Datasheet FX802LS, FX802LG, FX802J Datasheet (Consumer Microcircuits Limited)

Page 1
FX802 DVSR C
SERIAL CLOCK
DATA
READ
COUNTER
WE
CAS
RAS 1
COMMAND
DATA
C-BUS INTERFACE AND CONTROL LOGIC
COMMAND
DATA
WRITE
COUNTER
COUNTERS
RAS 3RAS 2 RAS 4
ODEC
DATA
PLAY
BUFFER
SPEECH
PLAY
DRAM CONTROL AND TIMING
STORE
COMMAND
BUFFER
SPEECH
STORE
COUNTERS
CS
CONTROL
REGISTER
ENCODER
DECODER
CLOCK
CLOCK
DIRECT ACCESS CLOCKS and DATA
A4A5A6A7A8A9
A3/ECK
A2/DCK
DRAM ADDRESS LINES
IRQ
STATUS
REGISTER
POWER
ASSESS
A0/ENO
(ENCODER
OUT)
XTAL/
CLOCK
CLOCK
GENERATOR
(DECODER
XTAL
ENCODE
CLOCK
A1/ DEI
IN)
AUDIO
IN
MOD
VDD VBIAS
AUDIO
BYPASS
BIAS
V
DECODE
CLOCK
IDLE
PATTERN
AUDIO
OUT
DEMOD
DECODER
OUTPUT
V
SS
Fig.1 FX802 DVSR Codec
Brief Description
The FX802 DVSR Codec contains:
A Continuously Variable Slope Delta Modulation (CVSD) encoder and decoder.
Control and timing circuitry for up to 4Mbits of external Dynamic Random Access Memory (DRAM).
“C-BUS” µProcessor interface and control logic.
When used with external DRAM, the FX802 has four primary functions:
Speech Storage
Speech signals present at the Audio Input may be digitized by the CVSD encoder, and the resulting bit stream stored in DRAM. This process also provides readings of input power level for use by the system µController.
Speech Playback
Previously digitized speech data may be read from DRAM and converted back into analogue form by the CVSD decoder.
Data Storage
Digital data sent over the “C-BUS” from the system µController may be stored in DRAM.
Data Retrieval
Digital data may be read from DRAM and sent over “C-BUS” to the system µController.
Speech storage and playback may be performed concurrently with data storage or retrieval.
The FX802 may also be used without DRAM (as a “stand­alone” CVSD Codec), in which case direct access is provided to the CVSD Codec digital data and clock signals.
All functions are controlled by “C-BUS” commands from
the system µController.
The Storage, Recovery and Replay functions of the
FX802 can be used for:
Answering Machine applications, where an incoming speech message is stored for later recall.
Busy Buffering, an outgoing speech message is stored temporarily until the transmit channel becomes free.
Automatic transmission of pre-recorded ‘Alarm’ or status announcements.
Time Domain Scrambling of speech messages.
VOX control of transmitter functions.
Temporary Data Storage applications, such as
buffering of over-air data transmissions.
On-chip the Delta Codec is supported by input and output analogue switched-capacitor filters and audio output switching circuitry. The DRAM control and timing circuitry provides all the necessary address, control and refresh signals to interface to external DRAM.
The FX802 DVSR Codec is a low-power 5-volt CMOS LSI device.
Publication D/802/4 December 1995
Page 2
Pin Number Function
FX802
J
1
2
3
4
5
6
FX802 LG/LS
1
2
3
4
Row Address Strobe 2 (RAS2): Should be connected to the Row Address Strobe input of the second
1Mbit DRAM chip (if fitted).
Row Address Strobe 1 (RAS1): Should be connected to the Row Address Strobe input of the first DRAM chip.
Write Enable (WE): The DRAM Read/Write control pin.
Xtal: The output of the on-chip clock oscillator. External components are required at this output when
a Xtal is employed. A Xtal cannot be used with the 24-pin version.
Xtal/Clock: The input to the on-chip clock oscillator inverter. A 4.0MHz Xtal or externally derived clock should be connected here, see Figure 2. This clock provides timing for on-chip elements, filters etc. A Xtal cannot be used with the 24-pin version. Various Xtal frequencies can be used with this device, see Table 3 for the sampling clock rate variations.
Interrupt Request (IRQ): The output of this pin indicates an interrupt condition to the µController, by going to a logic “0.” This is a “wire-or able” output, enabling the connection of up to 8 peripherals to 1 interrupt port on the µController. The pin has a low-impedance pulldown to logic “0” when active and a high impedance when inactive. Conditions indicated by this function are:
Power Reading Ready, Play Command Complete, Store Command Complete.
10
11
12
7
5
Serial Clock: The “C-BUS,” serial clock input. This clock, produced by the µController, is used for
transfer timing of commands and data to and from the DVSR Codec. See Timing Diagrams and System Support Document, Document 2. The clock-rate requirements vary for differing FX802 functions.
8
6
Command Data: The “C-BUS,” serial data input from the µController. Data is loaded to this device in
8-bit bytes, MSB (B7) first, and LSB (B0) last, synchronized to the Serial Clock. See Timing Diagrams and System Support Document, Document 2.
