Datasheet GP2W0104YP Datasheet (Sharp)

GP2W0104YP

IrDA Data Sheet

FEATURES

• Built-in Photodiode

• Operating voltage 2.4 V to 5.5 V

• Conforms to eye safety IEC60825-1, without exter­nal resistor

• This product shall not contain the following materi­als, and these materials shall not be used in the pro­duction process for this product.

–CFCs
– Halon
– Carbon Tetrachloride
– 1.1.1. Trichloroethane (Methylchloroform)
– Specific brominated flame retardants such as the

PBBO

INTRODUCTION

This specification applies to the outline and charac­teristics of IrDA 1.2 type (data rate 2.4 kbps to 115.2
kbps, low power option compliant).

NOTES

• Caution should be taken to prevent the detector sur-

face from being smeared with dust or dirt, or from
being touched, as it may cause faulty operation.

• Cleaning conditions:

– Solvent cleaning: Solvent temperature 45°C or

less. Immersion for 3 minutes or less.

– Ultrasonic cleaning: The effect of ultrasonic

cleaning on the device differs by cleaning bath
size, ultrasonic power output, cleaning time, PCB
size or device mounting condition, etc. Test the
device under actual conditions and confirm that
ultrasonic cleaning does not cause any immedi­ate or potential defects.

– Cleaning solvent: The cleaning shall be carried out

with ethyl alcohol, methyl alcohol, isopropyl alcohol.

• In order to prevent electrostatic damage to the inte-

grated circuit, handle this device in a static-free envi­ronment and workstation.

• External force applied to the device after mounting can

cause mounting defects such as the terminal coming
off. Be careful when handling the device and prevent
objects from touching the device after mounting.

• Refer to the ‘Precautions for Soldering’ section.

• When the system (program) is designed, the turn

around time from transmit to receive should be
designed by considering 0.5 ms or more that is spec­ified by IrDA. This turn around time means the time

and PBBS are not used in this device.

S

115 kbps Transceiver

that this device does not temporarily detect the
inconsistent signal, since the transmitted light from
the transmitter side reaches the detector side of the
same transceiver.

• When designing the system (program), consider that

0.3 ms or more (at T
essary to return from shut-down mode to ready­operation mode. In addition, thoroughly confirm the
operation in the actual application.

• When there is considerable external stray light or a
light source is located near the transceiver, or the
detector face receives considerable external stray
light, a pulse other than signal output may be gener­ated as noise on output terminal of the transceiver.
Consider the layout and structure in your design to
minimize disturbing light on the detector face.

• When the sensor is adopted in an IR communication
system, it should be used according to the signal
method which is specified by ‘Serial Infrared Physical
Layer Link Specification’ published by the Infrared
Data Association. Faulty operation may occur, if a sig­nal method other than that specified is used.

• RXD pinout remains at high-level output in shutdown
mode. The RXD pinout is CMOS output, and other
CMOS outputs must not be directly connected to this
pinout, as it does not conform to tri-state output.

• In circuit designs, make allowance for the degradation
of the light emitting diode output that results from long­term continuous operation (50% degradation/5 years).

1NC2NC3

+

CX

COMPONENTS

CX 10 µF/6.3 V (NOTE 1)

NOTES:

1. Choose the most suitable CX according to the
noise level and noise frequency of power supply.

2. Pin 1 and Pin 2 are not connected internally.

Figure 1. Recommended External Circuit

= 25°C, no input signal) is nec-

A

4

V

DD

V

DD

RECOMMENDED VALUES

5SD6

GND

GND SD RXD TXD

RXD7TXD8LEDA

GP2W0104YP-1

IrDA Data Sheet 1

GP2W0104YP 115 kbps Transceiver

CX

+

UART

SD INPUT PERFORMANCE

LOW Normal Mode

3T/16

T

0

Shutdown

Mode

T

10 1

HIGH

1

1

ENCODER

CIRCUIT

DECODER

5

NOTES:

1 Transmitting data waveform

2 Encoder circuit output waveform

3 Transmitter output optical signal waveform

4 GP2W0104YP receiver output waveform

Receiving data waveform

5

CIRCUIT

2

TXD

4

RXD

SD

Figure 2. System Example

Recommended Size of
Solder Cream Paste

Open the solder mask as shown in Figure 4. The
size of solder cream paste for this device before reflow
soldering must be as large as one of the foot pattern
land, indicated in Figure 5.

