Page 1
Fibre Channel 133 MBd and
266 MBd Transceivers in Low
Cost 1x9 Package Style
Technical Data
HFBR-5301 133 MBd
HFBR-5302 266 MBd
Features
• Full Compliance with ANSI
X3T11 Fibre Channel
Physical and Signaling
Interface
• Multisourced 1x9 Package
Style with Duplex SC
Connector
• Wave Solder and Aqueous
Wash Process Compatibility
• Compatible with Various
Manufacturers FC-0 and
FC-1 Circuits
Applications
• Fibre Channel 12.5 MB/s
12-M6-LE-I Interfaces for
1300 nm LED Links to
1500 m
• Fibre Channel 25 MB/s
25-M6-LE-I Interfaces for
1300 nm LED Links to
1500 m
Description
The HFBR-5301 and HFBR-5302
Fibre Channel Transceivers from
Hewlett-Packard provide the
system designer with products to
implement Fibre Channel designs
for use in multimode fiber (MMF)
applications. These include the
12.5 MB/sec 12-M6-LE-I interface
and the 25 MB/sec 25-M6-LE-I
interface for 1300 nm LED links.
The products are produced in the
new industry standard 1x9 SIP
package style with a duplex SC
connector interface as defined in
the Fiber Channel ANSI FC-PH
standard document.
The HFBR-5301 is a 1300 nm
transceiver specified for use in
133 MBd, 12.5 MB/s, 12-M6-LE-I
Fibre Channel interfaces to either
62.5/125 µm or 50/125 µm
multimode fiber-optic cables.
The HFBR-5302 is a 1300 nm
transceiver specified for use in
266 MBd, 25 MB/s, 25-M6-LE-I
Fibre Channel interfaces to either
62.5/125 µm or 50/125 µm
multimode fiber-optic cables.
Transmitter Sections
The transmitter sections of the
HFBR-5301 and HFBR-5302
utilize 1300 nm InGaAsP LEDs.
These LEDs are packaged in the
optical subassembly portion of
the transmitter section. They are
driven by a custom silicon IC
which converts PECL logic
signals, into an analog LED drive
current.
Receiver Sections
The receiver sections of the
HFBR-5301 and HFBR-5302
utilize InGaAs PIN photo diodes
coupled to a custom silicon
transimpedance preamplifier IC.
These are packaged in the optical
subassembly portion of the
receiver.
These PIN/preamplifier combinations are coupled to a custom
quantizer IC which provides the
final pulse shaping for the logic
output and the Signal Detect
function. The Data output is
differential. The Signal Detect
output is single-ended. Both data
and signal detect outputs are
PECL compatible, ECL referenced (shifted) to a +5 volt
power supply.
Package
The overall package concept for
the HP Fibre Channel transceivers consists of three basic
elements; the two optical
subassemblies, an electrical
subassembly and the housing
with integral duplex SC connector interface. This is illustrated in
the block diagram in Figure 1.
5963-5608E (3/95)
215
Page 2
DATA OUT
SIGNAL
DETECT
OUT
ELECTRICAL SUBASSEMBLY
QUANTIZER IC
PREAMP IC
DUPLEX SC
RECEPTACLE
PIN
OPTICAL
SUBASSEMBLIES
The electrical subassembly consists of a high volume multilayer
printed circuit board to which the
IC chips and various surfacemount passive circuit elements
are attached.
DATA IN
DRIVER IC
TOP VIEW
LED
Figure 1. Block Diagram.
The package outline drawing and
pin out are shown in Figures 2
and 3. The details of this package
maximum height allowed for the
duplex SC connector over the
entire length of the package.
outline and pin out are compliant
with the multisource definition of
the 1x9 single in-line package
(SIP). The low profile of the
Hewlett-Packard transceiver
design complies with the
39.12
(1.540)
25.40
MAX.
(1.000)
HFBR-5XXX
DATE CODE (YYWW)
H
SINGAPORE
+ 0.08
0.75
3.30 ± 0.38
(0.130 ± 0.015)
23.55
(0.927)
NOTE 1: THE SOLDER POSTS AND ELECTRICAL PINS ARE PHOSPHOR BRONZE WITH TIN LEAD OVER NICKEL PLATING.
DIMENSIONS ARE IN MILLIMETERS (INCHES).
