Datasheet HEF4750V Datasheet (Philips)

Page 1
INTEGRATED CIRCUITS
DATA SH EET
•The IC04 LOCMOS HE4000B Logic Family Specifications HEF, HEC
•The IC04 LOCMOS HE4000B Logic Package Outlines/Information HEF, HEC
HEF4750V LSI
Frequency synthesizer
Product specification File under Integrated Circuits, IC04
January 1995
Page 2
Philips Semiconductors Product specification
Frequency synthesizer

DESCRIPTION

The HEF4750V frequency synthesizer is one of a pair of LOCMOS devices, primarily intended for use in high-performance frequency synthesizers, e.g. in all communication, instrumentation, television and broadcast applications. A combination of analogue and digital techniques results in an integrated circuit that enables high performance. The complementary device is the universal divider type HEF4751V.
Together with a standard prescaler, the two LOCMOS integrated circuits offer low-cost single loop synthesizers with full professional performance. Salient features offered (in combination with HEF4751V) are:
• Wide choice of reference frequency using a single crystal.
• High-performance phase comparator low phase noise low spurii.
• System operation to > 1 GHz.
• Typical 15 MHz input at 10 V.
• Flexible programming:
frequency offsets ROM compatible fractional channel capability.
1
• Programme range 6 3 decades of prescaler control.
• Division range extension by cascading.
• Built-in phase modulator.
• Fast lock feature.
• Out-of-lock indication.
• Low power dissipation and high noise immunity.
⁄2 decades, including up to
HEF4750V
LSI

SUPPLY VOLTAGE

RATING RECOMMENDED OPERATING
−0,5 to +15 9,5 to 10,5 V

APPLICATION INFORMATION

Some examples of applications for the HEF4750V in combination with the HEF4751V are:
• VHF/UHF mobile radios.
• HF s.s.b. transceivers.
• Airborne and marine communications and navaids.
• Broadcast transmitters.
• High quality radio and television receivers.
• High performance citizens band equipment.
• Signal generators.
January 1995 2
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Philips Semiconductors Product specification
Frequency synthesizer
HEF4750V

PINNING

R phase comparator input, reference V phase comparator input STB strobe input TCA timing capacitor C TCB timing capacitor C TCC timing capacitor C TRA biasing pin (resistor R PC PC
1 2
analogue phase comparator output
digital phase comparator output MOD phase modulation input OL out-of-lock indication OSC reference oscillator/buffer input XTAL reference oscillator/buffer output A
to A
0
NS
, NS1programming inputs, prescaler
0
programming inputs/programmable divider
9
OUT reference divider output
pin
A
pin
B
pin
C
)
A
LSI
Fig.1 Pinning diagram.
HEF4750VD(F): 28-lead DIL; ceramic (cerdip)
(SOT135)
( ): Package Designator North America
January 1995 3
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January 1995 4
Philips Semiconductors Product specification

