Page 1
GP2W0001YP
IrDA Data Sheet
FEATURES
• Built-in Photodiode
• Operating voltage 2.7 V to 5.5 V
• In circuit design, allow for the degradation of light
emitting diode output that results from long continuous operation (50% degradation/5 years).
• This product shall not contain the following materials, and these materials shall not be used in the production process for this product.
–CFCs
– Halon
– Carbon Tetrachloride
– 1.1.1. Trichloroethane (Methylchloroform)
– Specific brominated flame retardants such as the
PBBOs and PBBs are not used in this device.
INTRODUCTION
This specification applies to the outline and charac-
teristics of IrDA 1.2 type (data rate 2.4 kbps to
115.2 kbps, low power option compliant) optical data
communication transceiver.
115 kbps Transceiver
designed by considering 0.5 ms or more that is specified by IrDA. This turn around time means the time
that this device temporarily does not detect the
incoming signal, since the transmitted light from the
transmitter side reaches the detector side of the
same transceiver.
• Consider that 20 ms or more (at T
signal) is necessary to return from shut-down mode
to ready operation mode. In addition, thoroughly
confirm the operation in the actual application.
• When there is considerable external stray light or a
light source is located near the transceiver, or the
detector face receives considerable external stray
light, a pulse other than the desired signal output may
be generated as noise on the output terminal of the
transceiver. Consider the layout and structure in your
design to minimize disturbing light on the detector face.
• When the sensor is adopted in an IR communication
system, it should be used according to the signal
method specified by ‘Serial Infrared Physical Layer
Link Specification’ published by the Infrared Data
Association. Faulty operation may occur if a signal
method other than that specified is used.
= 25°C, no input
A
NOTES
• Caution should be taken to prevent the detector surface from being smeared with dust or dirt, or from
being touched, as it may cause faulty operation.
• Cleaning conditions:
– Solvent cleaning: Solvent temperature 45°C or
less. Immersion for 3 minutes or less.
– Ultrasonic cleaning: The effect of ultrasonic
cleaning on the device differs by cleaning bath
size, ultrasonic power output, cleaning time, PCB
size or device mounting condition, etc. Test the
device under actual conditions and confirm that
ultrasonic cleaning does not cause any immediate or potential defects.
– Cleaning solvent: The cleaning shall be carried
out with ethyl alcohol, methyl alcohol, or isopropyl
alcohol.
• In order to prevent electrostatic damage to the integrated circuit, handle this device in a static-free environment and workstation.
• External force applied to the device after mounting can
cause mounting defects such as the terminal coming
off. Be careful when handling the device and prevent
objects from touching the device after mounting.
• Refer to the ‘Precautions for Soldering’ section.
• When the system (program) is designed, the turn
around time from transmit to receive should be
1
2
LEDA
TXD3SD
R
2
RL
CX
TX
COMPONENTS
CX
1
CX
2
R
1
R
2
RL
(STANDARD)
RL
(LOW POWER)
NOTE: Choose the most suitable CX
the noise level and noise frequency of power supply.
4
RXD
2
SD
RXD
RECOMMENDED VALUES
47 µF/6.3 V (NOTE)
1500 pF/25 V
47 Ω ±5%, 1/10 W (NOTE)
1 kΩ ±5%, 1/10 W
2.2 Ω ±5%, 1/2 W
(V
= 3.0 V, IE = 40 mW/sr)
CC
33 Ω ±1%, 1/8 W
= 3.0 V, IE = 3.6 mW/Sr)
(V
CC
6
5
V
GND
CC
CX
1
+
R
1
V
CC
and R1 according to
1
GP2W0001YP-1
Figure 1. Recommended External Circuit
IrDA Data Sheet 1
Page 2
GP2W0001YP 115 kbps Transceiver
R
1
CX
1
+
UART
SD INPUT PERFORMANCE
HIGH Normal Mode
LOW or
OPEN
Shutdown
Mode
1
ENCODER
2
CIRCUIT
4
5
DECODER
CIRCUIT
NOTES:
1 Transmitting data waveform
2
Encoder circuit output waveform
3 Transmitter output optical signal waveform
4 GP2W0001YP receiver output waveform
5
Receiving data waveform
Figure 2. System Example
CX
R
RL
V
2
CC
LEDA
3
TXD
2
GP2W0001YP
RXD
3
SD
GND
GP2W0001YP-2
2 IrDA Data Sheet
Page 3
115 kbps Transceiver GP2W0001YP
0.9
0.7
P 1.4 x 5 = 7
1.7
1
2
3
4
5
6
LED Anode
Transmitter Data Input
Shutdown
Receiver Data Output
Ground
Supply Voltage
LEDA
PIN PIN NAME SYMBOL
TXD
SD
RXD
GND
V
CC
1
23456
0.9
0.7
P 1.4 x 5 = 7
1.7
NOTES: Dimensions are in mm.
