
PRELIMINARY
Notice: This is not a final specification.
Some parametric limits are subject to change.
MITSUBISHI Pch POWER MOSFET
FX50KMJ-2
HIGH-SPEED SWITCHING USE
FX50KMJ-2
4V DRIVE
•
VDSS .............................................................–100V
•
rDS (ON) (MAX) ................................................ 50mΩ
•
ID ....................................................................–50A
•
Integrated Fast Recovery Diode (TYP.) .........100ns
•
Viso ................................................................................ 2000V
•
OUTLINE DRAWING Dimensions in mm
10 ± 0.3 2.8 ± 0.2
3 ± 0.33.6 ± 0.3
15 ± 0.314 ± 0.5
1
2
3
1
3
2
6.5 ± 0.3
φ 3.2 ± 0.2
1.1 ± 0.2
1.1 ± 0.2
0.75 ± 0.15
2.54 ± 0.252.54 ± 0.25
2.6 ± 0.2
1
2
3
E
0.75 ± 0.15
4.5 ± 0.2
GATE
DRAIN
SOURCE
TO-220FN
APPLICATION
Motor control, Lamp control, Solenoid control
DC-DC converter, etc.
MAXIMUM RATINGS (Tc = 25°C)
Symbol
VDSS
VGSS
ID
IDM
IDA
IS
ISM
PD
Tch
Tstg
Viso
—
Drain-source voltage
Gate-source voltage
Drain current
Drain current (Pulsed)
Avalanche drain current (Pulsed)
Source current
Source current (Pulsed)
Maximum power dissipation
Channel temperature
Storage temperature
Isolation voltage
Weight
Parameter Conditions Ratings Unit
VGS = 0V
VDS = 0V
L = 30µH
AC for 1minute, Terminal to case
Typical value
–100
±20
–50
–200
–50
–50
–200
35
–55 ~ +150
–55 ~ +150
2000
2.0
V
V
A
A
A
A
A
W
°C
°C
V
g
Jan.1999

PRELIMINARY
Notice: This is not a final specification.
Some parametric limits are subject to change.
ELECTRICAL CHARACTERISTICS (Tch = 25°C)
Symbol UnitParameter Test conditions
V
(BR) DSS
IGSS
IDSS
VGS (th)
rDS (ON)
rDS (ON)
VDS (ON)
yfs
Ciss
Coss
Crss
td (on)
tr
td (off)
tf
VSD
Rth (ch-c)
trr
Drain-source breakdown voltage
Gate-source leakage current
Drain-source leakage current
Gate-source threshold voltage
Drain-source on-state resistance
Drain-source on-state resistance
Drain-source on-state voltage
Forward transfer admittance
Input capacitance
Output capacitance
Reverse transfer capacitance
Turn-on delay time
Rise time
Turn-off delay time
Fall time
Source-drain voltage
Thermal resistance
Reverse recovery time
ID = –1mA, VGS = 0V
VGS = ±20V, VDS = 0V
VDS = –100V, VGS = 0V
ID = –1mA, VDS = –10V
ID = –25A, VGS = –10V
ID = –25A, VGS = –4V
ID = –25A, VGS = –10V
ID = –25A, VDS = –10V
VDS = –10V, VGS = 0V, f = 1MHz
VDD = –50V, ID = –25A, VGS = –10V , RGEN = RGS = 50Ω
IS = –25A, VGS = 0V
Channel to case
IS = –50A, dis/dt = 100A/µs
MITSUBISHI Pch POWER MOSFET
FX50KMJ-2
HIGH-SPEED SWITCHING USE
Limits
Min. Typ. Max.
–100
—
—
–1.0
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
–1.5
39
47
–0.98
49.2
11130
896
480
57
118
828
380
–1.0
—
100
—
±0.1
–0.1
–2.0
50
61
–1.25
—
—
—
—
—
—
—
—
–1.5
3.57
—
V
µA
mA
V
mΩ
mΩ
V
S
pF
pF
pF
ns
ns
ns
ns
V
°C/W
ns
PERFORMANCE CURVES
POWER DISSIPATION DERATING CURVE
50
40
30
20
10
POWER DISSIPATION PD (W)
0
0 20050 100 150
CASE TEMPERATURE T
OUTPUT CHARACTERISTICS
–100
–80
–60
–40
–20
DRAIN CURRENT ID (A)
0
0 –2–4–6–8–10
VGS =
–10V
(TYPICAL)
–8V
–6V
Tc = 25°C
Pulse Test
–5V
PD = 35W
C (°C)
–4V
–3V
MAXIMUM SAFE OPERATING AREA
–3
–2
2
–10
–7
–5
–3
–2
1
–10
–7
TC = 25°C
–5
Single Pulse
DRAIN CURRENT ID (A)
–3
–2
0
–10
–7
–5
–3
–3 –5–7 –2 –2–10
100µs
1ms
10ms
100ms
0
–2 –10
–3 –5–7–2 –10
1
DRAIN-SOURCE VOLTAGE V
OUTPUT CHARACTERISTICS
(TYPICAL)
–50
–40
–30
VGS =
–10V
–4V
–8V
–6V
–5V
–20
–10
DRAIN CURRENT ID (A)
0
0 –1.0 –2.0 –3.0 –4.0 –5.0
tw =
10µs
DC
–3 –5–7
DS (V)
Tc = 25°C
Pulse Test
PD = 35W
2
–3V
DRAIN-SOURCE VOLTAGE VDS (V)
DRAIN-SOURCE VOLTAGE VDS (V)
Jan.1999

