Datasheet FSTD16450 Datasheet (Fairchild Semiconductor)

Page 1
FSTD16450 Configurable 4-Bit to 20-Bit Bus Switch
with Selectable Level Shifting
FSTD16450 Configurable 4-Bit to 20-Bit Bus Switch with Selectable Level Shifting
January 2001 Revised August 2001
General Description
The FSTD16450 is designed to allow “customer” configura­tion control of the enable co nnections . The device is o rga­nized as either a 4-bit, 5-bit , 10-bi t or 20-b it bus swit ch. 8­bit and 16-bit configurations are also achievable (see Func­tional Description). The d evice' s bi t con figur atio n i s chos en through select pin logic. (s ee Truth Table). When OE
LOW, Port A the switch is OPEN. Another key device feature is the addition of a level shifting
select pin, “S standard N-MOS switch. When S is integrated into the circuit allowing for level shifting
between 5V inputs and 3.3V outputs.
is connected to Port Bx. When OEx is HIGH,
x
”. When S2 is LOW, the device behaves as a
2
is HIGH, a diode to V
2
Features
4 switch connection between two ports
Voltage level shifting
Minimal propagation delay through the switch
Low l
CC
Zero bounce in flow-through mode
Control inputs compatible with TTL level
Also packaged in plastic Fine-Pitch Ball Grid Array
(FBGA) (Preliminary)
Applications Note
is
x
Select pins S0, S1, S2 are intended to be used as static user configurable control pins. The AC performance of
these pins has not be en characterized or teste d. Swit ching of these select pin s during system operation may tempo­rarily disrupt output logic states and/or enable pin controls.
CC
Ordering Code:
Order Number Package Number Package Description
FSTD16450GX (Note 1)
FSTD16450MTD MTD56 56-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
Devices also availab l e in Tape and Reel. Specify by appending th e s uffix let t er “X” to the ordering code. Note 1: BGA package available in Tape and Reel only.
BGA54A
(Preliminary)
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide [Tape and Reel]
UHC is a trademark of Fairchild Semiconductor Corporation.
© 2001 Fairchild Semiconductor Corporation DS500438 www.fairchildsemi.com
Page 2
Connection Diagrams
Pin Assignments for TS SO P
FSTD16450
Pin Descriptions
Pin Name Description
OE
, OE
1
2
Bus Switch Enables 1A, 2A Bus A 1B, 2B Bus B
S
, S
0
1
S
2
Bit Configuration Enables
Level Shifting Diode Enable
FBGA Pin Assignments
123456
A 1A B 1A51A41A11B11B41B
C 1A71A6GND OE51B61B D 1A91A8GND V E 2A11A F 2A32A2S G 2A52A4VCCGND 2B42B H 2A72A62A102B102B62B
J 2A92A8OE4OE32B82B
1A2OE1OE21B21B
3
CC
10S0VCC1B10
S22B22B
1
1B81B
2B
3 5
7 9 1 3 5 7
9
Pin Assignments for FBGA
(Top Thru View)
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Page 3
Logic Diagrams
20-Bit Configuration
(Configuration 1)
FSTD16450
10-Bit Configuration
(Configuration 2)
5-Bit Configuration
(Configuration 3)
4-Bit Configuration
(Configuration 4)
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Page 4
Functional Description
The device can a lso be configured as an 8 and 16-bit devi ce by grounding the u nused pins in Configu rations 2 and 1 respectively. The 8-bit configuration may also be achieved by tying two of the 4-bit enables from configuration together and tying the remaining enabl e pin (OE
FSTD16450
Truth Tables (X = V
(see Functional Description)
S
2
L Std. NMOS Switch H Level Shifting Diode Enabled
Configuration 1
OE
OE
1
2
LXXXX 1A HXXXX Z
Configuration 2
OE
OE
1
2
LXXLX 1A
LXXHX 1A HXXLX Z 2A HXXHX Z Z
) HIGH.
