Page 1
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6450
Issued Date : 1992.11.25
Revised Date : 2002.04.18
Page No. : 1/3
HM28S
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The HM28S is a NPN silicon transistor, designed for use in general-purpose
SPEECH SYNTHSIZER (Voice Rom) IC audio output driver stage amplifier
applications.
TO-92
Features
• Excellent hFE Linearity
• High DC Current Gain
• High Power Dissipation
Absolute Maximum Ratings
• Maximum Temperatures
Stora ge Temperature........................................................................................................ -55 ~ +150 °C
Junction Temperature .................................................................................................. 150 °C Maximum
• Maximum Power Dissipation
Total Power Dissipation (Ta=25°C)............................................................................................. 850 mW
• Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage..................................................................................................... 40 V
VCEO Collector to Emitter Voltage ................................................................................................. 20 V
VEBO Emitter to Base Voltage.......................................................................................................... 6 V
IC Collector Current ..................................................................................................................... 1.25 A
IB Base Current ............................................................................................................................. 0.4 A
Characteristics (Ta=25°C)
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO 40 - - V IC=100uA, IE=0
BVCEO 20 - - V IC=1mA, IB=0
BVEBO 6 - - V I E= 100uA, IC=0
ICBO - - 100 nA VCB=35V, IE=0
IEBO - - 100 nA VEB=6V, IC=0
*VCE(sat) - - 0.55 V IC=600mA, IB=2 0mA
*hFE1 290 - - VCE=1V, IC=1mA
*hFE2 300 - 1000 VCE=1V, IC=0.1A
hFE3 300 - - VCE=1V, IC=0.3A
hFE4 300 - - VCE=1V, IC=0.5A
fT 100 - - MHz VCE=10V, IC=50mA, f=1MHz
Cob - 9 - pF VCB=10V, f=1MHz, IE=0
*Pulse T est: Pulse Width ≤380us, Duty Cycle≤2%
Classification of hFE2
Rank B C D
Range 300-550 500-700 650-1000
HM28S HSMC Product Specification
Page 2
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE6450
Issued Date : 1992.11.25
Revised Date : 2002.04.18
Page No. : 2/3
1000
hFE
100
0.1 1 10 100 1000
100
Current Gai n & Collector Current
125oC
75oC
25oC
hFE @ VCE=1V
Collector Current-IC (mA)
Capacitance & Rev erse-Biased Volta ge
1000
Sat urati on Voltage & Col lector Current
CE(sat)
V
100
Satur ation Voltage ( m V)
10
0.1 1 10 100 1000
1000
100
Cut off Fr equency & Collector Current
B
@ IC=30I
75oC
125oC
Collect o r Current- IC (mA)
fT
25oC
10
Capacitance (pF)
1
0.1 1 10 100 1000
10000
1000
(mA)
C
100
Collect or Current - I
10
1
1 10 100
Reverse Biased Volt age (V)
Safe Operating Area
Forwar d Biased Vol tage-VCE (V)
Cob
PT=1ms
PT=100ms
PT=1s
10
Cutoff Frequency (MHz)...
1
1 10 100 1000
Collector Current (mA) -VCE=10V
Power Derating
900
800
700
600
500
400
300
Power Dis s ip ation- PD(mW)
200
100
0
0 50 100 150 200
Ambient Temper a t ure-Ta (oC)
HM28S HSMC Product Specification
Page 3
HI-SINCERITY
g
A
MICROELECTRONICS CORP.
TO-92 Dimension
Spec. No. : HE6450
Issued Date : 1992.11.25
Revised Date : 2002.04.18
Page No. : 3/3
A
α2
B
31
2
Marking:
HM
82S
Date Code Control Code
α3
C
D
H
I
α1
G
Style: Pin 1.Emitter 2.Collector 3.Base
E
F
DIM
A 0.1704 0.1902 4.33 4.83 G 0.0142 0.0220 0.36 0.56
B 0.1704 0.1902 4.33 4.83 H - *0.1000 - *2.54
C 0.5000 - 12.70 - I - *0.0500 - *1.27
D 0.0142 0.0220 0.36 0.56
E - *0.0500 - *1.27
F 0.1323 0.1480 3.36 3.76
Notes: 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
3-Lead TO-92 Plastic Package
HSMC Packa
e Code:
DIM
α1
α2
α3
*: Typical
Min. Max. Min. M ax.
-
-
-
*5°
*2°
*2°
-
-
-
*5°
*2°
*2°
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec . 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HM28S HSMC Product Specification
Loading...