Datasheet HM3669 Datasheet (HSMC)

HI-SINCERITY

MICROELECTRONICS CORP.

HM3669

NPN EPITAXIAL PLANAR TRANSISTOR

Description

The HM3669 is designed for using in power amplifier applications,
power switching application.

Spec. No. : Preliminary Data
Issued Date : 2000.07.01
Revised Date : 2000.07.01
Page No. : 1/3

Absolute Maximum Ratings

Maximum Temperatures

•

Tstg Storage Temperature .................................................................................... -55 ~ +150 °C

Tj Junction Temperature................................................................................................ +150 °C

Maximum Power Dissipation

•

Total Power Dissipation (Ta=25°C)...................................................................................... 1 W

Maximum Voltages and Currents

•

BVCBO Collector to Base Breakdown Voltage................................................................... 80 V

BVCEO Collector to Emitter Breakdown Voltage................................................................ 80 V

BVEBO Emitter to Base Emitter Breakdown Voltage............................................................ 5 V

IC Collector Current (DC)...................................................................................................... 2 A

Characteristics

Symbol Min. Typ. Max. Unit Test Co nditions

BVCBO 80 - - V IC=100uA
BVCEO 80 - - V IC=10mA
BVEBO 5 - - V IE=100uA

ICBO - - 1000 nA VCB=80V

IEBO - - 1000 nA VEB=5V
*VCE(sat) - 0.15 0.5 V IC=1A, IB=50mA
*VBE(sat) - 0.9 1.2 V IC=1A, IB=50mA

*hFE 300 - - VCE=2V, IC=500mA

fT - 100 - MHz VCE=2V, IC=500mA

Cob - 30 - pF VCB=10V, f=1MHz

Ton - 0.2 - uS

Tstg - 1 - uS

Tf - 0.2 - uS

(Ta=25°C)

(Ta=25°C)

IB1=-IB2=50mA, Duty Cycle1%

*Pulse Test : Pulse Width ≤380us, Duty Cycle≤2%

HSMC Product Specification

HI-SINCERITY

MICROELECTRONICS CORP.

Characteristics Curve

Spec. No. : Preliminary Data
Issued Date : 2000.07.01
Revised Date : 2000.07.01
Page No. : 2/3

10000

1000

100

hFE

10

1

0.1 1 10 100 1000 10000

10000

Current Gain & Collector Current

VCE=10V

Collector Curren t ( mA)

Saturation Voltag e & Collector Current

100000

10000

1000

Satu r ation Voltage ( m V)

100

CE(s at)

V

10

0.1 1 10 100 1000 10000

Collector Curren t ( mA)

Capacitance & Reverse-Biased Voltage

100.0

Saturation Voltage & Collector Curr ent

@ IC=20I

B

1000

BE(sat)

Satu r ation Voltage ( m V)

100

0 1 10 100 1000 10000

V

Collector Curren t ( mA)

@ IC=20I

B

10.0

Capac itance (pF)

1.0

0.1 1.0 10.0 100.0
Reverse Biased Vol tage (V)

Cob

HSMC Product Specification

HI-SINCERITY

MICROELECTRONICS CORP.

SOT-89 Dimension

Spec. No. : Preliminary Data
Issued Date : 2000.07.01
Revised Date : 2000.07.01
Page No. : 3/3

Marking :

C

B

D

321

E

H

HSMC Logo

Date Code

Part Number

Style : Pin 1.Base 2.Collector 3.Emitter

Package Code

I

F

G

A

3-Lead SOT-89 Plastic Surface Mounted Package

HSMC Package Code : M

DIM

Inches Millimeters Inches Millimeters

Min. Max. Min. Max.

DIM

Min. Max. Min. Max.
A 0.1732 0.1811 4.40 4.60 F 0.0583 0.0598 1.48 1.52
B 0.1594 0.1673 4.05 4.25 G 0.1165 0.1197 2.96 3.04
C 0.0591 0.0663 1.50 1.70 H 0.0551 0.0630 1.40 1.60
D 0.0945 0.1024 2.40 2.60 I 0.0138 0.0161 0.35 0.41
E 0.0141 0.0201 0.36 0.51

Notes :

Material :

• Lead : 42 Alloy ; solder plating

• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0

1.Dimension and tolerance based on our Spec. dated May. 05,1996.

2.Controlling dimension : millimeters.

3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.

4.If there is any question with packing specification or packing method, pleas e contact your l ocal HSMC sales office.

*:Typical

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.

• HSMC reserves the right to make changes to its products without notice.

•

HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• HSMC assumes no liability for any consequence of customer product design, infringem ent of pat ents, or applic ati on assistance.

Head Office And Factory :

•

Head Office

Tel : [phone] Fax : [phone]

•

Factory 1 :

Tel : [phone]~5 Fax : [phone]

•

Factory 2 :

Tel : [phone] Fax : [phone]

(Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.

No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C

No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C

HSMC Product Specification