Figure 2. Package Outline Drawing.
(0.030
20.32
(0.800)
- 0.05
+ 0.003
)
- 0.002
[8x(2.54/.100)]
10.35
(0.407)
0.46
(0.018)
NOTE 1
(0.034)
2.92
(0.115)
(9x)ø
16.70
(0.657)
0.87
MAX.
23.24
(0.915)
The optical subassemblies utilize
a high volume assembly process
together with low cost lens
elements which result in a cost
effective building block.
4.14
(0.163)
12.70
(0.500)
AREA
RESERVED
FOR
PROCESS
PLUG
1.27
(0.050
+ 0.25
- 0.05
+ 0.010
- 0.002
NOTE 1
17.32
(0.682)
)
20.32
(0.800)
MAX.
18.52
(0.729)
15.88
(0.625)
12.70
(0.500)
23.32
(0.918)
The package includes internal
shields for the electrical and
optical subassemblies to insure
high immunity to external EMI
fields and low EMI emissions.
The outer housing, including the
duplex SC connector, is molded
of filled non-conductive plastic to
provide mechanical strength and
electrical isolation. The solder
posts are isolated from the circuit
design of the transceiver, while
they can be connected to a
ground plane on the circuit
board, doing so will have no
impact on circuit performance.
The transceiver is attached to a
printed circuit board with the
nine signal pins and the two
solder posts which exit the
bottom of the housing. The two
solder posts provide the primary
mechanical strength to withstand
the loads imposed on the transceiver by mating with the duplex
SC connectored fiber cables.
Application Information
The Applications Engineering
group in the Hewlett-Packard
Optical Communication Division
is available to assist with the
technical understanding and
design trade-offs associated with
these transceivers. You can
contact them through your local
Hewlett-Packard sales
representative.
The following information is
provided to answer some of the
most common questions about
the use of these parts.
216
Page 3
1 = V
EE
2 = RD
3 = RD
4 = SD
5 = V
CC
6 = V
CC
7 = TD
8 = TD
9 = V
EE
Figure 3. Pinout Diagram.
N/C
N/C
TOP VIEW
Compatibility with Fibre Channel FC-0/1 Chip Sets
The HFBR-5301 and HFBR-5302
transceivers are compatible with
various manufacturers FC-0 and
FC-1 integrated circuits. Evaluation boards, which include the
Hewlett-Packard transceivers, are
available from these manufacturers. The Applications Engineering
group in the Hewlett- Packard
Optical Communication Division
is available to assist you with
implementation details.
Transceiver Optical Power Budget vs. Link Length
Optical Power Budget (OPB) is
the available optical power for a
fiber optic link to accommodate
fiber cable losses plus losses due
to in-line connectors, splices,
optical switches, and to provide
margin for link aging and
unplanned losses due to cable
plant reconfiguration or repair.
Figure 4 illustrates the predicted
OPB associated with the two
transceivers specified in this data
sheet at the Beginning of Life
(BOL). These curves represent
the attenuation and chromatic
plus modal dispersion losses
associated with the 62.5/125 µm
and 50/125 µm fiber cables only.
The area under the curves
8
7
6
5
HFBR-5302, 62.5/125µm
4
3
2
HFBR-5302, 50/125µm
1
OPTICAL POWER BUDGET – dB
0
021.5
FIBER OPTIC CABLE LENGTH – km
Figure 4. Optical Power Budget vs.
Fiber Optic Cable Length.
HFBR-5301, 62.5/125µm
HFBR-5301,
50/125µm
0.5
1
represents the remaining OPB at
any link length, which is available
for overcoming non-fiber cable
losses.
Hewlett-Packard LED technology
has produced 1300 nm LED
devices with lower aging characteristics than normally associated
with these technologies in the
industry. The industry convention
is 1.5 dB aging for 1300 nm
LEDs. The HP LEDs will experience less than 1 dB of aging over
normal commercial equipment
mission life periods. Contact your
Hewlett-Packard sales representative for additional details.
Figure 4 was generated with a
Hewlett-Packard fiber optic link
model containing the current
industry conventions for fiber
cable specifications and the Fibre
Channel optical parameters.
These parameters are reflected in
the specified performance of the
transceiver in this data sheet.
