Page 1
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : Preliminary Data
Issued Date : 1998.08.01
Revised Date : 2001.01.30
Page No. : 1/3
H7812AM
H7812BM
Low Current Positive Voltage Regulator Of Surface Mount Device
Description
The H7812_M series of surface mount device regulators are easyto-use devices suitable for multitude of applications that require a
regulated supply of up to 100mA. These regulators feature internal current limiting and thermal
shutdown making them remarkably rugged. No external components are required with the 7812_M devices in many applications.
These devices offer a substantial performance advantage over the traditional zener diode
resistor combination, as output impedance and quiescent current are substantially reduced.
Wide Range Of Available, Fixed Output Voltages
•
Internal Short-Circuit Current Limiting
•
Internal Thermal Overload Prot ecti on
•
No External Components Required
•
Absolute Maximum Ratings
Input Voltage................................................... 30 V (5V Through 9V), 35 V (12V Through 18V)
•
Total Power Dissipation ........................................................................................... Internal limit
•
Operating Temperature Range............................................................................ 0 °C to +70 °C
•
Maximum Junction Temperature...................................................................................... 125 °C
•
Storage Temperature Range .......................................................................... -55 °C to +150 °C
•
Lead Temperature (Soldering 10S).................................................................................. 260 °C
•
(Ta=25°C)
Typical Application Schematic Diagram
Vin
VoutVin
H7812_M
C1 C2
3.41K
3.89K
5.7K
576
13K
7.8K
5K
100
100
5pF
1.5K 1.9K
2.23K
Vout
A common ground is required between the input
and the output voltages. The input voltage must
remain typically 2.0V above the output voltage
even during the low point on the input ripple
voltage.
Note : C1 and C2 are required if regulator is
located far from power supply filter and load, or
H7812AM, H7812BM HSMC Product Specification
2.84K
GND
Page 2
HI-SINCERITY
MICROELECTRONICS CORP.
Electrical Characteristics
Vin=19V, Io=40mA, Tj=25°C Cin=0.33uF, Cout=0.1uF (unless otherwise noted)
Spec. No. : Preliminary Data
Issued Date : 1998.08.01
Revised Date : 2001.01.30
Page No. : 2/3
Symbol Parameter Conditions
Tj=25°C
Vo Output Voltage
14.5V≤Vin≤27V
1mA≤Io≤40mA
1mA≤Io≤70mA
Vo
∆
Vo
∆
Line Regulation
Load Regulation
IQ Quiescent Current
IQ
∆
Quiescent Current
Change
Vn Output Noise Voltage
Vin / ∆Vout
∆
Ripple Rejection
Ipk Peak Output Current
VD Dropout Voltage
14.5V≤Vin≤27V
16V≤Vin≤27V
1mA≤Io≤100mA
1mA≤Io≤40mA
Ta=25°C
16V≤Vin≤27V
1mA≤Io≤40mA
Ta=25°C
15V≤Vin≤25V, f=120Hz
Ta=25°C
Ta=25°C
Symbol Parameter Conditions
Tj=25°C
Vo Output Voltage
14.5V≤Vin≤27V
1mA≤Io≤40mA
1mA≤Io≤70mA
Vo
∆
Vo
∆
Line Regulation
Load Regulation
IQ Quiescent Current
IQ
∆
Quiescent Current
Change
Vn Output Noise Voltage
Vin / ∆Vout
∆
Ripple Rejection
Ipk Peak Output Current
VD Dropout Voltage
14.5V≤Vin≤27V
16V≤Vin≤27V
1mA≤Io≤100mA
1mA≤Io≤40mA
Ta=25°C
16V≤Vin≤27V
1mA≤Io≤40mA
Ta=25°C
15V≤Vin≤25V, f=120Hz
Ta=25°C
Ta=25°C
H7812AM
Min Typ Max
Units
11.64 12 12.36
11.4 12 12.6
V
11.4 12 12.6
--180
--110
--100
--50
mV
mV
--5mA
--1
-0.1
mA
-80-uV
40 54 - dB
- 140 - mA
-1.7- V
H7812BM
Min Typ Max
Units
11.4 12 12.6
11.4 12 12.6
V
11.4 12 12.6
--180
--110
--100
--50
mV
mV
--5mA
--1
-0.1
mA
-80-uV
40 54 - dB
- 140 - mA
-1.7- V
H7812AM, H7812BM HSMC Product Specification
Page 3
HI-SINCERITY
MICROELECTRONICS CORP.
SOT-89 Dimension
Spec. No. : Preliminary Data
Issued Date : 1998.08.01
Revised Date : 2001.01.30
Page No. : 3/3
Marking :
C
B
D
321
E
H
HSMC Logo
Date Code
Part Number
Style : Pin 1.Vout 2.Ground 3.Vin
Package Code
I
F
G
A
3-Lead SOT-89 Plastic Surface Mounted Package
HSMC Package Code : M
DIM
Inches Millimeters Inches M illimeters
Min. Max. Min. Max.
DIM
Min. Max. Min. Max.
A 0.1732 0.1811 4.40 4.60 F 0.0583 0.0598 1.48 1.52
B 0.1594 0.1673 4.05 4.25 G 0.1165 0.1197 2.96 3.04
C 0.0591 0.0663 1.50 1.70 H 0.0551 0.0630 1.40 1.60
D 0.0945 0.1024 2.40 2.60 I 0.0138 0.0161 0.35 0.41
E 0.0141 0.0201 0.36 0.51
Notes :
Material :
• Lead : 42 Alloy ; solder plating
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
1.Dimension and tolerance based on our Spec. dated May. 05,1996.
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, pleas e contact your l ocal HSMC sal es office.
*:Typical
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringem ent of pat ents, or applic ati on assistance.
Head Office And Factory :
•
Head Office
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
•
Factory 1 :
Tel : 886-3-5983621~5 Fax : 886-3-5982931
•
Factory 2 :
Tel : 886-3-5977061 Fax : 886-3-5979220
H7812AM, H7812BM HSMC Product Specification
(Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
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