LEDA

GP2W0104YP

GND

V

DD

3

3

GP2W0104YP-2

2

1.55

3

1.1

4

5

NOTES:

1 Transmitting data waveform

Encoder circuit output waveform

2

3 Transmitter output optical signal waveform

4 GP2W0104YP receiver output waveform

Receiving data waveform

5

T =

Data Rate

Data rate: 2.4 kbps, 9.6 kbps, 19.2 kbps, 38.4 kbps,

0

1

57.6 kbps, 115.2 kbps

10 1

Figure 3. Signal Waveform Example

GP2W0104YP-3

0.6

NOTES:

1. Dimensions are in mm.

2. Dimensions are for reference.

3. Soldering paste area

0.475

1.425

Figure 4. Solder Cream Size

2.375

3.325

2.0

GP2W0104YP-5

0.1

1.55

2 IrDA Data Sheet

115 kbps Transceiver GP2W0104YP

1.0

1.55

CENTER OF

MOUNTING AREA

1.1

2.0

0.1

1.55

8

7

0.6

PIN

1

2

3

4

5

6

7

8

NOTES:

1. Dimensions are in mm.

2. Dimensions are shown for reference.

3. Connect foot pattern of shield case to GND pattern.

PIN NAME SYMBOL

NC

NC

V

DD

Ground

Shutdown

Receiver Data Output

Transmitter Data Input

LED Anode

NC

NC

V

DD

GND

SD

RXD

TXD

LEDA

Figure 5. Foot Pattern of PCB

6

0.475

4

5

1.425

2.375

3.325

2

3

1

GP2W0104YP-4

IrDA Data Sheet 3

GP2W0104YP 115 kbps Transceiver

1.15 3.9

2.75 ±0.3

CENTER

OF DETECTOR

1

EMBOSSED

2 3

+0.2

8 - 0.4

-0.3

PO .95 x 7 = 6.65

7.9 ±0.3

'S'

4

2.5

5.2

1.15 0.9

CENTER

OF EMITTER

5 6

0.48

1.88

±0.3

2.7

2 ±0.3

φ2.2φ2.2

1.5 ±0.3

1.05 ±0.3

2.15 ±0.3

+0.3

0.8

-0.2

+0.4

0.35

-0.2

8

7

PIN

1

2

3

4

5

6

7

8

PIN NAME SYMBOL

NC

NC

V

DD

Ground

Shutdown

Receiver Data Output

Transmitter Data Input

LED Anode

NC

NC

V

DD

GND

SD

RXD

TXD

LEDA

BOTTOM VIEW

8 - 0.6

NOTES:

1. Dimensions are in mm.

2. Unspecified tolerances are ±0.2

3. Adhesion of resin to the terminal area are allowed MAX. 0.2 mm.
area: Au plating

Figure 6. GP2W0104YP Outline Dimensions

0.6 ±0.3

PO .95 x 7 = 6.65

GP2W0104YP-6

4 IrDA Data Sheet

115 kbps Transceiver GP2W0104YP

RATINGS AND CHARACTERISTICS

Absolute Maximum Ratings

PARAMETER SYMBOL RATINGS UNIT NOTES

Supply voltage V

Peak forward current I

Operating temperature T

Storage temperature T

Soldering temperature T

NOTES:

