Page 1
FDR8521L
(
)
y
)
P-Channel MOSFET With Gate Driver For Load Switch Application
FDR8521L
August 2000
General Description
This device is designed for configuration as a load switch
and is particularly suited for power management in portable battery powered electronic equipment. Designed to
operate from 3V to 20V input and supply up to 2.9A, the
device features a small N-Channel MOSFET (Q1) together
with a large P-Channel Power MOSFET (Q2) in a single
SO-8 package.
Applications
• Power management
• Load switch
V
OU T,C1,CO
5
V
OUT ,C1,CO
6
7
2
R
R
2
8
SuperSOT -8
TM
1
pin
Features
• V
= 0.07 V @ VIN= 12 V, IL= 1 A.R
DROP
V
= 0.115 V @ VIN= 5 V, IL= 1 A.R
DROP
• V
= 0.2 V @ VIN= 12 V, IL=2.9 A.R
DROP
V
= 0.2 V @ VIN= 5 V,IL= 1.8 A.R
DROP
(ON)
(ON)
(ON)
(ON)
• Control MOSFET (Q1) includes Zener protection for
ESD ruggedness (>6kV Human Body Model).
• High density cell design for extremely low on-resistance.
VIN,R1,C
i
Q2
Q1
Se e App li cat i o n Ci r c ui t
4
R1,R2,C
1
3
IN
C1,C
O
2
V
ON/OFF
1
EQUIVALENT CIRCUIT
V
DR OP
+
ON/OFF
= 0.07 Ω
= 0.115 Ω.
= 0.07 Ω
= 0.115 Ω.
-
OUT
T
=25oC unless otherwise noted
Absolute Maximum Ratings
A
Symbol Parameter Ratings Units
V
IN
V
ON/OFF
I
D
Input Voltage Range
On/Off Voltage Range 2.5 - 8 V
Load Current - Continuous
- Puls e d 8
P
D
TJ, T
stg
Max im um Powe r D iss ipatio n
Operating and Storage Temperature Range -55 to +150
ESD Electros tatic D isc ha rge Rating MIL-STD-883D
Human-Bod
-Model (100pf/1500 Ohm
(Note 1)
Note 2
(Note 2)
3 - 20 V
2.9 A
0.8 W
6kV
Thermal Characteristics
R
JA
θ
R
JC
θ
Thermal Resistance, Junction-to-Ambient
Thermal Resistance, Junction-to-Case
(Note 2)
(Note 2)
156
40
Package Marking and Ordering Information
Device Marking Device Reel Size Tape width
8521L FDR8521L 13’’ 12mm 3000 units
2000 Fairchild Semiconductor International
C
°
C/W
°
C/W
°
Qua n tity
FDR8521L Rev. C
Page 2
FDR8521L
Electrical Characteristics
TA=25oC unless otherwise noted
Symbol Parameter Test Conditions Min Typ Max Units
OFF Characteristics
I
FL
ON Characteristics
V
DROP
R
(ON)
I
L
Notes:
1. Range of VIN can be up to 25V, but R1 and R2 must be scaled such that VGS of Q2 does not exceed -20V.
2. R
mounting surface of the drain pins. R
3. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%.
Forward Leakage Current VIN = 20 V, V
(Note 3)
V
Conduction Voltage
IN
V
IN
V
IN
V
IN
= 12 V, V
= 5 V, V
= 12 V, V
= 5 V, V
Q2 - Static On-Resistance VGS = -12 V, ID = 2.9 A
V
= -5 V, ID = 1.8 A
Load Current V
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder
θJA
GS
= 0.2 V, VIN = 12 V, V
DROP
V
= 0.2 V, VIN = 5 V, V
DROP
is guaranteed by design while R
θJC
= 250 µA1
ON/OFF
= 3.3 V, IL = 1 A
ON/OFF
= 3.3 V, IL = 1 A
ON/OFF
= 3.3 V, IL = 2.9 A 0.200
ON/OFF
= 3.3 V, IL = 1.8 A 0.200
ON/OFF
0.053
0.085
0.054
0.090
= 3.3 V
ON/OFF
= 3.3 V
ON/OFF
is determined by the user’s board design.
θJA
2.9
1.8
0.070
0.115
0.070
0.115
µ
V
Ω
A
FDR8521L Load Switch Application
APP LICA TI ON CIRCUIT
A
Q2
IN OUT
R1
Ci
ON/OFF
C1
R2
Co
Q1
External Component Recommendation:
For applications where Co ≤ 1µF.
