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HI-SINCERITY
MICROELECTRONICS CORP.
HJ882
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The HJ882 is designed for using in output stage of 20 W audio amplifier,
voltage regulator, DC-DC converter and relay driver.
Spec. No. : HE6014
Issued Date : 1996.04.12
Revised Date : 2003.01.07
Page No. : 1/4
Absolute Maximum Ratings (Ta=25°C)
• Maximum Temperatures
Stora ge Temperature........................................................................................................ -55 ~ +150 °C
Junction Temperature................................................................................................................ +150 °C
• Maximum Power Dissipation
Total Power Dissipation (Tc=25°C)................................................................................................. 10 W
• Maximum Voltages and Currents
BVCBO Collector to Base Voltage.................................................................................................. 40 V
BVCEO Collector to Emitter Voltage............................................................................................... 30 V
BVEBO Emitter to Base Voltage....................................................................................................... 5 V
IC Collector Current (DC)................................................................................................................... 3 A
IC Collector Current (Pulse)............................................................................................................... 7 A
IB Base Current (DC).................................................................................................................. 600 mA
TO-252
Thermal Characteristic
Characteristic Symbol Max Unit
Thermal Resistance, junction to case
Rθjc
12.5
o
C/W
Characteristics (Ta=25°C)
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO 40 - - V IC=100uA, IE=0
BVCEO 30 - - V IC=1mA, IB=0
BVEBO 5 - - V I E= 10uA, IC=0
ICBO - - 1 uA VCB=30V, IE=0
IEBO - - 1 uA VEB=3V, IC=0
*VCE(sat) - 0.3 0.5 V IC=2A, IB=0.2A
*VBE(sat) - 1 2 V I C= 2 A, IB=0.2A
*hFE1 30 - - VCE=2V, IC=20mA
*hFE2 160 - 400 VCE=2V, IC=1A
fT - 90 - MHz VCE=5V, IC=0.1A, f=100MHz
Cob - 45 - pF VCB=10V, f=1MHz
*Pulse T est: Pulse Width ≤380us, Duty Cycle≤2%
Classification Of hFE1
Rank Q P E
Range 100-200 160-320 250-500
HJ882 HSMC Product Specification
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HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE6014
Issued Date : 1996.04.12
Revised Date : 2003.01.07
Page No. : 2/4
1000
125oC
25oC
100
hFE
hFE @ VCE=2V
10
1 10 100 1000 10000
Collector Current- IC (mA)
75oC
Sat uration Voltage & Collect or Cur rent
1000
Current Gain & Coll ector Curren t
75oC
1000
100
Satur ation Voltage ( m V)
125oC
10
1 10 100 1000 10000
Collector Current- IC (mA)
25oC
CE(sat)
V
@ IC=10I
Sat urati on Voltage & Collector Curren t
1000
Sat urati on Voltage & Col lector Current
75oC
B
75oC
100
125oC
Saturation Voltage (mV)
10
1 10 100 1000 10000
Collector Current- IC (mA)
25oC
CE(sat)
V
@ IC=40I
Sat urati on Voltage & Col lector Current
10000
1000
Saturation Voltage (mV)
100
25oC
125oC
1 10 100 1000 10000
Collector Current- IC (mA)
75oC
BE(sat)
V
@ IC=10I
100
Saturat ion Volt age ( m V)
B
10
1 10 100 1000 10000
125oC
Collector Current- IC (mA)
25oC
CE(sat)
V
@ IC=20I
B
Capacita nce & Reverse-Biased Voltage
100
Capacitance (pF)
Cob
B
10
0.1 1 10 100
Reverse-Biased Vol t a ge ( V)
HJ882 HSMC Product Specification
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HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6014
Issued Date : 1996.04.12
Revised Date : 2003.01.07
Page No. : 3/4
1000
Cutoff Frequency & Coll ector Current
Cutoff Frequency (MHz)...
VCE=5V
100
1 10 100 1000
Collector Current (mA)
10000
(mA)
1000
C
Collector Current-I
PT=1ms
PT=100ms
PT=1s
100
10
1 10 100
Forwar d Voltage-VCE (V)
Safe Operating Area
HJ882 HSMC Product Specification
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HI-SINCERITY
MICROELECTRONICS CORP.
TO-252 Dimension
Spec. No. : HE6014
Issued Date : 1996.04.12
Revised Date : 2003.01.07
Page No. : 4/4
A
B
L
F
G
C
D
Marking:
Date Code
HJ
882
Control Code
Style: Pin 1.Base 2.Collector 3.Emitter
3
H
E
K
2
I
1
J
3-Lead TO-252 Plastic Surface Mount Package
HSMC Package Code: J
DIM
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
DIM
Min. Max. Min. Max.
A 0.0177 0.0217 0.45 0.55 G 0.0866 0.1102 2.20 2.80
B 0.0650 0.0768 1.65 1.95 H - *0.0906 - *2.30
C 0.0354 0.0591 0.90 1.50 I - 0.0354 - 0.90
D 0.0177 0.0236 0.45 0.60 J - 0.0315 - 0.80
E 0.2520 0.2677 6.40 6.80 K 0.2047 0.2165 5.20 5.50
F 0.2125 0.2283 5.40 5.80 L 0.0551 0.0630 1.40 1.60
Notes: 1.Dimension and tolerance based on our Spec. dated May. 05,1996.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
*: Typical
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec . 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HJ882 HSMC Product Specification
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