1. Pulse width: 78.1 µs. Duty ratio: 3/16.

2. Soldering reflow time: 5 seconds.

DD

FM

OPR

STG

SOL

0 to 6.0 V

60 mA 1

-20 to +85 °C

-30 to +85 °C

230 °C2

Recommended Operating Conditions

PARAMETER SYMBOL OPERATING CONDITION UNIT NOTES

Supply voltage V

DD

Data rate BR 2.4 to 115.2 kbps

SD terminal high level input voltage V

SD terminal low level input voltage V

TXD high level input voltage V

TXD low level input voltage V

IHSD

ILSD

IHTXD

ILTXD

2.4 to 5.5 V

VDD -0.5 to V

DD

V1

0.0 to 0.4 V 2

VDD -0.5 to V

DD

V3

0.0 to 0.4 V 4

NOTES:

1. Shut down mode

2. Normal mode

3. LED ON. See Figure 12.

4. LED OFF. See Figure 12.

Electrical Characteristics

TA = 25°C, VCC = 3.3 V unless otherwise specified

PARAMETER SYMBOL MIN. TYP. MAX. UNIT NOTES

Current consumption at no input signal I

Current consumption at shut-down mode I

High level output voltage V

Low level output voltage V

Low level pulse width t

Rise time t

Fall time t

DD

DD-S

OH

OL

W

R

F

3.0 V 3

1.0 6.0 µs 5

Maximum reception distance L 20 cm 5

Input irradiance Ee 0.09 W/m

Radiant intensity I

LED peak current I

Rise time t

Fall time t

Peak emission wavelength

E

LED

R

F

p 850 870 900 nm 6

λ

3.6 25 mW/sr 6

14 20 26 mA 6

70 120 µA 1

0.01 1.0 µA 2

0.4 V 4

0.4 µs 5

0.4 µs 5

2

0.6 µs 6

0.6 µs 6

5

4. I

NOTES:

1. No input signal, V

2. No input signal, V

3. See Figures 7, 8, and 9.

= 0 V. Output terminal open.

ILSD

IHSD

= VDD. Output terminal open.

= 400 µA. See Figures 7, 8, and 9.

OL

5. BR = 115.2 kbps, φ ≤ 15°, See Figures 7, 8, and 9.

6. BR = 115.2 kbps, φ ≤ 15°, V

and 12.

= 2.8 V. See Figures 10, 11,

IHTXD

IrDA Data Sheet 5

GP2W0104YP 115 kbps Transceiver

t

W

V

OL

t

R

t

F

V

OH

90%

50%

10%

GP2W0104YP-8

T

1

T

2

T

1

RADIATION
INTENSITY OF
TRANSMITTER

3.6 mW/sr

NOTE: At BR = 2.4 Kbps: T1 = 416.7 µs, T2 = 78.1 µs
At BR = 115.2 Kbps: T1 = 8.68 µs, T2 = 1.63 µs

GP2W0104YP-7

Figure 7. Input Signal Waveform (Detector Side)

Figure 8. Output Waveform (Detector Side)

TRANSMITTER

(NOTE)

NOTE:

1. Transmitter uses GP2W0104YP (λp = 870 nm TYP.)
which is adjusted the radiation intensity at 3.6 mW/sr.

2. φ Indicates horizontal and vertical directions.

3. Ee: Detector face illuminance < 10 x

Figure 9. Standard Optical System (Detector Side)

φ

φ

GP2W0104YP

OSCILLOSCOPE

L

GP2W0104YP-9

6 IrDA Data Sheet

115 kbps Transceiver GP2W0104YP

GP2W0104YP-13

PEAK

FORWARD

CURRENT

I

FM

(mA)

60

40

25
20

-20 85
100755025

AMBIENT TEMPERATURE T

A

(°C)

NOTE: Pulse width ≤ 78.1 µs, Duty ratio 3/16

0-25

0

90%

I

E

10%

t

R

t

F

GP2W0104YP-10

Figure 10. Output Waveform Specification

(Emitter Side)

GP2W0104YP

NOTE: φ indicates horizontal
and vertical directions

φ
φ

DETECTOR FOR
RADIATION INTENSITY
MEASURING

GP2W0104YP-11

= 3.3 V

V

DD

1.63 µs

Tx = 2.8 V

V

IN

BR = 115.2 Kbps

Figure 12. Recommended Circuit (Emitter Side)