GP2W0001YP-4
1
23456
Soldering paste area
View from parts side
LENS (PD/LED) SIDE
Solder Mask Opening
T
1
2
3
4
5
NOTES:
1 Transmitting data waveform
2
Encoder circuit output waveform
3 Transmitter output optical signal waveform
4 GP2W0001YP receiver output waveform
5
Receiving data waveform
T =
Data Rate
Data rate: 2.4 kbps, 9.6 kbps, 19.2 kbps, 38.4 kbps,
Figure 3. Signal Waveform Example
0
3T/16
0
1
57.6 kbps, 115.2 kbps
T
10 1
10 1
GP2W0001YP-3
Recommended Size of
Solder Cream Paste
Open the solder mask as shown in Figure 4. The size
of solder cream paste for this device before reflow soldering must be as large as the foot pattern landings.
Figure 4. Foot Pattern and
Solder Cream Paste Size
IrDA Data Sheet 3
Page 4
GP2W0001YP 115 kbps Transceiver
8.7 ±0.2
3.15
3.5
1.7
0.6
2.95
CENTER
OF EMITTER
2
1
2.325
2.2
4.2
4.2
EMBOSSED
'S'
1.0
φ2.8
±0.1
CENTER
OF DETECTOR
φ3.6 ±0.1
6 - 1.1 ±0.2
0.7
0.7
P 1.4 x 5 = 7 ±0.2
4
3
6
5
+0.2
6 - 0.8
-0.3
0.7
0.7
P 1.4 x 5 = 7 ±0.2
NOTES:
1. Dimensions are in mm.
2. Unspecified tolerances are ±0.3 mm.
3. Adhesion of resin to the terminal area are allowed MAX. 0.3 mm.
4. Resin burr are not included in this outline drawing.
5. Product mass: Approx. 0.12 g
6. Mold resin: Epoxy resin (black)
area: Au plating
Figure 5. GP2W0001YP Outline Dimensions
PIN
1
2
3
4
5
6
PIN NAME SYMBOL
LED Anode
Transmitter data Input
Shutdown
Receiver Data Output
Ground
Supply Voltage
LEDA
TXD
SD
RXD
GND
V
CC
GP2W0001YP-5
4 IrDA Data Sheet
Page 5
115 kbps Transceiver GP2W0001YP
RATINGS AND CHARACTERISTICS
Absolute Maximum Ratings
PARAMETER SYMBOL RATINGS UNIT NOTES
Supply voltage V
Forward current I
Peak forward current I
Operating temperature T
Storage temperature T
Soldering temperature T
NOTES:
1. Pulse width: 78.1 µs. Duty ratio: 3/16.
2. Soldering reflow time: 5 seconds.
CC
F
FM
OPR
STG
SOL
0 to 6.0 V
50 mA
500 mA 1
-10 to +70 °C
-20 to +85 °C
230 °C2
Recommended Operating Conditions
PARAMETER SYMBOL OPERATING CONDITION UNIT
Supply voltage V
CC
Data rate BR 2.4 to 115.2 kbps
Shutdown circuit high level input voltage V
Shutdown circuit low level input voltage V
Logic high transmitter input voltage* V
Logic low receiver input voltage* V
IHSD
ILSD
IHTXD
ILTXD
2.7 to 5.5 V
VCC – 0.6 to V
CC
0.0 to 0.4 or Open V
2.4 to V
CC
0.0 to 0.4 V
V
V
NOTES:
*Recommended circuit of emitter side.
