*Drain current limited by maximum junction temperature
= 0.46Ω ( Typ.) @ VGS = 10V, ID = 3.4A
DS(on)
TO-220AB
FCP Series
STG
S
G D
Drain to Source Voltage600V
Gate to Source Voltage±30V
Drain Current
Drain Current- Pulsed (Note 1)20.4 20.4 A
Single Pulsed Avalanche Energy (Note 2)79.4mJ
Avalanche Current 6.8A
Repetitive Avalanche Energy 0.6mJ
MOSFET dv/dt Ruggedness100V/ns
Peak Diode Recovery dv/dt (Note 3)4.9V/ns
Power Dissipation
Operating and Storage Temperature Range-55 to +150
Maximum Lead Temperature for Soldering Purpose,
1/8” from Case for 5 Seconds
G S D
o
= 25
C unless otherwise noted
C
-Continuous (T
-Continuous (T
(T
= 25oC)64.130.5W
C
- Derate above 25
Description
The SupreMOS MOSFET , Fairchild’s next generation of high
voltage super-junction MOSFETs, employs a deep trench filling
process that differentiates it from preceding multi-epi based
technologies. By utilizing this advanced technology and precise
process control, SupreMOS provides world class Rsp, superior
switching performance and ruggedness.
This SupreMOS MOSFET fits the industry’s AC-DC SMPS
requirements for PFC, server/telecom power, FPD TV power, A TX
power, and industrial power applications.
D
TO-220F
FCPF Series
= 25oC)6.86.8*
C
= 100oC)4.34.3*
C
o
C0.510.24W/oC
G
S
300
Thermal Characteristics
SymbolParameterFCP7N60N FCPF7N60NTUnits
R
θJC
θCS
R
θJA
Thermal Resistance, Junction to Case 1.954.1
Thermal Resistance, Case to Heak Sink ( Typical) 0.50.5
Thermal Resistance, Junction to Ambient 62.562.5
4. Essentially Independent of Operating Temperature Typical Characteristics
Maximum Continuous Drain to Source Diode Forward Current--6.8A
Maximum Pulsed Drain to Source Diode Forward Current--20.4A
Drain to Source Diode Forward VoltageV
Reverse Recovery Time
Reverse Recovery Charge-1.8-µC
= 380V, ID = 3.4A
V
DD
R
= 4.7Ω
G
(Note 4)
= 0V, I
GS
V
= 0V, I
GS
dI
/dt = 100A/µs
F
=3.4A- -1.2V
SD
= 3.4A
SD
-1224ns
-211-ns
FCP7N60N / FCPF7N60NT Rev. A
2
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Page 3
Typical Performance Characteristics
Figure 1. On-Region CharacteristicsFigure 2. Transfer Characteristics
30
10
V
= 15.0 V
GS
10.0 V
6.0 V
4.5 V
4.0 V
60
10
150oC
FCP7N60N / FCPF7N60NT N-Channel MOSFET
, Drain Current[A]
D
I
1
0.5
0.111030
*Notes:
1. 250
2. T
µs Pulse Test
= 25oC
C
VDS, Drain-Source Voltage[V]
, Drain Current[A]
D
1
I
0.2
2468
VGS, Gate-Source Voltage[V]
25oC
-55oC
*Notes:
1. V
2. 250
= 20V
DS
µs Pulse Test
Figure 3. On-Resistance Variation vs. Figure 4. Body Diode Forward Voltage
Drain Current and Gate Voltage Variation vs. Source Current
Figure 7. Breakdown Voltage Variation Figure 8. On-Resistance Variation
vs. Temperature vs. Temperature
1.2
1.1
3.0
2.5
2.0
FCP7N60N / FCPF7N60NT N-Channel MOSFET
1.0
, [Normalized]
DSS
BV
0.9
Drain-Source Breakdown Voltage
0.8
-80-4004080120160
TJ, Junction Temperature [oC]
*Notes:
1. V
2. I
D
= 0V
GS
= 1mA
1.5
, [Normalized]
1.0
DS(on)
R
Drain-Source On-Resistance
0.5
0.0
-80-4004080120160
TJ, Junction Temperature [oC]
*Notes:
1. V
2. I
GS
= 3.4A
D
= 10V
Figure 9. Maximum Safe Operating Area Figure 10. Maximum Safe Operating Area
_ FCP7N60N
100
10
1
, Drain Current [A]
D
I
0.1
0.01
Operation in This Area
is Limited by R
DS(on)
*Notes:
1. T
C
2. T
J
3. Single Pulse
0.11101001000
VDS, Drain-Source Voltage [V]
10ms
DC
= 25oC
= 150oC
100µs
1ms
20µs
_ FCPF7N60NT
100
10
1
, Drain Current [A]
D
I
0.1
0.01
Operation in This Area
is Limited by R
0.11101001000
VDS, Drain-Source Voltage [V]
10ms
DC
DS(on)
*Notes:
= 25oC
1. T
C
2. T
= 150oC
J
3. Single Pulse
20µs
100µs
1ms
Figure 11. Maximum Drain Currentvs. Case Temperature
8
6
4
, Drain Current [A]
D
I
2
0
255075100125150
TC, Case Temperatu re [oC]
FCP7N60N / FCPF7N60NT Rev. A
4
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Page 5
Typical Performance Characteristics (Continued)
Figure 12. Transient Thermal Response Curve
3
]
0.5
1
θJC
0.2
Thermal Response [Z
0.1
0.01
0.1
0.05
0.02
0.01
Single pulse
-5
10
-4
10
-3
10
Rectangular Pulse Duration [sec]
P
DM
P
DM
*Notes:
1. Z
θJC
2. Duty Factor, D= t
3. TJM - TC = PDM * Z
10
_ FCP7N60N
t
1
t
2
t
1
t
2
(t) = 1.95oC/W Max.
