Datasheet GP2W0106YP Datasheet (Sharp)

Page 1
GP2W0106YP
IrDA Data Sheet
FEATURES
• Built-in Photodiode
• Operating voltage 2.0 V to 3.6 V
• Conforms to eye safety IEC60825-1, without exter­nal resistor
• This product shall not contain the following materi­als, and these materials shall not be used in the pro­duction process for this product.
–CFC – Halon – Carbon Tetrachloride – 1.1.1. Trichloroethane (Methylchloroform) – Specific brominated flame retardants such as the
INTRODUCTION
This specification applies to the outline and charac-
teristics of IrDA 1.2 type (data rate 2.4 kbps to
115.2 kbps, low power option compliant) optical data
communication transceiver.
NOTES
• Caution should be taken to prevent the detector sur­face from being smeared with dust or dirt, or from being touched, as it may cause faulty operation.
• Cleaning conditions:
– Solvent cleaning: Solvent temperature 45°C or
– Ultrasonic cleaning: The effect of ultrasonic
– Cleaning solvent: The cleaning shall be carried
• In order to prevent electrostatic damage to the inte­grated circuit, handle this device in a static-free envi­ronment and workstation.
S
PBBO
less. Immersion for 3 minutes or less.
cleaning on the device differs by cleaning bath size, ultrasonic power output, cleaning time, PCB size or device mounting condition, etc. Test the device under actual conditions and confirm that ultrasonic cleaning does not cause any immedi­ate or potential defects.
out with ethyl alcohol, methyl alcohol, or isopropyl alcohol.
and PBBS are not used in this device.
S
115 kbps Transceiver
• External force applied to the device after mounting can cause mounting defects such as the terminal coming off. Be careful when handling the device and prevent objects from touching the device after mounting.
• Refer to the ‘Precautions for Soldering’ section.
• When the system (program) is designed, the turn around time from transmit to receive should be designed by considering 200 µs or more that is spec­ified by IrDA. This turn around time means the time that this device does not temporarily detect the incoming signal, since the transmitted light from the transmitter side reaches the detector side of the same transceiver.
• Consider that 200 µs or more (at T signal) is necessary to return from shut-down mode to ready-operation mode. In addition, thoroughly confirm the operation in the actual application.
• When there is considerable external stray light or a light source is located near the transceiver, or the detector face receives considerable external stray light, a pulse other than desired signal output may be generated as noise on output terminal of the transceiver. Consider the layout and structure in your design to minimize disturbing light on the detector face.
• When the sensor is adopted in an IR communication system, it should be used according to the signal method which is specified by ‘Serial Infrared Physi­cal Layer Link Specification’ published by the Infra­red Data Association. Faulty operation may occur, if a signal method other than that specified is used.
• RXD pinout is a pullup (260 kΩ TYP.) to V down mode. See Table 1 and Figure 2.
• In circuit designs, make allowance for the degradation of the light emitting diode output that results from long-term continuous operation (50% degradation/5 years). The light emitting diode output may be degraded quickly when operated at T fore it is recommended to operate over T
= 25°C, no input
A
in shut-
DD
= -40°C, there-
A
= -20°C.
A
IrDA Data Sheet 1
Page 2
GP2W0106YP 115 kbps Transceiver
GP2W0106YP-2
TR1
TR2
260 k TYP.
RXD
Table 1. I/O Truth Table
SD TXD LED RECEIVER TR1 TR2 RXD
Not
Valid
High
Pullup
1NC2NC3
V
+
CX
4
5SD6
GND SD RXD TXD
DD
GND
V
DD
RXD7TXD8LEDA
Low High On Dont Care ——
Low Low Off IrDA Signal Off On Low
Low Low Off No Signal On Off High
High
Dont
Care
Off Dont Care Off Off
COMPONENT
CX 3.3 µF/6.3 V (NOTE 1)
NOTES:
1. Choose the most suitable CX according to the noise level and noise frequency of power supply.
2. Pin 1 and Pin 2 are not connected internally.
RECOMMENDED VALUE
Figure 1. Recommended External Circuit
1
ENCODER
CIRCUIT
UART
GP2W0106YP-1
Figure 2. RXD Equivalent Circuit
CX
+
LEDA
2
TXD
CONSTANT
CURRENT
CIRCUIT
GP2W0106YP
V
DD
3
3
GP2W0106YP-3
SD INPUT PERFORMANCE
LOW Normal Mode
HIGH
Shutdown
Mode
4
5
NOTES:
1 Transmitting data waveform
2 Encoder circuit output waveform
3 Transmitter output optical signal waveform
4 GP2W0106YP receiver output waveform
Receiving data waveform
5
DECODER
CIRCUIT
RXD
SD
Figure 3. Example of Circuit
GND
2 IrDA Data Sheet
Page 3
115 kbps Transceiver GP2W0106YP
1.425
1.55
0.475
2.375
3.325
1.55
0.1
1.1
2.0
NOTES:
1. Dimensions are in mm.
2. Dimensions are for reference.
3. Soldering paste area
GP2W0106YP-6
0.6
T
1
0
T
10 1
3T/16
2
3
4
5
0
10 1
NOTES:
1 Transmitting data waveform
2 Encoder circuit output waveform
3 Transmitter output optical signal waveform
4 GP2W0106YP receiver output waveform
5 Receiving data waveform
T =
1
Data Rate
Data rate: 2.4 kbps, 9.6 kbps, 19.2 kbps, 38.4 kbps,
57.6 kbps, 115.2 kbps
Figure 4. Example of Signal Waveform
Recommended Size of Solder Cream Paste
Open the solder mask as shown in Figure 5. The size of solder cream paste for this device before reflow soldering must be as large as one of the foot pattern land, indicated in Figure 6.
GP2W0106YP-4
Figure 5. Solder Cream Paste Size
NOTES:
1. Dimensions are in mm.
2. Dimensions are shown for reference.
3. Connect foot pattern of shield case to GND pattern.
IrDA Data Sheet 3
CENTER OF
MOUNTING AREA
8
0.6
7
6
5
0.475
1.0
1.55
1.425
4
2.375
3
3.325
1.1
2
2.0
0.1
1
Figure 6. Foot Pattern of PCB
1.55
PIN
1
2
3
4
5
6
7
8
PIN NAME SYMBOL
NC
NC
V
DD
Ground
Shutdown
Receiver Data Output
Transmitter Data Input
LED Anode
NC
NC
V
DD
GND
SD
RXD
TXD
LEDA
GP2W0106YP-5
Page 4
GP2W0106YP 115 kbps Transceiver
COMPONENT SIDE
CX
LEDA
TXD
RXD
SD
GND
CIRCUIT SIDE
Figure 7. PCB Layout Example
DD
V
GND
SHIELD
2W0106-7
4 IrDA Data Sheet
Page 5
115 kbps Transceiver GP2W0106YP
1.15 3.9
2.75 ±0.3
CENTER
OF DETECTOR
2.5
7.9 ±0.3
5.2
EMBOSSED
'S'
1.15 0.9
φ2.2φ2.2
CENTER
OF EMITTER
1.5 ±0.3
0.48
2.15 ±0.3
1.88
0.8
±0.3
2.7
+0.3
-0.2
2 ±0.3
1.05 ±0.3
PIN
1
2
3
4
5
6
7
8
PIN NAME SYMBOL
NC
NC
V
DD
Ground
Shutdown
Receiver Data Output
Transmitter Data Input
LED Anode
1
NC
NC
V
DD
GND
SD
RXD
TXD
LEDA
2 3
+0.2
8 - 0.4
-0.3
PO .95 x 7 = 6.65
8 - 0.6
5 6
4
BOTTOM VIEW
NOTES:
1. Dimensions are in mm.
2. Unspecified tolerances are ±0.2
3.
Adhesion of resin to the terminal area are allowed MAX. 0.2 mm.
