Product specification
File under Integrated Circuits, IC04
January 1995
Page 2
Philips SemiconductorsProduct specification
Frequency synthesizer
DESCRIPTION
The HEF4750V frequency synthesizer is one of a pair of
LOCMOS devices, primarily intended for use in
high-performance frequency synthesizers, e.g. in all
communication, instrumentation, television and broadcast
applications. A combination of analogue and digital
techniques results in an integrated circuit that enables high
performance. The complementary device is the universal
divider type HEF4751V.
Together with a standard prescaler, the two LOCMOS
integrated circuits offer low-cost single loop synthesizers
with full professional performance. Salient features offered
(in combination with HEF4751V) are:
• Wide choice of reference frequency using a single
crystal.
frequency offsets
ROM compatible
fractional channel capability.
1
• Programme range 6
3 decades of prescaler control.
• Division range extension by cascading.
• Built-in phase modulator.
• Fast lock feature.
• Out-of-lock indication.
• Low power dissipation and high noise immunity.
⁄2 decades, including up to
HEF4750V
LSI
SUPPLY VOLTAGE
RATINGRECOMMENDED OPERATING
−0,5 to +159,5 to 10,5 V
APPLICATION INFORMATION
Some examples of applications for the HEF4750V in
combination with the HEF4751V are:
• VHF/UHF mobile radios.
• HF s.s.b. transceivers.
• Airborne and marine communications and navaids.
• Broadcast transmitters.
• High quality radio and television receivers.
• High performance citizens band equipment.
• Signal generators.
January 19952
Page 3
Philips SemiconductorsProduct specification
Frequency synthesizer
HEF4750V
PINNING
Rphase comparator input, reference
Vphase comparator input
STBstrobe input
TCAtiming capacitor C
TCBtiming capacitor C
TCCtiming capacitor C
TRAbiasing pin (resistor R
PC
PC
1
2
analogue phase comparator output
digital phase comparator output
MODphase modulation input
OLout-of-lock indication
OSCreference oscillator/buffer input
XTALreference oscillator/buffer output
A
to A
0
NS
, NS1programming inputs, prescaler
0
programming inputs/programmable divider
9
OUTreference divider output
pin
A
pin
B
pin
C
)
A
LSI
Fig.1 Pinning diagram.
HEF4750VD(F):28-lead DIL; ceramic (cerdip)
(SOT135)
( ): Package Designator North America
January 19953
Page 4
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oscillator and reference divider. These functions are described separately.
HEF4750V
LSI
Page 5
Philips SemiconductorsProduct specification
Frequency synthesizer
FUNCTIONAL DESCRIPTION
Phase comparator 1
Phase comparator 1 (PC1) is built around a SAMPLE and
HOLD circuit. A negative-going transition at the V-input
causes the hold capacitor (C
a specified delay, caused by the Phase Modulator by
means of an internal V’ pulse, it produces a positive-going
ramp. A negative-going transition at the R-input terminates
) to be discharged and after
A
HEF4750V
LSI
the ramp. Capacitor C
has attained. Via an internal sampling switch this voltage
is transferred to CCand in turn buffered and made
available at output PC1.
If the ramp terminates before an R-input is present, an
internal end of ramp (EOR) signal is produced.
These actions are illustrated in Fig.3.
holds the voltage that the ramp
A
Fig.3 Waveforms associated with PC1.
The resultant phase characteristic is shown in Fig.4.
January 19955
Page 6
Philips SemiconductorsProduct specification
Frequency synthesizer
Fig.4 Phase characteristic of PC1.
PC1 is designed to have a high gain, typically 3200 V/cycle
(at 12,5 kHz). This enables a low noise performance.
Phase comparator 2
Phase comparator 2 (PC2) has a wide range, which
enables faster lock times to be achieved than otherwise
would be possible. It has a linear ± 360° phase range,
which corresponds to a gain of typically 5 V/cycle.
HEF4750V
LSI
This digital phase comparator has three stable states:
• reset state,
• V’ leads R state,
• R leads V’ state.
Fig.5 State diagram of PC2.
