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HI-SINCERITY
MICROELECTRONICS CORP.
HMBT5089
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The HMBT5089 is designe d for low noise, high g ain, ge neral pur pose
amplifier applicati ons.
Spec. No. : HE6816
Issued Date : 1993.08.26
Revised Date : 2002.10.25
Page No. : 1/3
Absolute Maximum Ratings
• Maximum Temperatures
Storage Temperatur e........................................................................................... -55 ~ +150 °C
Junction Temperature.................................................................................... +150 °C Maximum
• Maximum Power Dissipation
Total Power Dissipation (Ta=25°C)............................................................................... 225 mW
• Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage......................................................................................... 30 V
VCEO Collector to Emitter Voltage...................................................................................... 25 V
VEBO Emitter to Base Voltage........................................................................................... 4.5 V
IC Collector Current ......................................................................................................... 50 mA
SOT-23
Characteristics (Ta=25°C)
Symbol Min. Typ. Max. Unit Test Co nditions
BVCBO 30 - - V IC=100uA
BVCEO 25 - - V IC=1mA
BVEBO 4.5 - - V IE=10uA
ICBO - - 50 nA VCB=15V
IEBO - - 100 nA VEB=4.5V
*VCE(sat) - - 500 mV IC=10mA, IB=1mA
*VBE(sat) - - 800 mV IC=10mA, IB=1mA
*hFE1 400 - 1200 VCE=5V, IC=0.1mA
*hFE2 450 - - VCE=5V, IC=1mA
*hFE3 400 - - VCE=5V, IC=10mA
fT 50 - - MHz VCE=5V, IC=0.5mA, f=20MHz
Cob - - 4.0 pF VCB=5V, f=1MHz
*Pulse T est: Pulse Width ≤380us, Duty Cycle≤2%
HMBT5089 HSMC Product Specification
Page 2
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE6816
Issued Date : 1993.08.26
Revised Date : 2002.10.25
Page No. : 2/3
1000
100
Current Gain-hFE
10
1
0.1 1 10 100 1000 10000
10000
Current Gain & Collector Current
hFE @ VCE=5V
Collector Current-IC (mA)
On Voltage & Collector Current
10000
1000
100
Saturation Voltage (mV)
10
0.1 1 10 100 1000 10000
10
Satu r ation Vol tage & Coll ector Cu r r e nt
V
@ IC=10I
CE(s at)
Colle ctor Curren t -IC (mA)
Capacitan ce & R evers e- Biased Vol tage
Cob
B
1000
V
BE(on)
On Voltage (mV)
100
0.1 1 10 100 1000 10000
Collector Current-IC (mA)
@ VCE=5V
Cutoff Frequency & Collector Current
1000
VCE=5
V
100
Cutoff Frequence (MHz)
1
Capacitance (pF)
0.1
0.1 1 10 100
10000
1000
100
Collector Current (mA)
10
Reverse-Biased Voltage (V)
Safe Operatin g Ar e a
PT=1ms
PT=100ms
PT=1s
10
110100
Colle ctor Curren t -IC (mA)
1
110100
Forward Voltage (v)
HMBT5089 HSMC Product Specification
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HI-SINCERITY
MICROELECTRONICS CORP.
SOT-23 Dimension
Spec. No. : HE6816
Issued Date : 1993.08.26
Revised Date : 2002.10.25
Page No. : 3/3
A
L
3
B
S
21
GV
3-Lead SOT-23 Plastic
Surface Mounted Package
HSMC Package Code: N
1 R
Rank Code
Control Code
C
JK
DIM
Style: Pin 1.Base 2.Emitter 3.Collector
Min. Max. Min. Max.
DIM
D
H
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
A 0.1102 0.1204 2.80 3.04 J 0.0034 0.0070 0.085 0.177
B 0.0472 0.0630 1.20 1.60 K 0.0128 0.0266 0.32 0.67
C 0.0335 0.0512 0.89 1.30 L 0.0335 0.0453 0.85 1.15
D 0.0118 0.0197 0.30 0.50 S 0.0830 0.1083 2.10 2.75
G 0.0669 0.0910 1.70 2.30 V 0.0098 0.0256 0.25 0.65
H 0.0005 0.0040 0.013 0.10
Marking:
Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
*: Typical
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec . 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HMBT5089 HSMC Product Specification
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