Page 1
INTEGRATED CIRCUITS
DATA SH EET
HEF4794B
8-stage shift-and-store register
LED driver
Product specification
Supersedes data of 1994 Jul 01
File under Integrated Circuits, IC04
1999 Jun 30
Page 2
Philips Semiconductors Product specification
8-stage shift-and-store register LED driver HEF4794B
APPLICA TIONS
• Automotive
• Industrial.
transferred to the storage register when the strobe (STR)
input is HIGH. Data in the storage register appears at the
outputs whenever the output enable (EO) signal is HIGH.
Two serial outputs (O
and OS') are available for
S
cascading a number of HEF4794B devices. Data is
GENERAL DESCRIPTION
The HEF4794B is an 8-stage serial shift register having a
storage latch associated with each stage for strobing data
from the serial input to parallel LED driver outputs
O
to O7. Data is shifted on positive-going clock
0
transitions. The data in each shift register stage is
available at OS on positive-going clock edges to allow
high-speed operation in cascaded systems in which the
clock rise time is fast. The same serial information is
available at OS' on the next negative-going clock edge and
provides cascading HEF4794B devices when the clock
rise time is slow.
ORDERING INFORMATION
PACKAGES
TYPE NUMBER
PINS PIN POSITION MATERIAL CODE
HEF4794BT 16 SO16 plastic SOT109-1
HEF4794BP 16 DIP16 plastic SOT38-1
FUNCTIONAL DIAGRAM
LOGIC DIAGRAMS
CP
STR
EO
D2
3
1
15
V
DD
16
48 5 6 7 14 13 12 11
V
O0O1O2O3O4O5O6O
SS
HEF4794B
8-STAGE SHIFT
REGISTER
8-BIT STORAGE
REGISTER
OPEN-DRAIN OUTPUTS
Fig.1 Functional diagram.
O '
10
S
O
9
S
MBD909
7
handbook, halfpage
D
CP
O
MBD912
Fig.2 One D-latch.
1999 Jun 30 2
Page 3
Philips Semiconductors Product specification
8-stage shift-and-store register LED driver HEF4794B
handbook, full pagewidth
STAGE 0
STAGE 1 to 6 STAGE 7
PINNING
CP
STR
EO
D
DO
CP
FF
1
DO
CP
latch
1
DO
DO
CP
FF
8
DO
CP
latch
8
DQ
CP
latch
O
O '
S
S
HEF4794B
O
O1O2O3O4O5O
0
6
O
7
MBD911
Fig.3 Logic diagram.
SYMBOL PIN DESCRIPTION
STR 1 strobe input
D 2 data input
CP 3 clock input
O
0
to O
3
4 to 7 parallel outputs 0 to 3
(open drain)
V
SS
O
' 9 and 10 serial outputs
S,OS
O
7
O
6
O
5
O
4
8 ground
11 parallel output 7 (open drain)
12 parallel output 6 (open drain)
13 parallel output 5 (open drain)
14 parallel output 4 (open drain)
EO 15 output enable input
V
DD
16 supply voltage
1999 Jun 30 3
handbook, halfpage
STR
CP
O
O
O
O
V
SS
1
D
2
3
4
0
HEF4794B
5
1
6
2
7
3
8
16
15
14
13
12
11
10
9
MBD910
Fig.4 Pin configuration.
V
DD
EO
O
O
O
O
O '
O
4
5
6
7
S
S
Page 4
Philips Semiconductors Product specification
8-stage shift-and-store register LED driver HEF4794B
FUNCTIONAL DESCRIPTION
Table 1 Function table; note 1
INPUTS
CP EO STR D O
PARALLEL
OUTPUTS
O
0
↑ LXXZZO
n
SERIAL
OUTPUTS
O
OS'
S
'nc
6
↓ LXXZZncO
↑HLXncncO
↑ HHL LO
↑ HHHHO
n−1
n−1
'nc
6
O
'nc
6
O
'nc
6
↓ H H H nc nc nc O
Note
1. H = HIGH state;
L = LOW state;
X = don’t care;
↑ = positive-going transition;
↓ = negative-going transition;
Z = high-impedance OFF state;
nc = no change;
O
' = the information in the seventh shift register
6
stage.
a) At the positive clock edge the information in the
7thregister stage is transferred to the 8thregister
stage and the OSoutput.
