Page 1
HI-SINCERITY
MICROELECTRONICS CORP.
HI44H11
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The HI44H11 is designed for various specific and general purpose
applications, such as: output and driver stages of amplifiers operating at frequencies from DC to greater than 1MHz; series, shunt and
switching regulators; low and high frequency inverters/converters;
and many others.
Spec. No. : HE9305-B
Issued Date : 1994.11.09
Revised Date : 2000.11.01
Page No. : 1/3
Absolute Maximum Ratings
Maximum Temperatures
•
Storage Temperature............................................................................................ -55 ~ +150 °C
Junction Temperature.................................................................................................... +150 °C
Maximum Power Dissipation
•
Total Power Dissipation (Tc=25°C) .................................................................................... 20 W
Maximum Voltages and Currents
•
BVCEO Collector to Base Voltage...................................................................................... 80 V
BVCES Collector to Emitter Voltage ................................................................................... 80 V
BVEBO Emitter to Base Voltage........................................................................................... 5 V
IC Collector Current............................................................................................................ 10 A
IB Base Current.................................................................................................................... 5 A
Characteristics
Symbol Min. Typ. Max. Unit Test Conditions
BVCEO 80 - - V IC=30mA, IB=0
BVCES 80 - - V IC=1mA, IB=0
BVEBO 5 - - V IE=1mA, IC=0
ICBO - - 10 uA VCB=80V, VEB=0
IEBO - - 50 uA VEB=5V, IC=0
*VCE(sat) - - 1 V IC=8A, IB=0.4A
*VBE(sat) - - 1.5 V IC=8A, IB=0.8A
*hFE1 60 - - VCE=1V, IC=2A
*hFE2 40 - - VCE=1V, IC=4A
Cob - 130 - pF VCB=10V, f=1MHz
fT - 50 - MHz VCE=10V, IC=500mA, f=20MHz
(Ta=25°C)
(Ta=25°C)
*Pulse Test : Pulse Width ≤380us, Duty Cycle≤2%
HSMC Product Specification
Page 2
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE9305-B
Issued Date : 1994.11.09
Revised Date : 2000.11.01
Page No. : 2/3
1000
100
hFE
10
100 1000 10000
10000
Current Gain & Collector Curren t
VCE=1V
Collector Curren t ( mA)
Saturation Voltage & Collect or Cu rr ent
1000
100
CE(sat)
V
Saturation Voltage (mV)
10
10 100 1000 10000
Collector Current (mA)
@ IC=20I
B
Capacit ance & Reverse- Bia s ed Voltage
1000
Saturation Voltage & Collect or Cu rr ent
1000
BE(sat)
V
Saturation Voltage (mV)
100
100 1000 10000
Collector Current (mA)
@ IC=10I
B
100
Capacitance (Pf)
10
1 10 100
Reverse Biased Vol tage (V)
Cob
HSMC Product Specification
Page 3
HI-SINCERITY
g
MICROELECTRONICS CORP.
TO-251 Dimension
Spec. No. : HE9305-B
Issued Date : 1994.11.09
Revised Date : 2000.11.01
Page No. : 3/3
A
C
B
HSMC Logo
D
Part Number
Date Code
Product Series
Rank
Ink Mark
F G
Style : Pin 1.Base 2.Collector 3.Emitter
3
I
Marking :
E
K
2
H
1
J
3-Lead TO-251 Plastic Package
DIM
HSMC Packa
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
e Code : I
DIM
Min. Max. Min. Max.
A 0.0177 0.0217 0.45 0.55 G 0.2559 - 6.50 B 0.0354 0.0591 0.90 1.50 H - *0.1811 - *4.60
C 0.0177 0.0236 0.45 0.60 I - 0.0354 - 0.90
D 0.0866 0.0945 2.20 2.40 J - 0.0315 - 0.80
E 0.2520 0.2677 6.40 6.80 K 0.2047 0.2165 5.20 5.50
F 0.2677 0.2835 6.80 7.20
Notes :
Material :
• Lead : 42 Alloy ; solder plating
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
1.Dimension and tolerance based on our Spec. dated May. 24,1995.
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, pleas e contact your l ocal HSMC sal es office.
*:Typical
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringem ent of pat ents, or applic ati on assistance.
Head Office And Factory :
•
Head Office
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
•
Factory 1 :
Tel : 886-3-5983621~5 Fax : 886-3-5982931
•
Factory 2 :
Tel : 886-3-5977061 Fax : 886-3-5979220
(Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
HSMC Product Specification
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