Output PC2produces positive or negative-going pulses
with variable width; they depend on the phase relationship
of R and V’. The average output voltage is a linear function
of the phase difference. Output PC2remains in the high
impedance OFF-state in the region in which PC1 operates.
The resultant phase characteristic is shown in Fig.6.
Conversion from one state to another takes place
according to the state diagram of Fig.5.
January 19956
Page 7
Philips SemiconductorsProduct specification
Frequency synthesizer
Fig.6 Phase characteristic of PC2.
Strobe function
The strobe function is intended for applications requiring
extremely fast lock times. In normal operation the
additional strobe input (STB) can be connected to the
V-input and the circuit will function as described in the
previous sections.
In single, phase-locked-loop type frequency synthesizers,
the comparison frequency generally used is either the
nominal channel spacing or a sub-multiple. PC2 runs at
the higher frequency (a higher reference frequency must
also be used), whilst strobing takes place on the lower
frequency, thereby obtaining a decrease in lock time. In a
system using the Universal Divider HEF4751V, the output
OFS cycles on the lower frequency, the output OFF cycles
on the higher frequency.
HEF4750V
LSI
way. If no modulation is required, the MOD-input must be
connected to a fixed voltage of a certain positive value up
. Care must be taken that the V’ pulse is never
to V
DD
smaller than the minimum value to ensure that the external
capacitor of PC1 (CA) can be discharged during that time.
Since the V’ pulse width is directly related to the TCB ramp
duration, there is a requirement for the minimum value of
this ramp duration.
Reference oscillator
The reference oscillator normally operates with an external
crystal as shown in Fig.2. The internal circuitry can be
used as a buffer amplifier in case an external reference
should be required.
Reference divider
Out-of-lock function
There are a number of situations in which the system goes
from the locked to the out-of-lock state (OL goes HIGH):
1. When V’ leads R, however out of the range of PC1.
2. When R leads V’.
3. When an R-pulse is missing.
4. When a V-pulse is missing.
5. When two successive STB-commands occur, the first
without corresponding V-signal.
Phase modulator
The phase modulator only uses one external capacitor,
at pin TCB. A negative-going transition at the V-input
C
B
causes CBto produce a positive-going linear ramp. When
the ramp has reached a value almost equal to the
modulation input voltage (at MOD), the ramp terminates,
CBdischarges and a start signal to the CA-ramp at TCA is
produced. A linear phase modulation is reached in this
January 19957
The reference divider consists of a binary divider with a
programmable division ratio of 1 to 1024 and a prescaler
with selectable division ratios of 1, 2, 10 and 100,
according to the following tables:
Binary divider
N (A
TO A9)DIVISION RATIO
0
01024
0 ≤ N ≤ 1023N
Prescaler
PROGRAMMING WORD
, NS1)
(NS
0
01
12
210
3100
DIVISION RATIO
Page 8
Philips SemiconductorsProduct specification
Frequency synthesizer
In this way suitable comparison frequencies can be
obtained from a range of crystal frequencies. The divider
can also be used as a ‘stand alone’ programmable divider
by connecting input TRA to VDD, which causes all internal
analogue currents to be switched off.
Biasing circuitry
The biasing circuitry uses an external current source or
resistor, which has to be connected between the TRA and
V
pins. This circuitry supplies all analogue parts of the
SS
circuit. Consequently the analogue properties of the
device, such as gain, charge currents, speed, power
dissipation, impedance levels etc., are mainly determined
by the value of the input current at TRA. The TRA input
must be decoupled to V
CDhas to be chosen such that the TRA input is ‘clean’, e.g.
10 nF at RA= 68 kΩ.
, as shown in Fig.7. The value of
DD
HEF4750V
LSI
Fig.7 Decoupling of input TRA.