FAMILY DATA
See
“Family Specifications”
except for: rating for DC
current into any open-drain output is 40 mA.
I
LIMITS CATEGORY MSI
DD
See
“Family Specifications”
7
7
for ratings.
DC CHARACTERISTICS
V
=0V.
SS
SYMBOL PARAMETER CONDITIONS
V
OL
LOW level output
voltage
VI=VSSor VDD;
IO < 20 mA; VDD=5V
V
I=VSS
or VDD;
IO < 20 mA;
VDD=10V
V
I=VSS
or VDD;
IO < 20 mA;
VDD=15V
I
OZH
HIGH level output
leakage current;
3-state
VO=15V; VDD=5V − 2 − 2 − 15 µA
=15V; VDD=10V − 2 − 2 − 15 µA
V
O
V
=15V; VDD=15V − 2 − 2 − 15 µA
O
1999 Jun 30 4
T
(°C)
amb
MIN. MAX. MIN. MAX. MIN. MAX.
− 0.75 − 0.75 − 1.5 V
− 0.75 − 0.75 − 1.5 V
− 0.75 − 0.75 − 1.5 V
UNIT−40 +25 +85
Page 5
Philips Semiconductors Product specification
8-stage shift-and-store register LED driver HEF4794B
AC POWER CHARACTERISTICS
V
=0V; T
SS
SYMBOL PARAMETER CONDITIONS TYPICAL FORMULA FOR P (µW)
P dynamic power dissipation per
Note
1. Where:
R
= ∞;
L
fi= input frequency (MHz);
fo= output frequency (MHz);
CL= load capacitance (pF);
Σ(foCL) = sum of outputs;
VDD= supply voltage (V).
=25°C; input transition times ≤ 20 ns; unless otherwise specified.
amb
VDD=5V
package
V
=10V
DD
=15V
V
DD
1200fiΣ foCL()V
5550f
15000f
Σ foCL()V
i
Σ foCL()V
i
2
×+
DD
2
×+
DD
2
×+
DD
(1)
AC TIMING CHARACTERISTICS
V
SS
=0V; T
=25°C; CL= 50 pF; input transition times ≤20 ns; unless otherwise specified.
amb
SYMBOL PARAMETER
t
PHL
propagation delay time CP to OS;
HIGH-to-LOW
t
PLH
propagation delay time CP to OS;
LOW-to-HIGH
t
PHL
propagation delay time CP to OS';
HIGH-to-LOW
t
PLH
propagation delay time CP to OS';
LOW-to-HIGH
t
PZL
propagation delay time CP to On;
OFF-to-LOW
t
PLZ
propagation delay time CP to On;
LOW-to-OFF
V
(V)
DD
MIN. TYP. MAX. UNIT
TYPICAL
EXTRAPOLATION
FORMULA
5 − 160 320 ns 132 ns + (0.55 ns/pF)C
10 − 65 130 ns 53 ns + (0.23 ns/pF)C
15 − 45 90 ns 37 ns + (0.16 ns/pF)C
5 − 130 260 ns 102 ns + (0.55 ns/pF)C
10 − 55 110 ns 44 ns + (0.23 ns/pF)C
15 − 40 80 ns 32 ns + (0.16 ns/pF)C
5 − 120 240 ns 92 ns + (0.55 ns/pF)C
10 − 50 100 ns 39 ns + (0.23 ns/pF)C
15 − 40 80 ns 32 ns + (0.16 ns/pF)C
5 − 130 260 ns 102 ns + (0.55 ns/pF)C
10 − 60 120 ns 49 ns + (0.23 ns/pF)C
15 − 45 90 ns 37 ns + (0.16 ns/pF)C
5 − 240 480 ns note 1
10 − 80 160 ns
15 − 55 110 ns
5 − 170 340 ns note 1
10 − 75 150 ns
15 − 60 120 ns
L
L
L
L
L
L
L
L
L
L
L
L
1999 Jun 30 5
Page 6
Philips Semiconductors Product specification
8-stage shift-and-store register LED driver HEF4794B
SYMBOL PARAMETER
t
PZL
propagation delay time STR to On;
OFF-to-LOW
t
PLZ
propagation delay time STR to On;
LOW-to-OFF
t
THL
output transition time OSand OS';
HIGH-to-LOW
t
TLH
output transition time OSand OS';
LOW-to-HIGH
t
PZL
output enable time EO to On;
OFF-to-LOW
t
PLZ
output disable time EO to On;
LOW-to-OFF
t
WCPL
t
WSTRH
t
su
t
h
f
clk(max)
minimum clock pulse width LOW 5 60 30 − ns
minimum strobe pulse width HIGH 5 80 40 − ns