IrDA Data Sheet 5
Page 6
GP2W0001YP 115 kbps Transceiver
t
W
V
OL
t
R
t
F
V
OH
90%
50%
10%
GP2W0001YP-7
Electrical Characteristics
TA = -25°C, VCC = 5 V unless otherwise specified
PARAMETER SYMBOL MIN. TYP. MAX. UNIT NOTES
I
Current consumption at no input signal
Current consumption at shut-down mode
High level output voltage
Low level output voltage
CC1
I
CC2
I
CC1-S
I
CC2-S
V
OH1
V
OH2
V
OL1
V
OL2
4.5 V 5
2.5 V 6
Low level pulse width tw 0.8 8.0 µs 9
Rise time tr 1.2 µs 9
Fall time tf 0.2 µs 9
Maximum reception distance L 1 m 10
Radiant intensity I
Peak emission wavelength
E
p 850 870 900 nm 11
λ
40 350 mW/Sr 11
1.0 1.4 mA 1
0.7 1.0 mA 2
0.5 1.0 µA 3
0.3 1.0 µA 4
0.6 V 7
0.6 V 8
NOTES:
= 5 V, no input signal, output terminal open, V
1. V
CC
2. V
= 3 V, no input signal, output terminal open, V
CC
= 5 V, SD terminal open.
3. V
CC
= 3 V, SD terminal open.
4. V
CC
5. V
= 5 V.
CC
= 3 V.
6. V
CC
= 5 V, IOL = 400 µA.
7. V
CC
8. V
= 3 V, IOL = 400 µA. See Figures 6, 7, and 8.
CC
= VCC -0.6 V.
IHSD
= VCC -0.6 V.
IHSD
9. BR = 115.2 kbps. See Figures 6, 7, and 8.
, VOL, tw, tr, tf shall be satisfied at
10.V
OH
11.BR = 115.2 kbps,
φ ≤
15°, V
CC
φ ≤
15°. See Figures 6, 7, and 8.
= 3 V, RL = 2.2 Ω,
VINTX = 2.7 V, R2 = 1 kΩ ±5%, CX2 = 1,500 pF. See Figures 9, 10, and 11.
T
1
T
2
T
1
RADIATION
INTENSITY OF
TRANSMITTER
40 mW/Sr
NOTE: At BR = 2.4 kbps: T1 = 416.7 µs, T2 = 78.1 µs
At BR = 115.2 kbps: T
= 8.68 µs, T2 = 1.63 µs
1
GP2W0001YP-6
Figure 6. Input Signal Waveform (Detector Side)
Figure 7. Output Waveform (Detector Side)
6 IrDA Data Sheet
Page 7
115 kbps Transceiver GP2W0001YP
TRANSMITTER
(NOTE 1)
NOTES:
1. Transmitter uses GP2W0001YP (λp = 870 nm TYP.)
adjusted to a radiation intensity of 40 mW/Sr.
2. φ Indicates horizontal and vertical directions.
3. Ee: Detector face illuminance < 10 x
Figure 8. Standard Optical System (Detector Side)
90%
I
φ
φ
L
E
GP2W0001YP
OSCILLOSCOPE
GP2W0001YP-8
10%
t
R
t
F
GP2W0001YP-9
Figure 9. Output Waveform Specification
(Emitter Side)
IrDA Data Sheet 7
Page 8
GP2W0001YP 115 kbps Transceiver
GP2W0001YP-12
PEAK
FORWARD
CURRENT
I
FM
(mA)
300
400
200
100
-10 60 70
100755025
AMBIENT TEMPERATURE T
A
(°C)
0-25
0
GP2W0001YP
φ
φ
NOTE: φ indicates horizontal
and vertical directions
Figure 10. Standard Optical System (Emitter Side)
V
= 3 V,
CC
RL = 2.2 Ω
= 1500 pF
1.63 µs
CX
2
LEDA
Tx = 2.7 V
V
IN
TX
R
2
= 1 kΩ
TXD
GP2W0001YP
BR = 115.2 kbps
GP2W0001YP-11
Figure 11. Recommended Circuit (Emitter Side)
DETECTOR FOR
RADIATION INTENSITY
MEASURMENT
GP2W0001YP-10
Figure 12. Peak Forward Current
Versus Ambient Temperature
8 IrDA Data Sheet
Page 9
115 kbps Transceiver GP2W0001YP
RELIABILITY
TEST ITEMS TEST CONDITIONS
Temperature cycling
High temperature and high
humidity storage
High temperature storage +85°C, 240 hours n = 22 c = 0 2
Low temperature storage -20°C, 240 hours n = 22 c = 0 2
Operation life 1 +25°C, V
Operation life 2
Mechanical shock
Variable frequency
vibration
Reflow solder heat 230°C, 5 s. n = 11 c = 0 3
NOTES:
1. Confidence level 90%, LTPD 10%/20%.
2. The sample to be tested shall be left at normal temperature and humidity for
2 hours after it is taken out of the chamber. No dew point.
3. Refer to the ‘Precautions for Soldering’ section for temperature profile.
1
FAILURE JUDGEMENT
CRITERIA
1 cycle -20°C to 85°C
(30 minutes at each extreme)
20 cycles test
+40°C, 90% RH, 240 hours n = 22 c = 0 2
= 5 V, 240 hours n = 11 c = 0 2
CC
+25°C, I
240 hours, Pulse width
= 400 mA,
FM
Judgement of Criteria:
78.1 µs, Duty ratio 3/16
1,000 m/s
2
, 6 ms,
3 times/±X, ±Y, ±Z direction
200 m/s
2
,
100 to 2,000 to 100 Hz for
> Up × 1.2
I
CC1
> Up × 1.2
I
CC2
L < Low × 0.8
V
< Low × 0.8
OH1
< Low × 0.8
V
OH2
> Up × 1.2
V
OL1
V
> Up × 1.2
OL2
> Up × 1.2
tw
1
< Low × 0.8
tw
1
tw2 > Up × 1.2
< Low × 0.8
tw
2
tr > Up × 1.2
tf > Up × 1.2
Up: Upper
Specification Limit
approximately 4 minutes
48 minutes/X, Y, Z direction
Low: Lower
SAMPLES
(n)
DEFECTIVE
(c)
n = 22 c = 0 2
n = 11 c = 0
n = 11 c = 0
n = 11 c = 0
NOTES
Specification Limit
IrDA Data Sheet 9
Page 10
GP2W0001YP 115 kbps Transceiver
INCOMING INSPECTION
• Inspection lot: Inspection shall be carried out per
each delivery lot.
• Inspection method: A single sampling plan, normal
inspection level two based on ISO 2859 shall be
adopted.
Table 1. Incoming Inspection
PARAMETER
Major defect
Minor defect
INSPECTION ITEMS AND
TEST METHOD
Disconnection, short 0.1
Inverse polarity on terminal 0.1
Soldering defect (obstacle
to use)
Electrical characteristic defect 0.1
Appearance defect which
affects the electrical characteristics such as, split, chip,
scratch, stain, or blur
AQL(%)
0.1
0.25
PRECAUTIONS FOR SOLDERING
Solder Reflow
Solder only once at the temperature and the time
within the temperature profile as shown in Figure 13.
Other Precautions
An infrared lamp used to heat up for soldering may
cause a localized temperature rise in the resin. Keep the
package temperature within that specified in Figure 13.
Also avoid immersing the resin part in the solder. Even if
within the temperature profile shown in Figure 13, there
is the possibility that the gold wire in the package may
break if the deformation of the PCB affects the lead pins.
Use after fully confirming the conditions of actual solder
reflow machine.
Soldering
• Soldering iron shall be less than 25 W, and temper-
ature of soldering iron point shall be used at less
than 260°C.
• Soldering time shall be within 3 seconds.
• Soldered product shall treat at normal temperature.
• Solder: 6/4 solder or included Ag solder.
230°C
MAX.
200°C
165°C
MAX.
25°C
1 - 4°C/s
1 - 4°C/s1 - 4°C/s
5 s MAX.
60 s MAX.
120 s MAX. 90 s MAX.
GP2W0001YP-13
Figure 13. Temperature Profile
10 IrDA Data Sheet
Page 11
115 kbps Transceiver GP2W0001YP
TAPING SPECIFICATIONS
Taping Method
• Taping structure and dimensions: The tape should
have a structure in which a cover tape is sealed by
using heat-pressed on the carrier tape of conductive
PET. See Figure 14.