Frequency synthesizer

N.B. PC1= analogue output; PC2= 3-state output.
Fig.2 Block diagram comprising five basic functions: phase comparator 1 (PC1), phase comparator 2 (PC2), phase modulator, reference
oscillator and reference divider. These functions are described separately.
HEF4750V
LSI
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Philips Semiconductors Product specification
Frequency synthesizer
FUNCTIONAL DESCRIPTION Phase comparator 1
Phase comparator 1 (PC1) is built around a SAMPLE and HOLD circuit. A negative-going transition at the V-input causes the hold capacitor (C a specified delay, caused by the Phase Modulator by means of an internal V’ pulse, it produces a positive-going ramp. A negative-going transition at the R-input terminates
) to be discharged and after
A
HEF4750V
LSI
the ramp. Capacitor C has attained. Via an internal sampling switch this voltage is transferred to CCand in turn buffered and made available at output PC1.
If the ramp terminates before an R-input is present, an internal end of ramp (EOR) signal is produced.
These actions are illustrated in Fig.3.
holds the voltage that the ramp
A
Fig.3 Waveforms associated with PC1.
The resultant phase characteristic is shown in Fig.4.
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Philips Semiconductors Product specification
Frequency synthesizer
Fig.4 Phase characteristic of PC1.
PC1 is designed to have a high gain, typically 3200 V/cycle (at 12,5 kHz). This enables a low noise performance.
Phase comparator 2
Phase comparator 2 (PC2) has a wide range, which enables faster lock times to be achieved than otherwise would be possible. It has a linear ± 360° phase range, which corresponds to a gain of typically 5 V/cycle.
HEF4750V
LSI
This digital phase comparator has three stable states:
• reset state,
• V’ leads R state,
• R leads V’ state.
Fig.5 State diagram of PC2.
Output PC2produces positive or negative-going pulses with variable width; they depend on the phase relationship of R and V’. The average output voltage is a linear function of the phase difference. Output PC2remains in the high impedance OFF-state in the region in which PC1 operates. The resultant phase characteristic is shown in Fig.6.
Conversion from one state to another takes place according to the state diagram of Fig.5.
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Philips Semiconductors Product specification
Frequency synthesizer
Fig.6 Phase characteristic of PC2.
Strobe function
The strobe function is intended for applications requiring extremely fast lock times. In normal operation the additional strobe input (STB) can be connected to the V-input and the circuit will function as described in the previous sections.
In single, phase-locked-loop type frequency synthesizers, the comparison frequency generally used is either the nominal channel spacing or a sub-multiple. PC2 runs at the higher frequency (a higher reference frequency must also be used), whilst strobing takes place on the lower frequency, thereby obtaining a decrease in lock time. In a system using the Universal Divider HEF4751V, the output OFS cycles on the lower frequency, the output OFF cycles on the higher frequency.
HEF4750V
LSI
way. If no modulation is required, the MOD-input must be connected to a fixed voltage of a certain positive value up
. Care must be taken that the V’ pulse is never
to V
DD
smaller than the minimum value to ensure that the external capacitor of PC1 (CA) can be discharged during that time. Since the V’ pulse width is directly related to the TCB ramp duration, there is a requirement for the minimum value of this ramp duration.
Reference oscillator
The reference oscillator normally operates with an external crystal as shown in Fig.2. The internal circuitry can be used as a buffer amplifier in case an external reference should be required.
Reference divider
Out-of-lock function
There are a number of situations in which the system goes from the locked to the out-of-lock state (OL goes HIGH):
1. When V’ leads R, however out of the range of PC1.
2. When R leads V’.
3. When an R-pulse is missing.
4. When a V-pulse is missing.
5. When two successive STB-commands occur, the first without corresponding V-signal.
Phase modulator
The phase modulator only uses one external capacitor,
at pin TCB. A negative-going transition at the V-input
C
B
causes CBto produce a positive-going linear ramp. When the ramp has reached a value almost equal to the modulation input voltage (at MOD), the ramp terminates, CBdischarges and a start signal to the CA-ramp at TCA is produced. A linear phase modulation is reached in this
January 1995 7
The reference divider consists of a binary divider with a programmable division ratio of 1 to 1024 and a prescaler with selectable division ratios of 1, 2, 10 and 100, according to the following tables:
Binary divider
N (A
TO A9) DIVISION RATIO
0
0 1024
0 ≤ N ≤ 1023 N
Prescaler
PROGRAMMING WORD
, NS1)
(NS
0
01 12 210 3 100
DIVISION RATIO
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Philips Semiconductors Product specification
Frequency synthesizer
In this way suitable comparison frequencies can be obtained from a range of crystal frequencies. The divider can also be used as a ‘stand alone’ programmable divider by connecting input TRA to VDD, which causes all internal analogue currents to be switched off.
Biasing circuitry
The biasing circuitry uses an external current source or resistor, which has to be connected between the TRA and V
pins. This circuitry supplies all analogue parts of the
SS
circuit. Consequently the analogue properties of the device, such as gain, charge currents, speed, power dissipation, impedance levels etc., are mainly determined by the value of the input current at TRA. The TRA input must be decoupled to V CDhas to be chosen such that the TRA input is ‘clean’, e.g. 10 nF at RA= 68 kΩ.
, as shown in Fig.7. The value of
DD
HEF4750V
LSI
Fig.7 Decoupling of input TRA.

RATINGS

Limiting values in accordance with the Absolute Maximum System (IEC 134)
Supply voltage V Voltage on any input V
DD I
−0,5 to + 15 V
−0,5 to VDD+ 0,5 V
D.C. current into any input or output ± I max. 10 mA Power dissipation per package
for T
= 0 to + 85 °CP
amb
tot
max. 500 mW
Power dissipation per output
for T Storage temperature T Operating ambient temperature T
= 0 to 85 °C P max. 100 mW
amb
stg amb
−65 to + 150 °C
−40 to + 85 °C
January 1995 8
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Philips Semiconductors Product specification
Frequency synthesizer
HEF4750V