9
7
Chip Select (CS): The “C-BUS”, data transfer control function, this input is provided by the
µController. Command Data transfer sequences are initiated, completed or aborted by the CS signal. See Timing Diagrams and System Support Document, Document 2.
8
Reply Data: The “C-BUS,” serial data output to the µController. The transmission of Reply Data bytes
is synchronized to the Serial Data Clock under the control of the Chip Select input. This 3-state output is held at high impedance when not sending data to the µController. See Timing Diagrams and System Support Document, Document 2.
9
10
V
: The output of the on-chip analogue circuitry bias system, held internally at VDD/2. This pin should
BIAS
be decoupled to V
by a capacitor C1, See Figure 2.
SS
Audio Out: The analogue signal output.
13
14
11
12
Audio In: The audio (speech) input. The signal to this pin must be a.c. coupled by a capacitor C
decoupled to VSS by an HF bypass capacitor C6. For optimum noise performance this input should be
4
and
driven from a source impedance of less than 100.
V
: Negative supply rail (GND).
SS
2
Page 3
Pin Number Function
FX802
J
15
16
17
18
19
FX802 LG/LS
13
14
15
16
17
DRAM Data In/A0/ (Direct Access – Encoder Out (ENO)): Connected to the DRAM data input and
address line A0. With no DRAM employed this output is available (in Direct Access mode) as the Delta Encoder digital data output. Direct Access control is achieved by Control Register byte 1 – bit 6.
DRAM Data Out/ A1/ (Direct Access – Decoder In (DEI)): Connected to the DRAM data output and address line A1. With no DRAM employed this pin is available (in Direct Access mode) as the Delta Decoder digital data input. Direct Access control is achieved by Control Register byte 1 – bit 6.
DRAM A2/ (Direct Access – Decoder Clock (DCK)): DRAM address line A2. With no DRAM employed this pin is available (in Direct Access mode) as the Delta Decoder Clock input. Direct Access control is achieved by Control Register byte 1 – bit 6.
DRAM A3/ (Direct Access – Encoder Clock (ECK)): DRAM address line A3. With no DRAM employed this pin is available (in Direct Access mode) as the Delta Encoder Clock output. Direct Access control is achieved by Control Register byte 1 – bit 6.
DRAM A4: DRAM address line A4.
20
21
22
23
24
25
26
18
19
20
21
22
DRAM A5: DRAM address line A5.
DRAM A6: DRAM address line A6.
DRAM A7: DRAM address line A7.
DRAM A8: DRAM address line A8.
Row Address Strobe 4 (RAS4): Should be connected to the Row Address Strobe input of the fourth
1Mbit DRAM chip (if fitted).
Row Address Strobe 3 (RAS3): Should be connected to the Row Address Strobe input of the third 1Mbit DRAM chip (if fitted).
DRAM A9: DRAM address line A9. This pin is not connected when a 256kbit DRAM is employed. Note: To simplify PCB layout, the DRAM address inputs A0 – A8 may be connected in any physical
order to the DVSR Codec output pins A0 – A8.
27
28
23
24
Column Address Strobe (CAS): The DRAM Column Address Strobe pin. Should be connected to the
CAS pins of all DRAM chips.
V
: Positive supply rail. A single, stable +5-volt supply is required. Levels and voltages within the
DD
DVSR Codec are dependant upon this supply.
3
Page 4
External Components
C
5
V
SS
R
1
See INSET
C-BUS
INTERFACE
C
1
R A S 2 R A S 1
W E
XTAL
XTAL/CLOCK
IRQ
SERIAL CLOCK
COMMAND DATA
C S
REPLY DATA
V
BIAS
AUDIO OUT
AUDIO IN
C
6
C
4
V
V
DD
4 x 1Mbit
DRAM
A0 – A9
V
§
1 2 3
§
4 5
§
§ 6 7
FX802J
8 9 10 11
12 13
14
SS
V
SS
28 27 26 25 24
23 22 21 20
19 18 17 16 15
DD
C A S
A9 R A S 3 R A S 4
A8
A7
A6
A5
A4
A3/ECK
A2/DCK
A1/DEI
A0/ENO
R
WE CAS RAS D Q
A0 – A9 WE CAS RAS D Q
A0 – A9 WE CAS RAS D Q
A0 – A9 WE CAS RAS D
3
Q
INSET
C
XTAL
§
4
R
2X
1
XTAL/CLOCK
C
2
3
V
SS
FX802J
5
Component Value
R
1
R
2
R
3
C
1
C
2
C
3
Fig.2 Recommended Component and DRAM Connections
Notes
1. Xtal circuitry shown INSET is in accordance with CML Application Note D/XT/2 December 1991.
2. External Xtal circuitry is not applicable to the 24-pin/lead versions of this device, only a clock pulse input can be used.
3. Functions whose pins are marked § above are not available on the 24-pin/lead versions of this device. Pin numbers illustrated are for 28-pin versions.
4. Table 3 details the actual encoder/decoder sample rates available using the Xtal frequencies recommended above.
5. R1 is used as the DBS 800 system common-pullup for the “C-BUS” Interrupt Request (IRQ) line, the optimum value will depend upon the circuitry connected to the IRQ line. Up to 8 peripherals may be connected to this line.