This same model has been used
extensively in the ANSI and IEEE
committees, including the ANSI
X3T9.5 committee, to establish
the optical performance requirements for various fiber-optic
interface standards. The cable
parameters used come from the
ISO/IEC JTC1/SC 25/WG3
Generic Cabling for Customer
Premises per DIS 11801
document and the EIA/TIA-568-A
Commercial Building Telecommunications Cabling Standard
per SP-2840.
Transceiver Signaling Operating Rate Range and BER Performance
For purposes of definition, the
symbol rate (Baud), also called
signaling rate, is the reciprocal of
the symbol time. Data rate (bits/
sec) is the symbol rate divided by
the encoding factor used to
encode the data (symbols/bit).
The specifications in this data
sheet have all been measured
using the standard Fibre Channel
symbol rates of 133 Mbd or
266 MBd.
The transceivers may be used for
other applications at signaling
rates different than specified in
this data sheet. Depending on the
actual signaling rate, there may
be some differences in optical
-2
1 x 10
-3
1 x 10
-4
1 x 10
-5
1 x 10
-6
1 x 10
-7
1 x 10
BIT ERROR RATE
-8
1 x 10
-9
1 x 10
-10
1 x 10
-11
1 x 10
-12
1 x 10
-6 20
RELATIVE INPUT OPTICAL POWER – dB
CONDITIONS:
1. 133 & 266 MBd
2. PRBS 2
3. CENTER OF SYMBOL SAMPLING
4. T
5. V
6. INPUT OPTICAL RISE/FALL TIMES =
1.0/1.9 ns
Figure 5. HFBR-5301/5302 Bit Error
Rate vs. Relative Receiver Input
Optical Power.
= 25 °C
A
= 5 V
CC
-4
-2
7
-1
DC
217
Page 4
power budget to do this. This is
primarily caused by a change of
receiver sensitivity.
These transceivers can also be
used for applications which
require different Bit Error Rate
(BER) performance. Figure 5
illustrates the typical trade-off
between link BER and the
receivers input optical power
level.
Transceiver Jitter Performance
The Hewlett-Packard 1300 nm
transceivers are designed to
operate per the system jitter
allocations stated in FC-PH
Annex A.4.3 and A.4.4.
The HP 1300 nm transmitters will
tolerate the worst case input
electrical jitter allowed, without
violating the worst case output
optical jitter requirements.
The HP 1300 nm receivers will
tolerate the worst case input
optical jitter allowed without
violating the worst case output
electrical jitter allowed.
The jitter specifications stated in
the following tables are derived
from the values in FC-PH Annex
A.4.3 and A.4.4. They represent
the worst case jitter contribution
that the transceivers are allowed
to make to the overall system
jitter without violating the
allowed allocation. In practice,
the typical contribution of the HP
transceivers is below these
maximum allowed amounts.
Recommended Handling Precautions
Hewlett-Packard recommends
that normal static precautions be
taken in handling and assembly
of these transceivers to prevent
damage and/or degradation which
may be induced by electrostatic
discharge (ESD). These transceivers are certified as MIL-STD-
These transceivers are compatible with industry standard wave
and hand solder processes.
883C Method 3015.4 Class 2
devices.
Shipping Container
The transceiver is packaged in a
Care should be used to avoid
shorting the receiver data or
signal detect outputs directly to
ground.
Solder and Wash Process Compatibility
The transceivers are delivered
with a protective process plug
inserted into the duplex SC
connector receptacle. This
process plug protects the optical
subassemblies during wave solder
and aqueous wash processing and
acts as a dust cover during
shipping.
NO INTERNAL CONNECTION NO INTERNAL CONNECTION
HFBR-530X
TOP VIEW
Rx Rx Tx Tx
V
RD RD SD VCCVCCTD TD V
EE
123456789
C1 C2
TERMINATION
AT PHY
DEVICE
INPUTS
NOTES:
THE SPLIT-LOAD TERMINATIONS FOR ECL SIGNALS NEED TO BE LOCATED AT THE INPUT
OF DEVICES RECEIVING THOSE ECL SIGNALS. RECOMMEND 4-LAYER PRINTED CIRCUIT
BOARD WITH 50 OHM MICROSTRIP SIGNAL PATHS BE USED.
R1 = R4 = R6 = R8 = R10 = 130 ohms.