or GND)
CC
Select Pin
Mode
= S1 = L
Inputs
OE
3
S
0
OE
S
= L, S1 = H
0
OE
4
5
20-Bit Configuration
Inputs/Outputs
= 1B
1-10
1-10
10-Bit Configuration
Inputs Inputs/Outputs
OE
OE
3
4
OE
1A
5
1-10
= 1B
= 1B
X
= 1B
X
1-10
X X
, 2A
1-10
= 2B
2A
1-10
2AX = 2B
1-10
= 2B
= 2B
X
Z
1-10
X
X
S
Configuration 3
= H, S1 = L
0
5-Bit Configuration
Inputs Inputs/Outputs
OE
OE2OE3OE4OE51A
1
LLLLX1A LLLHX1A LLHLX1A LLHHX1A LHLLX1A LHLHX1A LHHLX1A LHHHX1A HLLLX Z 1A HLLHX Z 1A HLHLX Z 1A HLHHX Z 1A HHL LX Z Z 2A HHLHX Z Z 2A
1-5
, 1B
= 1B
x
= 1B
x
= 1B
x
= 1B
x
= 1B
x
= 1B
x
= 1B
x
= 1B
x
1-5
1A
, 1B
6-10
1Ay = 1B
x
1Ay = 1B
x
1Ay = 1B
x
1Ay = 1B
x x x x x
Z2A Z2A ZZ2A ZZZ
= 1B
y
= 1B
y
= 1B
y
= 1B
y
6-10
y y y y
y y y y
2A
, 2B
1-5
1-5
2Ax = 2B
x
2Ax = 2B
x
Z2A ZZ
= 2B
x
x
= 2B
x
x
2Ax = 2B
x
2Ax = 2B
x
Z2A ZZ
= 2B
x
x
= 2B
x
x
HHHLX Z Z Z 2A HHHHX Z Z Z Z
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2A
6-10
2Ay = 2B
2Ay = 2B
2Ay = 2B
2Ay = 2B
, 2B
Z
= 2B
y
Z
= 2B
y
Z
= 2B
y
Z
= 2B
y
6-10
y
y
y
y
y
y
y
y
Page 5
Truth Tables (Continued)
S
Configuration 4
Inputs Inputs/Outputs
OE2OE3OE4OE51A
OE
1
LLLLL1Ax = 1B LLLLH1Ax = 1B LLLHL1A LLLHH1Ax = 1B LLHLL1A LLHLH1Ax = 1B LLHHL1A LLHHH1Ax = 1B LHLLL1A LHLLH1Ax = 1B LHLHL1A LHLHH1Ax = 1B LHHLL1A LHHLH1Ax = 1B LHHHL1A LHHHH1Ax = 1B HLLLL Z 1A HLLLH Z 1Ay = 1B HLLHL Z 1A HLLHH Z 1Ay = 1B HLHLL Z 1A HLHLH Z 1Ay = 1B HLHHL Z 1A HLHHH Z 1Ay = 1B HHL LL Z Z 2A HHL LH Z Z 2Ax = 2B HHLHL Z Z 2A HHLHH Z Z 2Ax = 2B HHHL L Z Z Z 2A HHHLH Z Z Z 2Ay = 2B HHHHL Z Z Z Z HHHHH Z Z Z Z Z
= S1 = H
0
1-4
, 1B
= 1B
x
= 1B
x
= 1B
x
= 1B
x
= 1B
x
= 1B
x
= 1B
x
4-Bit Configuration
1A
1A
1-4
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
, 1B
5-8
1Ay = 1B 1Ay = 1B 1Ay = 1B 1Ay = 1B 1Ay = 1B 1Ay = 1B 1Ay = 1B 1Ay = 1B
Z2A Z2A Z2A Z2A ZZ2A ZZ2A ZZZ ZZZZ
= 1B
y
= 1B
y
= 1B
y
= 1B
y
5-8
2A
, 2B
3-6
3-62A7-10
2Ax = 2B
y
y
y
y
y
y
y
y
y
y
y
y
y
y
y
y
x
2Ax = 2B
x
2Ax = 2B
x
2Ax = 2B
x
Z2A Z2A ZZ ZZZ
= 2B
x
x
= 2B
x
x
= 2B
x
x
= 2B
x
x
2Ax = 2B
x
2Ax = 2B
x
2Ax = 2B
x
2Ax = 2B
x
Z2A Z2A ZZ ZZZ
= 2B
x
x
x
= 2B
x
x
x
, 2B
2Ay = 2B 2Ay = 2B
Z ZZ
= 2B
y
= 2B
y
2Ay = 2B 2Ay = 2B
Z ZZ
= 2B
y
= 2B
y
2Ay = 2B 2Ay = 2B
Z ZZ
= 2B
y
= 2B
y
2Ay = 2B 2Ay = 2B
Z ZZ
= 2B
y
7-10
y
y
y
y
y
y
y
y
y
y
y
y
y
y
y
y
9-10
2A
1Az = 1B 2Az = 2B
1A 2Az = 2B
1Az = 1B 2Az = 2B
1A 2Az = 2B
1Az = 1B 2Az = 2B
1A 2Az = 2B
1Az = 1B 2Az = 2B
1A 2Az = 2B
1Az = 1B 2Az = 2B
1A 2Az = 2B
1Az = 1B 2Az = 2B
1A 2Az = 2B
1Az = 1B 2Az = 2B
1A 2Az = 2B
1Az = 1B 2Az = 2B
1A 2Az = 2B
1-2
, 2B , 2B
Z
= 1B
z
Z
= 1B
z
Z
= 1B
z
Z
= 1B
z
Z
= 1B
z
Z
= 1B
z
Z
= 1B
z
Z
= 1B
z
9-10 1-2
z z
z z
z z
z z
z z
z z
z z
z z
z z
z z
z z
z z
z z
z z
z z
z z
FSTD16450
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Page 6
Absolute Maximum Ratings(Note 2) Recommended Operating
Supply Voltage (VCC) 0.5V to +7.0V DC Switch Voltage (V DC Input Control Pin Voltage
FSTD16450
(V
) (Note 4) 0.5V to +7.0V
IN
DC Input Diode Current (l DC Output (I DC V
OUT