= 22.0k
1.0M
1.0k
1.0µF
33.0pF
33.0pF
C
= 1.0µF
4
C
5
C
6
X
1
or 4.032MHz or 4.096MHz
1.0µF
1.0nF
4.00MHz
Tolerance: R = ±10% C = ±20%
6. Recommended DRAM Parameters: 256kbit x 1 or 1Mbit x 1 Dynamic Random Access Memory with ‘CAS before RAS’ refresh mode, maximum Row Address Access time = 200nsec.
Example DRAM types: 256kbit (262,144bits)
Texas Instruments TMS4256–20 Hitachi HM51256–15
1Mbit (1,048,576bits)
Texas Instruments TMX4C1024–15 Hitachi HM511000–15
7. Figure 2 (above) shows connections to 4 x 1Mbit sections of DRAM. If desired, to simplify PCB layout, the DRAM inputs A0 to A8 may be connected in any order to the FX802 DVSR Codec output pins A0 to A8. Connections to 256kbit DRAM are similar, but A9 unconnected.
8. When using the FX802 “stand-alone (Direct Access),” no DRAM should be connected.
4
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Controlling Protocol
Control of the functions of the FX802 DVSR Codec is by a group of Address/Commands (A/Cs) and appended instructions or data to and from the system µController (see Figure 5). The use and content of these instructions is detailed in the following paragraphs and tables.
Command Address/Command (A/C) Byte + Data Assignment Hex. Binary Byte/s
MSB LSB
General Reset 01 0 0 0 00001 Write to Control Register 60 0 1 1 00000 + 2 byte Instruction to Control Register Read Status Register 61 0 1 1 00001 + 1 byte Reply from Status Register Store ‘N’ pages. Start page ‘X’ 62 0 1 1 00010 + 2 bytes Command – Immediate Store ‘N’ pages. Start page ‘X’ 63 0 1 1 00011 + 2 bytes Command – Buffered Play ‘N’ pages. Start page ‘X’ 64 0 1 1 00100 + 2 bytes Command – Immediate Play ‘N’ pages. Start page ‘X’ 65 0 1 1 00101 + 2 bytes Command – Buffered Write Data. Start page ‘P’ 66 0 1 1 00110 + 2 bytes ‘P’ + Write data Read Data. Start page ‘P’ 67 0 1 1 00111 + 2 bytes ‘P’ + Read data Write Data – Continue 68 0 1 1 01000 + Write data Read Data – Continue 69 0 1 1 01001 + Read data
Table 1 “C-BUS” Address/Commands
Address/Commands
Instruction and data transactions to and from this device consist of an Address/Command (A/C) byte followed by either:
(i) a further instruction or data, or (ii) a Status or data Reply.
Control and configuration is by writing instructions from the µController to the Control Register (60 Reporting of FX802 configurations is by reading the Status Register (61H). Instructions and data are transferred, via “C-BUS,” in accordance with the timing information given in Figures 5 and 6. A complete list of DBS 800 “C-BUS” Address locations is published in the System Support Document.
).
H
Operation with DRAM
The FX802 can operate with up to 4Mbits of DRAM. When used with DRAM the DVSR Codec performs four main functions under the control of commands received over the “C-BUS” interface from the µController:
Stores Speech by digitally encoding the analogue input
signal and writing the resulting digital data into the associated Dynamic RAM (DRAM).
Plays stored speech by reading the digital data stored in the
DRAM and decoding it to provide an analogue output signal.
Writes data sent over the “C-BUS” from the µController to
DRAM.
Reads data from DRAM, sending it to the µC over the
“C-BUS”.
‘Data’ is directed to and from DRAM by the on-chip DRAM Controller.
Speech
The delta encoder and decoder sampling rates are independently set, via the Control Register (Table 4), to (nominally) 16, 25, 32, 50 or 64kbits/s (see Tables 2 and 3), allowing the user to choose between speech-quality and storage-time, whilst providing for time-compression or expansion of the speech signals.
The DVSR Codec can handle from 256kbits to 4Mbits of
DRAM, giving, in the case of 32kbit/s sampling rate, from 8 to 131 seconds of speech storage.
For speech storage purposes, the memory is divided into
'pages' of 1024 bits each, corresponding to 32ms at a 32kbit/s sampling rate.
A 256kbit DRAM contains 256 pages. A 1Mbit DRAM contains 1024 pages. 4Mbit of DRAM contains 4096 pages.
The Delta Codec may be used without DRAM, when the decoder sampling rate (8 to 64 kbits/s) is determined by an external clock source applied to the Decoder Clock pin.
Store and Play Speech Commands
Speech storage and playback may take place simultaneously.
These commands are transmitted, via “C-BUS,” to the FX802, in the form:
STORE or PLAY ‘N’ (1024-bit) pages (of encoded speech data) starting at page ‘X.’
‘N’ is any number from 1 to 16 (pages) and ‘X’ from (page) 0
to 4095 (4Mbit DRAM), as illustrated below. Preceded by the A/C, this command writes 16-bits (byte 1 (first) and byte 0) of data from the µC to the FX802 Store or Play Command Buffer.
MSB Byte 1 Byte 0 LSB
1514131211109876543210
‘N’ ‘X’
5
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Controlling Protocol ......