• Reel structure and dimensions: The taping reel
should be conductive plastic with its dimensions as
shown in Figure 15.
• Direction of product insertion: Product direction in
carrier tape should be such that electrode side of
product is placed on the cover tape side and lens
side of product is placed on the hold side of the tape.
See Figure 16.
2.0 ±0.1
4.0 ±0.1
8.0 ±0.1
• Taped device repair: To repair taped device failure,
cut the bottom of carrier tape with a cutter, and after
replacing with good devices, seal the cut portion with
adhesive tape.
• Adhesiveness of cover tape: The exfoliation force
between carrier tape and cover tape should be 0.2 N
to 1 N for the angle from 160° to 180°.
• Rolling method and quantity: Wind the tape back on
the reel so that the cover tape is on the outside.
Attach more than 20 cm of blank tape to the trailer
and the leader of the tape and fix both ends with
adhesive tape. One reel shall contain 2,000 pieces.
• Safety protection during shipping: There should be
no deformation of component or degradation of electrical characteristics due to shipping.
3.5 ±0.1
+0.1
φ1.5
-0.0
0.3 ±0.05
NOTE: Dimensions are in mm.
1.75 ±0.1
7.5 ±0.1
16.0 ±0.3
10.7 ±0.1
7° MAX.
4.8 ±0.25
4.1 ±0.25
GP2W0001YP-14
Figure 14. Tape Structure and Dimensions
IrDA Data Sheet 11
Page 12
GP2W0001YP 115 kbps Transceiver
±0.8
21
13 ±0.2
2 ±0.5
22.4 MAX.
100 ±0.1
NOTE: Dimensions are in mm.
330 ±2
17.5 ±0.5
GP2W0001YP-15
Figure 15. Reel Structure and Dimensions
PULL-OUT DIRECTION
LENS
SIDE
GP2W0001YP-16
Figure 16. Direction of Product Insertion
12 IrDA Data Sheet
Page 13
115 kbps Transceiver GP2W0001YP
TAPING MOISTURE-PROOF PACKING
Packaging Specifications
Table 2. Packaging Material
NAME MATERIAL
Aluminum laminate bag Aluminum polyethylene
Label Paper
Desiccant
Outer case Paper
Pads Paper
Packaging Method
• Seal the aluminum laminated bag containing the
tape reel (2,000 pieces per reel) and desiccant.
• Fill out necessary information on the label and paste
it on the aluminum laminate bag.
• Pack four aluminum laminated bags (containing one
reel each) into the designated outer case, where
paper pads are placed on the bottom and top of the
outer case, as well as between each layer of the aluminum laminated bags. Minimum order/shipment
quantity should be one laminated bag.
• The outer case should then be sealed with packing
tape, indicating the model name, quantity, and outgoing inspection data on the case. Total of 8,000
pieces per carton.
Table 3. Packaging Method Specifications
Storage and Treatment After Unsealing
• Storage conditions: The product should be stored
with these conditions:
– Storage temperature: 10°C to 30°C
– Humidity: below 60% RH
• Treatment after opening:
– After unsealing, devices should be mounted un-
der the temperature condition of 10°C to 30°C, at
the humidity conditions of below 60% RH, within
two days.
– In case long term storage is needed, devices
should either be stored in dry box or re-sealed in
a moisture-proof bag with desiccant and kept in
an environment where the temperature is 10°C to
30°C, at the humidity condition of below 60% RH.
Devices must be mounted within two weeks.
• Baking before mounting:
– In the event that the devices are not maintained
in the recommended storage conditions or the
enclosed desiccant indicator has turned pink,
baking must be done before devices are mounted. Please also note that baking should only be
done once.
– Recommended condition: 100°C, 12 to 24 hours.
– Baking will not be properly done with the devices
in their shipping package. To complete the baking
properly, devices should either be temporarily
mounted to PCB with adhesive, or placed in a
metal tray. The temporary mounting should be
done using adhesive, not by soldering.
