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HI-SINCERITY
MICROELECTRONICS CORP.
HI31C
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The HI31C is designed for use in general purpose amplifier and
switching applications.
Spec. No. : HE9001
Issued Date : 1996.02.28
Revised Date : 2002.03.04
Page No. : 1/3
Absolute Maximum Ratings (Ta=25°C)
• Maximum Temperatures
Stor age Temperature............................................................................................ -55 ~ +150 °C
Junction Temperature.................................................................................................... +150 °C
• Maximum Power Dissipation
Total Power Dissipation (Tc=25°C)..................................................................................... 15 W
• Maximum Voltages and Currents
BVCBO Collector to Base Voltage..................................................................................... 100 V
BVCEO Collector to Emitter Voltage.................................................................................. 100 V
BVEBO Emitter to Base Voltage............................................................................................ 5 V
IC Collector Current .............................................................................................................. 3 A
TO-251
Characteristics (Ta=25°C)
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO 100 - - V IC=1mA, IE=0
BVCEO 100 - - V IC=30mA, IB=0
ICES - - 20 uA VCE=100V, VEB=0
ICEO - - 50 uA VCE=60V, IB=0
IEBO - - 1 mA VEB=5V, IC=0
*VCE(sat) - - 1.2 V IC=3A, IB=375mA
*VBE(on) - - 1.8 V VCE=4V, IC=3A
*hFE1 25 - - VCE=4V, IC=1A
*hFE2 10 - 50 VCE=4V, IC=3A
fT 3 - - MHz VCE=10V, IC=500mA, f=1MHz
*Pulse Test : Pulse Width ≤380us, Duty Cycle≤2%
HI31C HSMC Product Specification
Page 2
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE9001
Issued Date : 1996.02.28
Revised Date : 2002.03.04
Page No. : 2/3
100
Cur rent Gain & Collector Current
125oC
hFE
10
1 10 100 1000 10000
10000
25oC 75oC
hFE @ VCE=4V
Collector Current- IC (mA)
ON Voltage & Collector Current
BE(ON)
V
@ VCE=4V
1000
100
Satur ation Voltage ( m V)
10
10.0
Sat ura tion Voltage & C ollector C urrent
CE(sat)
V
1 10 100 1000 10000
B
@ IC=8I
75oC
Collector Current- IC (mA)
25oC
125oC
Swi tchi ng Time & Col lector Current
VCC=30V, IC=10IB1=-10I
B2
1000
ON Voltage (mV)
100
1 10 100 1000 10000
25oC
75oC125oC
Collector Current- IC (mA)
Capacitance & Rev erse-Biased Voltage
100
Cob
10
Capacitance (pF)
1.0
Switching Times (us)...
0.1
0.1 1.0 10.0
100000
10000
(mA)
C
1000
Collector Curr ent -I
PT=1ms
PT=100ms
PT=1s
100
10
Collect o r Current ( mA)
Safe Operating Area
Tst
Ton
Tf
1
0.1 1 10 100
Reverse-Biased Vol t a ge ( V)
1
1 10 100
Forwar d Voltage-VCE (V)
HI31C HSMC Product Specification
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HI-SINCERITY
g
MICROELECTRONICS CORP.
TO-251 Dimension
Spec. No. : HE9001
Issued Date : 1996.02.28
Revised Date : 2002.03.04
Page No. : 3/3
A
C
B
HI
D
Date Code
13C
Control Code
F G
Marking:
Style: Pin 1.Base 2.Collector 3.Emitter
3
I
E
K
2
H
1
J
3-Lead TO-251 Plastic Package
DIM
HSMC Packa
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
e Code: I
DIM
*: Typical
Min. Max. Min. Max.
A 0.0177 0.0217 0.45 0.55 G 0.2559 - 6.50 B 0.0354 0.0591 0.90 1.50 H - *0.1811 - *4.60
C 0.0177 0.0236 0.45 0 .60 I - 0.0354 - 0.90
D 0.0866 0.0945 2.20 2 .40 J - 0.0315 - 0.80
E 0.2520 0.2677 6.40 6.80 K 0.2047 0.2165 5.20 5.50
F 0.2677 0.2835 6.80 7.20
Notes: 1.Dimension and tolerance based on our Spec. dated May. 24,1995.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HI31C HSMC Product Specification
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