area: Au plating
Figure 8. GP2W0106YP Outline Dimensions
8
7
PO .95 x 7 = 6.65
0.35
0.6
±0.3
GP2W0106YP-8
IrDA Data Sheet 5
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GP2W0106YP 115 kbps Transceiver
RATINGS AND CHARACTERISTICS
Absolute Maximum Ratings
PARAMETER SYMBOL RATINGS UNIT NOTES
Supply voltage V
LED supply voltage V
Peak forward current I
Operating temperature T
Storage temperature T
Soldering temperature T
NOTES:
1. Pulse width: 78.1 µs. Duty ratio: 3/16.
2. Recommended condition: -20°C to +85°C.
3. Soldering reflow time: 5 seconds.
DD
LEDA
FM
OPR
STG
SOL
0 to 6.0 V
0 to VDD +1.0 V
60 mA 1
-20 to +85 °C2
-40 to +85 °C
230 °C3
Recommended Operating Conditions
PARAMETER SYMBOL OPERATING CONDITION UNIT NOTES
Supply voltage V
LED supply voltage V
Operating temperature T
DD
LEDA
OPR
Data rate BR 2.4 to 115.2 kbps
SD terminal high level input voltage V
SD terminal low level input voltage V
TXD high level input voltage V
TXD low level input voltage V
IHSD
ILSD
IHTXD
ILTXD
2.0 to 3.6 V
2.0 to VDD +1.0 V
-20 to +85 °C
VDD × 0.95 to V
DD
V1
0.0 to VDD × 0.1 V 2
VDD × 0.8 to V
DD
V3
0.0 to VDD × 0.2 V 4
NOTES:
1. Shut down mode
2. Normal mode
3. LED ON. See Figure 14.
4. LED OFF. See Figure 14.
6 IrDA Data Sheet
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115 kbps Transceiver GP2W0106YP
t
W
V
OL
t
R
t
F
V
OH
90%
50%
10%
GP2W0106YP-10
Electrical Characteristics
T
= -40°C to +85°C, VDD = 2.0 V to 3.6 V unless otherwise specified
OPR
PARAMETER SYMBOL MIN. TYP. MAX. UNIT NOTES
Current consumption at no input signal I
Current consumption at shut-down mode I
High level output voltage V
Low level output voltage V
DD
DD-S
OH
OL
V
DD
Rise time tr 0.4 µs 5
Fall time tf 0.4 µs 5
Low level pulse width tw 1.0 3.0 µs 5
Reception distance L 20 cm 5
Input irradiance Ee 9.0 µW/cm
Receiver latency tl 30 500 µs
Receiver wakeup time tsdw 60 500 µs 6
Radiant intensity I
LED peak current I
E
LED
3.6 25 mW/sr 7
16 20 26 mA 7
Rise time tr 0.6 µs 8
Fall time tf 0.6 µs 8
Peak emission wavelength
p 870 nm
λ
100 170 µA 1
0.01 0.2 µA 2
V3
0.5 V 4
2
5
NOTES:
1. No input signal, V
2. No input signal, V = 20 µA. See Figures 9, 10, and 11.
3. I
OH
4. BR = 115.2 kbps,
5. BR = 115.2 kbps,
6. No input signal.
7. BR = 115.2 kbps,
See Figures 12, 13, and 14.
8. BR = 115.2 kbps. See Figures 12, 13, and 14.
T
1
T
2
NOTE: At BR = 2.4 kbps: T1 = 416.7 µs, T2 = 78.1 µs At BR = 115.2 kbps: T1 = 8.68 µs, T2 = 1.63 µs
= 0 V. Output terminal open.
ILSD
= VDD. Output terminal open. VDD = 3.3 V.
IHSD
φ ≤
15°, See Figures 9, 10, and 11.
φ ≤
φ ≤
15°, T
15°, T
T
1
= 25°C. See Figures 9, 10, and 11.
OPR
= 25°C. VDD = V
OPR
LEDA
RADIATION INTENSITY OF TRANSMITTER
3.6 mW/sr
GP2W0106YP-9
= 3.3 V. V
Figure 9. Input Signal Waveform (Detector Side)
IHTXD
= 2.8 V.
Figure 10. Output Waveform (Detector Side)
IrDA Data Sheet 7
Page 8
GP2W0106YP 115 kbps Transceiver
TRANSMITTER
(NOTE)
NOTE:
1. Transmitter uses GP2W0106YP (λp = 870 nm TYP.) which is adjusted to a radiation intensity of 3.6 mW/sr.
2. φ Indicates horizontal and vertical directions.