set-up time D to CP 5 60 30 − ns
hold time D to CP +5 +5 −15 − ns
maximum clock frequency 5 5 10 − MHz
V
(V)
DD
MIN. TYP. MAX. UNIT
TYPICAL
EXTRAPOLATION
FORMULA
5 − 140 280 ns note 1
10 − 70 140 ns
15 − 55 110 ns
5 − 100 200 ns note 1
10 − 40 100 ns
15 − 35 70 ns
5 − 85 170 ns 35 ns + (1.0 ns/pF)C
10 − 40 80 ns 19 ns + (0.42 ns/pF)C
15 − 30 60 ns 16 ns + (0.28 ns/pF)C
5 − 85 170 ns 35 ns + (1.0 ns/pF)C
10 − 40 80 ns 19 ns + (0.42 ns/pF)C
15 − 30 60 ns 16 ns + (0.28 ns/pF)C
5 − 100 200 ns note 1
10 − 55 110 ns
15 − 50 100 ns
5 − 80 160 ns note 1
10 − 40 80 ns
15 − 30 60 ns
10 30 15 − ns
15 24 12 − ns
10 60 30 − ns
15 24 12 − ns
10 20 10 − ns
15 15 5 − ns
10 20 5 − ns
15 20 5 − ns
10 11 22 − MHz
15 14 28 − MHz
L
L
L
L
L
L
Note
1. Definition of symbol equivalent to 3-state outputs.
1999 Jun 30 6
Page 7
Philips Semiconductors Product specification
8-stage shift-and-store register LED driver HEF4794B
handbook, full pagewidth
clock input
data input
strobe input
output enable input
internal O ' (FF1)
output O
internal O ' (FF7)
output O
serial output O
serial output O '
0
0
6
6
S
S
MBD914
Fig.5 Timing diagram.
1999 Jun 30 7
Page 8
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1999 Jun 30 8
V
DD
V
CC
APPLICATION INFORMATION
Philips Semiconductors Product specification
8-stage shift-and-store register LED driver HEF4794B
PWM
dimmer input
SYNC CIRCUITRY
DATA CLOCK
V
D
CONTROL AND
from remote
controller
O
0
DD
STR CP
EO
HEF4794B
Fig.6 Application example: serial-to-parallel converting LED drivers.
O
7
O '
S
V
SS
handbook, full pagewidth
O
0
V
DD
D
STR CP
EO
HEF4794B
O
V
7
O '
SS
S
MBD913
Page 9
Philips Semiconductors Product specification
8-stage shift-and-store register LED driver HEF4794B
PACKAGE OUTLINES
SO16: plastic small outline package; 16 leads; body width 3.9 mm
D
c
y
Z
16
pin 1 index
1
e
9
8
w M
b
p
SOT109-1
E
H
E
A
2
A
1
L
detail X
A
X
v M
A
Q
(A )
L
p
A
3
θ
0 2.5 5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
mm
OUTLINE
VERSION
SOT109-1
A
max.
1.75
0.069
A1A
0.25
0.10
0.010
0.004
A3b
2
1.45
0.25
1.25
0.057
0.01
0.049
IEC JEDEC EIAJ
076E07S MS-012AC
p
0.49
0.36
0.019
0.014
0.25
0.19
0.0100
0.0075
UNIT
inches
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
(1)E(1) (1)
cD
10.0
4.0
9.8
3.8
0.39
0.16
0.15
0.050
0.38
REFERENCES
1999 Jun 30 9
eHELLpQZywv θ
1.27
6.2
5.8
0.244
0.228
1.05
0.041
1.0
0.4
0.039
0.016
0.7
0.25
0.6
0.028
0.01 0.004
0.020
EUROPEAN
PROJECTION
0.25 0.1
0.01
0.7
0.3
0.028
0.012
ISSUE DATE
95-01-23
97-05-22
o
8
o
0
Page 10
Philips Semiconductors Product specification
8-stage shift-and-store register LED driver HEF4794B
DIP16: plastic dual in-line package; 16 leads (300 mil); long body
D
seating plane
L
Z
16
pin 1 index
e
b
b
1
9
A
w M
SOT38-1
M
E
A
2
A
1
c
(e )
1
M
H
E
1
0 5 10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
UNIT
mm
inches
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
A
max.
