Datasheet FDR6580 Datasheet (Fairchild Semiconductor)

Page 1
FDR6580
N-Chennal 2.5V Specified PowerTrenchTM MOSFET
FDR6580
April 1999
ADVANCE INFORMATION
General Description
This N-Channel 2.5V specified MOSFET is produced using Fairchild Semiconductor's advanced PowerTrench process that has been especially tailored to minimize the on-state resistance and yet maintain low gate charge for superior switching performance.
Applications
Load switchMotor drivingPower Management
S
D
D
S
G
SuperSOT -8
TM
Absolute Maximum Ratings
D
D
D
TA = 25°C unless otherwise noted
Features
11 A, 20 V. R
R
DS(ON)
DS(ON)
= 0.009 Ω @ V = 0.013 Ω @ V
= 4.5 V
= 2.5 V.
Low gate charge.
High performance trench technology for extremely
low R
DS(ON)
.
Small footprint (38% smaller than a standard SO-8); low
profile package (1 mm thick); power handling capability similar to SO-8.
5
6 7
8
4
3
2 1
Symbol Parameter Ratings Units
V
DSS
V
GSS
I
D
P
D
TJ, T
stg
Drain-Source Voltage 20 V Gate-Source Voltage Drain Current - Continuous
(Note 1a)
8V
±
11 A
- Pulsed 50
Power Dissipation for Single Operation
(Note 1a) (Note 1b)
(Note 1c)
1.8 W
1.0
0.9
Operating and Storage Junction Temperature Range -55 to +150
Thermal Characteristics
R
JA
θ
R
JC
θ
Thermal Resistance, Junction-to-Ambient Thermal Resistance, Juncti on-to-Case
(Note 1a) (Note 1)
70 20
Package Outlines and Ordering Information
Device Marking Device Reel Size Tape Width Quantity
.6580 FDR6580 13’’ 12mm 3000 units
1999 Fairchild Semiconductor Corporation
C
°
C/W
°
C/W
°
FDR6580, Rev. A
Page 2
FDR6580
Electrical Characteristics T
=25oC unless otherwise noted
A
Symbol Parameter Test Conditions Min Typ Max Units
OFF CHARACTERISTICS
BV I
DSS
I
GSSF
I
GSSR
DSS
Drain-Source Breakdown Voltage
= 0 V, ID = 250 µA
V
GS
Zero Gate Voltage Drain Current VDS = 16 V, VGS = 0 V 1 Gate-Body Leakage, Forward VGS = 8 V, VDS = 0 V 10 Gate-Body Leakage, Reverse VGS = -8 V, VDS = 0 V -10
20 V
ON CHARACTERISTICS (Note 2)
V
GS(TH)
R
DS(ON)
I
D(ON)
Gate Threshold Voltage Static Drain-Sourc e
On-Resistance
= VGS, ID = 250 µA
V
DS
VGS = 4.5 V, ID = 11 A V
= 2.5 V, ID = 9.3 A
GS
On-State Drain Current VGS = 4.5 V, VDS = 5 V 25 A
0.4 1.5 V
0.009
0.013
DRAIN-SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS
I
S
V
SD
Notes:
1. R
θJA
the drain pins. R
Maximum Continuous Drain-S ource Diode Forward Current 1.5 A Drain-Source Diode Forward
VGS = 0 V, IS = 1.5 A (Note 2) 1.2 V
Voltage
is the sum of the junction-to-case and case-to-ambient resistance where the case thermal reference is defined as the solder mounting surface of
is guaranteed by design while R
θJC
is determined by the user's board design.
θCA
µA µA µA
Ω
a) 70° C/W when mounted on a
1.0 in2 pad of 2 oz. copper.
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2.0%
b) 125 ° C/W when mounted on a 0.026 in2 pad of 2oz. copper.
c) 135° C/W when mounted on a minimum pad.
FDR6580, Rev. A
Page 3
SuperSOTTM-8 Tape and Reel Data and Package Dimensions
SSOT-8 Packaging Configuration: Figure 1.0
Customized Label
F63TNR Label
Emboss ed Carrier Tape
Antistatic Cover Tape
Static Dissi pative
852
F
831N
Packaging Description:
SSOT-8 parts are shipped in tape. The carrier tape is made from a di ssipative (c arbon fil led) polycarbonate resin. The cov er tap e is a mu lt ilayer film (Heat Act ivat ed Adhesiv e in nat ure) prim aril y c omp osed of po lyes ter film , adhesive layer, sealant, and anti-static sprayed agent. These reeled parts in standar d option are ship ped wi th 3,000 u n i t s pe r 13" or 33 0c m dia m eter r e el . The r e el s ar e dark blue in color and is made of po ly s t yr ene plas ti c (anti­static c oated). Other option comes in 500 units per 7" or 177c m diam eter reel. This and s ome o ther opt ion s are furth er described in the Packaging Info rmation table.
These full reels are in di vidu ally barcode labe led and placed in side a standard intermediat e box (illus trated in figur e 1.0) made of recyclable corr ugated brown pa per. One box cont ains t wo reels maxi mum. And t hese bo xes are placed ins ide a barc ode labeled shipp ing bo x whic h co m e s i n di ffer en t s i z es depe nd in g on t he nu mbe r of pa rt s sh i ppe d.
