Datasheet FDPF320N06L Datasheet (Fairchild)

Page 1

FDPF320N06L

G
S
D
TO-220F
(Retractable)
G
E
C
N-Channel PowerTrench® MOSFET
60V, 21A, 25mΩ
FDPF320N06L N-Channel PowerTrench
December 2010
Features
•R
•R
• Low Gate Charge ( Typ. 23.2nC)
•Low C
• Fast Switching
• 100% Avalanche Tested
• Improved dv/dt Capability
•RoHS Compliant
= 20mΩ ( Typ.)@ VGS = 10V, ID = 21A
DS(on)
= 23mΩ ( Typ.)@ VGS = 5V, ID = 17A
DS(on)
( Typ. 64pF)
rss
Description
This N-Channel MOSFET is produced using Fairchild Semiconductor’s advance PowerTrench process that has been especially tailored to minimize the on-state resistance and yet maintain superior switching performance.
Application
• DC to DC converters / Synchronous Rectification
MOSFET Maximum Ratings T
Symbol Parameter FDPF320N06L Units
V
DSS
V
GSS
I
D
I
DM
E
AS
dv/dt Peak Diode Recovery dv/dt (Note 3) 6.0 V/ns P
D
, T
T
J
STG
T
L

*Drain current limited by maximum junction temperature

Drain to Source Voltage 60 V Gate to Source Voltage ±20 V
Drain Current Drain Current - Pulsed (Note 1) 84 A
Single Pulsed Avalanche Energy (Note 2) 66 mJ
Power Dissipation Operating and Storage Temperature Range -55 to +175
Maximum Lead Temperature for Soldering Purpose, 1/8” from Case for 5 Seconds
o
= 25
C unless otherwise noted*
- Continuous (T
- Continuous (T
(T
= 25oC) 26 W
C
- Derate above 25
= 25oC) 21
C
= 100oC) 15
C
o
C0.17W/
300
o
o
®
MOSFET
A
o
C
C C

Thermal Characteristics

Symbol Parameter
R
θJC
R
θJA
©2010 Fairchild Semiconductor Corporation FDPF320N06L Rev. A4
Thermal Resistance, Junction to Case 5.8 Thermal Resistance, Junction to Ambient 62.5
FDPF320N06L
www.fairchildsemi.com1
Units
o
C/W
Page 2

