
HI-SINCERITY
MICROELECTRONICS CORP.
HJ42C
PNP EPITAXIAL PLANAR TRANSIST OR
Description
The HJ42C is designed for use in general purpose amplifier, low
speed switching applications.
Spec. No. : HE6013-B
Issued Date : 1996.04.12
Revised Date : 2000.11.01
Page No. : 1/3
Absolute Maximum Ratings
Maximum Temperatures
•
Storage Temperature............................................................................................ -55 ~ +150 °C
Junction Temperature.................................................................................................... +150 °C
Maximum Power Dissipation
•
Total Power Dissipation (Tc=25°C) .................................................................................... 20 W
Maximum Voltages and Currents (Ta=25°C)
•
BVCBO Collector to Base Voltage................................................................................... -100 V
BVCEO Collector to Emitter Voltage................................................................................ -100 V
BVEBO Emitter to Base Voltage.......................................................................................... -5 V
IC Collector Current ............................................................................................................ -6 A
Characteristics
Symbol Min. Typ. Max. Unit Test Co nditions
BVCBO -100 - - V IC=-1mA, IE=0
BVCEO -100 - - V IC=-30mA, IB=0
BVEBO -5 - - V IC=-100uA, IC=0
ICES - - -10 uA VCE=-100V, VEB=0
ICEO - - -50 uA VCE=-60V, IB=0
IEBO - - -500 uA VEB=-5V, IC=0
*VCE(sat) - - -1.5 V IC=-6A, IB=-600mA
*VBE(on) - - -2 V VCE=-4V, IC=-6A
*hFE1 30 - - VCE=-4V, IC=-300mA
*hFE2 15 - 75 VCE=-4V, IC=-3A
fT 3 - - MHz VCE=-10V, IC=-500mA, f=1MHz
(Ta=25°C)
(Ta=25°C)
*Pulse Test : Pulse Width ≤380us, Duty Cycle≤2%
HSMC Product Specification

HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE6013-B
Issued Date : 1996.04.12
Revised Date : 2000.11.01
Page No. : 2/3
1000
100
hFE
10
1
1 10 100 1000 10000
Current Gain & Collector Current
hFE @ VCE=4V
Collector Current (mA)
On Voltage & Collector Current
1000
BE(on)
V
@ VCE=4V
10000
1000
BE(sat)
V
100
Saturation Voltage (mV)
CE(sat)
V
10
1 10 100 1000 10000
Collector Current (mA)
@ IC=8I
@ IC=8I
B
B
Switching Time & Collector Current
Saturation Volt age & Coll ector Current
10.00
VCC=30V, IC=10IB1=-10I
1.00
B2
On Voltage (mV)
100
1 10 100 1000 10000
Collector Current (mA)
Capacitance & Reverse-Biased Volt age
1000
100
Capac itanc e (pF)
Cob
Ton
Tstg
0.10
Switchin g T imes ( us)
0.01
0.1 1.0 10.0
100000
PT=1ms
10000
(mA)
C
Collector Current-I
1000
100
10
PT=100ms
PT=1s
Collector Current (A)
Safe Operating Ar ea
Tf
10
0.1 1 10 100
Reverse-Biased Vol t a ge (V)
1
1 10 100
Forwar d Voltage-VCE (V)
HSMC Product Specification

HI-SINCERITY
MICROELECTRONICS CORP.
TO-252 Dimension
Spec. No. : HE6013-B
Issued Date : 1996.04.12
Revised Date : 2000.11.01
Page No. : 3/3
A
B
L
F
G
C
D
Marking :
HSMC Logo
Part Number
Date Code
Product Series
Rank
Ink Mark
Style : Pin 1.Base 2.Collector 3.Emitter
3
H
E
K
2
I
1
J
3-Lead TO-252 Plastic Surface Mount Package
HSMC Package Code : J
DIM
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
DIM
Min. Max. Min. Max.
A 0.0177 0.0217 0.45 0.55 G 0.0866 0.1102 2.20 2.80
B 0.0650 0.0768 1.65 1.95 H - *0.0906 - *2.30
C 0.0354 0.0591 0.90 1.50 I - 0.0354 - 0.90
D 0.0177 0.0236 0.45 0.60 J - 0.0315 - 0.80
E 0.2520 0.2677 6.40 6.80 K 0.2047 0.2165 5.20 5.50
F 0.2125 0.2283 5.40 5.80 L 0.0551 0.0630 1.40 1.60
Notes :
Material :
• Lead : 42 Alloy ; solder plating
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
1.Dimension and tolerance based on our Spec. dated May. 05,1996.
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, pl ease contact your local HSMC sales office.
*:Typical
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringem ent of pat ents, or applic ati on assistance.
Head Office And Factory :
•
Head Office
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
•
Factory 1 :
Tel : 886-3-5983621~5 Fax : 886-3-5982931
•
Factory 2 :
Tel : 886-3-5977061 Fax : 886-3-5979220
(Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
HSMC Product Specification