Store and Play Speech
Speech Store Commands
STORE ‘N’ PAGES – ST AR T PAGE ‘X’
62
H
(immediate). STORE ‘N’ PAGES – ST AR T PAGE ‘X’
63
H
(buffered).
The digitised speech from the Delta Encoder is stored in consecutive DRAM locations with the Speech Store Counters sequencing through the DRAM addresses and counting the number of complete ‘pages’ stored since the start of execution of the command. As soon as the command has terminated the following events take place:
(1) The “Store Command Complete” bit in the Status
Register (Table 6) is set.
(2) An “Interrupt Request” (IRQ) is sent (if enabled) to
the µC.
(3) The next Speech Store command (if present) is
immediately taken from the Store Command Buffer and execution of the new command commences.
The IRQ output is cleared by reading the Status Register.
READ STATUS REGISTER
61
H
(Table 6).
To provide continuity of speech commands, both Store and Play commands can be presented to the FX802 in one of two formats;
An
Immediate
Immediate or Buffered.
command will be started on completion of its loading, irrespective of the condition of the current command.
Buffered
A
command will be acted upon on the completion of the current Store or Play command, unless Speech Synchronization Bits (Control Register) are set.
Buffering of commands lets the DVSR Codec execute a series of commands without intervening gaps, even though the µController may take several milliseconds to respond to each “Command Complete” Interrupt Request.
In either case, the Store or Play Command Complete bit of the Status Register will be cleared.
Speech Playback is controlled by similar commands:
PLA Y ‘N’ PAGES – START PAGE ‘X’
64
H
(immediate).
65HPLA Y ‘N’ PAGES – START PAGE ‘X’
(buffered).
using the Speech Play Counters and Play Command Buffer .
As soon as the Play Command has completed, the “Play Command Complete” bit in the Status Register is set and an Interrupt Request generated (if enabled).
If no 'next' command is waiting in the Play Command Buffer when a speech Play command finishes,
a continuous idle code (0101.....0101) will be fed to the
Delta Decoder.
Speech “data” is stored or recovered at the selected Encode or Decode sample rate (Table 3). Store or Play Command Complete bits in the Status Register are cleared by the next Store or Play command
Store/Play Speech Synchronization – (Table 4) This facility is provided, primarily, for Time Domain
Scrambling applications.
Speech Synchronization bits in the Control Register
will produce the effects described below: No Speech Sync Set; Store and Play operations may
take place completely independently . Store after Play; The next “buffered” Store command
will start
on completion of a Play operation
, whilst the next Play command (if any) sequence continues normally .
Play after Store; The next “buffered” Play command will
on completion of a Store operation
start
, whilst the next
Store command (if any) sequence continues normally . These actions will continue whilst ‘Speech Sync’ bits
remain set.
received from the µC, or by a General Reset command.
DRAM Speech Capacity
28-pin/lead versions of the FX802 may be used with a single 256kbit DRAM or with up to 4 x 1Mbit DRAM. 24-pin/lead versions may only be used with a single 256kbit or 1Mbit DRAM. The different Encode and Decode sampling clock rates available enable the user to set voice store and play times against recovered speech quality. Table 2 gives information on storage capacity and Store/Playback times. Speech data can be replayed at a different sample rate or in a reverse sequence, see Control Register for details.
DRAM Available “Speech Nominal Sample Rates (kbits/s)
Size Bits Pages” 16 25 32 50 64
256kbits 262144 256 16.0 10.0 8.0 5.0 4.0
1024k 1048576 1024 65.0 42.0 32.0 20.0 16.0
2Mbits 2097152 2048 131.0 84.0 65.0 42.0 32.0
3M 3145728 3072 196.0 126.0 98.0 63.0 49.0 4M 4194304 4096 262.0 168.0 131.0 84.0 65.5
Store and Play Times (seconds)
Table 2 Sampling Clock Rates vs Speech Storage/Playback Times
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Controlling Protocol ......
Data Operations
Data Storage and Recovery
For the purpose of storing data sent via “C-BUS” from the µC, the memory (DRAM) is divided into ‘data-pages’ of 64-bits (8-bytes).
A single 256kbit DRAM contains
4096 data-pages.
A single 1Mbit DRAM contains
16384 data-pages.
4Mbit DRAM contains
65536 data-pages.
In accordance with “C-BUS” timing specifications, data is handled 8-bits (1-byte) at a time although any number of 8-bit blocks of data may be written-to or read-from the DRAM by a single command.
The data transfer action is terminated by the Chip Select line being taken to a logic “1.
Read and Write Data actions are explained below
“C-BUS” Data Transfer Limitations
For those commands which transfer data over the “C-BUS” between DRAM and the µController (Write and Read Data) the “C-BUS” Serial Clock rate is limited to a maximum of:
125kHz if the VSR Codec is executing Store and Play commands.
250kHz if no speech Store or Play commands are active.
All other commands and replies (Control, Status, General Reset) may use a maximum clock rate of 500kHz. See Figure 5.
Read Data
READ DATA – START PAGE “P”
67
H
Sets the Data Read Counter to “P” page and then reads data bytes from successive DRAM locations, sending them to the µC as Reply Data bytes incrementing the Data Read Counter by 1 for each bit read.