For slew rate control, select R2 in the range of 470 - 10kΩ .
For additional in-rush current control,C1 ≤ 1000pF can be added.
Select R1 so that the R1/R2 ratio ranges from 10 - 100. R1 is required to turn Q2 off.
LOAD
FDR8521L Rev. C
Page 3
T ypical Characteristics (continued)
µ
FDR8521L
0.7
VIN = 12V
= 1.5 - 8V
V
0.6
ON/OFF
S, D < 2%
PW = 300
0.5
0.4
(V)
DROP
0.3
V
0.2
0.1
0
012345678
TA = 125oC
TA = 25oC
(A)
I
L
Figure 1. Conduction V oltage Drop
Variation with Load Current.
0.3
0.25
0.2
(V)
0.15
DROP
V
0.1
0.05
0
2 4 6 8 10 12
, INPUT VOLTAGE (V)
V
IN
IL = 1A
V
ON/OFF
PW = 300µS, D <
TA = 125oC
TA = 25oC
= 1.5V -8V
1
VIN = 5V
V
= 1.5 - 8V
ON/OFF
0.8
PW = 300µS, D <
0.6
(V)
DROP
V
0.4
0.2
0
012345678
2%
TA = 125oC
I
(A)
L
TA = 25oC
Figure 2. Conduction V oltage Drop
Variation with Load Current.
2%
Figure 3. On-Resistance V ariation
with Input Volt age.
1
D = 0.5
0.5
R (t) = r(t) * R
JA
0.2
0.2
0.1
0.05
0.02
0.01
0.005
r(t), NORMALIZED EFFECTIVE
0.002
TRANSIENT THERMAL RESISTANCE
0.001
0.1
0.05
0.02
0.01
Single Pulse
0.0001 0.001 0.01 0.1 1 10 100 300
t , TIME (sec)
1
JA
θ
θ
R =
JA
θ
P(pk)
P(pk)
t
t
1
1
t
t
2
2
T - T = P * R (t)
J
J
A
A
Duty Cycle, D = t / t
156
Figure 4.Transient Thermal Response Curve.
Thermal characterization performed using the conditions described in Note 2.
Transient themal response will change depending on the circuit board design.
°C/W
JA
θ
1
JA
θ
2
2
FDR8521L Rev. C
Page 4
SuperSOTTM-8 Tape and Reel Data and Package Dimensions
SSOT-8 Packaging
Configuration: Figure 1.0
Customized Label
F63TNR Label
Emboss ed Carrier Tape
Antistatic Cover Tape
Static Dissipative
852
F
831N
Packaging Description:
SSOT-8 parts are shipped in tape. The carrier tape is
made from a dissipati ve (carbon filled) po lycarb onate
resin. The cov er tap e is a mu lt ilayer film (Heat Act ivat ed
Adhesiv e in nat ure) prim aril y c omp osed of po lyes ter film ,
adhesive layer, sealant, and anti-static sprayed agent.
These reeled parts in standar d option are ship ped wi th
3,000 u n i ts pe r 13" or 330c m diam eter r e el . Th e re el s ar e
dark blue in color and is made of poly styr ene plas t ic (antistatic c oated). Other option comes in 500 units per 7" or
177c m diam eter reel. This and s ome o ther opt ion s are
furth er described in the Packaging Information t able.
These full reels are individu ally ba rcode la bel ed and
placed in side a standard intermediat e box (illus trated in
figur e 1.0) made of recyc lable corrugated brown paper.
One box cont ains t wo reels maxi mum. And t hese bo xes
are placed ins ide a barc ode labeled shipp ing bo x whic h
co m e s i n di ff ere n t siz es depe nd in g on t he nu m b e r of pa r ts
sh i ppe d.