Package Marking and Ordering Information

Device Marking Device Package Reel Size Tape Width Quantity
FDPF320N06L FDPF320N06L TO-220F - - 50
FDPF320N06L N-Channel PowerTrench
Electrical Characteristics T
= 25oC unless otherwise noted
Symbol Parameter Test Conditions Min. Typ. Max. Units
Off Characteristics
BV ΔBV
ΔT I
DSS
I
GSS
DSS
DSS
J
Drain to Source Breakdown Voltage ID = 250μA, VGS = 0V 60 - - V Breakdown Voltage Temperature
Coefficient Zero Gate Voltage Drain Current Gate to Body Leakage Current VGS = ±20V, V
I
= 250μA, Referenced to 25oC - 0.04 - V/oC
D
V
= 48V, V
DS
= 48V, TC = 150oC - - 500
V
DS
= 0V - - 1
GS
= 0V - - ±100 μA
DS
On Characteristics
V
GS(th)
R
DS(on)
g
FS
Gate Threshold Voltage VGS = VDS, ID = 250μA1.0-2.5V
V
= 10V, ID = 21A - 20 25 mΩ
Static Drain to Source On Resistance Forward Transconductance
GS
= 5V, ID = 17A - 23 38 mΩ
V
GS
= 10V , ID = 21A (Note 4)
V
DS
-34-S
Dynamic Characteristics
C C C Q Q Q Q
iss oss rss
g(tot) g(tot) gs gd
Input Capacitance Output Capacitance - 115 150 pF Reverse Transfer Capacitance - 64 - pF
= 25V, VGS = 0V
V
DS
f = 1MHz
Total Gate Charge at 10V VGS = 10V Total Gate Charge at 5V VGS = 5V - 12.7 16.5 nC Gate to Source Gate Charge - 3.4 - nC
V I
D
= 48V
DS
= 21A
Gate to Drain “Miller” Charge - 6.3 - nC
- 1105 1470 pF
- 23.2 30.2 nC
μA
®
MOSFET
Switching Characteristics
t
d(on)
t
r
t
d(off)
t
f
Turn-On Delay Time Turn-On Rise Time - 34 78 ns Turn-Off Delay Time - 27 64 ns Turn-Off Fall Time - 8 26 ns
-1642ns
= 30V, ID = 21A
V
DD
V
= 5V, R
GS
(Note 4, 5)
GEN
= 4.7Ω
ESR Equivalent Series Resistance (G-S) - 2 - Ω
Drain-Source Diode Characteristics
I
S
I
SM
V
SD
t
rr
Q
rr
Notes:
1. Repetitive Rating: Pulse width limited by maximum junction temperature
2. L = 1mH, I 21A, di/dt 200A/μs, VDD BV
3. I
SD
4. Pulse Test: Pulse width 300μs, Dual Cycle 2%
5. Essentially Independent of Operating Temperature Typical Characteristics
Maximum Continuous Drain to Source Diode Forward Current - - 21 A Maximum Pulsed Drain to Source Diode Forward Current - - 84 A Drain to Source Diode Forward Voltage V Reverse Recovery Time Reverse Recovery Charge - 23 - nC
= 11.5A, RG = 25Ω, Starting TJ = 25°C
AS
, Starting TJ = 25°C
DSS
= 0V, I
GS
V
= 0V, I
GS
dI
/dt = 100A/μs (Note 4)
F
= 21A - - 1.3 V
SD
= 21A, VDD = 48V
SD
-27-ns
FDPF320N06L Rev. A4
2
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Page 3
Typical Performance Characteristics
0.1 1 4
2
10
100
200
*Notes:
1. 250
μs Pulse Test
2. T
C
= 25oC
I
D
, Drain Current[A]
VDS, Drain-Source Voltage[V]
V
GS
= 15.0V
10.0V
8.0V
5.0V
4.0V
3.5V
3.0V
12345
1
10
100
-55oC
175oC
*Notes:
1. V
DS
= 10V
2. 250
μs Pulse Test
25oC
I
D
, Drain Current[A]
VGS, Gate-Source Voltage[V]
0.0 0.5 1.0 1.5
1
10
100
*Notes:
1. VGS = 0V
2. 250
μs Pulse Test
175oC
I
S
, Reverse Drain Current [A]
VSD, Body Diode Forward Voltage [V]
25oC
0 20406080100
0.01
0.02
0.03
0.04
*Note: TC = 25oC
VGS = 20V
VGS = 10V
R
DS(ON)
[Ω],
Drain-Source On-Resistance
ID, Drain Current [A]
0.1 1 10 60
40
100
1000
4000
C
oss
C
iss
C
iss
= Cgs + Cgd (Cds = shorted)
C
oss
= Cds + C
gd
C
rss
= C
gd
*Note:
1. V
GS
= 0V
2. f = 1MH z
C
rss
Capacitances [pF]
VDS, Drain-Source Voltage [V]
0 4 8 12162024
0
2
4
6
8
10
*Note: ID = 21A
VDS = 12V V
DS
= 30V
V
DS
= 48V
V
GS
, Gate-Source Voltage [V]
Qg, Total Ga te Charge [nC ]
Figure 1. On-Region Characteristics Figure 2. Transfer Characteristics
FDPF320N06L N-Channel PowerTrench
Figure 3. On-Resistance Variation vs. Figure 4. Body Diode Forward Voltage
Drain Current and Gate Voltage Variation vs. Source Current
and Temperature
Figure 5. Capacitance Characteristics Figure 6. Gate Charge Characteristics
®
MOSFET
FDPF320N06L Rev. A4
3
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Page 4
Typical Performance Characteristics (Continued)
-100 -50 0 50 100 150 200
0.8
0.9
1.0
1.1
1.2
*Notes:
1. V
GS
= 0V
2. I
D
= 250μA
BV
DSS
, [Normalized]
Drain-Source Breakdown Voltage
TJ, Junction Temperature [oC]
-100 -50 0 50 100 150 200
0.0
0.5
1.0
1.5
2.0
2.5
3.0
*Notes:
1. V
GS
= 10V
2. I
D
= 21A
R
DS(on)
, [Normalized]
Drain-Source On-Resistance
TJ, Junction Temperature [oC]
0.1 1 10 100
0.01
0.1
1
10
100
300
100ms
100μs
1ms
10ms
I
D
, Drain Current [A]
VDS, Drain-Source Voltage [V]
Operation in This Area is Limited by R
DS(on)
*Notes:
1. T
C
= 25oC
2. T
J
= 175oC
3. Single Pulse
DC
25 50 75 100 125 150 175
0
6
12
18
24
V
GS
= 5 V
R
θJC
= 5.8 oC/W
V
GS
= 10 V
I
D
, Drain Current [A]
T
C
, Case Temperature [
o
C]
10
-5
10
-4
10
-3
10
-2
10
-1
110
100
0.01
0.1
1
8
0.01
0.1
0.2
0.05
0.02
*Notes:
1. Z
θJC
(t) = 5.8oC/W Max.
2. Dut y Facto r , D= t
1/t2
3. TJM - TC = PDM * Z
θJC
(t)
0.5