R2 = R3 = R5 = R7 = R9 = 82 ohms.
C1 = C2 = C3 = C5 = C6 = 0.1 µF.
C4 = 10 µF.
L1 = L2 = 1 µH COIL OR FERRITE INDUCTOR.
Figure 6. Recommended Decoupling and Termination Circuits.
V
CC
R5 R7
R6 R8
C6
RD RD SD V
L1 L2
C3 C4
VCC FILTER
AT V
CC
TRANSCEIVER
R9
R10
PINS
CC
shipping container designed to
protect it from mechanical and
ESD damage during shipment or
storage.
Board Layout – Decoupling
Circuit and Ground Planes
You should take care in the layout
of your circuit board to achieve
optimum performance from these
transceivers. Figure 6 provides a
good example of a schematic for
a power supply decoupling circuit
that works well with these parts.
Hewlett-Packard further recom-
mends that a contiguous ground
EE
V
CC
R2 R3
R1 R4
C5
TERMINATION
AT TRANSCEIVER
INPUTS
TD TD
218
Page 5
plane be provided in the circuit
board directly under the
transceiver to provide a low
inductance ground for signal
return current. This recommendation is in keeping with good
high frequency board layout
practices.
Board Layout - Hole Pattern
The Hewlett-Packard transceiver
complies with the circuit board
“Common Transceiver Footprint”
hole pattern defined in the
original multisource announcement for the 1x9 pin package
style. This drawing is reproduced
in Figure 7 with the addition of
ANSI Y14.5M compliant dimensioning to be used as a guide in
the mechanical layout of your
circuit board.
Board Layout – Art Work
The Applications Engineering
group has developed Gerber file
art work for a multilayer printed
circuit board layout incorporating
the recommendations above.
Contact your local HewlettPackard sales representative for
details.
20.32
.800
20.32
.800
Regulatory Compliance
These transceiver products are
intended to enable system
designers to develop equipment
that complies with the various
international regulations governing certification of Information
Technology Equipment. See the
Regulatory Compliance Table for
details.
Electromagnetic Interference (EMI)
Most equipment designs utilizing
these high-speed transceivers
from Hewlett-Packard will need
to meet the requirements of the
FCC in the United States,
CENELEC EN55022 (CISPR 22)
in Europe and VCCI in Japan.
The HFBR-5301 and HFBR-5302
are suitable for use in designs
ranging from a single transceiver
in a desktop computer to large
quantities of transceivers in a
hub, switch or concentrator.
Electrostatic Discharge (ESD)
There are two design cases in
which immunity to ESD damage
is important.
1.9 ± 0.1
ø
(2X)
(9X)
Ø0.000
.075 ± .004
Ø0.000
0.8 ± 0.1
ø
.032 ± .004
M
A
M
A
–A–
The first case is during handling
of the transceiver prior to mounting it on the circuit board. You
should use normal ESD handling
precautions for ESD sensitive
devices. These precautions
include using grounded wrist
straps, work benches, and floor
mats in ESD controlled areas.
The second case to consider is
static discharges to the exterior
of the equipment chassis containing the transceiver parts. To the
extent that the transceiver duplex
SC connector is exposed to the
outside of the equipment chassis,
it may be subject to whatever
ESD system level test criteria that
the equipment is intended to
meet.
Immunity
Equipment utilizing these transceivers will be subject to radiofrequency electromagnetic fields
in some environments. These
transceivers have a high immunity
to such fields (see AN1075,
“Testing and Measuring Electromagnetic Compatibility Performance of the HFBR-510X/520X
Fiber-Optic Transceivers,” 59633358E).
Transceiver Reliability and Performance Qualification Data
The 1x9 transceivers have passed
Hewlett-Packard reliability and
performance qualification testing
and are undergoing ongoing
quality monitoring. Details are
available from your HewlettPackard sales representative.
2.54
(8X)
.100
TOP VIEW
Figure 7. Recommended Board Layout Hole Pattern.
These transceivers are manufactured at the Hewlett-Packard
Singapore location which is an
ISO 9002 certified facility.
219
Page 6
Regulatory Compliance Table
Feature Test Method Performance
Electrostatic Discharge Mil-STD-883C Class 2 (2000 to 3999 Volts) Withstand up to
(ESD) to the Electrical Method 3015.4 2200 V applied between electrical pins.