DC CHARACTERISTICS

at V
= 10 V ± 5%; voltages are referenced to VSS= 0 V, unless otherwise specified; for definitions see note 1.
DD
T
(°C
amb
PARAMETER SYMBOL
MIN. TYP. MAX. MIN. TYP. MAX. MIN. TYP. MAX.
Quiescent device
current I
DD
−− 100 −− 100 −− 750 µA2
Input current; logic
inputs, MOD ± I
IN
−− 300 −− 300 −− 1000 nA 3
Output leakage current
at1⁄2V
DD
TCA, hold-state ± I
Z
−− 20 − 0,05 20 −− 60 nA
TCC, analogue
switch OFF ± I
PC
, high impedance
2
OFF-state ± I
Z
Z
−− 20 − 0,05 20 −− 60 nA
−− 50 −− 50 −− 500 nA
Logic input voltage
LOW V
HIGH V
IL IH
 max. 0,3 VDD V  max. 0,7 VDD V
Logic output voltage
LOW; at I
HIGH V
<1µAV
O
OL OH
−− 50 −− 50 −− 50 mV 3  min. VDD− 50 mV  mV 3
Logic output current
LOW; at VOL= 0,5 V 3 outputs OL, PC
OUT I
output XTAL I
,
2
OL OL
5,5 −−4,6 −−3,6 −−mA 2,8 −−2,4 −−1,9 −−mA
Logic output current
HIGH; at V
OH=VDD
outputs OL, PC output XTAL −I
− 0,5 V 3 ,OUT −I
2
OH OH
1,5 −−1,3 −−1,0 −−mA 1,4 −−1,2 −−0,9 −−mA
Output TCC sink
current I
O
−− −−2,1 −− − −mA 3,4,5
Output TCC source
current −I
O
−− −−1,9 −− − −mA 3,4,6
Internal resistance
of TCC
output swing
≤ 200 mV
specified output range:
0,3 V
DD
to 0,7 V
DDRi
−− −−0,7 −− − −kΩ 3,4
UNIT NOTES−40 + 25 + 85
LSI
3,4
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Philips Semiconductors Product specification
Frequency synthesizer
HEF4750V
T
(°C
amb
PARAMETER SYMBOL
MIN. TYP. MAX. MIN. TYP. MAX. MIN. TYP. MAX.
Output TCC voltage
with respect to TCA input voltage ∆V − 0 −− 0 −− 0 −V 3,4,7
Output PC
current I
Output PC
current −I
sink
1
source
1
O
O
−− −−1,1 −− − −mA 3,4,8
−− −−1,0 −− − −mA 3,4,9
Internal resistance
of PC
1
output swing
≤ 200 mV
specified output range:
0,3 V
Output PC
to 0,7 V
DD
voltage
1
DDRi
−− −−1,4 −− − −kΩ 3,4
with respect to TCC input voltage ∆V − 0 −− 0 −− 0 −V 3,4,10
EOR generation
V
EOR=VDD
− V
TCA
V
EOR
− 0,9 −− 0,7 −− 0,6 − V 3,4,11
Source current; HIGH
at V
OUT
=1⁄2VDD; output in ramp mode 3,4 TCA I TCB I
O O
−− −−13 −− − −mA
−− −−2,5 −− − −mA
UNIT NOTES−40 + 25 + 85
LSI
January 1995 10
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Philips Semiconductors Product specification
Frequency synthesizer
HEF4750V
AC CHARACTERISTICS General note
The dynamic specifications are given for the circuit built-up with external components as given in Fig.8, under the following conditions; for definitions see note 1; for definitions of times see Fig.19; V transition times ≤ 20 ns; R
= 68 kΩ±30% (see also note 4); CA= 270 pF; CB= 150 pF; CC= 1 nF; CD= 10 nF; unless
A
otherwise specified.
SYMBOL MIN. TYP. MAX. UNIT CONDITIONS NOTES
Slew rate
TCA S TCA S TCB S TCB S
TCA TCA TCB TCB
− 52 − V/µsR
− 28 − V/µsR
− 20 − V/µsR
− 10 − V/µsR
Ramp linearity
TCA I TCB I
Start of TCA-ramp delay t Delay of TCA-hold t Delay of TCA-discharge t Start of TCB-ramp delay t TCB-ramp duration t
TCA TCB CBCA RCA VCA VCB rCB
t
rCB
t
rCB
− 2 − %13
− 2 − %13
− 200 − ns
− 40 − ns
− 60 − ns
− 60 − ns
− 250 − ns V
− 350 − ns V
− 450 − ns V
Required TCB min.
ramp duration t
rCB
− 150 − ns 14
Pulse width
V : LOW t V : HIGH t R : LOW t R : HIGH t STB : LOW t STB : HIGH t
PWVL PWVH PWRL PWRH PWSL PWSH
− 20 − ns
− 20 − ns
− 20 − ns
− 20 − ns
− 20 − ns
− 20 − ns
Fall time
TCA t TCB t
Prescaler input frequency f Binary divider frequency f Crystal oscillator frequency f
fCA fCB PR DIV OSC
− 50 − ns
− 50 − ns
− 30 − MHz all division ratios
− 30 − MHz all division ratios
− 10 − MHz
Average power supply current locked state
with speed-up 1 : 10 I without speed-up I
P P
− 3,6 − mA 15
− 3,2 − mA 16
= 10 V ± 5%; T
DD
= minimum 12
A
= maximum 12
A
= minimum 12
A
= maximum 12
A
MOD MOD MOD
=4V =6V =8V
=25°C; input
amb
LSI
January 1995 11
