Datasheet HDMP-1636, HDMP-1646 Datasheet (HP)

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711
HDMP-1636 Transceiver HDMP-1646 Transceiver
Features
• IEEE 802.3z Gbit Ethernet Compatible, Supports 1250 MBd Gigabit Ethernet
• Based on X3T11 “10 Bit Specification”
• Transmitter and Receiver Functions Incorporated onto a Single IC
• Two Package Sizes Available:
– 10 mm PQFP (HDMP-1636) – 14 mm PQFP (HDMP-1646)
• 10-Bit Wide Parallel TTL Compatible I/Os
• Single +3.3 V Power Supply
• 5-Volt Tolerant I/Os
• 2 KV ESD Protection
Applications
• 1250 MBd Gigabit Ethernet Interface
• High Speed Proprietary Interface
• Backplane Serialization
• Bus Extender
Description
The HDMP-1636/46 transceiver is a single silicon bipolar integrated circuit packaged in a plastic QFP package. It provides a low-cost, low-power physical layer solution for 1250 MBd Gigabit Ethernet or proprietary link interfaces. It
Gigabit Ethernet Transceiver Chip
Preliminary Technical Data
provides complete Serialize/ Deserialize for copper transmis­sion, incorporating both the Gigabit Ethernet transmit and receive functions into a single device.
This chip is used to build a high speed interface (as shown in Figure 1) while minimizing board space, power and cost. It is compatible with the IEEE 802.3z specification.
The transmitter section accepts 10-bit wide parallel TTL data and multiplexes this data into a high speed serial data stream. The parallel data is expected to be 8B/10B encoded data, or equiv­alent. This parallel data is latched into the input register of the transmitter section on the rising edge of the 125 MHz reference clock (used as the transmit byte clock).
The transmitter section’s PLL locks to this user supplied 125 MHz byte clock. This clock is then multiplied by 10, to gener­ate the 1250 MHz serial signal clock used to generate the high speed output. The high speed outputs are capable of interfacing directly to copper cables for electrical transmission or to a separate fiber optic module for optical transmission.
The receiver section accepts a serial electrical data stream at 1250 MBd and recovers the original 10-bit wide parallel data. The receiver PLL locks onto the incoming serial signal and recovers the high speed serial clock and data. The serial data is converted back into 10-bit parallel data, recognizing the 8B/10B comma character to establish byte alignment.
The recovered parallel data is presented to the user at TTL compatible outputs. The receiver section also recovers two 62.5 MHz receiver byte clocks which are 180 degrees out of phase with each other. The parallel data is properly aligned with the rising edge of alternating clocks.
For test purposes, the transceiver provides for on-chip local loop­back functionality, controlled through an external input pin. Additionally, the byte
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± DOUT
TX
PLL/CLOCK
GENERATOR
REFCLK
± DIN
RXCAP0 RXCAP1
RBC0 RBC1
BYTSYNC ENBYTSYNC
OUTPUT
DRIVER
INTERNAL TX CLOCKS
INPUT
LATCH
DATA BYTE
RX[0-9]
TXCAP1
TXCAP0
DATA BYTE
TX[0-9]
INTERNAL
RX CLOCKS
LOOPEN
INTERNAL
LOOPBACK
OUTPUT SELECT
FRAME
MUX
RX PLL/CLOCK RECOVERY
INPUT
SELECT
FRAME DEMUX
AND
BYTE SYNC
INPUT
SAMPLER
HDMP-16x6
PROTOCOL DEVICE
SERIAL DATA OUT
RECEIVER SECTION
PLL
TRANSMITTER SECTION
BYTSYNC
ENBYTSYNC
REFCLK
SERIAL DATA IN
PLL
Figure 1. Typical Application Using the HDMP-16x6.
Figure 2. HDMP-16x6 Transceiver Block Diagram.
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713
synchronization feature may be disabled. This may be useful in proprietary applications which use alternative methods to align the parallel data.