Pins
Electrostatic Discharge Variation of Typically withstand at least 25 kV without damage
(ESD) to the Duplex IEC 801-2 when the Duplex SC Connector Receptacle is
SC Receptacle contacted by a Human Body Model Probe.
Electromagnetic FCC Class B Transceivers typically provide a 13 dB margin at
Interference (EMI) CENELEC EN55022 133 MBd, and a 7 dB margin at 266 MBd to the
Class B (CISPR 22B) noted standard limits when tested at a certified test
VCCI Class 2 range with the transceiver mounted to a circuit
card without a chassis enclosure.
Immunity Variation of Typically show no measurable effect from a 10 V/m
IEC 801-3 field swept from 10 to 450 MHz applied to the
transceiver when mounted to a circuit card without
a chassis enclosure.
220
200
180
160
140
120
100
80
SPECTRAL WIDTH (FWHM) – nm
60
∆λc – TRANSMITTER OUTPUT OPTICAL
1300
1280 13801340
λc – TRANSMITTER OUTPUT OPTICAL
CENTER WAVELENGTH – nm
TRANSMITTER
OUTPUT OPTICAL
RISE TIMES – ns
1320
1360
HFBR-5302 Typical Transmitter
test results of λc, ∆λ and tr are
correlated and comply with the
allowed spectral width as a
function of center wavelength for
various rise and fall times.
= 1.8 ns
t
r
t
= 1.9 ns
r
t
= 2.0 ns
r
= 2.1 ns
t
r
= 2.2 ns
t
r
3
2
1
0
-1
RELATIVE INPUT OPTICAL POWER – dB
-24-1
-3 31
EYE SAMPLING TIME POSITION – ns
CONDITIONS:
1. T
= 25 °C
A
= 5 V
2. V
CC
3. INPUT OPTICAL RISE/FALL TIMES = 1.0/1.9 ns
4. INPUT OPTICAL POWER IS NORMALIZED
TO CENTER OF DATA SYMBOL
5. NOTES 11a AND 12a APPLY
0
DC
2
Figure 9. HFBR-5301, Relative Input
Optical Power vs. Eye Sampling Time
Position.
Figure 8. Typical Transmitter Output
Optical Spectral Width (FWHM) vs.
Transmitter Output Optical Center
Wavelength and Rise/Fall Times.
220
Page 7
4
3
2
1
0
RELATIVE INPUT OPTICAL POWER – dB
CONDITIONS:
1. T
2. V
3. INPUT OPTICAL RISE/FALL TIMES = 1.0/1.9 ns
4. INPUT OPTICAL POWER IS NORMALIZED
TO CENTER OF DATA SYMBOL
5. NOTES 11 AND 12 APPLY
Figure 10. HFBR-5302, Relative Input
Optical Power vs. Eye Sampling Time
Position.
-15-0.5
-1.5 1.50.5
EYE SAMPLING TIME POSITION – ns
= 25 °C
A
= 5 V
CC
DC
0
1
Ordering Information
The HFBR-5301 and HFBR-5302
1300 nm products are available
for production orders through the
Hewlett-Packard Component
Sales Offices and Authorized
Distributors world wide.
Applications Support Materials
Contact your local HewlettPackard Component Field Sales
Office for information on how to
obtain PCB layouts and Test
fixtures for the 1x9 transceivers.
Accessory Duplex SC Connectored Cable Assemblies
Hewlett-Packard also offers two
compatible Duplex SC connectored jumper cable assemblies to
assist you in the evaluation of
these transceiver products. These
cables may be purchased from
HP with the following part
numbers. They are available
through the Hewlett-Packard
Component Field Sales Offices
and Authorized Distributors world
wide.
1. HFBR-BKD001
A duplex cable 1 meter long
assembled with 62.5/125 µm
fiber and Duplex SC connector
plugs on both ends.
2. HFBR-BKD010
A duplex cable 10 meters long
assembled with 62.5/125 µm
fiber and Duplex SC connector
plugs on both ends.