IrDA Data Sheet 7

Figure 11. Standard Optical System (Emitter Side)

LEDA

TXD

GP2W0104YP

GP2W0104YP-12

Figure 13. Peak Forward Current

Versus Ambient Temperature

GP2W0104YP 115 kbps Transceiver

RELIABILITY

TEST ITEMS TEST CONDITIONS

Temperature cycling

High temperature and high
humidity storage

1 cycle -30°C to 85°C
(30 minutes) 20 cycles test

+40°C, 90% RH, 20 hours n = 22 c = 0 1, 3, 4

High temperature storage +85°C, 240 hours n = 22 c = 0 1, 3, 4

Low temperature storage -30°C, 240 hours n = 22 c = 0 1, 3, 4

Operation life 1 +25°C, V

+25°C, V

Operation life 2

240 hours, Pulse width 78.1 µs,

= 3.3 V, 240 hours n = 11 c = 0 1, 3, 4

DD

= LEDA = 3.3 V,

DD

Duty ratio 3/16

Mechanical shock

Variable frequency
vibration

1000 m/s
3 times/±X, ±Y, ±Z direction

200 m/s
100 to 2,000 to 100 Hz for
Approximately 4 minutes

2

, 6 ms,

2

,

FAILURE JUDGEMENT

CRITERIA

> Up × 1.2

I

DD

L < Low × 0.8

< Low × 0.8

I

E

IE > Up × 1.2

Up: Upper

Specification Limint

Low: Lower

Specification Limint

SAMPLES

(n)

DEFEC­TIVE (c)

n = 22 c = 0 1, 3, 4

n = 11 c = 0 1, 3, 4

n = 11 c = 0 3, 4

n = 11 c = 0 3, 4

NOTE

48 minutes/X, Y, Z direction

Reflow solder head 230°C, 5 s n = 11 c = 0 2, 3, 4

NOTES:

1. The sample to be tested shall be left at normal temperature and humidity for
2 hours after it is taken out of the chamber. No dew point.

2. Refer to the ‘Precautions for Soldering’ section for temperature profile.

3. Confidence level: 90%

4. LTPD: 10%/20%.

8 IrDA Data Sheet

115 kbps Transceiver GP2W0104YP

PRECAUTIONS FOR SOLDERING

Solder Reflow

Solder only once at the temperature and the time

within the temperature profile as shown in Figure 14.

Other Precautions

An infrared lamp used to heat up for soldering may

cause a localized temperature rise in the resin. So keep
the package temperature within that specified in Figure

14. Also avoid immersing the resin part in the solder.

Even if within the temperature profile shown in Figure 14,
there is the possibility that the gold wire in the package

230°C

MAX.

200°C

165°C

MAX.

may break if the deformation of the PCB affects the lead
pins. Use after fully confirming the conditions of actual
solder reflow machine.

Soldering

• Soldering iron shall be less than 25 W, and temper­ature of soldering iron point shall be used at less
than 260°C.

• Soldering time shall be within 5 seconds.

• Soldered product shall treat at normal temperature.

• Solder: 6/4 solder or included Ag solder.

1 - 4°C/s

25°C

1 - 4°C/s

1 - 4°C/s

5 s MAX.

60 s MAX.

120 s MAX. 90 s MAX.

GP2W0104YP-14

Figure 14. Temperature Profile

IrDA Data Sheet 9

GP2W0104YP 115 kbps Transceiver

TAPING SPECIFICATIONS

Taping Method

• Taping structure and dimensions: The tape should
have a structure in which a cover tape is sealed heat­pressed on the carrier tape of conductive PET. See
Figure 15.

• Reel structure and dimensions: The taping reel
should be conductive plastic with its dimensions as
shown in Figure 16.