HDMP-1636/46 Block Diagram
The HDMP-1636/46 was designed to transmit and receive 10-bit wide parallel data over a single high-speed line. The parallel data applied to the trans­mitter is expected to be encoded per the Gigabit Ethernet specifi­cation, which uses an 8B/10B encoding scheme with special reserve characters for link management purposes. In order to accomplish this task, the HDMP-1636/46 incorporates the following:
• TTL Parallel I/O’s
• High Speed Phase Lock Loops
• Clock Generation/Recovery Circuitry
• Parallel to Serial Converter
• High Speed Serial Clock and Data Recovery Circuitry
• Comma Character Recognition Circuitry
• Byte Alignment Circuitry
• Serial to Parallel Converter
INPUT LATCH
The transmitter accepts 10-bit wide TTL parallel data at inputs TX[0..9]. The user-provided reference clock signal, REFCLK, is also used as the transmit byte clock. The TX[0..9] and REFCLK signals must be properly aligned, as shown in Figure 3.
TX PLL/CLOCK GENERATOR
The transmitter Phase Lock Loop and Clock Generator (TX PLL/ CLOCK GENERATOR) block is responsible for generating all internal clocks needed by the transmitter section to perform its functions. These clocks are based on the supplied reference byte clock (REFCLK). REFCLK is used as both the frequency reference clock for the PLL and the transmit byte clock for the incoming data latches. It is expected to be 125 MHz and properly aligned to the incoming parallel data (see Figure 3). This clock is then multiplied by 10 to generate the 1250 MHz clock necessary for the high speed serial outputs.
FRAME MUX
The FRAME MUX accepts the 10­bit wide parallel data from the INPUT LATCH. Using internally generated high speed clocks, this parallel data is multiplexed into the 1250 MBd serial data stream. The data bits are transmitted sequentially, from the least significant bit (TX[0]) to the most significant bit (TX[9]).
OUTPUT SELECT
The OUTPUT SELECT block provides for an optional internal loopback of the high speed serial signal, for testing purposes.
In normal operation, LOOPEN is set low and the serial data stream is placed at +/- DOUT. When wrap-mode is activated by setting
LOOPEN high, the +/- DOUT pins are held static at logic 1 and the serial output signal is internally wrapped to the INPUT SELECT box of the receiver section.
INPUT SELECT
The INPUT SELECT block determines whether the signal at +/- DIN or the internal loop-back serial signal is used. In normal operation, LOOPEN is set low and the serial data is accepted at +/- DIN. When LOOPEN is set high, the high speed serial signal is internally looped-back from the transmitter section to the receiver section. This feature allows for loop back testing exclusive of the transmission medium.
RX PLL/CLOCK RECOVERY
The RX PLL/CLOCK RECOVERY block is responsible for frequency and phase locking onto the incoming serial data stream and recovering the bit and byte clocks. An automatic locking feature allows the Rx PLL to lock onto the input data stream without external controls. It does this by continually frequency locking onto the 125 MHz clock, and then phase locking onto the input data stream. An internal signal detection circuit monitors the presence of the input, and invokes the phase detection as the data stream appears. Once bit locked, the receiver generates the high speed sampling clock at 1250 MHz for the input sampler, and recovers the two 62.5 Mhz
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HDMP-1636/46 (Transmitter Section)
Timing Characteristics
TA = 0°C to +60°C, VCC = 3.15 V to 3.45 V
Symbol Parameter Units Min. Typ. Max.
t
setup
Setup Time nsec 2
t
hold
Hold Time nsec 1
t_txlat
[1]
Transmitter Latency nsec TBD
bits TBD
Note:
1. The transmitter latency, as shown in Figure 4, is defined as the time between the latching in of the parallel data word (as triggered
by the rising edge of the transmit byte clock, REFCLK) and the transmission of the first serial bit of that parallel word (defined by the rising edge of the first bit transmitted).
receiver byte clocks (RBC1/RBC0). These clocks are 180 degrees out of phase with each other, and are alternately used to clock the 10-bit parallel output data.
