The HD74ALVCH162244 is designed specifically to improve both the performance and density of 3-state
memory address drivers, clock drivers, and bus oriented receivers and transmitters. The device can be used
as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer. It provides true outputs and symmetrical
active-low output-enable (OE) inputs.
To ensure the high impedance state during power up or power down, OE should be tied to VCC through a
pullup resistor; the minimum value of the resistor is determined by the current sinking capability of the
driver.
Active bus hold circuitry is provided to hold unused or floating data inputs at a valid logic level.
All outputs, which are designed to sink up to 12 mA, include 26 Ω resistors to reduce overshoot and
undershoot.
Features
• VCC = 2.3 V to 3.6 V
• Typical VOL ground bounce < 0.8 V (@VCC = 3.3 V, Ta = 25°C)
• Typical VOH undershoot > 2.0 V (@VCC = 3.3 V, Ta = 25°C)
• High output current ±12 mA (@VCC = 3.0 V)
• Bus hold on data inputs eliminates the need for external pullup / pulldown resistors
• All outputs have equivalent 26 Ω series resistors, so no external resistors are required.
Page 2
HD74ALVCH162244
Function Table
InputsOutput Y
OEA
LHH
LLL
HXZ
H : High level
L : Low level
X : Immaterial
Z : High impedance
Input clamp currentI
Output clamp currentI
Continuous output currentI
VCC, GND current / pinICC or I
Maximum power dissipation
at Ta = 55°C (in still air)
*3
CC
V
I
V
O
IK
OK
O
GND
P
T
Storage temperatureTstg–65 to 150°C
Notes:Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage
to the device. These are stress ratings only, and functional operation of the device at these or
any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute maximum rated conditions for extended periods may affect device
reliability.
1. The input and output negative voltage ratings may be exceeded if the input and output clamp
current ratings are observed.
2. This value is limited to 4.6 V maximum.
3. The maximum package power dissipation is calculated using a junction temperature of 150°C
and a board trace length of 750 mils.
–0.5 to 4.6V
–0.5 to 4.6V
–0.5 to VCC +0.5V
–50mAVI < 0
±50mAVO < 0 or VO > V
±50mAVO = 0 to V
CC
±100mA
0.85WTSSOP
CC
Recommended Operating Conditions
ItemSymbolMinMaxUnitConditions
Supply voltageV
Input voltageV
Output voltageV
High level output currentI
Low level output currentI
CC
I
O
OH
OL
Input transition rise or fall rate∆t / ∆v010ns / V
Operating temperatureTa–4085°C
Note: Unused control inputs must be held high or low to prevent them from floating.
2.33.6V
0VCCV
0VCCV
—–6mAV
—–8V
= 2.3 V
CC
= 2.7 V
CC
—–12VCC = 3.0 V
—6mAVCC = 2.3 V
—8V
—12V
= 2.7 V
CC
= 3.0 V
CC
4
Page 5
Logic Diagram
HD74ALVCH162244
1OE
1A1
1A2
1A3
1A4
3OE
3A1
3A2
3A3
47
46
44
43
25
36
35
33
1
2
1Y1
3
1Y2
5
1Y3
6
1Y4
13
3Y1
14
3Y2
16
3Y3
2OE
2A1
2A2
2A3
2A4
4OE
4A1
4A2
4A3
48
41
40
38
37
24
30
29
27
11
12
19
20
22
8
2Y1
9
2Y2
2Y3
2Y4
4Y1
4Y2
4Y3
3A4
32
17
3Y4
4A4
26
23
4Y4
5
Page 6
HD74ALVCH162244
Electrical Characteristics (Ta = –40 to 85°C)
ItemSymbol V
Input voltageV
IH
(V)MinMaxUnit Test Conditions
CC
2.3 to 2.7 1.7—V
2.7 to 3.6 2.0—
V
IL
2.3 to 2.7 —0.7
2.7 to 3.6 —0.8
Output voltageV
OH
2.3 to 3.6 VCC–0.2 —VIOH = –100 µA
2.31.9—IOH = –4 mA, VIH = 1.7 V
2.31.7—IOH = –6 mA, VIH = 1.7 V
3.02.4—IOH = –6 mA, VIH = 2.0 V
2.72.0—IOH = –8 mA, VIH = 2.0 V
3.02.0—IOH = –12 mA, VIH = 2.0 V
V
OL
2.3 to 3.6 —0.2IOL = 100 µA
2.3—0.4IOL = 4 mA, VIL = 0.7 V
2.3—0.55IOL = 6 mA, VIL = 0.7 V
3.0—0.55IOL = 6 mA, VIL = 0.8 V
2.7—0.6IOL = 8 mA, VIL = 0.8 V
3.0—0.8IOL = 12 mA, VIL = 0.8 V
Input currentI
IN
I
IN (hold)
3.6—±5µAVIN = VCC or GND
2.345—VIN = 0.7 V
2.3–45—VIN = 1.7 V
3.075—VIN = 0.8 V
3.0–75—VIN = 2.0 V
*1
or GND
CC
Off state output currentI
Quiescent supply currentI
∆I
3.6—±500VIN = 0 to 3.6 V
OZ
CC
CC
3.6—±10µAV
3.6—40µAVIN = VCC or GND
3.0 to 3.6 —750µAVIN = one input at (VCC–0.6) V,
= VCC or GND
OUT
other inputs at V
Notes: 1. This is the bus hold maximum dynamic current required to switch the input from one state to
another.