3. Ee: Detector face illuminance < 10 x
Figure 11. Standard Optical System (Detector Side)
90%
I
E
φ
φ
GP2W0106YP
OSCILLOSCOPE
L
GP2W0106YP-11
10%
t
R
t
F
GP2W0106YP-12
Figure 12. Output Waveform Specification
(Emitter Side)
8 IrDA Data Sheet
Page 9
115 kbps Transceiver GP2W0106YP
GP2W0106YP-15
PEAK
FORWARD
CURRENT
I
FM
(mA)
60
40
26 20
-20 85 100755025
AMBIENT TEMPERATURE T
A
(°C)
NOTE: Pulse width ≤ 78.1 µs, Duty ratio 3/16
0-25
0
GP2W0106YP
NOTE: φ indicates horizontal and vertical directions
1.63 µs
Tx = 2.8 V
V
IN
φ φ
Figure 13. Standard Optical System (Emitter Side)
= 3.3 V
V
DD
LEDA
TXD
GP2W0106YP
DETECTOR FOR RADIATION INTENSITY MEASURING
GP2W0106YP-13
BR = 115.2 kbps
Figure 14. Recommended Circuit (Emitter Side)
IrDA Data Sheet 9
GP2W0106YP-14
Figure 15. Peak Forward Current
Versus Ambient Temperature
Page 10
GP2W0106YP 115 kbps Transceiver
RELIABILITY
TEST ITEMS TEST CONDITIONS
FAILURE JUDGEMENT
CRITERIA
SAMPLES
(n)
DEFECTIVE
(c)
NOTES
1 cycle -20°C to 85°C
Temperature cycling
(30 minutes at each extreme)
n = 22 c = 0 1
20 cycles test
High temperature and high humidity storage
High temperature storage +85°C, 240 hours n = 22 c = 0 1
Low temperature storage -30°C, 240 hours n = 22 c = 0 1
Operation life 1
Operation life 2
+40°C, 90% RH, 240 hours n = 22 c = 0 1
> Up × 1.2
I
DD
L < Low × 0.8
< Low × 0.8
I
+25°C, V hours
+25°C, V 240 hours, Pulse width
= 3.3 V, 240
DD
= LEDA = 3.3 V,
DD
E
> Up × 1.2
I
E
Up: Upper
Specification Limint
n = 11 c = 0 1
n = 11 c = 0
78.1 µs, Duty ratio 3/16
Mechanical shock
Variable frequency vibration
1,000 m/s2, 6 ms, 3 times/±X, ±Y, ±Z direction
2
200 m/s
, 100 to 2,000 to 100 Hz for approximately 4 minutes
Low: Lower
Specification Limint
n = 11 c = 0
n = 11 c = 0
48 minutes/X, Y, Z direction
Reflow solder head 230°C, 5 s. n = 11 c = 0 2
NOTES:
1. The sample to be tested shall be left at normal temperature and humidity for 2 hours after it is taken out of the chamber. No dew point.
2. Refer to the Precautions for Soldering section for temperature profile.
10 IrDA Data Sheet
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115 kbps Transceiver GP2W0106YP
OUTGOING INSPECTION
Inspection lot: Inspection shall be carried out per
each delivery lot.
Inspection method: A single sampling plan, normal
inspection level two based on ISO 2859 shall be adopted.
Table 2. Outgoing Inspection
PARAMETER
Major defect
Minor defect
INSPECTION ITEMS AND
TEST METHOD
Disconnection, short 0.1
Inverse polarity on terminal 0.1
Soldering defect (obstacle to use)
Electrical characteristic defect 0.1
Appearance defect which affects the electrical character­istics such as, split, chip, scratch, stain, or blur
AQL(%)
0.1
0.25
PRECAUTIONS FOR SOLDERING
Solder Reflow
Solder only once at the temperature and the time
within the temperature profile as shown in Figure 16.
Other Precautions
An infrared lamp used to heat up for soldering may cause a localized temperature rise in the resin. Keep the package temperature within that specified in Figure 16. Also avoid immersing the resin part in the solder. Even if within the temperature profile shown in Figure 16, there is the possibility that the gold wire in the package may break if the deformation of the PCB affects the lead pins. Use after fully confirming the conditions of actual solder reflow machine.
Soldering
Soldering iron shall be less than 25 W, and temper-
ature of soldering iron point shall be used at less than 260°C.
Soldering time shall be within 5 seconds.
Soldered product shall treat at normal temperature.
Solder: 6/4 solder or included Ag solder.
230°C
MAX.
200°C
165°C
MAX.