/GND Current (ICC/I
CC
Storage Temperature Range (T
) (Note 3) 0.5V to +7.0V
S
) V
< 0V 50 mA
IK
IN
) Current 128 mA
) +/ 100 mA
GND
) 65°C to +150 °C
STG
Conditions
Power Supply Operating (V Input Voltage (V Output Voltage (V Free Air Operating Temperature (T
Note 2: The Absolute Maximum Ratings are those values bey ond which the safety of the d evice cannot be guaranteed. The device sh ould not be operated at these limit s. The parametric values defin ed in the Electrical Characteristics tables are not guaranteed at the absolute maximum rating. The Recomme nded O peratin g Cond itions table will defin e the condition s for actual device operation.
is the voltage observed/applied at either the A or B Ports across
Note 3: V
S
the switch. Note 4: The input and output ne gative vo ltage ra tings may be excee ded if
the input and output diode current ratings are observed. Note 5: Unused control inputs must be held HIGH or LOW. They may not
float.
(Note 5)
CC)
)0V to 5.5V
IN
)0V to 5.5V
OUT
)-40 °C to +85 °C
A
DC Electrical Characteristics
Symbol Parameter
V V V V I
I
I
OZ
R
Clamp Diode Voltage 4.5 −1.2 V IIN = 18 mA
IK
HIGH Level Input Voltage 4.0-5.5 2.0 V IF S2 = HIGH 4.5V VCC 5.5V
IH
LOW Level Input Voltage 4.0-5.5 0.8 V IF S2 = HIGH 4.5V VCC 5.5V
IL
HIGH Level Output Voltage 4.5-5.5 See Figure 3 V S2 = V
OH
Input Leakage Current 5.5 ±1.0 µA0 ≤ VIN 5.5V
OFF-STATE Leakage Current 5.5 ±1.0 µA0 ≤ A, B ≤ V Switch On Resistance 4.5 4 7 VIN = 0V, IIN = 64 mA, S2 = 0V or V
ON
(V) Min
(Note 7) 4.5 4 7 VIN = 0V, IIN = 30 mA, S2 = 0V or V
4.5 8 12 VIN = 2.4V, IIN = 15 mA, S2 = 0V
4.0 11 20 V
4.5 35 50 V
V
I
CC
Quiescent Supply Current
5.5
I
Increase in I
CC
per Input
CC
5.5
Note 6: Typi c al values are at VCC = 5.0V and TA = +25°C Note 7: Measured by the volta ge drop between A an d B pins at the indicated c urrent through the switch. On Resistance is determined by the lower of the
voltages on the two (A or B) pins.
TA = 40 °C to +85 °C
CC
Typ
(Note 6)
010µAV
Units Conditions
Max
IN
IN IN
3 µAS2 = GND, VIN = VCC or GND, I
10 µAS2 = VCC, OEx = VCC, VIN = VCC or GND, I
1.5 mA S2 = VCC, OEx = GND, VIN = VCC or GND, I
2.5 mA
4.0 mA
One Input at 3.4V Other Inputs at VCC or GND, S2 = 0V One Input at 3.4V Other Inputs at VCC or GND, S2 = V
CC
= 5.5V
CC
= 2.4V, IIN = 15 mA, S2 = 0V = 2.4V, IIN = 15 mA, S2 = V
CC
OUT
4.0V to 5.5V
CC CC
= 0
OUT
OUT
CC
= 0
= 0
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Page 7
AC Electrical Characteristics
= 40 °C to +85 °C,
T
A
C
Symbol Parameter
= 50pF, RU = RD = 500
L
= 4.5 – 5.5V VCC = 4.0V (S2 = 0V)
V
CC
Units
Conditions Figure
Number
Min Max Min Max
t
, t
PHL
t
PZH
t
PHZ
t
PZH
t
PHZ
Note 8: This par ameter is guaranteed by desi gn but is not test ed. The bus switch contribut es no propagati on delay other than the RC dela y of the typical On Resistance of the sw it c h and the 50pF load capa citance, when drive n by an ideal voltage sourc e (zero output impe dance).
