10mA
*hFE1 100 - 300 VCE=5V, IC=1mA
*hFE2 100 - - VCE=5V, IC=10mA
*hFE3 75 - - VCE=5V, IC=100mA
fT 150 - - VCE=5V, IC=10mA
Cob - - 6 pF VCB=5V, f=1MHz, IE=0
*Pulse T est: Pulse Width ≤380us, Duty Cycle≤2%
HMBT8099 HSMC Product Specification
Page 2
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE6826
Issued Date : 1993.10.27
Revised Date : 2002.10.25
Page No. : 2/3
1000
100
hFE
10
0.1 1 10 100 1000
10000
Cu rr ent Gain & Col lector Curre nt
Collector Current (mA)
On Vol tage & Collect or Current
1000
CE(sat)
100
Saturation Voltage (mV)
10
0.1 1 10 100 1000
V
Collector Current (mA)
@ IC=20I
B
CE(sat)
V
@ IC=10I
Cutoff Frequency & Collector Current
1000
VCE=5V
Sat urati on Voltage & Collector Current
B
1000
On Voltage (mV)
100
0.1 1 10 100 1000
Collector Current (mA)
100
10
Capacitanc e ( pF)
Capacitan ce & Reverse- Biased Voltage
BE(on)
V
@ VCE=5V
Cob
100
Cutoff Frequency (MHz)
10
1 10 100 1000
Collector Curren t (mA)
Safe Operating Area
10000
PT=1ms
1000
PT=100ms
100
Collector Current (mA)
10
PT=1s
1
0.1 1 10 100
Reverse- Biased Vol t age ( V)
1
1 10 100
Forwar d Vol t a ge- VCE (V)
HMBT8099 HSMC Product Specification
Page 3
HI-SINCERITY
MICROELECTRONICS CORP.
SOT-23 Dimension
Spec. No. : HE6826
Issued Date : 1993.10.27
Revised Date : 2002.10.25
Page No. : 3/3
A
L
3
B
S
21
GV
3-Lead SOT-23 Plastic
Surface Mounted Package
HSMC Package Code: N
K B
Rank Code
Control Code
C
JK
DIM
Style: Pin 1.Base 2.Emitter 3.Collector
*: Typical
Min. Max. Min. Max.
DIM
D
H
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
A 0.1102 0.1204 2.80 3.04 J 0.0034 0.0070 0.085 0.177
B 0.0472 0.0630 1.20 1.60 K 0.0128 0.0266 0.32 0.67
C 0.0335 0.0512 0.89 1.30 L 0.0335 0.0453 0.85 1.15
D 0.0118 0.0197 0.30 0.50 S 0.0830 0.1083 2.10 2.75
G 0.0669 0.0910 1.70 2.30 V 0.0098 0.0256 0.25 0.65
H 0.0005 0.0040 0.013 0.10
Marking:
Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec . 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HMBT8099 HSMC Product Specification
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