Datasheet HI32C Datasheet (HSMC)

Page 1
HI-SINCERITY
MICROELECTRONICS CORP.
HI32C
Description
The HI32C is designed for use in general purpose amplifier and low speed switching applications.
Spec. No. : HE9002 Issued Date : 1994.03.02 Revised Date : 2002.01.17 Page No. : 1/3
Absolute Maximum Ratings (Ta=25°C)
Maximum Temperatures
Stor age Temperature............................................................................................ -55 ~ +150 °C
Junction Temperature.................................................................................................... +150 °C
Maximum Power Dissipation
Total Power Dissipation (Tc=25°C)...................................................................................... 15W
Maximum Voltages and Currents
BVCBO Collector to Base Voltage.................................................................................... -100 V
BVCEO Collector to Emitter Voltage................................................................................. -100 V
BVEBO Emitter to Base Voltage........................................................................................... -5 V
IC Collector Current ............................................................................................................. -3 A
TO-251
Characteristics (Ta=25°C)
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO -100 - - V IC=-1mA, IE=0 BVCEO -100 - - V IC=-30mA, IB=0
ICES - - -20 uA VCE=-100V, VBE=0 ICEO - - -50 uA VCE=-60V, IB=0 IEBO - - -1 mA VEB=-5V, IC=0
*VCE(sat) - - -1.2 V IC=-3A, IB=-375mA
*VBE(on) - - -1.8 V VCE=-4V, IC=-3A
*hFE1 25 - - VCE=-4V, IC=-1A *hFE2 10 - 50 VCE=-4V, IC=-3A
fT 3 - - MHz VCE=-10V, IC=-500mA, f=1MHz
*Pulse T est: Pulse Width 380us, Duty Cycle≤2%
HI32C HSMC Product Specification
Page 2
HI-SINCERITY
)
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE9002 Issued Date : 1994.03.02 Revised Date : 2002.01.17 Page No. : 2/3
100
75oC125oC
hFE
10
25oC
hFE @ VCE=4V
1 10 100 1000 10000
Collec tor Current IC (mA)
ON Voltage & Collector Current
10000
Current Gain & Collector Current
1000
Sat urat ion Vol tage & Collect or Cu rrent
75oC
125oC
Satur ation Voltag e (mV)
100
1 10 100 1000 10000
10.00
1.00
25oC
Collec tor Current IC (mA)
Switching Time & Collector Current
VCC=30V, IC=10IB1=-10I
B2
CE(sat)
V
@ IC=8I
B
1000
ON Voltage (mV)
100
1 10 100 1000 10000
25oC
75oC125oC
Collec tor Current IC (mA)
BE(ON)
V
@ VCE=4V
Capacit ance & Reverse-Biased Volt age
1000
100
Capacitance (pF)
Cob
Ton Tstg
0.10
Switching Times (us)..
0.01
0.1 1.0 10.0
Collector Current (A)
Tf
Safe Operati ng Area
10000
1000
PT=1ms
100
Collector Curr ent (mA
10
PT=100ms PT=1s
10
0.1 1 10 100
Reverse- Biased Voltage ( V)
1
1 10 100 1000
Forwar d Voltage ( V)
HI32C HSMC Product Specification
Page 3
HI-SINCERITY
g
MICROELECTRONICS CORP.
TO-251 Dimension
Spec. No. : HE9002 Issued Date : 1994.03.02 Revised Date : 2002.01.17 Page No. : 3/3
A
C
B
HI
D
Date Code
23C
Control Code
F G
Marking:
Style: Pin 1.Base 2.Collector 3.Emitter
3
I
E
K
2
H
1
J
3-Lead TO-251 Plastic Package
DIM
HSMC Packa
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
e Code: I
DIM
*: Typical
Min. Max. Min. Max. A 0.0177 0.0217 0.45 0.55 G 0.2559 - 6.50 ­B 0.0354 0.0591 0.90 1.50 H - *0.1811 - *4.60 C 0.0177 0.0236 0.45 0.60 I - 0.0354 - 0.90 D 0.0866 0.0945 2.20 2.40 J - 0.0315 - 0.80 E 0.2520 0.2677 6.40 6.80 K 0.2047 0.2165 5.20 5.50 F 0.2677 0.2835 6.80 7.20
Notes: 1.Dimension and tolerance based on our Spec. dated May. 24,1995.
Material:
Lead: 42 Alloy; solder plating
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
HSMC reserves the right to make changes to its products without notice.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931
HI32C HSMC Product Specification
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