INPUT SAMPLER
The INPUT SAMPLER is respon­sible for converting the serial input signal into a re-timed serial bit stream. In order to accom­plish this, it uses the high speed serial clock recovered from the RX PLL/CLOCK RECOVERY block. This serial bit stream is sent to the FRAME DEMUX and BYTE SYNC block.
FRAME DEMUX AND BYTE SYNC
The FRAME DEMUX AND BYTE SYNC block is responsible for restoring the 10-bit parallel data from the high speed serial bit stream. This block is also responsible for recognizing the comma character (or a K28.5 character) of positive disparity (0011111xxx). When recognized, the FRAME DEMUX AND BYTE SYNC block works with the RX PLL/CLOCK RECOVERY block to properly align the receive byte clocks to the parallel data. When a comma character is detected and realignment of the receiver byte clocks (RBC1/RBC0) is necessary, these clocks are stretched, not slivered, to the
next possible correct alignment position. These clocks will be fully aligned by the start of the second 2-byte ordered set. The second comma character received shall be aligned with the rising edge of RBC1. Comma characters should not be trans­mitted in consecutive bytes to allow the receiver byte clocks to maintain their proper recovered frequencies.
OUTPUT DRIVERS
The OUTPUT DRIVERS present the 10-bit parallel recovered data byte properly aligned to the receive byte clocks (RBC1/RBC0), as shown in Figure 5. These output data buffers provide TTL compatible signals.
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Figure 3. Transmitter Section Timing.
Figure 4. Transmitter Latency.
DATA DATA
TX[0]-TX[9]
t
SETUP
t
HOLD
REFCLK
DATA
DATA DATA
1.4 V
2.0 V
0.8 V
DATA BYTE B DATA BYTE C
TX[0]-TX[9]
DATA BYTE A
± DOUT
1.4 V
DATA BYTE B
t_TXLAT
T5 T6 T7 T8 T9 T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T0 T1 T2 T3 T4 T5
REFCLK
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HDMP-1636/46 (Receiver Section)
Timing Characteristics
TA = 0°C to +70°C, VCC = 3.15 V to 3.45 V
Symbol Parameter Units Min. Typ. Max.
b_sync
[1,2]
Bit Sync Time bits 2500
t
valid_before
Time Data Valid Before Rising Edge of RBC nsec 2.5 TBD
t
valid_after
Time Data Valid After Rising Edge of RBC nsec 1.5 TBD
t
duty
RBC Duty Cycle % 40 60
t
A-B
Rising Edge Time Difference nsec 7.5 7.9 8.5
t_rxlat
[3]
Receiver Latency nsec 22.4
bits 28
Notes:
1. This is the recovery time for input phase jumps, per the Fibre Channel Specification X3.230-1994 FC-PH Standard, Sec 5.3.
2. Tested using C
PLL
= 0.1 µF.
3. The receiver latency, as shown in Figure 6, is defined as the time between receiving the first serial bit of a parallel data word
(defined as the first edge of the first serial) and the clocking out of that parallel word (defined by the rising edge of the receive byte clock, either RBC1 or RBC0).
DATA DATA
X[0]-RX[9]
t
valid_before
t
valid_after
RBC1
,
K28.5
DATA DATA
1.4 V
2.0 V
0.8 V
BYTSYNC
RBC0
t
A-B
2.0 V
0.8 V
1.4 V
Figure 6. Receiver Latency.
Figure 5. Receiver Section Timing.
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HDMP-1636/46 (TRx) Absolute Maximum Ratings
TA = 25°C, except as specified. Operation in excess of any one of these conditions may result in permanent damage to this device.
Symbol Parameter Units Min. Max.
V
CC
Supply Voltage V -0.5 5.0
V
IN,TTL
TTL Input Voltage V -0.7 VCC + 0.7
V
IN,HS_IN
HS_IN Input Voltage V 2.0 V
CC
I
O,TTL
TTL Output Source Current mA 13
T
stg
Storage Temperature °C -40 +130
T
j
Junction Operating Temperature °C 0 +130
HDMP-1636/46 (TRx) DC Electrical Specifications
TA= 0°C to +70°C, VCC = 3.15 V to 3.45 V
Symbol Parameter Unit Min. Typ. Max.