4.7 0.51 3.7
OUTLINE
VERSION
SOT38-1
min.
A
1 2
max.
0.15
IEC JEDEC EIAJ
050G09 MO-001AE
b
1.40
1.14
0.055
0.045
b
1
0.53
0.38
0.021
0.015
cEe M
0.32
0.23
0.013
0.009
REFERENCES
(1) (1)
D
21.8
21.4
0.86
0.84
1999 Jun 30 10
8
6.48
6.20
0.26
0.24
e
0.30
1
0.15
0.13
M
L
3.9
3.4
E
8.25
7.80
0.32
0.31
EUROPEAN
PROJECTION
H
9.5
0.2542.54 7.62
8.3
0.37
0.010.100.0200.19
0.33
ISSUE DATE
w
92-10-02
95-01-19
Z
max.
2.2
0.087
(1)
Page 11
Philips Semiconductors Product specification
8-stage shift-and-store register LED driver HEF4794B
SOLDERING
Introduction
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
“Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mount components are mixed on
one printed-circuit board. However, wave soldering is not
always suitable for surface mount ICs, or for printed-circuit
boards with high population densities. In these situations
reflow soldering is often used.
Through-hole mount packages
S
OLDERING BY DIPPING OR BY SOLDER WAVE
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joints for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
stg(max)
). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
M
ANUAL SOLDERING
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400 °C, contact may be up to 5 seconds.
Surface mount packages
REFLOW SOLDERING
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.
W
AVE SOLDERING
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
ANUAL SOLDERING
M
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
1999 Jun 30 11
Page 12
Philips Semiconductors Product specification
8-stage shift-and-store register LED driver HEF4794B
Suitability of IC packages for wave, reflow and dipping soldering methods
MOUNTING PACKAGE
Through-hole mount DBS, DIP, HDIP, SDIP, SIL suitable
WAVE REFLOW
(2)
− suitable
(1)
DIPPING
Surface mount BGA, SQFP not suitable suitable −
SOLDERING METHOD
HLQFP, HSQFP, HSOP, HTQFP, HTSSOP,
not suitable
(3)
suitable −
SMS
(4)
PLCC
LQFP, QFP, TQFP not recommended
SSOP, TSSOP, VSO not recommended
, SO, SOJ suitable suitable −
(4)(5)
suitable −
(6)
suitable −
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
.
2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
1999 Jun 30 12
Page 13
Philips Semiconductors Product specification
8-stage shift-and-store register LED driver HEF4794B
DEFINITIONS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1999 Jun 30 13
Page 14
Philips Semiconductors Product specification
8-stage shift-and-store register LED driver HEF4794B
NOTES
1999 Jun 30 14
Page 15
Philips Semiconductors Product specification
8-stage shift-and-store register LED driver HEF4794B
NOTES
1999 Jun 30 15
Page 16
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Tel. +31 40 27 82785, Fax. +31 40 27 88399
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811
Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341
Pakistan: see Singapore
Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. +48 22 612 2831, Fax. +48 22 612 2327
Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 755 6918, Fax. +7 095 755 6919
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,
Tel. +65 350 2538, Fax. +65 251 6500
Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. +27 11 471 5401, Fax. +27 11 471 5398
South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 821 2382
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 93 301 6312, Fax. +34 93 301 4107
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2741 Fax. +41 1 488 3263
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 62 5344, Fax.+381 11 63 5777
For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
© Philips Electronics N.V. SCA
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
1999 66
Internet: http://www.semiconductors.philips.com
Printed in The Netherlands 245002/02/pp16 Date of release: 1999 Jun 30 Document order number: 9397 750 06151
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