• Direction of product insertion: Product direction in
carrier tape should be such that electrode side of
product is placed on the cover tape side and lens
side of product is placed on the hold side of the tape.
See Figure 17.

2.0 ±0.1

4.0 ±0.1

8.0 ±0.1

• Taped device repair: To repair taped failure devices,
cut the bottom of carrier tape with a cutter, and after
replacing with good devices, seal the cut portion with
adhesive tape.

• Adhesiveness of cover tape: The exfoliation force
between carrier tape and cover tape should be 0.2 N
to 1 N for the angle from 160° to 180°.

• Rolling method and quantity: Wind the tape back on
the reel so that the cover tape is on the outside.
Attach more than 20 cm of blank tape to the trailer
and the leader of the tape and fix both ends with
adhesive tape. One reel shall contain 2,000 pieces.

• Safety protection during shipping: There should be
no deformation of component or degradation of elec­trical characteristics due to shipping.

φ1.5

+0.1

-0.0

0.3 ±0.05

2.65 ±0.1

NOTE: Dimensions are in mm.

1.75 ±0.1

7.5 ±0.1

16.0 ±0.3

3.25 ±0.1

Figure 15. Tape Structure and Dimensions

8.2 ±0.1

GP2W0104YP-15

10 IrDA Data Sheet

115 kbps Transceiver GP2W0104YP

±0.8

21

13 ±0.2

2 ±0.5

22.4 MAX.

100 ±1

NOTE: Dimensions are in mm.

330 ±2

17.5 ±0.5

GP2W0104YP-16

Figure 16. Reel Structure and Dimensions

PULL-OUT DIRECTION

LENS

SIDE

GP2W0104YP-17

Figure 17. Direction of Product Insertion

IrDA Data Sheet 11

GP2W0104YP 115 kbps Transceiver

TAPING MOISTURE-PROOF PACKING

Packaging Specifications

Table 1. Packaging Material

NAME MATERIAL

Aluminum laminate bag Aluminum polyethylene

Label Paper

Siccative

Outer case Paper

Pads Paper

Packaging Method

• Seal the aluminum laminated bag containing the
tape reel (2,000 pieces per reel) and siccative.

• Fill out necessary information on the label and paste
it on the aluminum laminate bag.

• Pack four aluminum laminated bags (containing one
reel each) into the designated outer case, where
paper pads are placed on the bottom and top of the
outer case, as well as between each layer of the alu­minum laminated bags. Minimum order/shipment
quantity should be one laminated bag.

• The outer case should then be sealed with packing
tape, with indicating the model name, quantity, and
outgoing inspection data on the case. Total of 8,000
pieces per carton.

Table 2. Packaging Method Specifications

Storage and Treatment After Unsealing

• Storage conditions: The product should be stored
with these conditions:

– Storage temperature: 10°C to 30°C
– Humidity: below 60% RH

• Treatment after opening:

– After unsealing, devices should be mounted un-

der the temperature condition of 10°C to 30°C, at
the humidity conditions of below 60% RH, within
two days.

– In case long term storage is needed, devices

should either be stored in dry box or re-sealed in
a moisture-proof bag with siccative and kept in an
environment where the temperature is 10°C to
30°C, at the humidity condition of below 60% RH.
Devices must be mounted within two weeks.

• Baking before mounting:

– In the event that the devices are not maintained

in the recommended storage conditions or the
enclosed siccative indicator has turned pink,
baking must be done before devices are mount­ed. Please also note that baking should only be
done once.

– Recommended condition: 100°C, 12 to 24 hours.
– Baking will not be properly done with the devices

in their shipping package. To complete the baking
properly, devices should either be temporarily
mounted to PCB with adhesive, or placed in a
metal tray. The temporary mounting should be
done using adhesive, not by soldering.