852
852
F
831N
F
831N
852
F
831N
852
F
831N
Pin 1
SSOT-8 Packaging Information
Packaging Option
Packaging type
Qty per Reel/Tube/Bag
Reel Size
Box Dimension (mm)
Max qty per Box
Weight per unit (gm )
Weight per Reel (kg)
Note/Comments
184mm x 187mm x 47mm
Stan dard
(no flow code)
3,000 500
13" Dia
343x64x343 184x187x47
6,000 1,000
0.0416 0.0416
0.5615 0.0980
TNR
D84Z
TNR
7" Dia
F63TNR
Label
Pizza Box for D84Z Option
SSOT-8 Tape Leader and Trailer
Configuration: Figur e 2.0
F63TNR
Label
SSOT-8 Unit Orientation
343mm x 342mm x 64mm
Inter mediate box fo r Standar d
and L 99Z Options
F63TNR Label sampl e
LOT: CBVK7 41B019
FSID: FDR835N
D/C1: D9842 QTY1: SPEC REV:
D/C2: QTY2: CPN:
F63TNR Label
QTY: 3000
SPEC:
N/F: F (F63TNR)3
Carrier Tape
Cover Tape
Tr ailer Tape
300mm mi nimum or
38 empty pockets
Components
Leader Tape
500mm mi nimum or
62 empty poc kets
August 1999, Rev. C
Page 5
SuperSOTTM-8 Tape and Reel Data and Package Dimensions, continued
SSOT-8 Embossed Carrier Tape
Configuration: Figur e 3.0
T
K0
Wc
B0
P0
D0
E1
F
W
E2
Tc
A0
P1
D1
User Direction of Feed
Dimensions are in millimeter
Pkg type
SSOT-8
(12mm)
Notes: A0, B0, and K0 dimensions are determined with r espect to the EIA/Jedec RS-481
SSOT-8 Reel Configuration: Figur e 4.0
A0 B0 W D0 D1 E1 E2 F P1 P0 K0 T Wc Tc
4.47
5.00
12.0
1.55
1.50
1.75
10.25
+/-0.10
+/-0.10
+/-0.3
+/-0.05
+/-0.10
+/-0.10
5.50
min
+/-0.05
rotational and lateral movement requi rements (see sketches A, B, and C).
20 deg maximum
Typical
component
cavity
center line
Typical
component
center line
A0
Dim A
Max
20 deg maximum component rotation
Sketc h A (Side or F r o nt Sectional View)
Component Rotation
B0
Sketc h B (Top View )
Component Rotation
W1 Measured at Hub
8.0
+/-0.1
4.0
+/-0.1
1.37
0.280
+/-0.150
9.5
+/-0.025
0.5mm
maximum
+/-0.10
0.5mm
maximum
Sketc h C (Top View)
Component lateral movement
0.06
+/-0.02
Dim A
max
13" Diameter Option
Tape Size
12mm 7" Dia
12mm 13" Dia
1998 Fairchild Semiconductor Corporation
Reel
Option
Dim A Dim B Dim C Dim D Dim N Dim W1 Dim W2 Dim W3 (LSL-USL)
7.00
177.8
13.00
330
0.059
1.5
0.059
1.5
Dim N
See detail AA
W3
W2 max Measured at Hub
Dimensions are in inches and millimeters
512 +0.020/-0.008
13 +0.5/-0.2
512 +0.020/-0.008
13 +0.5/-0.2
0.795
20.2
0.795
20.2
5.906
150
7.00
178
Dim D
min
0.488 +0.078/-0.000
12.4 +2/0
0.488 +0.078/-0.000
12.4 +2/0
Diameter Option
7"
DETAIL AA
0.724
18.4
0.724
18.4
See detail AA
B Min
Dim C
0.469 – 0.606
11.9 – 15.4
0.469 – 0.606
11.9 – 15.4
July 1999, Rev. C
Page 6
SuperSOTTM-8 Tape and Reel Data and Package Dimensions, continued
SuperSOT-8 (FS PKG Code 34, 35)
1 : 1
Scale 1:1 on letter size paper
Dimensio ns shown below are in:
inches [mil lime ters ]
Part Weight per unit (gram): 0.0416
September 1998, Rev. A
Page 7
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is
not intended to be an exhaustive list of all such trademarks.
ACEx™
Bottomless™
CoolFET™
CROSSVOLT™
DOME™
E2CMOS
EnSigna
TM
TM
FACT™
FACT Quiet Series™
®
FAST
FASTr™
GlobalOptoisolator™
GTO™
HiSeC™
ISOPLANAR™
MICROWIRE™
OPTOLOGIC™
OPTOPLANAR™
POP™
PowerTrench
®
QFET™
QS™
QT Optoelectronics™
Quiet Series™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
SyncFET™
TinyLogic™
UHC™
VCX™
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER
NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD
DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT
OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT
RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant into
the body, or (b) support or sustain life, or (c) whose
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
reasonably expected to result in significant injury to the
user.
2. A critical component is any component of a life
support device or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification Product Status Definition
Advance Information
Preliminary
No Identification Needed
Obsolete
Formative or
In Design
First Production
Full Production
Not In Production
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Rev. F1
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