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
Supply voltageV
Voltage on any inputV
DD
I
−0,5 to + 15 V
−0,5 to VDD+ 0,5 V
D.C. current into any input or output± Imax.10 mA
Power dissipation per package
for T
= 0 to + 85 °CP
amb
tot
max.500 mW
Power dissipation per output
for T
Storage temperatureT
Operating ambient temperatureT
= 0 to 85 °CPmax.100 mW
amb
stg
amb
−65 to + 150 °C
−40 to + 85 °C
January 19958
Page 9
Philips SemiconductorsProduct specification
Frequency synthesizer
HEF4750V
DC CHARACTERISTICS
at V
= 10 V ± 5%; voltages are referenced to VSS= 0 V, unless otherwise specified; for definitions see note 1.
−−50 −−50 −−50 mV3
min. VDD− 50 mV mV3
Logic output current
LOW; at VOL= 0,5 V3
outputs OL, PC
OUTI
output XTALI
,
2
OL
OL
5,5−−4,6−−3,6−−mA
2,8−−2,4−−1,9−−mA
Logic output current
HIGH;
at V
OH=VDD
outputs OL, PC
output XTAL−I
− 0,5 V3
,OUT−I
2
OH
OH
1,5−−1,3−−1,0−−mA
1,4−−1,2−−0,9−−mA
Output TCC sink
currentI
O
−− −−2,1−− − −mA3,4,5
Output TCC source
current−I
O
−− −−1,9−− − −mA3,4,6
Internal resistance
of TCC
output swing
≤ 200 mV
specified output range:
0,3 V
DD
to 0,7 V
DDRi
−− −−0,7−− − −kΩ 3,4
UNIT NOTES−40+ 25+ 85
LSI
3,4
January 19959
Page 10
Philips SemiconductorsProduct specification
Frequency synthesizer
HEF4750V
T
(°C
amb
PARAMETERSYMBOL
MIN. TYP. MAX. MIN. TYP. MAX. MIN. TYP. MAX.
Output TCC voltage
with respect to
TCA input voltage∆V−0−− 0−− 0 −V3,4,7
Output PC
currentI
Output PC
current−I
sink
1
source
1
O
O
−− −−1,1−− − −mA3,4,8
−− −−1,0−− − −mA3,4,9
Internal resistance
of PC
1
output swing
≤ 200 mV
specified output range:
0,3 V
Output PC
to 0,7 V
DD
voltage
1
DDRi
−− −−1,4−− − −kΩ 3,4
with respect to
TCC input voltage∆V−0−− 0−− 0 −V3,4,10
EOR generation
V
EOR=VDD
− V
TCA
V
EOR
−0,9−− 0,7−− 0,6−V3,4,11
Source current; HIGH
at V
OUT
=1⁄2VDD;
output in ramp mode3,4
TCAI
TCBI
O
O
−− −−13−− − −mA
−− −−2,5−− − −mA
UNIT NOTES−40+ 25+ 85
LSI
January 199510
Page 11
Philips SemiconductorsProduct specification
Frequency synthesizer
HEF4750V
AC CHARACTERISTICS
General note
The dynamic specifications are given for the circuit built-up with external components as given in Fig.8, under the
following conditions; for definitions see note 1; for definitions of times see Fig.19; V
transition times ≤ 20 ns; R
= 68 kΩ±30% (see also note 4); CA= 270 pF; CB= 150 pF; CC= 1 nF; CD= 10 nF; unless
A
otherwise specified.
SYMBOLMIN.TYP.MAX.UNITCONDITIONSNOTES
Slew rate
TCAS
TCAS
TCBS
TCBS
TCA
TCA
TCB
TCB
−52−V/µsR
−28−V/µsR
−20−V/µsR
−10−V/µsR
Ramp linearity
TCAI
TCBI
Start of TCA-ramp delayt
Delay of TCA-holdt
Delay of TCA-discharget
Start of TCB-ramp delayt
TCB-ramp durationt
TCA
TCB
CBCA
RCA
VCA
VCB
rCB
t
rCB
t
rCB
−2−%13
−2−%13
−200−ns
−40−ns
−60−ns
−60−ns
−250−nsV
−350−nsV
−450−nsV
Required TCB min.
ramp durationt
rCB
−150−ns14
Pulse width
V : LOWt
V : HIGHt
R : LOWt
R : HIGHt
STB : LOWt
STB : HIGHt
1. Definitions:
RA= external biasing resistor between pins TRA and VSS; 68 kΩ±30%.
