Page 1
HI-SINCERITY
MICROELECTRONICS CORP.
HMBT6429
NPN EPITAXIAL PLANAR TRANSISTOR
Description
Amplifier T ransist or
Spec. No. : HE6810
Issued Date : 1998.07.01
Revised Date : 2002.10.25
Page No. : 1/3
Absolute Maximum Ratings
• Maximum Temperatures
Stor age Temperature............................................................................................ -55 ~ +150 °C
Junction Temperature.................................................................................... +150 °C Maximum
• Maximum Power Dissipation
Total Power Dissipation (Ta=25°C)................................................................................ 225 mW
• Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage......................................................................................... 55 V
VCEO Collector to Emitter Voltage...................................................................................... 45 V
VEBO Emitter to Base Voltage.............................................................................................. 6 V
IC Collector Current........................................................................................................ 200 mA
SOT-23
Characteristics (Ta=25°C)
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO 55 - - V IC=100uA
BVCEO 45 - - V IC=1mA
ICBO - - 10 nA VCB=30V
ICEO - - 100 nA VCE=30V
IEBO - - 10 nA VEB=5V
*VCE(sat)1 - - 200 mV IC=10mA, IB=0.5mA
*VCE(sat)2 - - 600 mV IC=100mA, IB=5mA
VBE(on) 560 - 660 mV VCE=5V, IC=1mA
*hFE1 500 - - VCE=5V, IC=0.01mA
*hFE2 500 - 1250 VCE=5V, IC=0.1mA
*hFE3 500 - - VCE=5V, IC=1mA
*hFE4 500 - - VCE=5V, IC=10mA
fT 100 - 700 MHz VCE=5V, IC=1mA, f=100MHz
Cob - - 3.0 pF VCB=10V, f=1MHz
*Pulse T est: Pulse Width ≤380us, Duty Cycle≤2%
HMBT6429 HSMC Product Specification
Page 2
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE6810
Issued Date : 1998.07.01
Revised Date : 2002.10.25
Page No. : 2/3
1000
100
hFE
10
0.1 1 10 100 1000
Current Gain & Collector Current
hFE @ VCE=5V
Collector Current ( m A )
Cut off Frequ ency & Coll ect or Current
1000
10000
1000
100
CE(sat)
V
@ IC=20I
Satu r ation Volt ag e ( mV)
10
1
0.1 1 10 100 1000
Collect o r Current (mA)
On Voltage & C ollector Current
10000
Sat urati on Voltage & Collector Curr ent
B
fT
100
Cutoff Frequency (MHz)
10
1 10 100
Collector Current (mA)
Capacitance & Reverse-Biased Voltage
10
Capacitance (PF)
Cob
1000
On Voltage (m V)
100
0.1 1 10 100 1000
BE(on)
V
@ VCE=5V
Collector Current ( mA)
Safe Operating Area
10000
PT=1ms
1000
PT=100ms
PT=1s
100
Collector Current ( m A )
10
1
0.1 1 10 100
Reverse Biased Volt ag e ( V)
1
1 10 100
Forwar d Voltage (V)
HMBT6429 HSMC Product Specification
Page 3
HI-SINCERITY
MICROELECTRONICS CORP.
SOT-23 Dimension
Spec. No. : HE6810
Issued Date : 1998.07.01
Revised Date : 2002.10.25
Page No. : 3/3
A
Marking:
L
3
B
S
21
GV
3-Lead SOT-23 Plastic
Surface Mounted Package
HSMC Package Code: N
1 L
Rank Code
Control Code
C
JK
DIM
Style: Pin 1.Base 2.Emitter 3.Collector
*: Typical
Min. Max. Min. Max.
DIM
D
H
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
A 0.1102 0.1204 2.80 3.04 J 0.0034 0.0070 0.085 0.177
B 0.0472 0.0630 1.20 1.60 K 0.0128 0.0266 0.32 0.67
C 0.0335 0.0512 0.89 1.30 L 0.0335 0.0453 0.85 1.15
D 0.0118 0.0197 0.30 0.50 S 0.0830 0.1083 2.10 2.75
G 0.0669 0.0910 1.70 2.30 V 0.0098 0.0256 0.25 0.65
H 0.0005 0.0040 0.013 0.10
Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec . 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HMBT6429 HSMC Product Specification
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