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HI-SINCERITY
MICROELECTRONICS CORP.
HJ50
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The HJ50 is designed for line operated audio output amplifier switch
mode power supply drivers and other switching applications.
Spec. No. : HE6016
Issued Date : 1996.04.12
Revised Date : 2002.02.26
Page No. : 1/3
Absolute Maximum Ratings (Ta=25°C)
• Maximum Temperatures
Stor age Temperature............................................................................................ -55 ~ +150 °C
Junction Temperature.................................................................................................... +150 °C
• Maximum Power Dissipation
Total Power Dissipation (Tc=25°C)..................................................................................... 15 W
• Maximum Voltages and Currents
BVCBO Collector to Base Voltage..................................................................................... 500 V
BVCEO Collector to Emitter Voltage.................................................................................. 400 V
BVEBO Emitter to Base Voltage............................................................................................ 5 V
IC Collector Current .............................................................................................................. 1 A
TO-252
Characteristics (Ta=25°C)
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO 500 - - V IC=1mA
BVCEO 400 - - V IC=30mA
BVEBO 5 - - V IC=100uA
ICES - - 100 uA VCE=500V
ICEO - - 200 uA VCE=300V
IEBO - - 1 mA VEB=5V
*VCE(sat) - - 1 V IC=1A, IB=0.2A
*VBE(on) - - 1.5 V VCE=10V, IC=1A
*hFE1 30 - 150 VCE=10V, IC=0.3A
*hFE2 10 - - VCE=10V, IC=1A
fT 10 - - MHz VCE=10V, IC=200mA, f=2MHz
*Pulse T est: Pulse Width ≤380us, Duty Cycle≤2%
HJ50 HSMC Product Specification
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HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE6016
Issued Date : 1996.04.12
Revised Date : 2002.02.26
Page No. : 2/3
1000
hFE @ VCE=10V
100
hFE
10
1 10 100 1000
125oC
25oC
75oC
Collector Current- IC (mA)
ON Voltage & C ollector Current
1000
25oC
75oC
Current Gai n & Collector Current
1000
Sat uration Voltage & Collect or Cur rent
CE(sat)
V
100
125oC
Satur ation Voltage ( m V)
10
1 10 100 1000
10.0
Switching Time & C ollector Current
VCC=30V, IC=10IB1=-10I
B
@ IC=5I
75oC
Collector Current- IC (mA)
B2
25oC
125oC
ON Voltage ( m V)
100
1 10 100 1000
100
10
Capacitance (p F)
Capacita nce & Reverse-Biased Volta ge
Collector Current- IC (mA)
BE(ON)
V
@ VCE=10V
Cob
1.0
Switch in g Times (u s )...
0.1
0.1 1.0 10.0
Collector Current (A)
Tstg
Ton
Tf
Safe Oper ating Area
10000
1000
(mA)
C
100
Collector Current-I
10
PT=1ms
PT=100ms
PT=1s
1
0.1 1 10 100
Reverse-Biased Vol tage (V)
1
1 10 100 1000
Forwar d Voltage-VCE (V)
HJ50 HSMC Product Specification
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HI-SINCERITY
MICROELECTRONICS CORP.
TO-252 Dimension
Spec. No. : HE6016
Issued Date : 1996.04.12
Revised Date : 2002.02.26
Page No. : 3/3
A
B
L
F
G
C
D
Marking:
Date Code
HJ
05
Control Code
Style: Pin 1.Base 2.Collector 3.Emitter
3
H
E
K
2
I
1
J
3-Lead TO-252 Plastic Surface Mount Package
HSMC Package Code: J
*: Typical
DIM
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
DIM
Min. Max. Min. Max.
A 0.0177 0.0217 0.45 0.55 G 0.0866 0.1102 2.20 2.80
B 0.0650 0.0768 1.65 1.95 H - *0.0906 - *2.30
C 0.0354 0.0591 0.90 1.50 I - 0.0354 - 0.90
D 0.0177 0.0236 0.45 0.60 J - 0.0315 - 0.80
E 0.2520 0.2677 6.40 6.80 K 0.2047 0.2165 5.20 5.50
F 0.2125 0.2283 5.40 5.80 L 0.0551 0.0630 1.40 1.60
Notes: 1.Dimension and tolerance based on our Spec. dated May. 05,1996.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec . 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HJ50 HSMC Product Specification
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