1/t2
θJC
-2
FCP7N60N / FCPF7N60NT N-Channel MOSFET
(t)
-1
10
Figure 13. Transient Thermal Response Curve
5
0.5
]
θJC
1
0.2
Thermal Response [Z
0.1
0.01
0.1
0.05
0.02
0.01
Single pulse
-5
10
-4
10
-3
10
Rectangular Pulse Duration [sec]
-2
10
-1
10
P
DM
*Notes:
1. Z
θJC
2. Duty Factor, D= t
3. TJM - TC = PDM * Z
110
_ FCPF7N60NT
t
1
t
2
(t) = 4.1oC/W Max.
1/t2
θJC
(t)
100
FCP7N60N / FCPF7N60NT Rev. A
5
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Page 6
Gate Charge Test Circuit & Waveform
Resistive Switching Test Circuit & Waveforms
FCP7N60N / FCPF7N60NT N-Channel MOSFET
FCP7N60N / FCPF7N60NT Rev. A
Unclamped Inductive Switching Test Circuit & Waveforms
6
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Page 7
Peak Diode Recovery dv/dt Test Circuit & Waveforms
g
g
+
+
V
V
DS
DS
_
_
L
LL
Same Type
Same Type
as DUT
as DUT
• dv/dt controlled by R
• dv/dt controlled by R
•ISDcontrolled by pulse period
•ISDcontrolled by pulse period
G
G
V
V
GS
GS
R
R
G
G
DUT
DUT
I
I
SD
SD
Driver
Driver
V
V
DD
DD
FCP7N60N / FCPF7N60NT N-Channel MOSFET
V
V
GS
GS
( D riv er )
( D riv er )
I
I
SD
SD
( DUT )
( DUT )
V
V
DS
DS
( DUT )
( DUT )
G ate Pulse W idth
G ate Pulse W idth
G ate Pulse W idth
--------------------------
--------------------------
--------------------------
D =
D =
D =
G ate Pulse Period
G ate Pulse Period
G ate Pulse Period
IFM, Body Diode Forw ard Current
IFM, Body Diode Forw ard Current
I
I
RM
RM
Body Diode Reverse Current
Body Diode Reverse Current
Body Diode Recovery dv/dt
Body Diode Recovery dv/dt
V
V
SD
SD
Body Diode
Body Diode
Forw ard Volta
Forw ard Volta
e Drop
e Drop
di/dt
di/dt
10V
10V
V
V
DD
DD
FCP7N60N / FCPF7N60NT Rev. A
7
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Page 8
Mechanical Dimensions
FCP7N60N / FCPF7N60NT N-Channel MOSFET
TO-220AB
FCP7N60N / FCPF7N60NT Rev. A
Dimensions in Millimeters
8
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Page 9
Mechanical Dimensions
FCP7N60N / FCPF7N60NT N-Channel MOSFET
TO-220F
FCP7N60N / FCPF7N60NT Rev. A
Dimensions in Millimeters
9
www.fairchildsemi.com
Page 10
TRADEMARKS
®
tm
tm
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor an d/or its global subsidiaries, and is not
intended to be an exhaustive list of all such trademarks.
AccuPower™
Auto-SPM™
Build it Now™
CorePLUS™
CorePOWER™
CROSSVOLT™
CTL™
Current Transfer Logic™
EcoSPARK
EfficentMax™
EZSWITCH™*
*Trademarks of System General Corporation, used under license by Fairchild Semiconductor.
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY
PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY
THEREIN, WHICH COVERS THESE PRODUCTS.
FCP7N60N / FCPF7N60NT N-Channel MOSFET
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE
EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems which, (a) are
intended for surgical implant into the body or (b) support or sustain life,
and (c) whose failure to perform when properly used in accordance with
instructions for use provided in the labeling, can be reasonably
2. A critical component in any component of a life support, device, or
system whose failure to perform can be reasonably expected to cause
the failure of the life support device or system, or to affect its safety or
effectiveness.
expected to result in a significant injury of the user.
ANTI-COUNTERFEITING POLICY
Fairchild Semiconductor Corporation’s Anti-Counterfeiting Policy. Fairchild’s Anti-Counterfeiting Policy is also stated on our external website,
www.Fairchildsemi.com, under Sales Support
Counterfeiting of semiconductor parts is a growing problem in the industry. All manu factures of semiconductor products are experie ncing counterfeiting of their
parts. Customers who inadvertently purchase counterfeit parts experience ma ny problems such as lo ss of bran d reput ation, sub standard perf ormance, failed
application, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the
proliferation of counterfeit parts. Fairchild st rongly encourag es custome rs to purchase Fairchild parts either dir ectly from Fairchild or fr om Authorized Fairchild
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.
committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct o r from authorized distri butors.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet IdentificationProduct StatusDefinition
Advance InformationFormative / In Design
PreliminaryFirst Production
No Identification NeededFull Production
ObsoleteNot In Production
Datasheet contains the design specifications for product development. Specifications
may change in any manner without notice.
Datasheet contains preliminary data; supplementary data will be published at a later
date. Fairchild Semiconductor reserves the right to make changes at any time without
notice to improve design.
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to
make changes at any time without notice to improve the design.
Datasheet contains specifications on a product that is discontinued by Fairchild
Semiconductor. The datasheet is for reference information only.