READ DA TA – CONTINUE
69
H
Reads data bytes from successive DRAM locations determined by the Data Read Counter incrementing the counter by 1 for each bit read.
Write Data
66
WRITE DATA – START PAGE “P”
H
Sets the Data Write Counter to “P” page and then writes data bytes to successive DRAM locations, incrementing the Data Write Counter by 1 for each bit received via the “C-BUS.”
The Start Page “P,” is indicated by loading a 2-byte word after the relevant Address/Command byte. This 16-bit word allows data-page addresses from 0 to 65535 (4Mbits DRAM).
WRITE DA TA – CONTINUE
68
H
Writes data bytes to successive DRAM locations determined by the Data Write Counter, incrementing the counter by 1 for each bit received over the “C-BUS.”
Encoder and Decoder Sampling Clocks
Encoder and decoder sampling clock rates are programmable via the Control Register. Table 3 shows the range of sampling rates available for differing Xtal/clock input frequencies, and the counter ratios used to produce them. If different “Store and Play” sampling rates are used in a single operation, only combinations of 25kb/s with 32kb/s or 50kb/s with 64kb/s will give correct output levels in accordance with current specifications. Consideration should be given to the effect of differing Xtal/clock frequencies upon the audio frequency performance of the device.
Xtal/clock Frequency (MHz)
Control Register 4.0 4.032 4.096
Byte 0, Bits
5 4 3 Dec. Division Sampling Rate 2 1 0 Enc. Ratio (kbits/s)
0 1 1 256 15.625 15.75 16.0 1 0 0 160 25.0 25.20 25.60 1 0 1 128 31.25 31.50 32.0 1 1 0 80 50.0 50.4 51.20 1 1 1 64 62.50 63.0 64.0
Internal Counter
Table 3 Sampling Clock Rates Available
With respect to using a single Xtal/clock frequency for all DBS 800 devices in use it should be noted that:
(a) a 4.032MHz Xtal/clock input will produce an accurate 1200 baud rate for the FX809 FFSK Modem (b) a 4.096MHz Xtal/clock input will generate exactly 16kb/s and 32kb/s Codec sampling clock rates.
7
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“Write to Control Register” – Address/Command 60
, followed by 2 bytes of Command Data
H
Setting
Byte 1
(MSB)
Bit 7
6
1
0
5
1 0
4
1 0
3
1 0
2
1 0
1
1 0
0
1 0
Byte 0
(MSB)
76
00 01 10 11
543
000 001 010 011 100
101 110 111
210
000
001
010
011
100
101
110
111
Function
First Byte for Transmission
Not used – Set to “0”
Direct Access
– Encoder Data Out to A0/ENO – Encoder Clock to A3/ECK – Decoder Input from A1/DEI – Decoder Clock from A2/DCK Normal DVSR Operation
Play Counter
Decrement Increment
DRAM Control
Disable DRAM Enable DRAM
Codec Powersave
Powersave Delta Codec Enable Delta Codec
Store Command Interrupt Enable Interrupt Disable
Play Command Interrupt Enable Interrupt Disable
Power Reading Interrupt
Enable Interrupt Disable
Last Byte for Transmission
Store/Play Speech Sync
No Sync No Sync Sync – Play after Store Sync – Store after Play
Decoder Control
Idle (32kbit/s); Aud O/P via L.P.F. Idle (32kbit/s); Aud By-Pass Idle (32kbit/s); Aud O/P at High Z On – Sampling Rate 16kbit/s On – " 25kbit/s On – " 32kbit/s On – " 50kbit/s On – " 64kbit/s
Encoder Control
I/P at V I/P at High Z – F/Idle (32kbit/s)
– F/Idle (32kbit/s)
BIAS
I/P at High Z – F/Idle (32kbit/s) On – Sampling Rate 16kbit/s On – " 25kbit/s On – " 32kbit/s On – " 50kbit/s On – " 64kbit/s
General Reset
Upon Power-Up the “bits” in the FX802 registers will be random (either “0” or “1”). A General Reset command (01 will be required to “reset” all microcircuits on the “C-BUS,” and has the following effect upon the FX802:
Control Register Set as 00 Status Register Set as 00 Clear Store and Play Command Buffers
H H
Direct Access
Allows external circuitry “Direct Access” to the Delta Codec data and sampling clocks, disabling the DRAM timing circuitry . This permits the Delta Codec section of the FX802 to be used as a “stand-alone” delta modulation voice encoder and decoder.
Input Audio is encoded and made available at the Encoder Out (ENO) pin. Speech data input to the Decoder In (DEI) pin is decoded to give voice-band audio at the Audio Output.
The following points, with respect to Control Register settings, should be considered. Analogue output switching remains under the control of the Control Register, but the Decoder sampling clock rate (8kbit/s to 64kbit/s) must be provided from an external source to the Decoder Clock (DCK) pin. To ensure correct filter setting, Decoder Control bits (Byte 0, Bits 5, 4, 3) should be set to (binary) 1, 1, 1, where the required rate approximates to a multiple of 16kb/s, or (binary) 1, 1, 0, where the required rate approximates to a multiple of 25kb/s.