PACKAGE
SHAPE
Tape reel
(φ 330 mm)
PRODUCT QUANTITY
2,000
1 model
pieces
per reel
SACK
QUANTITY
1 reel per
moisture-proof
laminated bag
IrDA Data Sheet 13
Page 14
GP2W0001YP 115 kbps Transceiver
DESICCANT
EXAMPLE 1
LABEL
(MODEL NUMBER
QUANTITY
DATE)
PRODUCTS
IN TAPE-REEL
ALUMINUM
LAMINATED BAG
TAPE-REEL IN
ALUMINUM LAMINATED BAG
PADS
(TOTAL 5 SHEETS)
440 mm TYP.
TAPE-REEL IN
ALUMINUM
LAMINATED BAG
(TOTAL 4 SETS)
PACKING CASE
EXAMPLE 3
370 mm TYP.
PACKING
TAPE
EXAMPLE 2
PACKAGE METHOD EXAMPLES:
1. Seal the aluminum laminated bag, including the tape reel
with 2,000 pieces and desiccant.
2. Fill out the model name, quantity etc. in the blank area of label
and paste on the bag.
3. Put the four moisture-proof laminated bags in the ruled case.
Put the pad between the bags, and top and bottom.
4. Seal the case with packing tape, and indicate model name
and quantity. (8,000 pieces/package)
Total Packaged mass: Approximately 3.6 kg.
NOTE: Dimensions are in mm.
Figure 17. Packing Specification
150 mm TYP.
MODEL NUMBER
QUANTITY
DATE
EXAMPLE 4
GP2W0001YP-17
14 IrDA Data Sheet
Page 15
115 kbps Transceiver GP2W0001YP
LIFE SUPPORT POLICY
SHARP components should not be used in medical devices with life support functions or in safety equipment (or similiar applications where
component failure would result in loss of life or physical harm) without the written approval of an officer of the SHARP Corporation.
LIMITED WARRANTY
SHARP warrants to its Customer that the Products will be free from defects in material and workmanship under normal use and service for a
period of one year from the date of invoice. Customer's exclusive remedy for breach of this warranty is that SHARP will either (i) repair or
replace, at its option, any Product which fails during the warranty period because of such defect (if Customer promptly reported the failure to
SHARP in writing) or, (ii) if SHARP is unable to repair or replace, refund the purchase price of the Product upon its return to SHARP. This
warranty does not apply to any Product which has been subjected to misuse, abnormal service or handling, or which has been altered or
modified in design or construction, or which has been serviced or repaired by anyone other than Sharp. The warranties set forth herein are in
lieu of, and exclusive of, all other warranties, express or implied. ALL EXPRESS AND IMPLIED WARRANTIES, INCLUDING THE
WARRANTIES OF MERCHANTABILITY, FITNESS FOR USE AND FITNESS FOR A PARTICULAR PURPOSE, ARE SPECIFICALLY
EXCLUDED. In no event will Sharp be liable, or in any way responsible, for any incidental or consequential economic or property damage.
The above warranty is also extended to Customers of Sharp authorized distributors with the following exception: reports of failures of Products
during the warranty period and return of Products that were purchased from an authorized distributor must be made through the distributor.
In case Sharp is unable to repair or replace such Products, refunds will be issued to the distributor in the amount of distributor cost.
SHARP reserves the right to make changes in specifications at any time and without notice. SHARP does not assume any responsibility
for the use of any circuitry described; no circuit patent licenses are implied.
NORTH AMERICA
SHARP Microelectronics
of the Americas
5700 NW Pacific Rim Blvd.
Camas, WA 98607, U.S.A.
Phone: (360) 834-2500
Telex: 49608472 (SHARPCAM)
Facsimile: (360) 834-8903
EUROPE
SHARP Electronics (Europe) GmbH
Microelectronics Division
Sonninstraße 3
20097 Hamburg, Germany
Phone: (49) 40 2376-2286
Facsimile: (49) 40 2376-2232
http://www.sharpmed.com
ASIA
SHARP Corporation
Integrated Circuits Group
2613-1 Ichinomoto-Cho
Tenri-City, Nara, 632, Japan
Phone: +81-743-65-1321
Facsimile: +81-743-65-1532
http://www.sharp.co.jp
http://www.sharpsma.com
©2000 by SHARP Corporation Reference Code SMA00011
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