V
IH,TTL
TTL Input High Voltage Level, Guaranteed High Signal V 2 V
CC
for All Inputs
V
IL,TTL
TTL Input Low Voltage Level, Guaranteed Low Signal for V 0 0.8 All Inputs
V
OH,TTL
TTL Output High Voltage Level, IOH = -400 µA V 2.2 V
CC
V
OL,TTL
TTL Output Low Voltage Level, IOL = 1 mA V 0 0.6
I
IH,TTL
Input High Current (Magnitude), VIN = V
CC
µA 0.003 40
I
IL-TTL
Input Low Current (Magnitude), VIN = 0 Volts µA -366 -600
I
CC,TRx
[1,2]
Transceiver VCC Supply Current, TA = 25°C mA 205
Notes:
1. Measurement Conditions: Tested sending 1250 MBd PRBS 27-1 sequence from a serial BERT with both DOUT outputs biased with
150 resistors.
2. Typical specified with VCC = 3.3 volts, maximum specified with VCC = 3.45 volts.
HDMP-1636/46 (TRx) Transceiver Reference Clock Requirements
TA = 0°C to +70°C, VCC = 3.15 V to 3.45 V
Symbol Parameter Unit Min. Typ. Max.
f Nominal Frequency (for Gigabit Ethernet Compliance) MHz 125
F
tol
Frequency Tolerance ppm -100 +100
Symm Symmetry (Duty Cycle) % 40 60
HDMP-1636/46 (TRx) Guaranteed Operating Rates
T
A
= 0°C to +70°C, VCC = 3.15 V to 3.45 V
Parallel Clock Rate (MHz) Serial Baud Rate (MBaud)
Min. Max. Min. Max.
124.0 126.0 1240 1260
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HDMP-1636/46 (TRx) AC Electrical Specifications
TA = 0°C to +70°C, VCC = 3.15 V to 3.45 V
Symbol Parameter Units Min. Typ. Max.
t
r,TTLin
Input TTL Rise Time, 0.8 to 2.0 Volts nsec 2
t
f,TTLin
Input TTL Fall Time, 2.0 to 0.8 Volts nsec 2
t
r,TTLout
Output TTL Rise Time, 0.8 to 2.0 Volts, 10 pF Load nsec 1.5 2.4
t
f,TTLout
Output TTL Fall Time, 2.0 to 0.8 Volts, 10 pF Load nsec 1.1 2.4
t
rs,HS_OUT
HS_OUT Single-Ended (+DOUT) Rise Time psec 85 TBD 327
t
fs,HS_OUT
HS_OUT Single-Ended (+DOUT) Fall Time psec 85 TBD 327
t
rd,HS_OUT
HS_OUT Differential Rise Time psec 85 327
t
fd,HS_OUT
HS_OUT Differential Fall Time psec 85 327
V
IP,HS_IN
HS_IN Input Peak-to-Peak Differential Voltage mV 200 1200 2000
V
OP,HS_OUT
[1]
HS_OUT Output Peak-to-Peak Differential Voltage mV 1200 1580 2200
Note:
1. Output Peak-to-Peak Differential Voltage specified as DOUT+ minus DOUT-.
a. Differential HS_OUT Output (Dout+ Minus Dout-).
Figure 7. Transmitter DOUT Eye Diagrams.
b. Single-Ended HS_OUT Output (Dout+).
Eye Diagrams of the High-Speed Serial Outputs from the HDMP-1636/46 as Captured on the HP 83480A Digital Communications Analyzer. Tested with PRBS = 27-1.
