Page 1
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6819
Issued Date : 1993.06.30
Revised Date : 2002.10.25
Page No. : 1/3
HMBT5401
PNP EPITAXIAL PLANAR TRANSISTOR
Description
The HMBT5401 is designed for general purpose applications
requiring high breakdown voltages.
SOT-23
Features
• High Collector-Emitter Breakdown Voltage (BVCEO=150V@ IC=1mA)
• Complements to NPN Type HMBT5551
Absolute Maximum Ratings
• Maximum Temperatures
Stor age Temperature............................................................................................ -55 ~ +150 °C
Junction Temperature.................................................................................... +150 °C Maximum
• Maximum Power Dissipation
Total Power Dissipation (Ta=25°C)................................................................................ 225 mW
• Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage...................................................................................... -160 V
VCEO Collector to Emitter Voltage................................................................................... -150 V
VEBO Emitter to Base Voltage............................................................................................. -5 V
IC Collector Current....................................................................................................... -600 mA
Characteristics (Ta=25°C)
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO -160 - - V IC=-100uA
BVCEO -150 - - V IC=-1mA
BVEBO -5 - - V IE=-10uA
ICBO - - -50 nA VCB=-120V
*VCE(sat)1 - - -200 mV IC=-10mA, IB=-1mA
*VCE(sat)2 - - -500 mV IC=-50mA, IB=-5mA
*VBE(sat)1 - - -1 V IC=-10mA, IB=-1mA
*VBE(sat)2 - - -1 V IC=-50mA, IB=-5mA
*hFE1 50 - - VCE=-5V, IC=-1mA
*hFE2 60 - 240 VCE=-5V, IC=-10mA
*hFE3 50 - - VCE=-5V, IC=-50mA
fT 100 - 300 MHz VCE=-10V, IC=-10mA, f=100MHz
Cob - - 6 pF VCB=-10V, f=1MHZ
*Pulse T est: Pulse Width ≤380us, Duty Cycle≤2%
HMBT5401 HSMC Product Specification
Page 2
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE6819
Issued Date : 1993.06.30
Revised Date : 2002.10.25
Page No. : 2/3
1000
Current Gain & Coll ector Current
125oC
100
hFE
10
1
1000
25oC
75oC
hFE @ VCE=5V
1 10 100 1000
Collec tor Current-IC (mA)
Sat urati on Voltage & C ol lector C urrent
25oC
100000
Saturation Voltage & Col lector Current
CE(sat)
V
10000
1000
Saturation Voltage (mV)
100
10
0.1 1 10 100 1000
100
Capacitance & Reverse-Biased Volt age
B
@ IC=10I
125oC
Collector Current-IC (mA)
75oC
25oC
75oC
125oC
BE(sat)
V
Saturat ion Volta ge ( m V)
100
0.1 1 10 100 1000
Collector Current-IC (mA)
@ IC=10I
Cutoff Frequency & Collector Current
1000
100
Cutoff Fr eque ncy (M Hz)...
VCE=10V
10
`
Capacitance (p F)
B
Cob
1
0.1 1 10 100
Reverse Biased Vol t age (V)
10
1 10 100
Collector Curren t (mA)
HMBT5401 HSMC Product Specification
Page 3
HI-SINCERITY
MICROELECTRONICS CORP.
SOT-23 Dimension
Spec. No. : HE6819
Issued Date : 1993.06.30
Revised Date : 2002.10.25
Page No. : 3/3
A
L
3
B
S
21
GV
3-Lead SOT-23 Plastic
Surface Mounted Package
HSMC Package Code: N
2 L
Rank Code
Control Code
C
JK
DIM
Style: Pin 1.Base 2.Emitter 3.Collector
*: Typical
Min. Max. Min. Max.
DIM
D
H
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
A 0.1102 0.1204 2.80 3.04 J 0.0034 0.0070 0.085 0.177
B 0.0472 0.0630 1.20 1.60 K 0.0128 0.0266 0.32 0.67
C 0.0335 0.0512 0.89 1.30 L 0.0335 0.0453 0.85 1.15
D 0.0118 0.0197 0.30 0.50 S 0.0830 0.1083 2.10 2.75
G 0.0669 0.0910 1.70 2.30 V 0.0098 0.0256 0.25 0.65
H 0.0005 0.0040 0.013 0.10
Marking:
Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec . 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HMBT5401 HSMC Product Specification
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