6
Page 7
Switching Characteristics (Ta = –40 to 85°C)
HD74ALVCH162244
ItemSymbol VCC (V)MinTypMaxUnitFROM
(Input)
Propagation delay timet
PLH
t
PHL
2.5±0.2 1.0—4.9nsAY
2.7——4.7
3.3±0.3 1.0—4.2
Output enable timet
ZH
t
ZL
2.5±0.2 1.0—6.8nsOEY
2.7——6.7
3.3±0.3 1.0—5.6
Output disable timet
HZ
t
LZ
2.5±0.2 1.0—6.3nsOEY
2.7——5.7
3.3±0.3 1.0—5.5
Input capacitanceC
IN
3.3—3.0—pFControl inputs
3.3—6.0—Data inputs
Output capacitanceC
O
3.3—7.0—pFOutputs
Test Circuit
See under table
500 Ω
S1
OPEN
TO
(Output)
*1
L
500 ΩC = 50 pF
Load Circuit for Outputs
Symbol
t / t
PLH PHL
t / t
ZH HZ
t / t
ZL LZ
Vcc=2.5±0.2V
2 × V6.0 V
Note:1. CL includes probe and jig capacitance.
Vcc=2.7V,
3.3±0.3V
OPENOPEN
GND
CC
GND
GND
7
Page 8
HD74ALVCH162244
Waveforms – 1
Input
Output
Waveforms – 2
Output
Control
Waveform - A
Waveform - B
10 %
90 %
t
rf
90 %
V
ref
t
90 %
V
ref
10 %
t
PLH
V
ref
t
f
t
r
t
PHL
90 %
V
ref
V
ref
10 %10 %
t
ZL
V
ref
t
ZH
V
ref
t
LZ
t
HZ
V
IH
GND
V
OH
V
ref
V
OL
V
IH
GND
≈V
OH1
V
ref1
V
ref2
V
V
≈V
OL
OH
OL1
CC
Vcc=2.7V,
3.3±0.3V
V +0.3 V
OL
V –0.3 V
OH
TEST
V
IH
V
ref
V
ref1
V
ref2
V
OH1
V
OL1
Vcc=2.5±0.2V
V
CC
1/2 V1.5 V
V +0.15 V
OL
V –0.15 V
OH
V
CC
GND
Notes: 1.All input pulses are supplied by generators having the following characteristics :
2. Waveform – A is for an output with internal conditions such that the output is low except
when disabled by the output control.
3.Waveform – B is for an output with internal conditions such that the output is high except
when disabled by the output control.
4.The output are measured one at a time with one transition per measurement.
8
2.7 V
3.0 V
GND
Page 9
Package Dimensions
12.50
+0.3
–0.1
HD74ALVCH162244
Unit : mm
2548
+0.3
–0.1
6.10
124
+0.1
0.20
–0.05
0.50
0.08
M
0.65 Max
0.10
0.05 Min
1.20 max
8.10 ± 0.3
0.15 ± 0.05
Hitachi code
EIAJ code
JEDEC code
10° Max
0.50 ± 0.1
TTP-48DC
—
—
9
Page 10
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
Hitachi, Ltd.
Semiconductor & Integrated Circuits.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109
URLNorthAmerica : http:semiconductor.hitachi.com/
For further information write to:
Hitachi Semiconductor
(America) Inc.
179 East Tasman Drive,
San Jose,CA 95134
Tel: <1> (408) 433-1990
Fax: <1>(408) 433-0223
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Asia (Taiwan): http://www.hitachi.com.tw/E/Product/SICD_Frame.htm
Asia (HongKong): http://www.hitachi.com.hk/eng/bo/grp3/index.htm
Japan: http://www.hitachi.co.jp/Sicd/indx.htm
Hitachi Asia Ltd.
Taipei Branch Office
3F, Hung Kuo Building. No.167,
Tun-Hwa North Road, Taipei (105)
Tel: <886> (2) 2718-3666
Fax: <886> (2) 2718-8180
Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.
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Group III (Electronic Components)
7/F., North Tower, World Finance Centre,
Harbour City, Canton Road, Tsim Sha Tsui,
Kowloon, Hong Kong
Tel: <852> (2) 735 9218
Fax: <852> (2) 730 0281
Telex: 40815 HITEC HX
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