852
852
F
831N
F
831N
852
F
831N
852
F
831N
Pin 1
SSOT-8 Packaging Information
Packaging Option Packaging type
Qty per Reel/Tube/Bag Reel Size Box Dimension (mm) Max qty per Box Weight per unit (gm) Weight per Reel (kg)
Note/Comments
184mm x 187mm x 47mm
Stan dard
(no flow c ode )
TNR
3,000 500
13" Dia
343x64x343 184x187x47
6,000 1,000
0.0416 0.0416
0.5615 0.0980
D84Z
TNR
7" Dia
F63TNR Label
Pizza Box for D84Z Option
SSOT-8 Tape Leader and Trailer Configuration: Figur e 2.0
F63TNR Label
SSOT-8 Unit Orientation
343mm x 342mm x 64mm
Inter mediate box for St andard
and L 99Z Options
F63TNR Label sampl e
LOT: CBVK7 41B019
FSID: FDR835N
D/C1: D9842 QTY1: SPEC REV: D/C2: QTY2: CPN:
F63TNR Label
QTY: 3000
SPEC:
N/F: F (F63TNR)3
Carrier Tape
Cover Tape
Tr ailer Tape 300mm mi ni mum or 38 empty pockets
Components
Leader Tape 500mm mi ni mum or 62 empty pockets
August 1999, Rev. C
Page 4
SuperSOTTM-8 Tape and Reel Data and Package Dimensions, continued
SSOT-8 Embossed Carrier Tape Configuration: Figur e 3.0
T
K0
Wc
B0
P0
D0
E1
F
W
E2
Tc
A0
P1
D1
User Direction of Feed
Dimensions are in millimeter
Pkg type
SSOT-8
(12mm)
Notes: A0, B0, and K0 dimensions are determined with r espect to t he EIA/Jedec RS-481
rotationa l and lateral movement requi rements (see sketches A, B, and C).
SSOT-8 Reel Configuration: Figur e 4.0
A0 B0 W D0 D1 E1 E2 F P1 P0 K0 T Wc Tc
4.47
5.00
12.0
1.55
1.50
1.75
10.25
+/-0.10
+/-0.10
20 deg maximum component rotation
Sketc h A (Side or Fro nt Sectional View)
Component Rotation
+/-0.3
+/-0.05
+/-0.10
+/-0.10
B0
5.50
min
+/-0.05
20 deg maximum
Typical component cavity center line
Typical component center line
A0
Sketc h B (Top View)
Component Rotation
W1 Measured at Hub
Dim A
Max
8.0 +/-0.1
4.0 +/-0.1
1.37
0.280 +/-0.150
9.5 +/-0.025
0.5mm maximum
+/-0.10
0.5mm maximum
Sketc h C (Top View )
Component lateral movement
0.06 +/-0.02
Dim A
max
13" Diameter Option
Tape Size
12mm 7" Dia
12mm 13" Dia
1998 Fairchild Semiconductor Corporation
Reel
Option
Dim A Dim B Dim C Dim D Dim N Dim W1 Dim W2 Dim W3 (LSL-USL)
7.00
177.8
13.00 330
0.059
1.5
0.059
1.5
Dim N
See detail AA
W3
W2 max Measured at Hub
Dimensions are in inches and millimeters
512 +0.020/ -0.008 13 +0.5/-0.2
512 +0.020/ -0.008 13 +0.5/-0.2
0.795
20.2
0.795
20.2
5.906 150
7.00 178
Dim D
min
0.488 +0.078/-0.000
12.4 +2/0
0.488 +0.078/-0.000
12.4 +2/0
Diameter Option
7"
DETAIL AA
0.724
18.4
0.724
18.4
See detail AA
B Min
Dim C
0.469 – 0.606
11.9 – 15.4
0.469 – 0.606
11.9 – 15.4
July 1999, Rev. C
Page 5
SuperSOTTM-8 Tape and Reel Data and Package Dimensions, continued
SuperSOT-8 (FS PKG Code 34, 35)
1 : 1
Scale 1:1 on letter size paper
Dimensio ns shown below are in:
inches [mil lime ters ]
Part Weight per unit (gram): 0.0416
September 1998, Rev. A
Page 6
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks.
ACEx™ CoolFET™ CROSSVOLT™
2
E
CMOS
TM
FACT™ FACT Quiet Series™
®
FAST FASTr™ GTO™ HiSeC™
ISOPLANAR™ MICROWIRE™ POP™ PowerTrench
QFET™ QS™
Quiet Series™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8
TinyLogic™ UHC™ VCX™
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICA TION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROV AL OF FAIRCHILD SEMICONDUCTOR CORPORA TION. As used herein:
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or
effectiveness.
PRODUCT STA TUS DEFINITIONS Definition of Terms
Datasheet Identification Product Status Definition
Advance Information
Preliminary
No Identification Needed
Obsolete
Formative or In Design
First Production
Full Production
Not In Production
This datasheet contains the design specifications for product development. Specifications may change in any manner without notice.
This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.
This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.
This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.
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