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HI-SINCERITY
MICROELECTRONICS CORP.
HMBT5087
PNP EPITAXIAL PLANAR TRANSISTOR
Description
The HMBT5087 is designe d for low noise, high g ain, ge neral pur pose
amplifier applicati ons.
Spec. No. : HE6850
Issued Date : 1994.07.29
Revised Date : 2002.10.25
Page No. : 1/3
Absolute Maximum Ratings
• Maximum Temperatures
Storage Temperatur e........................................................................................... -55 ~ +150 °C
Junction Temperature.................................................................................... +150 °C Maximum
• Maximum Power Dissipation
Total Power Dissipation (Ta=25°C)............................................................................... 225 mW
• Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage........................................................................................ -50 V
VCEO Collector to Emitter Voltage..................................................................................... -50 V
VEBO Emitter to Base Voltage.............................................................................................. -3V
IC Collector Current ........................................................................................................ -50 mA
SOT-23
Characteristics (Ta=25°C)
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO -50 - - V IC=-100uA
BVCEO -50 - - V IC=-1mA
BVEBO -3 - - V IE=-10uA
ICBO1 - - -10 nA VCB=-10V
ICBO2 - - -50 nA VCB=-35V
*VCE(sat) - - -300 mV IC=-10mA, IB=-1mA
*VBE(sat) - - -850 mV IC=-10mA, IB=-1mA
*hFE1 250 - 800 VCE=-5V, IC=-0.1mA
*hFE2 250 - - VCE=-5V, IC=-1mA
*hFE3 250 - - VCE=-5V, IC=-10mA
fT 40 - - MHz VCE=-5V, IC=-0.5mA, f=100MHz
Cob - - 4.0 pF VCB=-5V , f=1 00KH z
*Pulse T est: Pulse Width ≤380us, Duty Cycle≤2%
HMBT5087 HSMC Product Specification
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HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE6850
Issued Date : 1994.07.29
Revised Date : 2002.10.25
Page No. : 2/3
1000
HFE
100
0.1 1 10 100
1000
Curr ent Gain & Collec tor Cu rr ent
hFE @ VCE=5V
Collector Current (mA)
On Voltage & Collect or Curr ent
V
@ VCE=5V
BE(on)
1000
100
Saturation Voltage (mV)
10
1 10 100
1000
Satu r at ion Vol t age & Col lecto r Curr ent
V
CE(s at)
@ IC=10I
Collector Current (mA)
Cutoff Frequency & Collector Current
B
On Voltage (mV)
100
0.1 1 10 100
10
Capacitance (pF)
Colle ctor Current (mA)
Capacitan c e & R everse-Biased Voltage
Cob
fT @ VCE=5V
100
Cutoff Frequency (MH z)
10
0.1 1 10 100
10000
1000
100
Collector Current (mA)
10
Collector Current (mA )
Safe Oper ating Ar ea
PT=1ms
PT=100ms
PT=1s
1
1 10 100
Reverse-Biased Voltage (V)
1
110100
Forward Voltage(V)
HMBT5087 HSMC Product Specification
Page 3
HI-SINCERITY
MICROELECTRONICS CORP.
SOT-23 Dimension
Spec. No. : HE6850
Issued Date : 1994.07.29
Revised Date : 2002.10.25
Page No. : 3/3
A
Marking:
L
3
B
S
21
GV
3-Lead SOT-23 Plastic
Surface Mounted Package
HSMC Package Code: N
2 Q
Rank Code
Control Code
C
JK
DIM
Style: Pin 1.Base 2.Emitter 3.Collector
*: Typical
Min. Max. Min. Max.
DIM
D
H
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
A 0.1102 0.1204 2.80 3.04 J 0.0034 0.0070 0.085 0.177
B 0.0472 0.0630 1.20 1.60 K 0.0128 0.0266 0.32 0.67
C 0.0335 0.0512 0.89 1.30 L 0.0335 0.0453 0.85 1.15
D 0.0118 0.0197 0.30 0.50 S 0.0830 0.1083 2.10 2.75
G 0.0669 0.0910 1.70 2.30 V 0.0098 0.0256 0.25 0.65
H 0.0005 0.0040 0.013 0.10
Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec . 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HMBT5087 HSMC Product Specification
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