Both the Encoder internal sampling clock rate and input switching (Table 5) remain under the control of the Control Register. The sampling clock rate is available to external circuitry at the Encoder Clock Out (ECK) pin.
Play Counter
The Play Counter direction may be set to run backwards as well as forwards. This can be used in a scrambling system by replaying speech data in reverse order.
DRAM Control
A logic “1” will disable the DRAM Control timing circuits and associated counters. The “C-BUS” Interface, Clock Generator, Delta Codec and filters remain active. This bit should be set to logic “1” when the FX802 is used in the Direct Access mode.
Minimum DVSR Codec power consumption is achieved by setting both DRAM Control and Powersave bits to a logic “1.”
Codec Powersave
A logic “1” puts the Delta Codec and filters into a Powersave mode, with V
The Clock Generator, “C-BUS” Interface and DRAM
maintained.
BIAS
Control and Timing remain active.
Command Interrupt Enable
A logic “1” set at the relevant bit will enable Interrupt Requests to the µController when that command operation is complete.
Store and Play Speech Synchronization
Intended, primarily, for Time Domain Scrambling.
Decoder and Encoder Control
Sets individually, decoder and encoder sampling clock rates and the source of the Audio Output.
)
H
Table 4 Control Register
8
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Encoder and Decoder Control
T
Analogue Input and Output Switching
The Control Register, Byte 0 – bits 0 to 5, are used, in conjunction with the codec Powersave Bit (Byte 1 – bit 3) to control codec input/output conditions and sample rates. Figure 3 shows the codec functional situation.
AUDIO IN
MOD
DEMOD
CVSD Codec
INPUT
BIAS
200k
(nom)
BIAS
V
AUDIO
BYPASS
Fig.3 Analogue Control – with reference to Fig.1
Control Register Circuit Switches
Codec Decoder
Powersave Control Audio Audio Output
Bit “5” “4” “3” By-Pass Out Bias
0 000
OFF ON OFF
0 001 ON OFF OFF 0 010 OFF OFF OFF
0 011 OFF ON OFF ––– ––– 0 111 OFF ON OFF
1 000 OFF OFF ON 1 001 ON OFF OFF 1 010 OFF OFF ON 1 011 OFF OFF ON ––– ––– 1 111 OFF OFF ON
Encoder
Control Input
“2” “1” “0” Bias
0 000
ON
0 001 OFF 0 010 OFF
0 011 OFF ––– 0 111 OFF
1 000 ON ––– – 1 111
ON
Table 5 Analogue Control – with reference to Fig.3
AUDIO OU
500k
(nom)
V
BIAS
OUTPUT
BIAS
OFF = Switch Open ON = Switch Closed
Decoder ‘idling’ fed with “1010101
....” pattern at 32kb/s.
Decoder running at the selected sampling rate.
Decoder circuits Powersaved
Encoder running at 32kb/s but Encoder Data Output forced to ‘idle’ pattern “01010 ...”
Encoder running at selected Sampling Rate
Encoder circuits Powersaved
Note
1
1
2
Notes
1. If the Delta Codec is in the Direct Access mode, these
sampling rates will be as provided by the externally applied clock.
2. The Input Bias switch is operated by the Control Register Codec Powersave’ and ‘Encoder Control’ bits to provide a
Time Compression of Speech
The 25kb/s and 50kb/s sampling rate options are provided for time compression (and subsequent expansion) of speech signals.
For example, 1.0 second of speech stored at 50kb/s may be transmitted in 0.8 seconds if played out at 64kb/s, and finally restored to its original speed at the receiver by storing
relatively low impedance path for V coupling capacitor whenever the codec is powersaved, or the
to charge the input
BIAS
Encoder control bits are set to “0,” so that input bias can be established quickly prior to operation.
at 64kb/s and playing out at 50kb/s. A similar result (with a degraded SINAD) may be achieved by using 25kb/s and 32kb/s sampling rates.
However, the speech frequencies are raised by time compression, and since the signal transmitted to air must be band limited to 3400Hz, the effective end-to-end bandwidth is 0.8 x 3400Hz, which is approximately 2700Hz.
9
Page 10
“Read Status Register” Address/Command, 61
Reading
MSB
Bit 7
1
6
1
5
1
43210
00000 00001 00010 00011 00100 00101 00110 00111 01000 01001 01010 01011 01100 01101 01110 01111 10000 10001 10010 10011 10100 10101 10110 10111 11000 11001 11010 11011 11100 11101 11110 11111
Table 6 Status Register
Power Reading
Ready
Store Command
Complete
Play Command
Complete
Pwr Compand Bits/page
-39.0 dB 8
-36.0 12
-33.5 16
-30.0 20
-28.0 24
-25.0 40
-22.0 56
-19.0 72
-16.0 88
-10.0 192
-6.0 320 0dB 448
Function
Power Register
0 1 2 3 4 5 6
7 10 14 18 22 32 48 64 80
128 256 384 512
, followed by 1 byte of Reply Data.
H
Interrupts
An Interrupt Request (
IRQ), (if enabled by the Control Register) is produced by the FX802 to report the following actions:
Power Reading Ready Store Command Complete Play Command Complete.
When an Interrupt Request is produced the Status Register must be read to ascertain the source of the interrupt. This action will clear the
IRQ output.