Propagation Delay Bus-to-Bus
PLH
(Note 8)
, t
Output Enable Time 1.5 6.5 7.0 ns VI = 7V for t
PZL
, t
Output Disable Time 1.5 6.7 7.2 ns VI = 7V for t
PLZ
, t
, t
PZLSel
PLZSel
(S
) to Output Enable Time 1.5 7.0 7.5 ns VI = 7V for t
0, 1
(S
) to Output Disable Time 1.5 7.5 7.7 ns VI = 7V for t
0, 1
0.25 0.25 ns VI = OPEN Figures
VI = OPEN for t
PZL
VI = OPEN for t
PLZ
= OPEN for t
I
= OPEN for t
I
PZL
PLZ
V
V
PZH
PHZ
PZH
PHZ
Figures
Figures
Figures
Figures
AC Electrical Characteristics: Translating Diode
T
= 40 °C to +85 °C,
A
= 50pF, RU = RD = 500
C
Symbol Parameter
L
VCC = 4.5 – 5.5V (S2 = VCC)
Units
Min Max
t
, t
Propagation Delay Bus-to-Bus (Note 9) 0.25 ns VI = OPEN Figures
PLH
, t
Output Enable Time 1.5 10.0 ns VI = 7V for t
PZL
t
PHL
PZH
VI = OPEN for t
t
, t
PHZ
Output Disable Time 1.5 9.0 ns VI = 7V for t
PLZ
VI = OPEN for t
t
PZH
, t
PZLSel
(S
) to Output Enable Time 1.5 11.0 ns VI = 7V for t
0, 1
VI = OPEN for t
t
PHZ
, t
PLZSel
(S
) to Output Disable Time 1.5 10.0 ns VI = 7V for t
0, 1
V
Note 9: This parameter is guaranteed by design but is not tested. This bus switch contributes no propagation delay other than the RC delay of the typical On Resistance of the sw it c h and the 50pF load capa citance, when drive n by an ideal voltage sourc e (zero output impe dance).
Conditions Figure
PZL
PZH
PLZ
PHZ
PZL
PZH
PLZ
= OPEN for t
I
PHZ
Number
Figures
Figures
Figures
Figures
FSTD16450
1, 2
1, 2
1, 2
1, 2
1, 2
1, 2
1, 2
1, 2
1, 2
1, 2
Capacitance (Note 10)
Symbol Parameter Typ Max Units Conditions
C
IN
C
I/O
Note 10: TA = +25°C, f = 1 MHz, Capacitance is characterized but not tested.
Control Pin Input Capacitance 4 pF VCC = 5.0V, VIN = 0V
Input/Output Capacitance OFF State 8pFV
, OE = 5.0V, VIN = 0V
CC
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Page 8
AC Loading and Waveforms
FSTD16450
Note: Input driven by 50 source terminated in 50
includes load and stray capacitance
Note: C
L
Note: Input Frequency = 1.0 MHz, t
FIGURE 1. AC Test Circuit
FIGURE 2. AC Waveforms
= 500 ns
W
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Page 9
FSTD16450
FIGURE 3.
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Page 10
Physical Dimensions inches (millimeters) unless otherwise noted
FSTD16450
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
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Package Number BGA54A
Preliminary
Page 11
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
FSTD16450 Configurable 4-Bit to 20-Bit Bus Switch with Selectable Level Shifting
56-Lead Thin Shrin k Small Ou tlin e Pack age (TSSOP), JEDEC MO-153, 6.1mm Wide
Package Number MTD56
Technology Description
The Fairchild Switch family derives from and embodies Fairchilds proven switch t echnology used for several years in it s 74LVX3L384 (FST3384) bus switch product.
Fairchild does not assume any responsibility for use of any circuitry described , no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.
LIFE SUPPORT POLICY
FAIRCHILDS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are dev ic es or syste ms which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provide d in the l abe ling, can be rea­sonably expected to result in a significant injury to the user.
2. A critical compo nent in any com ponen t of a life s upp ort device or system whose failure to perform can be rea­sonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
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