PACKAGE

SHAPE

Tape reel

(φ 330 mm)

PRODUCT QUANTITY

1 model

2,000 piec-

es per reel

SACK

QUANTITY

1 reel per

moisture-proof

laminated bag

12 IrDA Data Sheet

115 kbps Transceiver GP2W0104YP

DESICCANT

EXAMPLE 1

LABEL

(MODEL NUMBER

QUANTITY

DATE)

PRODUCTS

IN TAPE-REEL

ALUMINUM

LAMINATED BAG

TAPE-REEL IN

ALUMINUM LAMINATED BAG

PADS

(TOTAL 5 SHEETS)

440 mm TYP.

TAPE-REEL IN

ALUMINUM

LAMINATED BAG

(TOTAL 4 SETS)

PACKING CASE

EXAMPLE 3

370 mm TYP.

PACKING

TAPE

EXAMPLE 2

PACKAGE METHOD EXAMPLES:

1. Seal the aluminum laminated bag, including the tape reel
with 2,000 pieces and desiccant.

2. Fill out the model name, quantity etc. in the blank area of label
and paste on the bag.

3. Put the four moisture-proof laminated bags in the ruled case.
Put the pad between the bags, and top and bottom.

4. Seal the case with packing tape, and indicate model name
and quantity. (8,000 pieces/package)
Total Packaged mass: Approximately 0.7 kg.

NOTE: Dimensions are in mm.

Figure 18. Packing Specification

150 mm TYP.

MODEL NUMBER

QUANTITY

DATE

EXAMPLE 4

GP2W0104YP-18

IrDA Data Sheet 13

GP2W0104YP 115 kbps Transceiver

LIFE SUPPORT POLICY

SHARP components should not be used in medical devices with life support functions or in safety equipment (or similiar applications where
component failure would result in loss of life or physical harm) without the written approval of an officer of the SHARP Corporation.

LIMITED WARRANTY

SHARP warrants to its Customer that the Products will be free from defects in material and workmanship under normal use and service for a
period of one year from the date of invoice. Customer's exclusive remedy for breach of this warranty is that SHARP will either (i) repair or
replace, at its option, any Product which fails during the warranty period because of such defect (if Customer promptly reported the failure to
SHARP in writing) or, (ii) if SHARP is unable to repair or replace, refund the purchase price of the Product upon its return to SHARP. This
warranty does not apply to any Product which has been subjected to misuse, abnormal service or handling, or which has been altered or
modified in design or construction, or which has been serviced or repaired by anyone other than Sharp. The warranties set forth herein are in
lieu of, and exclusive of, all other warranties, express or implied. ALL EXPRESS AND IMPLIED WARRANTIES, INCLUDING THE
WARRANTIES OF MERCHANTABILITY, FITNESS FOR USE AND FITNESS FOR A PARTICULAR PURPOSE, ARE SPECIFICALLY
EXCLUDED. In no event will Sharp be liable, or in any way responsible, for any incidental or consequential economic or property damage.

The above warranty is also extended to Customers of Sharp authorized distributors with the following exception: reports of failures of Products
during the warranty period and return of Products that were purchased from an authorized distributor must be made through the distributor.
In case Sharp is unable to repair or replace such Products, refunds will be issued to the distributor in the amount of distributor cost.

SHARP reserves the right to make changes in specifications at any time and without notice. SHARP does not assume any responsibility
for the use of any circuitry described; no circuit patent licenses are implied.

NORTH AMERICA

SHARP Microelectronics
of the Americas
5700 NW Pacific Rim Blvd.
Camas, WA 98607, U.S.A.
Phone: [phone]
Telex: 49608472 (SHARPCAM)
Facsimile: [phone]

EUROPE

SHARP Electronics (Europe) GmbH
Microelectronics Division
Sonninstraße 3
20097 Hamburg, Germany
Phone: [phone]
Facsimile: (49) 40 2376-2232
http://www.sharpmed.com

ASIA

SHARP Corporation
Integrated Circuits Group
2613-1 Ichinomoto-Cho
Tenri-City, Nara, 632, Japan
Phone: [phone]
Facsimile: [phone]
http://www.sharp.co.jp

http://www.sharpsma.com

©2000 by SHARP Corporation Reference Code SMA00002