Store Command Complete bit (and an interrupt) is set on completion of a Store command. This bit is cleared by loading the next Store command, or by a General Reset command (01H).
Play Command Complete bit (and an interrupt) is set on completion of a Play command. This bit is cleared by loading the next Play command, or by a General Reset command (01
).
H
Power Reading Ready bit (and an interrupt) is set for every 1024 (1 page) voice-data bits from the Encoder. This bit is cleared after reading the Status Register, or by a General Reset command (01
).
H
Power Register
The power assessment element shown in Figure 1 assesses the input signal power for each encoded ‘page’ (every 1024 encoder output bits) by counting the number of 'compand bits' (000 or 111 sequences in the output bit-stream) produced during that ‘page,’ shown in Table 6, with typical encoder input power levels (dB). Power Reading measurements (Bits 0 – 4) are produced under the same conditions as in Figure 4.
At the end of each ‘page’ the “Power Reading Ready” bit of the Status Register is set, an Interrupt Request is generated (if enabled) and the resulting count converted to a 5-bit quasi-logarithmic form.
The Power Register reading is interpreted as below.
00000 represents 0 compand bits 00001 represents 1 compand bit 11111 represents 512 compand bits
– the maximum.
This “Power” reading is placed in the Status Register where it can be read by the µC.
Figure 4 shows this output in graphical form, indicating the typical Input Power Level.
5-Bit Power Reading
(Status Register – bits 0 to 4)
30
20
10
0
-50 -40 -30 -20 -10 0dB 5.0
Fig.4 Typical “Power” Readings vs Input Level
Input Frequency = 1.0kHz Sample Clock Rate = 32kb/s 0dB Ref: = 308mVrms
308mVrms
Average Input ‘Power Level’ (dB )
10
Page 11
Timing Information
CHIP SELECT
t
SERIAL CLOCK
COMMAND DATA
REPLY DATA
Logic level is not important
CSE
76543210 76543210 76543210
MSB LSB
ADDRESS/COMMAND
BYTE
t
t
NXT
t
CK
FIRST DATA BYTE LAST DATA BYTE
76543210
MSB LSB
FIRST REPLY DATA BYTE
NXT
76543210
LAST REPLY DATA BYTE
t
CSOFF
t
CSH
t
HIZ
Fig.5 “C-BUS” Timing Information
“C-BUS” Timing – Figure 5
Parameter Min. Max. Unit
abc
t
CSE
t
CSH
t
HIZ
t
CSOFF
t
NXT
t
CK
2.0 4.0 8.0 µs
4.0 4.0 8.0 µs –––2.0 µs
2.0 4.0 8.0 µs
4.0 8.0 16.0 µs
2.0 4.0 8.0 µs
Direct Access Timing – Figure 6
Parameter Min. Typ Max. Unit
t
CH
t
CL
t
SU
t
H
t
PCO
+ tH = Data True Time
t
SU
1.0 µs
1.0 µs 450 ns 600 ns
750 ns
NOT TO SCALE
Notes
(1) Minimum Timing Values
(a) For all commands except “Read Data” and “Write Data” commands. (b) For “Read Data” and “Write Data” commands when no “Speech Store” or “Speech Play” commands are active. (c) For “Read Data” and “Write Data” commands when “Speech Store” or “Speech Play” commands are active.
(2) Depending on the command, 1 or 2 bytes of Command Data are transmitted to the peripheral MSB (bit7) first, LSB
(bit0) last. Reply Data is read from the peripheral MSB (bit7) first, LSB (bit0) last.
(3) To allow for differing µController serial interface formats “C-BUS” compatible ICs are able to work with either polarity
Serial Clock pulses.
(4) Data sent from the µController is clocked into the FX802 on the rising edge of the Serial Clock pulses. Reply Data
sent from the FX802 to the µController is clocked into the µController when the Serial Clock is “high.”
(5) Loaded commands are acted upon at the end of each command.
Direct Access
ENCODER TIMING
t
ENCODER CLOCK
ENCODER DATA
BITS OUT
Data Clocked
Fig.6 Codec Direct Access Timing
CH
t
PCO
DECODER TIMING
t
CL
DECODER CLOCK
DECODER DATA
BITS IN
t
Data Clocked
SU
t
H
Data True Time
t
CH
t
CL
NOT TO SCALE
11
Page 12
Specification
Absolute Maximum Ratings
Exceeding the maximum rating can result in device damage. Operation of the device outside the operating limits is not implied. Supply voltage -0.3 to 7.0V
Input voltage at any pin (ref V Sink/source current (supply pins) +/- 30mA
(other pins) +/- 20mA Total device dissipation @ T Derating 10mW/°C Operating temperature range: FX802J -40°C to +85°C (cerdip)
Storage temperature range: FX802J -55°C to +125°C (cerdip)
Operating Limits
All device characteristics are measured under the following conditions unless otherwise specified: V
= 5.0V. T
DD
= 25°C. Xtal/Clock f0 = 4.0MHz. Standard Test Signal fo = 1.0kHz. Sample Rate = 31.25kbits/s
AMB
Audio Level 0dB ref: = 308mVrms .