22.0680 ns Yaxis = 400 mV/DIV
22.0680 ns Yaxis = 200 mV/DIV
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HP70841B PATTERN
GENERATOR
HP83480A
OSCILLOSCOPE
HDMP-1636
HP70311A
CLOCK SOURCE
+ DATA
- DATA
+K28.5, -K28.5
TRIGGER
CH1 CH2
+DOUT -DOUT
REFCLK LOOPEN
Tx[0..9]
1.25 GHz
125 MHz
ENBYTSYNC
Rx[0..9]
-DIN
+DIN
DIVIDE
BY 2
CIRCUIT
DIVIDE
BY 10
CIRCUIT
(DUAL
OUTPUT)
VARIABLE
DELAY
TTL
HDMP-1636/46 (Transmitter Section) Output Jitter Characteristics
TA = 0°C to +70°C, VCC = 3.15 V to 3.45 V
Symbol Parameter Units Typ.
RJ
[1]
Random Jitter at DOUT, the High Speed Electrical Data Port, specified as ps 8 1 sigma deviation of the 50% crossing point (RMS)
DJ
[1]
Deterministic Jitter at DOUT, the High Speed Electrical Data Port (pk-pk) ps 15
Note:
1. Defined by Fibre Channel Specification X3.230-1994 FC-PH Standard, Annex A, Section A.4 and tested using measurement method shown in Figure 8.
HDMP-1636/46 (TRx) Thermal and Power Temperature Characteristics
TA = 0°C to +70°C, VCC = 3.15 V to 3.45 V
Symbol Parameter Units Typ. Max.
P
D,TRx
[1,2]
Transceiver Power Dissipation, Outputs Open, Parallel Data mW 630 850 has 5 Ones and 5 Zeroes
P
D,TRx
[1,2,3]
Transceiver Power Dissipation, Outputs Connected per mW 685 900 Recommended Bias Terminations with Idle Pattern
Θ
jc
[4]
Thermal Resistance, Junction to Case HDMP-1636 °C/Watt 10
HDMP-1646 7
Notes:
1. PD is obtained by multiplying the max VCC by the max ICC and subtracting the power dissipated outside the chip at the high speed bias resistors.
2. Typical value specified with VCC = 3.3 volts, maximum value specified with VCC = 3.45 volts.
3. Specified with high speed outputs biased with 150 resistors and receiver TTL outputs driving 10 pF loads.
4. Based on independent package testing by HP. Θja for these devices is 48°C/Watt for the HDMP-1636 and 44°C/Watt for the HDMP-1646. Θja is measured on a standard 3x3" FR4 PCB in a still air environment. To determine the actual junction temperature in a given application, use the value as described as follows: Tj = TC + (Θjc x Pd), where TC is the case temperature measured on the top center of the package and PD is the power being dissipated.
Figure 8. Transmitter Jitter Measurement Method.
a. Block Diagram of RJ Measurement Method. b. Block Diagram of DJ Measurement Method.
HP70841B PATTERN
GENERATOR*
HP83480A
OSCILLOSCOPE
HDMP-1636
HP70311A
CLOCK SOURCE
+ DATA
- DATA
0000011111
TRIGGER
CH1 CH2
+DOUT -DOUT
REFCLK
LOOPEN
Tx[0..9]
BIAS
TEE
1.4 V
0011111000
(STATIC K28.7)
1.25 GHz
125 MHz
* PATTERN GENERATOR PROVIDES A DIVIDE BY 10 FUNCTION.
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I/O Type Definitions
I/O Type Definition
I-TTL Input TTL, Floats High When Left Open
O-TTL Output TTL
HS_OUT High Speed Output, ECL Compatible
HS_IN High Speed Input
C External Circuit Node S Power Supply or Ground
HDMP-1636/46 (TRx) Pin Input Capacitance
Symbol Parameter Units Typ. Max.
C
INPUT
Input Capacitance on TTL Input Pins pF 1.6
Figure 10. HS_OUT and HS_IN Simplified Circuit Schematic. Notes:
1. HS_IN inputs should never be connected to ground as permanent damage to the device may result.
2. The optional series padding resistors (Rpad) help dampen load reflections. Typical Rpad values for mismatched loads range between 25-75 .