221
Page 8
HFBR-5301, -5302 Absolute Maximum Ratings
Parameter Symbol Min. Typ. Max. Unit Reference
Storage Temperature T
Lead Soldering Temperature T
Lead Soldering Time t
SOLD
SOLD
Supply Voltage V
Data Input Voltage V
Differential Input Voltage V
Output Current I
HFBR-5301, -5302 Recommended Operating Conditions
Parameter Symbol Min. Typ. Max. Unit Reference
Operating Temperature - Ambient T
Supply Voltage V
Data Input Voltage - Low V
Data Input Voltage - High V
Data and Signal Detect Output Load R
IL
IH
S
CC
D
O
A
CC
- V
- V
L
-40 100 °C
260 °C
10 sec.
-0.5 7.0 V
I
-0.5 V
CC
V
1.4 V Note 1
50 mA
070°C
4.75 5.25 V
CC
CC
-1.810 -1.475 V
-1.165 -0.880 V
50 Ω Note 3
HFBR-5301, -5302 Transmitter Electrical Characteristics
(TA = 0°C to 70°C, VCC = 4.75 V to 5.25 V)
Parameter Symbol Min. Typ. Max. Unit Reference
Supply Current I
Power Dissipation P
Data Input Current - Low I
Data Input Current - High I
CC
DISS
IL
IH
-350 0 µA
165 205 mA Note 4
0.86 1.1 W Note 4
14 350 µA
HFBR-5301, -5302 Receiver Electrical Characteristics
(TA = 0°C to 70°C, VCC = 4.75 V to 5.25 V)
Parameter Symbol Min. Typ. Max. Unit Reference
Supply Current I
Power Dissipation P
Data Output Voltage - Low VOL - V
Data Output Voltage - High VOH - V
Data Output Rise Time t
Data Output Fall Time t
Signal Detect Output Voltage - Low VOL - V
Signal Detect Output Voltage - High VOH - V
Signal Detect Output Rise Time t
Signal Detect Output Fall Time t
CC
DISS
r
f
r
f
CC
CC
CC
CC
-1.840 -1.620 V Note 17
-1.045 -0.880 V Note 17
0.35 2.2 ns Note 18
0.35 2.2 ns Note 18
-1.840 -1.620 V Note 17
-1.045 -0.880 V Note 17
0.35 2.2 ns Note 18
0.35 2.2 ns Note 18
Signal Detect Assert Time (off to on) AS_Max 0 55 100 µs Note 19
Signal Detect Deassert Time (on to off) ANS_Max 0 110 350 µs Note 20
100 165 mA Note 15
0.3 0.5 W Note 16
222
Page 9
HFBR-5301 Transmitter Optical Characteristics
(TA = 0°C to 70°C, VCC = 4.75 V to 5.25 V)
Parameter Symbol Min. Typ. Max. Unit Reference
Output Optical Power PO, BOL -21 -14 dBm avg. Note 5
62.5/125 µm, NA = 0.275 Fiber PO, EOL -22 -14 dBm avg.
Output Optical Power PO, BOL -24.5 -14 dBm avg. Note 5
50/125 µm, NA = 0.20 Fiber
Optical Extinction Ratio 0.001 0.03 % Note 6
-50 -35 dB
Center Wavelength λ
C
1270 1308 1380 nm
Spectral Width - FWHM ∆λ 137 250 nm
Optical Rise Time t
Optical Fall Time t
Deterministic Jitter Contribution DJ
r
f
C
4 ns Note 8a
4 ns Note 8a
0.16T Note 9
of Transmitter 1.20 ns p-p
Random Jitter Contribution of RJ
C
0.09T Note 10
Transmitter 0.68 ns p-p
HFBR-5301 Receiver Optical Characteristics
(TA = 0°C to 70°C, VCC = 4.75 V to 5.25 V)
Parameter Symbol Min. Typ. Max. Unit Reference
Input Optical Power P
Minimum at Window Edge Figure 9
Input Optical Power P
Minimum at Eye Center Figure 9
Input Optical Power Maximum P
Operating Wavelength λ 1260 1360 nm
Signal Detect – Asserted P
Signal Detect – Deasserted P
Signal Detect – Hysteresis PA - P
(W) -28 dBm avg. Note 11a
IN Min.
(C) -29 dBm avg. Note 12a
IN Min.
IN Max.