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Philips Semiconductors Product specification
Frequency synthesizer
HEF4750V
LSI
Notes
1. Definitions: RA= external biasing resistor between pins TRA and VSS; 68 kΩ±30%. CA= external timing capacitor for time/voltage converter, between pins TCA and VSS. CB= external timing capacitor for phase modulator, between pins TCB and VSS. CC= external hold capacitor between pins TCC and VSS. CD= decoupling capacitor between pins TRA and VDD. Logic inputs: V, R, STB, A0to A9, NS0, NS1, OSC. Logic outputs: OL, PC2, XTAL, OUT. Analogue signals: TCA, TCB, TCC, TRA, PC1, MOD.
2. TRA at VDD; TCA, TCB, TCC and MOD at VSS; logic inputs at VSSor VDD.
3. All logic inputs at VSSor VDD.
4. RAconnected; its value chosen such that I
5. The analogue switch is in the ON position (see Fig.9).
6. The analogue switch is in the ON position (see Fig.10).
7. See Fig.11. This guarantees the d.c. voltage gain, combined with d.c.-offset. Input condition: 0,3 VDD≤ V ∆V=V
TCC−VTCA
.
TCA
≤ 0,7 VDD.
8. See Fig.12.
9. See Fig.13.
10. See Fig.14. This guarantees the d.c. voltage gain, combined with d.c.-offset. Input condition: 0,3 VDD≤ V ∆V=V
PC1−VTCC
.
TCC
≤ 0,7 VDD.
11. Switching level at TCA, generating an EOR-signal, during increasing input voltage.
12. See Fig.15.
13. See Fig.16. Definition of the ramp linearity at full swing.
14. The external components and modulation input voltage must be chosen such that this requirement will be fulfilled, to ensure that CAis sufficiently discharged during that time.
15. See Fig.17. Circuit connections for power supply current specification, with speed-up 1 : 10. V and R are in the range of PC1, such that the output voltage at PC1is equal to 5 V. f
= 5 MHz (external clock)
OSC
f
= 12,5 kHz
STB
fV= 125 kHz
16. See Fig.18. Circuit connections for power supply current specification, without speed-up. V and R are in the range of PC1, such that the output voltage at PC1is equal to 5 V. f
= 5 MHz (external clock)
OSC
f
= 12,5 kHz
STB
fV= 12,5 kHz
= 100 µA.
TRA
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Philips Semiconductors Product specification
Frequency synthesizer
HEF4750V
LSI
Fig.8 Test circuit for measuring a.c.
characteristics.
Fig.9 Equivalent circuit for note 5. Fig.10 Equivalent circuit for note 6.
Fig.11 Circuit for note 7. Fig.12 Equivalent circuit for PC1sink current.
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Philips Semiconductors Product specification
Frequency synthesizer
Fig.13 Equivalent circuit for PC1source current. Fig.14 Circuit for note 10.
HEF4750V
LSI
Fig.15 Waveform at the output.
Linearity
--------------------- -
1/2V
DD
100× %.=
∆V
Fig.16 Definition of the ramp linearity at full swing.
∆V is the maximum deviation of the ramp waveform to the straight line, which joins the 30% VDDand 70% VDDpoints.
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Philips Semiconductors Product specification
Frequency synthesizer
HEF4750V
LSI
Fig.17 Circuit for note 15.
Fig.18 Circuit for note 16.
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Philips Semiconductors Product specification
Frequency synthesizer
HEF4750V
LSI
(1) Forbidden zone in the
January 1995 16
locked state
for the positive edge of V and R and both edges of STB.
Fig.19 Waveforms showing times in the locked state.
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Philips Semiconductors Product specification
Frequency synthesizer

APPLICATION INFORMATION

HEF4750V
LSI
Fig.20 Application of HEF4750V as horizontal sync circuit with Phase-Locked Loop (PLL) and LC oscillator with
vari-cap control.
January 1995 17
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