Figure 9. O-TTL and I-TTL Simplified Circuit Schematic.
VCC_TTL
R
V
BB
1.4 V
R
GND_TTL
VCC_TX
or
V
CC
_RX
ESD
PROTECTION
GND_TTL
V
CC
_TTL
R
RR
O_TTL I_TTL
GND
ESD
PROTECTION
VCC_TX
HS_OUT
R
0.01
0.01
Zo = 75
Zo = 75
VCC_TXHS VCC_TXECL
GND
ESD
PROTECTION
-DOUT
+DOUT
150
150
R
PAD
R
PAD
GND_TXHS
+DIN
-DIN
ESD
PROTECTION
R
+ –
+ –
HS_IN
150
VCC_RX
GND
GND_RXHS
VCC_RXHS
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RXCAP0
48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
GND_TXHS
HDMP-16x6
xxxx-x Rz.zz
S YYWW
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
BYTSYNC GND_RXTTL RX[0] RX[1] RX[2] V
CC
_RXTTL RX[3] RX[4] RX[5] RX[6] V
CC
_RXTTL RX[7] RX[8] RX[9] GND_RXTTL
GND_TXTTL
TX[0] TX[1] TX[2]
V
CC
_TXTTL
TX[3] TX[4] TX[5] TX[6]
V
CC
_TXTTL
TX[7] TX[8] TX[9]
GND_TXTTL
GND_TXA
TXCAP1
V
CC
_TXHS
+DOUT
-DOUT
V
CC
_TXECL
V
CC
_TX
GND
V
CC
_RX
GND_RXHS
V
CC
_RXHS
+DIN
V
CC
_RXHS
-DIN
GND_RXA
V
CC
_RXA
RXCAP1
TXCAP0
V
CC
_TXA
LOOPEN
V
CC
_TX
GND
REFCLK
V
CC
_RX
ENBYTSYNC
GND
N/C
*
V
CC
_RX
V
CC
_RXTTL
RBC1
RBC0
GND_RXTTL
xxxx-x = WAFER LOT NUMBER–BUILD NUMBER Rzz.zz = DIE REVISION S = SUPPLIER CODE YYWW = DATE CODE (YY = YEAR, WW = WORK WEEK) COUNTRY = COUNTRY OF MANUFACTURE (MARKED ON BACK OF DEVICE)
N/C
*
Figure 11. HDMP-1636/46 (TRx) Package Layout and Marking, Top View.
*Note: Pins 26 and 27 are designated as “no connect” pins and must be left unconnected.
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TRx I/O Definition
Name Pin Type Signal
BYTSYNC 47 O-TTL Byte Sync Output: An active high output. Used to indicate detection of
a comma character (0011111XXX). It is only active when ENBYTSYNC is enabled.
-DIN 52 HS_IN Serial Data Inputs: High-speed inputs. Serial data is accepted from the
+DIN 54 ± DIN inputs when LOOPEN is low.
-DOUT 61 HS_OUT Serial Data Outputs: High-speed outputs. These lines are active when
+DOUT 62 LOOPEN is set low. When LOOPEN is set high, these outputs are held
static at logic 1.
ENBYTSYNC 24 I-TTL Enable Byte Sync Input: When high, turns on the internal byte sync
function to allow clock synchronization to a comma character, (0011111XXX). When the line is low, the function is disabled and will not reset registers and clocks, or strobe the BYTSYNC line.
GND 21 S Logic Ground: Normally 0 volts. This ground is used for internal PECL
25 logic. It should be isolated from the noisy TTL ground as well as possible. 58
GND_RXA 51 S Analog Ground: Normally 0 volts. Used to provide a clean ground
plane for the receiver PLL and high-speed analog cells.
GND_RXHS 56 S Ground: Normally 0 volts.
GND_RXTTL 32 S TTL Receiver Ground: Normally 0 volts. Used for the TTL output cells
33 of the receiver section. 46
GND_TXA 15 S Analog Ground: Normally 0 volts. Used to provide a clean ground plane
for the PLL and high-speed analog cells.