Characteristics See Note Min. Typ. Max. Unit
Static Values
Supply Voltage (V Supply Current (enabled) 1 7.0 mA Supply Current (all powersaved) 1 1.0 mA
Digital Interface
Input Logic “1” 2, 4 3.5 V Input Logic “0” 2, 4 1.5 V Output Logic “1”
at IOH = -120µA 8, 4 4.6 V at IOH = -50µA 3, 4 4.6 V at IOH = 20µA 4, 10 4.6 V
Output Logic “0”
at IOL = 20µA 4, 10 0.4 V at IOL = 100µA 3, 4 0.4 V at IOL = 360µA 4, 8, 9 0.4 V
Digital Input Current
(V
= Logic “1” or “0”) 2 1.0 µA
IN
Leakage Current into Digital Input Capacitance 2 7.5 pF
Analogue Impedance
Input Impedance 13 500 k Output Impedance 1.5 k
Dynamic Values
Encoder
Analogue Signal Input Levels 6 -24.0 4.0 dB Passband 11, 12 3400 Hz
Decoder
Analogue Signal Output Levels 6 -24.0 4.0 dB Passband 11, 12 300 3400 Hz
Encoder/Decoder (Full Codec)
Passband 11, 12 300 3400 Hz Passband Gain 12 0 dB Passband Ripple 12 -3.0 3.0 dB Stopband 6.0 10 kHz Stopband Attenuation 50.0 dB SINAD Level (-6dB) 23.0 dB Output Noise (Input short circuit) -50 dBp Idle Channel Noise (Forced ) -55 dBp Xtal/clock Frequency 7 4.0 MHz
DD
= 0V) -0.3 to (V
SS
25°C 800mW Max.
AMB
+ 0.3V)
DD
FX802LG/LS -40°C to +85°C (plastic) FX802LG/LS -40°C to +85°C (plastic)
) 4.5 5.0 5.5 V
IRQ “OFF” Output 5 4.0 µA
Notes 1. Does not include current drawn by any attached DRAM.
2. Serial Clock, Command Data, CS, A1/DEI and A2/DCK inputs.
3. CAS, WE and A0 to A9 outputs.
4. All measurements are made at 5.0 volts V
5. When the IRQ Output is at V
6. The optimum range of levels for a good Signal-to-Noise Ratio.
.
DD
, any variations may alter parameters accordingly.
DD
7. Audio frequency responses will vary with respect to Xtal/clock frequency.
8. Reply Data output.
9. IRQ output.
10. RAS Outputs.
11. Passband is reduced to (typically) 2700Hz when a sample rate of 25kb/s or 50kb/s is employed.
12. Measured with a -20dB input level to avoid codec slope-overload.
13. For optimum noise performance this input should be driven from a source impedance of less than 100. 12
Page 13
Codec Performance
)
+ 10
- 10
- 20
- 30
- 40
- 50
- 60
Gain (dB)
0
Input 0dB Ref: = 308mVrms Input Level = -20dB Sample Rates = 16, 32 or 63kb/s
0123456
0.2
Fig.7 Typical Overall (Encoder + Decoder) Frequency Response
SINAD
(dB)
0
64kb/s
30
0dB
Frequency (kHz)
SINAD
(dB)
0
Input Frequency = 1.0kHz 0dB Ref: = 308mVrms
10
-30 -24 -18 -12 -6 0
50kb/s
32kb/s
25kb/s
Input Level (dB
20
Sample Rate = 32kb/s 0dB Ref: = 308mVrms
10
-30 -24 -18 -12 -6 0
Input Level (dB
600Hz
1000Hz
1500Hz
Fig.8 SINAD vs Input Level at Differing Sample Rates Fig.9 SINAD vs Input Level at Differing Frequencies
+ 10
- 10
- 20
- 30
0
Gain (dB)
0dB
Input 0dB Ref: = 308mVrms Input Level = -20dB Sample Rates = 25 or 50kb/s
- 40
- 50
- 60
0.2
0123456
Fig.10 Typical Overall (Encoder + Decoder) Frequency Response
13
Frequency (kHz)
Page 14
Package Outlines
NOT TO SCALE
Max. Body Length 10.40mm Max. Body Width 10.40mm
The FX802 is available in the package styles outlined below. Mechanical package diagrams and specifications are detailed in Section 10 of this document. Pin 1 identification marking is shown on the relevant diagram and pins on all package styles number anti-clockwise when viewed from the top.
Handling Precautions
The FX802 is a CMOS LSI circuit which includes input protection. However precautions should be taken to prevent static discharges which may cause damage.
FX802J 28-pin cerdip DIL (J5)
NOT TO SCALE
Max. Body Length 37.05mm Max. Body Width 13.36mm
FX802LG 24-pin quad plastic encapsulated
bent and cropped (L1)
NOT TO SCALE
Max. Body Length 10.25mm Max. Body Width 10.25mm
Ordering Information
FX802J 28-pin cerdip DIL (J5) FX802LG 24-pin encapsulated bent and
cropped (L1)
FX802LS 24-lead plastic leaded chip
carrier (L2)
FX802LS 24-lead plastic leaded chip carrier
(L2)
CML does not assume any responsibility for the use of any circuitry described. No circuit patent licences are implied and CML reserves the right at any time without notice to change the said circuitry.
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