PRELIMINARY
Notice: This is not a final specification.
Some parametric limits are subject to change.
MITSUBISHI Pch POWER MOSFET
FX50KMJ-2
HIGH-SPEED SWITCHING USE
ON-STATE VOLTAGE VS.
GATE-SOURCE VOLTAGE
(TYPICAL)
–10
–8
(V)
–6
DS (ON)
–4
VOLTAGE V
–2
DRAIN-SOURCE ON-STATE
0
0 –2–4–6–8–10
GATE-SOURCE VOLTAGE V
TRANSFER CHARACTERISTICS
(TYPICAL)
–100
–80
(A)
D
–60
–40
–20
DRAIN CURRENT I
Tc = 25°C
Pulse Test
ID = –100A
–50A
–25A
GS
Tc = 25°C
DS
= –10V
V
Pulse Test
(V)
ON-STATE RESISTANCE VS.
DRAIN CURRENT
(TYPICAL)
100
80
(mΩ)
60
DS (ON)
40
20
DRAIN-SOURCE ON-STATE
RESISTANCE r
0
0
–10
–2
–3 –5 –7 –2
DRAIN CURRENT I
FORWARD TRANSFER ADMITTANCE
VS.DRAIN CURRENT
(TYPICAL)
2
10
TC =
7
25°C
5
(S)
3
fs
2
1
10
7
5
3
ADMITTANCE y
FORWARD TRANSFER
2
75°C 125°C
–10
1
VGS = –4V
–10V
Tc = 25°C
Pulse Test
–3 –5 –7
D
(A)
VDS = –10V
Pulse Test
–10
2
0
0 –2–4–6–8–10
GATE-SOURCE VOLTAGE V
DRAIN-SOURCE VOLTAGE
2
4
10
7
5
3
2
3
10
CAPACITANCE
7
Ciss, Coss, Crss (pF)
5
3
2
–10
–3 –5–7
DRAIN-SOURCE VOLTAGE V
CAPACITANCE VS.
(TYPICAL)
Ciss
Coss
0
1
–3–2 –5–7
–10
–3–2 –5–7 –3–2
GS
(V)
Tch = 25°C
GS
= 0V
V
Z
f = 1MH
Crss
2
–10
DS
(V)
0
10
0
–10
–2 –3 –5 –7
DRAIN CURRENT I
SWITCHING CHARACTERISTICS
(TYPICAL)
2
3
10
7
5
3
Tch = 25°C
2
GS
= –10V
V
DD
= –50V
V
2
GEN
= RGS = 50Ω
R
10
7
SWITCHING TIME (ns)
5
3
2
0
–2 –3 –5 –7 –2 –3 –5 –7
–10
–7
DRAIN CURRENT ID (A)
–10
1
–10
–2 –3 –5 –7
D
(A)
t
d(off)
t
f
t
r
t
d(on)
1
–10
2
Jan.1999

PRELIMINARY
Notice: This is not a final specification.
Some parametric limits are subject to change.
MITSUBISHI Pch POWER MOSFET
FX50KMJ-2
HIGH-SPEED SWITCHING USE
GATE-SOURCE VOLTAGE
VS.GATE CHARGE
(TYPICAL)
–10
(V)
GS
–8
VDS =
Tch = 25°C
D
= –50A
I
g
(nC)
–20V
–40V
–80V
–6
–4
–2
GATE-SOURCE VOLTAGE V
0
0 40 80 120 160 200
GATE CHARGE Q
ON-STATE RESISTANCE VS.
CHANNEL TEMPERATURE
(t°C)
(25°C)
1
10
7
DS (ON)
DS (ON)
5
3
2
0
10
7
5
3
2
–1
10
–50 0 50 100 150
DRAIN-SOURCE ON-STATE RESISTANCE r
DRAIN-SOURCE ON-STATE RESISTANCE r
CHANNEL TEMPERATURE Tch (°C)
(TYPICAL)
VGS = –10V
D
= 1/2I
D
I
Pulse Test
SOURCE-DRAIN DIODE
FORWARD CHARACTERISTICS
(TYPICAL)
–100
–80
(A)
S
–60
–40
–20
SOURCE CURRENT I
0
0 –0.4 –0.8 –1.2 –1.6 –2.0
SOURCE-DRAIN VOLTAGE V
THRESHOLD VOLTAGE VS.
CHANNEL TEMPERATURE
(TYPICAL)
–4.0
–3.2
(V)
–2.4
GS (th)
–1.6
VOLTAGE V
–0.8
GATE-SOURCE THRESHOLD
0
–50 0 50 100 150
CHANNEL TEMPERATURE Tch (°C)
TC =
25°C
75°C
125°C
VGS = 0V
Pulse Test
SD
VDS = –10V
D
= –1mA
I
(V)
BREAKDOWN VOLTAGE VS.
(t°C)
(25°C)
CHANNEL TEMPERATURE
(TYPICAL)
1.4
(BR) DSS
(BR) DSS
1.2
1.0
0.8
VGS = 0V
I
D
= –1mA
0.6
0.4
–50 0 50 100 150
DRAIN-SOURCE BREAKDOWN VOLTAGE V
CHANNEL TEMPERATURE Tch (°C)
DRAIN-SOURCE BREAKDOWN VOLTAGE V
TRANSIENT THERMAL IMPEDANCE
(°C/W)
1
10
7
(ch–c)
5
th
D = 1.0
3
0.5
2
0
10
10
10
0.2
7
0.1
5
0.05
3
2
–1
7
5
3
2
–2
–4
23 57 23 57 23 57 23 57
10
10
TRANSIENT THERMAL IMPEDANCE Z
CHARACTERISTICS
0.02
0.01
Single Pulse
–3
10
–2
PULSE WIDTH t
10
–1
P
DM
tw
T
tw
D
=
T
0
10
w
(s)
23 57
10
1
23 57
10
2
Jan.1999