A
D
D
-14 dBm avg. Note 11a
PD + 1.5 dB -31 dBm avg. Note 13, 19
-45 dBm avg. Note 14, 20
1.5 2.4 dB
HFBR-5301 Receiver Electrical Characteristics
(TA = 0°C to 70°C, VCC = 4.75 V to 5.25 V)
Parameter Symbol Min. Typ. Max. Unit Reference
Deterministic Jitter Contributed by DJ
C
the Receiver 1.43 ns p-p
Random Jitter Contributed by the RJ
C
Receiver 2.64 ns p-p 11a
0.19T Note 9, 11a
0.35T Note 10,
223
Page 10
HFBR-5302 Transmitter Optical Characteristics
(TA = 0°C to 70°C, VCC = 4.75 V to 5.25 V)
Parameter Symbol Min. Typ. Max. Unit Reference
Output Optical Power PO, BOL -19 -14 dBm avg. Note 5
62.5/125 µm, NA = 0.275 Fiber PO, EOL -20 -14 dBm avg.
Output Optical Power PO, BOL -22.5 -14 dBm avg. Note 5
50/125 µm, NA = 0.20 Fiber
Optical Extinction Ratio 0.03 % Note 6
-35 dB
Center Wavelength λ
C
Spectral Width - FWHM ∆λ 137 nm Note 7
Optical Rise Time t
Optical Fall Time t
Deterministic Jitter Contribution DJ
r
f
C
of Transmitter 0.30 ns p-p
Random Jitter Contribution of RJ
C
Transmitter 0.11 ns p-p
1280 1308 1380 nm Note 7
Figure 8
Figure 8
0.6 2.0 ns Note 8
Figure 8
0.6 2.2 ns Note 8
Figure 8
0.08T Note 9
0.03T Note 10
HFBR-5302 Receiver Optical Characteristics
(TA = 0°C to 70°C, VCC = 4.75 V to 5.25 V)
Parameter Symbol Min. Typ. Max. Unit Reference
Input Optical Power P
(W) -26 dBm avg. Note 11
IN Min.
Minimum at Window Edge Figure 10
Input Optical Power P
(C) -28 dBm avg. Note 12
IN Min.
Minimum at Eye Center Figure 10
Input Optical Power Maximum P
IN Max.
-14 dBm avg. Note 11
Operating Wavelength λ 1270 1380 nm
Signal Detect – Asserted P
Signal Detect – Deasserted P
A
D
Signal Detect – Hysteresis PA - P
PD + 1.5 dB -27 dBm avg. Note 13, 19
-45 dBm avg. Note 14, 20
D
1.5 2.4 dB
HFBR-5302
Receiver Electrical Characteristics
(TA = 0°C to 70°C, VCC = 4.75 V to 5.25 V)
Parameter Symbol Min. Typ. Max. Unit Reference
Deterministic Jitter Contributed by DJ
C
the Receiver 0.90 ns p-p
Random Jitter Contributed by the RJ
C
Receiver 0.97 ns p-p
0.24T Note 9, 11
0.26T Note 10, 11
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Notes:
1. This is the maximum voltage that
can be applied across the
Differential Transmitter Data Inputs
to prevent damage to the input ESD
protection circuit.
2. When component testing these
products do not short the receiver
data or signal detect outputs directly
to ground to avoid damage to the
part.
3. The outputs are terminated with 50
Ω connected to VCC-2V.
4. The power supply current needed to
operate the transmitter is provided
to differential ECL circuitry. This
circuitry maintains a nearly constant
current flow from the power supply.
Constant current operation helps to
prevent unwanted electrical noise
from being generated and conducted
or emitted to neighboring circuitry.
5. These optical power values are
measured as follows:
• The Beginning of Life (BOL) to
the End of Life (EOL) optical
power degradation is typically 1.5
dB per the industry convention for
long wavelength LEDs. The actual
degradation observed in HewlettPackard’s 1300 nm LED products
is < 1 dB as specified in this data
sheet.
• Over the specified operating
voltage and temperature ranges.
• With 25 MBd (12.5 MHz squarewave) input signal.
• At the end of one meter of noted
optical fiber with cladding modes
removed.
The average power value can be
converted to a peak power value by
adding 3 dB. Higher output optical
power transmitters are available on
special request.