GND_TXHS 64 S Ground: Normally 0 volts.
GND_TXTTL 1 S TTL Transmitter Ground: Normally 0 volts. Used for the TTL input
14 cells of the transmitter section.
LOOPEN 19 I-TTL Loopback Enable Input: When set high, the high-speed serial signal is
internally wrapped from the transmitter’s serial loopback outputs back to the receiver’s loopback inputs. Also, when in loopback mode, the ± DOUT outputs are held static at logic 1. When set low, ± DOUT outputs and ± DIN inputs are active.
RBC1 30 O-TTL Receiver Byte Clocks: The receiver section recovers two 62.5 MHz RBC0 31 receive byte clocks. These two clocks are 180 degrees out of phase.
The receiver parallel data outputs are alternately clocked on the rising edge of these clocks. The rising edge of RBC1 aligns with the output of the comma character (for byte alignment) when detected.
REFCLK 22 I-TTL Reference Clock and Transmit Byte Clock: A 125 MHz clock
supplied by the host system. The transmitter section accepts this signal as the frequency reference clock. It is multiplied by 10 to generate the serial bit clock and other internal clocks. The transmit side also uses this clock as the transmit byte clock for the incoming parallel data TX[0]..TX[9]. It also serves as the reference clock for the receive portion of the transceiver.
N/C 26,27 These pins are factory test pins and must be left unconnected.
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TRx I/O Definition (cont’d.)
Name Pin Type Signal
RX[0] 45 O-TTL Data Outputs: One 10 bit data byte. RX[0] is the first bit received. RX[1] 44 RX[0] is the least significant bit. RX[2] 43 RX[3] 41 RX[4] 40 RX[5] 39 RX[6] 38 RX[7] 36 RX[8] 35 RX[9] 34
RXCAP0 48 C Loop Filter Capacitor: A loop filter capacitor for the internal PLL must RXCAP1 49 be connected across the RXCAP0 and RXCAP1 pins. (typical value = 0.1 µF).
TX[0] 2 I-TTL Data Inputs: One 10 bit, 8B/10B-encoded data byte. TX[0] is the first TX[1] 3 bit transmitted. TX[0] is the least significant bit. TX[2] 4 TX[3] 6 TX[4] 7 TX[5] 8 TX[6] 9 TX[7] 11 TX[8] 12 TX[9] 13
TXCAP1 16 C Loop Filter Capacitor: A loop filter capacitor must be connected across TXCAP0 17 the TXCAP1 and TXCAP0 pins (typical value = 0.1 µF).
VCC_RX 23 S Logic Power Supply: Normally 3.3 volts. Used for internal receiver
28 PECL logic. It should be isolated from the noisy TTL supply as well as 57 possible.
VCC_RXA 50 S Analog Power Supply: Normally 3.3 volts. Used to provide a clean
supply line for the PLL and high-speed analog cells.
VCC_RXHS 53 S High-Speed Supply: Normally 3.3 volts. Used only for the high-speed
55 receiver cell (HS_IN). Noise on this line should be minimized for best
operation.
VCC_RXTTL 29 S TTL Power Supply: Normally 3.3 volts. Used for all TTL receiver output
37 buffer cells. 42
VCC_TX 20 S Logic Power Supply: Normally 3.3 volts. Used for internal transmitter PECL
59 logic. It should be isolated from the noisy TTL supply as well as possible.
VCC_TXA 18 S Analog Power Supply: Normally 3.3 volts. Used to provide a clean
supply line for the PLL and high-speed analog cells.
VCC_TXECL 60 S High-Speed ECL Supply: Normally 3.3 volts. Used only for the last stage
of the high-speed transmitter output cell (HS_OUT) as shown in Figure 10. Due to high current transitions, this VCC should be well bypassed to a ground plane.
VCC_TXHS 63 S High-Speed Supply: Normally 3.3 volts. Used by the transmitter side for the
high-speed circuitry. Noise on this line should be minimized for best operation.