CA= external timing capacitor for time/voltage converter, between pins TCA and VSS.
CB= external timing capacitor for phase modulator, between pins TCB and VSS.
CC= external hold capacitor between pins TCC and VSS.
CD= decoupling capacitor between pins TRA and VDD.
Logic inputs: V, R, STB, A0to A9, NS0, NS1, OSC.
Logic outputs: OL, PC2, XTAL, OUT.
Analogue signals: TCA, TCB, TCC, TRA, PC1, MOD.
2. TRA at VDD; TCA, TCB, TCC and MOD at VSS; logic inputs at VSSor VDD.
3. All logic inputs at VSSor VDD.
4. RAconnected; its value chosen such that I
5. The analogue switch is in the ON position (see Fig.9).
6. The analogue switch is in the ON position (see Fig.10).
7. See Fig.11.
This guarantees the d.c. voltage gain, combined with d.c.-offset.
Input condition: 0,3 VDD≤ V
∆V=V
TCC−VTCA
.
TCA
≤ 0,7 VDD.
8. See Fig.12.
9. See Fig.13.
10. See Fig.14.
This guarantees the d.c. voltage gain, combined with d.c.-offset.
Input condition: 0,3 VDD≤ V
∆V=V
PC1−VTCC
.
TCC
≤ 0,7 VDD.
11. Switching level at TCA, generating an EOR-signal, during increasing input voltage.
12. See Fig.15.
13. See Fig.16.
Definition of the ramp linearity at full swing.
14. The external components and modulation input voltage must be chosen such that this requirement will be fulfilled, to
ensure that CAis sufficiently discharged during that time.
15. See Fig.17.
Circuit connections for power supply current specification, with speed-up 1 : 10. V and R are in the range of PC1,
such that the output voltage at PC1is equal to 5 V.
f
= 5 MHz (external clock)
OSC
f
= 12,5 kHz
STB
fV= 125 kHz
16. See Fig.18.
Circuit connections for power supply current specification, without speed-up. V and R are in the range of PC1, such
that the output voltage at PC1is equal to 5 V.
f
= 5 MHz (external clock)
OSC
f
= 12,5 kHz
STB
fV= 12,5 kHz
= 100 µA.
TRA
January 199512
Page 13
Philips SemiconductorsProduct specification
Frequency synthesizer
HEF4750V
LSI
Fig.8Test circuit for measuring a.c.
characteristics.
Fig.9 Equivalent circuit for note 5.Fig.10 Equivalent circuit for note 6.
Fig.11 Circuit for note 7.Fig.12 Equivalent circuit for PC1sink current.
January 199513
Page 14
Philips SemiconductorsProduct specification
Frequency synthesizer
Fig.13 Equivalent circuit for PC1source current.Fig.14 Circuit for note 10.
HEF4750V
LSI
Fig.15 Waveform at the output.
Linearity
--------------------- -
1/2V
DD
100×%.=
∆V
Fig.16 Definition of the ramp linearity at full swing.
∆V is the maximum deviation of the ramp waveform to the straight line, which joins the 30% VDDand
70% VDDpoints.
January 199514
Page 15
Philips SemiconductorsProduct specification
Frequency synthesizer
HEF4750V
LSI
Fig.17 Circuit for note 15.
Fig.18 Circuit for note 16.
January 199515
Page 16
Philips SemiconductorsProduct specification
Frequency synthesizer
HEF4750V
LSI
(1) Forbidden zone in the
January 199516
locked state
for the positive edge of V and R and both edges of STB.
Fig.19 Waveforms showing times in the locked state.
Page 17
Philips SemiconductorsProduct specification
Frequency synthesizer
APPLICATION INFORMATION
HEF4750V
LSI
Fig.20 Application of HEF4750V as horizontal sync circuit with Phase-Locked Loop (PLL) and LC oscillator with
vari-cap control.
January 199517
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