25°C
1 - 4°C/s
1 - 4°C/s
1 - 4°C/s
5 s MAX.
60 s MAX.
120 s MAX. 90 s MAX.
GP2W0106YP-16
Figure 16. Temperature Profile
IrDA Data Sheet 11
Page 12
GP2W0106YP 115 kbps Transceiver
TAPING SPECIFICATIONS
Taping Method
Taping structure and dimensions: The tape should have a structure in which a cover tape is sealed heat­pressed on the carrier tape of conductive PET. See Figure 17.
Reel structure and dimensions: The taping reel should be conductive plastic with its dimensions as shown in Figure 18.
Direction of product insertion: Product direction in carrier tape should be such that electrode side of product is placed on the cover tape side and lens side of product is placed on the hold side of the tape. See Figure 19.
2.0 ±0.1
4.0 ±0.1
8.0 ±0.1
Taped device repair: To repair taped device failure, cut the bottom of carrier tape with a cutter, and after replacing with good devices, seal the cut portion with adhesive tape.
Adhesiveness of cover tape: The exfoliation force between carrier tape and cover tape should be 0.2 N to 1 N for the angle from 160° to 180°.
Rolling method and quantity: Wind the tape back on the reel so that the cover tape is on the outside. Attach more than 20 cm of blank tape to the trailer and the leader of the tape and fix both ends with adhesive tape. One reel shall contain 2,000 pieces.
Safety protection during shipping: There should be no deformation of component or degradation of elec­trical characteristics due to shipping.
φ1.5
+0.1
-0.0
0.3 ±0.05
2.65 ±0.1
NOTE: Dimensions are in mm.
1.75 ±0.1
7.5 ±0.1
16.0 ±0.3
3.25 ±0.1
Figure 17. Tape Structure and Dimensions
8.5 ±0.1
GP2W0106YP-17
12 IrDA Data Sheet
Page 13
115 kbps Transceiver GP2W0106YP
21 ±0.8
13 ±0.2
2 ±0.5
22.4 MAX.
100 ±1
NOTE: Dimensions are in mm.
330 ±2
17.5 ±0.5
GP2W0106YP-18
Figure 18. Reel Structure and Dimensions
PULL-OUT DIRECTION
LENS
SIDE
GP2W0106YP-19
Figure 19. Direction of Product Insertion
IrDA Data Sheet 13
Page 14
GP2W0106YP 115 kbps Transceiver
TAPING MOISTURE-PROOF PACKING
Packaging Specifications
Table 3. Packaging Material
NAME MATERIAL
Aluminum laminate bag Aluminum polyethylene
Label Paper
Siccative
Outer case Paper
Pads Paper
Packaging Method
Seal the aluminum laminated bag containing the tape reel (2,000 pieces per reel) and siccative.
Fill out necessary information on the label and paste it on the aluminum laminate bag.
Pack four aluminum laminated bags (containing one reel each) into the designated outer case, where paper pads are placed on the bottom and top of the outer case, as well as between each layer of the alu­minum laminated bags. Minimum order/shipment quantity should be one laminated bag.
The outer case should then be sealed with packaing tape, with indicating the model name, quantity, and outgoing inspection data on the case. Total of 8,000 pieces per carton.
Table 4. Packaging Method Specifications
Storage and Treatment After Unsealing
Storage conditions: The product should be stored with these conditions:
Storage temperature: 10°C to 30°CHumidity: below 60% RH
Treatment after opening:
After unsealing, devices should be mounted un-
der the temperature condition of 10°C to 30°C, at the humidity conditions of below 60% RH, within two days.
– In case long term storage is needed, devices
should either be stored in dry box or re-sealed in a moisture-proof bag with siccative and kept in an environment where the temperature is 10°C to 30°C, at the humidity condition of below 60% RH. Devices must be mounted within two weeks.
Baking before mounting:
In the event that the devices are not maintained
in the recommended storage conditions or the enclosed siccative indicator has turned pink, baking must be done before devices are mount­ed. Please also note that baking should only be done once.
Recommended condition: 100°C, 12 to 24 hours.Baking will not be properly done with the devices
in their shipping package. To complete the baking properly, devices should either be temporarily mounted to PCB with adhesive, or placed in a metal tray. The temporary mounting should be done using adhesive, not by soldering.