Single pulse
Thermal Response [Z
θJC
]
Rectangular Pulse Duration [sec]
t
1
P
DM
t
2
Figure 7. Breakdown Voltage Variation Figure 8. On-Resistance Variation vs. Temperature vs. Temperature
Figure 9. Maximum Safe Operating Area Figure 10. Maximum Drain Current vs. Case Temperature
FDPF320N06L N-Channel PowerTrench
®
MOSFET
Figure 11. Transient Thermal Response Curve
FDPF320N06L Rev. A4
4
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Page 5
Gate Charge Test Circuit & Waveform
Resistive Switching Test Circuit & Waveforms
Unclamped Inductive Switching Test Circuit & Waveforms
FDPF320N06L N-Channel PowerTrench
®
MOSFET
FDPF320N06L Rev. A4
5
www.fairchildsemi.com
Page 6
DUT
V
DS
+
_
Driver
R
G
Same Type
as DUT
V
GS
• dv/dt controlled by R
G
•ISDcontrolled by pulse period
V
DD
L
I
SD
10V
V
GS
( Driver )
I
SD
( DUT )
V
DS
( DUT )
V
DD
Body Diode
Forward Voltage Drop
V
SD
IFM, Body Diode Forward Current
Body Diode Reverse Current
I
RM
Body Diode Recoverydv/dt
di/dt
D =
Gate Pulse Width Gate Pulse Period
--------------------------
DUT
V
DS
+
_
Driver
R
G
Same Type
as DUT
V
GS
• dv/dt controlled by R
G
•ISDcontrolled by pulse period
V
DD
LL
I
SD
10V
V
GS
( Driver )
I
SD
( DUT )
V
DS
( DUT )
V
DD
Body Diode
Forward Voltage Drop
V
SD
IFM, Body Diode Forward Current
Body Diode Reverse Current
I
RM
Body Diode Recoverydv/dt
di/dt
D =
Gate Pulse Width Gate Pulse Period
--------------------------
D =
Gate Pulse Width Gate Pulse Period
--------------------------
FDPF320N06L N-Channel PowerTrench
Peak Diode Recovery dv/dt Test Circuit & Waveforms
®
MOSFET
FDPF320N06L Rev. A4
6
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Page 7
Package Dimensions
FDPF320N06L N-Channel PowerTrench
TO-220F
®
MOSFET
FDPF320N06L Rev. A4
* Front/Back Side Isolation Voltage : AC 2500V
Dimensions in Millimeters
7
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Page 8
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®
The following includes registered and unregistered trademarks and service mar ks, owned by Fairchild Semiconductor and/or its gl obal subsidiaries, and is not intended to be an exhaustive list of all such trademarks.
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®
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F-PFS™
®
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max
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®
®
®
PDP SPM™ Power-SPM™
PowerTrench PowerXS™
SM
Programmable Active Droop™ QFET QS™ Quiet Series™ RapidConfigure™
Saving our world, 1mW/W/kW at a time™ SignalWise™ SmartMax™ SMART START™ SPM STEALTH™ SuperFET SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SupreMOS SyncFET™ Sync-Lock™ ®*
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TinyCalc™
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*Trademarks of System General Corporation, used under license by Fairchild Semiconductor.
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FDPF320N06L N-Channel PowerTrench
®
MOSFET
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used here in:
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably
2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
expected to result in a significant injury of the user.
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Fairchild Semiconductor Corporation’s Anti-Counterfeiting Policy. Fairchild’s Anti-Counterfeiting Policy is also stated on our external website, www.Fairchildsemi.com, under Sales Support Counterfeiting of semiconductor parts is a growing problem in the industry. All manufactures of semiconductor products are exper iencing counterfeiting of their parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand repu tation, su bsta ndard perfo rmance, failed application, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to pro tect ourselves and our customers from the
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PRODUCT STATUS DEFINITIONS Definition of Terms
.
Datasheet Identification Product Status Definition
Advance Information Formative / In Design
Preliminary First Production
No Identification Needed Full Production
Obsolete Not In Production
FDPF320N06L Rev. A4
Datasheet contains the design specifications for product development. Specifications may change in any manner without notice.
Datasheet contains preliminary data; supplement ary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design.
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve the design.
Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor. The datasheet is for reference information only .
Rev. I51
8
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