VCC_TXTTL 5 S TTL Power Supply: Normally 3.3 volts. Used for all TTL
10 transmitter input buffer cells.
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724
RXCAP0
V
CC
_RXTTL
V
CC
_RXTTL
GND_TXHS
TOP VIEW
GND_RXTTL
GND_TXTTL
V
CC
_TXTTL
V
CC
_TXTTL
GND_TXTTL GND_TXA
TXCAP1
V
CC
_TXHS
V
CC
_TXECL
V
CC
_TX
GND
V
CC
_RX
GND_RXHS
V
CC
_RXHS
V
CC
_RXHS
GND_RXA
V
CC
_RXA
RXCAP1
* SUPPLY VOLTAGE INTO VCC_RXA AND VCC_TXA SHOULD BE FROM A LOW NOISE SOURCE. ALL BYPASS CAPACITORS AND PLL FILTER CAPACITORS ARE 0.1 µF.
V
CC
_TX
GND
V
CC
VCC*
V
CC
GND_RXTTL
TXCAP0
V
CC
_TXA
GND
V
CC
_RX
GND_RXTTL
V
CC
_RXTTL
V
CC
_RX
C
PLLT
VCC*
C
PLLR
Figure 12. Power Supply Bypass.
Start-up Procedure:
The transceiver start-up procedure(s) use the following conditions: VCC = +3.3 V ± 5% and REFCLK = 125 MHz ± 100 ppm.
After the above conditions have been met, apply valid data using a balanced code such as 8B/10B. Frequency lock occurs within 500 µs. After frequency lock, phase lock occurs within 2500 bit times.
Transceiver Power Supply Bypass and Loop Filter Capacitors
Bypass capacitors should be liberally used and placed as close as possible to the appropriate
power supply pins of the HDMP-1636/46 as shown on the schematic of Figure 12. All bypass chip capacitors are
0.1 µF. The VCC_RXA and VCC_TXA pins are the analog power supply pins for the PLL sections. The voltage into these pins should be clean with minimum noise. The PLL loop filter capacitors and their pin locations are also shown on Figure 12. Notice that only two capacitors are required: C
PLLT
for
the transmitter and C
PLLR
for the
receiver. Nominal capacitance is
0.1 µF. The voltage across the capacitors is on the order of 1 volt, so the capacitor can be a low voltage type and physically small. The PLL capacitors are placed physically close to the appropriate pins on the HDMP­1636/46. Keeping the lines short will prevent them from picking up stray noise from surrounding lines or components.
PRE-RELEASE PRODUCT
DISCLAIMER:
This product is in development at the Hewlett-Packard CSSD in San Jose, California. Until Hewlett­Packard releases this product for general sales, HP reserves the right to alter specifications, features, capabilities, functions, manufacturing release dates, and even general availability of the product at any time.
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Package Information
Item Details
Package Material Plastic Lead Finish Material 85% Tin, 15% Lead Lead Finish Thickness 300-800 µm Lead Coplanarity HDMP-1636 0.08 mm max
HDMP-1646 0.10 mm max
Mechanical Dimensions
Figure 13. Mechanical Dimensions of HDMP-1636/46.
A1
A2
PIN #1 ID
A1 A2
B1
B4
B3
C1
C2
B2
ALL DIMENSIONS ARE IN MILLIMETERS.
B5
48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
HDMP-16x6
TOP VIEW
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
C3
PART NUMBER A1 A2 B1 B2 B3 B4 B5 C1 C2 C3
HDMP-1636 10.00 13.20 0.22 0.50 0.60 0.17 0.25 2.00
0.25
MIN.
2.45
HDMP-1646 14.00 17.20 0.35 0.80 0.88 0.17 0.25 2.00
0.25
MAX.
2.35
TOLERANCE ± 0.10 ± 0.25 ± 0.05 BASIC + 0.15/
– 0.10
MAX.
+ 0.10/
– 0.05
MAX.
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