PACKAGE
SHAPE
Tape reel
(φ 330 mm)
PRODUCT QUANTITY
2,000
1 model
pieces
per reel
SACK
QUANTITY
1 reel per
moisture-proof
laminated bag
14 IrDA Data Sheet
Page 15
115 kbps Transceiver GP2W0106YP
DESICCANT
EXAMPLE 1
LABEL
(MODEL NUMBER
QUANTITY
DATE)
PRODUCTS
IN TAPE-REEL
ALUMINUM
LAMINATED BAG
TAPE-REEL IN
ALUMINUM LAMINATED BAG
PADS
(TOTAL 5 SHEETS)
440 mm TYP.
TAPE-REEL IN
ALUMINUM
LAMINATED BAG
(TOTAL 4 SETS)
PACKING CASE
EXAMPLE 3
370 mm TYP.
PACKING
TAPE
EXAMPLE 2
PACKAGE METHOD EXAMPLES:
1. Seal the aluminum laminated bag, including the tape reel with 2,000 pieces and desiccant.
2. Fill out the model name, quantity etc. in the blank area of label and paste on the bag.
3. Put the four moisture-proof laminated bags in the ruled case. Put the pad between the bags, and top and bottom.
4. Seal the case with packing tape, and indicate model name and quantity. (8,000 pieces/package) Total Packaged mass: Approximately 3.3 kg.
NOTE: Dimensions are in mm.
Figure 20. Packing Specification
150 mm TYP.
MODEL NUMBER
QUANTITY
DATE
EXAMPLE 4
GP2W0106YP-20
IrDA Data Sheet 15
Page 16
GP2W0106YP 115 kbps Transceiver
LIFE SUPPORT POLICY
SHARP components should not be used in medical devices with life support functions or in safety equipment (or similiar applications where component failure would result in loss of life or physical harm) without the written approval of an officer of the SHARP Corporation.
LIMITED WARRANTY
SHARP warrants to its Customer that the Products will be free from defects in material and workmanship under normal use and service for a period of one year from the date of invoice. Customer's exclusive remedy for breach of this warranty is that SHARP will either (i) repair or replace, at its option, any Product which fails during the warranty period because of such defect (if Customer promptly reported the failure to SHARP in writing) or, (ii) if SHARP is unable to repair or replace, refund the purchase price of the Product upon its return to SHARP. This warranty does not apply to any Product which has been subjected to misuse, abnormal service or handling, or which has been altered or modified in design or construction, or which has been serviced or repaired by anyone other than Sharp. The warranties set forth herein are in lieu of, and exclusive of, all other warranties, express or implied. ALL EXPRESS AND IMPLIED WARRANTIES, INCLUDING THE WARRANTIES OF MERCHANTABILITY, FITNESS FOR USE AND FITNESS FOR A PARTICULAR PURPOSE, ARE SPECIFICALLY EXCLUDED. In no event will Sharp be liable, or in any way responsible, for any incidental or consequential economic or property damage.
The above warranty is also extended to Customers of Sharp authorized distributors with the following exception: reports of failures of Products during the warranty period and return of Products that were purchased from an authorized distributor must be made through the distributor. In case Sharp is unable to repair or replace such Products, refunds will be issued to the distributor in the amount of distributor cost.
SHARP reserves the right to make changes in specifications at any time and without notice. SHARP does not assume any responsibility for the use of any circuitry described; no circuit patent licenses are implied.
NORTH AMERICA
SHARP Microelectronics of the Americas 5700 NW Pacific Rim Blvd. Camas, WA 98607, U.S.A. Phone: (360) 834-2500 Telex: 49608472 (SHARPCAM) Facsimile: (360) 834-8903
EUROPE
SHARP Electronics (Europe) GmbH Microelectronics Division Sonninstraße 3 20097 Hamburg, Germany Phone: (49) 40 2376-2286 Facsimile: (49) 40 2376-2232 http://www.sharpmed.com
ASIA
SHARP Corporation Integrated Circuits Group 2613-1 Ichinomoto-Cho Tenri-City, Nara, 632, Japan Phone: +81-743-65-1321 Facsimile: +81-743-65-1532 http://www.sharp.co.jp
http://www.sharpsma.com
©2000 by SHARP Corporation Reference Code SMA00007
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