6. The Extinction Ratio is a measure of
the modulation depth of the optical
signal. The data “0” output optical
power is compared to the data “1”
peak output optical power and
expressed as a percentage. With the
transmitter driven by a 12.5 MHz
square-wave signal, the average
optical power is measured. The data
“1” peak power is then calculated by
adding 3dB to the measured average
optical power. The data “0” output
optical power is found by measuring
the optical power when the transmitter is driven by a logic “0” input. The
extinction ratio is the ratio of the
optical power at the “0” level compared to the optical power at the “1”
level expressed as a percentage or in
decibels.
7. This parameter complies with the
requirements for the tradeoffs
between center wave-length, spectral
width, and rise/fall times shown in
Figure 8.
8. The optical rise and fall times are
measured from 10% to 90% when
the transmitter is driven by a 25
MBd (12.5 MHz square-wave) input
signal. This parameter complies with
the requirements for the tradeoffs
between center wavelength, spectral
width, and rise/fall times shown in
Figure 8.
8.a. The optical rise and fall times are
measured from 10% to 90% when
the transmitter is driven by a 25
MBd (12.5 MHz square-wave) input
signal.
9. Deterministic Jitter is defined as the
combination of Duty Cycle
Distortion and Data Dependent
Jitter. Deterministic Jitter is
measured with a test pattern
consisting of repeating K28.5
(00111110101100000101) data
bytes and evaluated per the method
in FC-PH Annex A.4.3.
10. Random Jitter is specified with a
sequence of K28.7 (square wave of
alternating 5 ones and 5 zeros) data
bytes and evaluated at a Bit Error
Ratio (BER) of 1 x 10
-12
per the
method in FC-PH Annex A.4.4.
11. This specification is intended to
indicate the performance of the
receiver section of the transceiver
when Input Optical Power signal
characteristics are present per the
following definitions. The Input
Optical Power dynamic range from
the minimum level (with a window
time-width) to the maximum level is
the range over which the receiver is
specified to provide output data with
a Bit Error Rate (BER) better than
or equal to 1 x 10
-12
.
• At the Beginning of Life (BOL)
• Over the specified operating temperature and voltage ranges.
• Input is a 266 MBd, 27 - 1
psuedorandom data pattern.
• Receiver data window time-width
is ± 0.94 ns or greater and
centered at mid-symbol. This data
window time width is calculated to
simulate the effect of worst case
input jitter per FC-PH Annex J
and clock recovery sampling
position in order to insure good
operation with the various FC-0
receiver circuits.
• The integral transmitter is operating with a 266 MBd, 133 MHz
square-wave, input signal to simulate any cross-talk present
between the transmitter and
receiver sections of the
transceiver.
• The maximum total jitter added by
the receiver and the maximum
total jitter presented to the clock
recovery circuit comply with the
maximum limits listed in Annex J,
but the allocations of the Rx
added jitter between deterministic
jitter and random jitter are
different than in Annex J.
11a. Same as Note 11 except:
• The receiver input signal is a 133
MBd, 27 - 1 psuedorandom data
patter.
• The integral transmitter is operating with a 133 MBd, 66.5 MHz
square wave.
• The receiver data window width
is ± 1.73 ns.
• The receiver added jitter maximums and allocations are
identical to the limits listed in
Annex J.
12. All conditions of Note 11 apply
except that the measurement is
made at the center of the symbol
with no window time-width.
12a. All conditions of Note 11a apply
except that the measurement is
made at the center of the symbol
with no window time-width.
13. This value is measured during the
transition from low to high levels of
input optical power.
14. This value is measured during the
transition from high to low levels of
input optical power.
15. These values are measured with the
outputs terminated into 50 Ω
connected to VCC - 2 V and an input
optical power level of -14 dBm
average.
16. The power dissipation value is the
power dissipated in the receiver
itself. Power dissipation is calculated
as the sum of the products of supply
voltage and supply current, minus
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the sum of the products of the output
voltages and currents.
17. These values are measured with
respect to VCC with the output
terminated into 50 Ω connected to
VCC - 2 V.
18. The output rise and fall times are
measured between 20% and 80%
levels with the output connected to
VCC - 2 V through 50 Ω.
19. The Signal Detect output shall be
asserted within 100 µs after a step
increase of the Input Optical Power.
20. Signal detect output shall be deasserted within 350 µs after a step
decrease in the Input Optical Power.
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