Dimensions / weight15.0 x 20.0 x 16.8 mm / approx. 13g
*
: Minimum switching loads mentioned above are reference values. Please perform the conrmation test with actual load before production
since reference values may vary according to switching frequencies, environmental conditions and expected reliability levels.
**
: Maximum switching loads mentioned above are reference values. Please refer to operation range graph for continuous current.
Note: Values of electrical characteristics are under 15 to 35 degC, 25 to 75%RH (JIS standard condition) unless otherwise specied.
Note: Care shall be taken on the heat generated on PC board when maximum carrying current exceeds 10A.
Please perform the conrmation test with actual conditions
2
Page 3
FBR59-HW Series
■ Coil Data
Coil
code
D0991705.4 (at 20ºC)
D10102206.3 (at 20ºC)
D12123207.3 (at 20ºC)
Note: All values in the table are valid at 20oC and zero contact current, unless otherwise specied.
*
: Specied operated values are valid for pulse wave voltage.
Note: Please use at rated coil voltage. Please refer to characteristic data and set up adequate voltage in case of use at over voltage.
■ Dimensions
• Dimensions
Rated Coil Voltage
(VDC)
Coil Resistance +/-10%
(Ω)
Must Operate Voltage*
(VDC)
7.7 (at 125ºC)
9 (at 125ºC)
10.4 (at 125ºC)
Must Release Voltage*
(VDC)
0.7 (at 20ºC)
1.0 (at 125ºC)
0.8 (at 20ºC)
1.2 (at 125ºC)
1.0 (at 20ºC)
1.5 (at 125ºC)
• Schematics
(BOTTOM VIEW)
124
20.0
+0.3
15.0
+0.3
15.0
+0.3
0.5
12.5
0.5
+0.3
+0.3
16.8
15.9
2.52.5
3
4.35
20.0
1.5
+0.3
+0.5
20.4
(3.6)
9.65
3
578
3
Page 4
• PC Board Mouting Hole Layout
(BOTTOM VIEW)
FBR59-HW Series
(3) 4.359.65
2 -2.8×0.85
12.5
+0.1
0
B
A
2 -1.8×0.85
* Dimensions of the terminals do not include thickness of pre-solder.
* Tolerance of PC board mounting hole layout : ±0.1 unless otherwise specified.
( ): Reference value
Unit: mm
■ Characteristic Data (Reference)
Distribution of operate/release voltage
+0.1
0
(R)
2 -2.8×0.85
+0.1
0
A
B
2.8
(R)
0.85
1.8
Distribution of contact resistance
0.85
+0.1
0
+0.1
0
Distribution of operate/release time
100
80
60
40
Distribution (%)
20
0
0
1 2 3 4 5 6 7 8 9 10 11 12
Operate/release voltage (VDC)Contact resistance (mΩ)Time (ms)
FBR59ND12-Y-HW
n=50
20
℃
Release voltage
Operate voltage
100
80
60
40
Distribution (%)
20
0
0
5 10 15 20 25 30 35 40 45 50
FBR59ND12-Y-HW
n=50
20
℃
100
FBR59ND12-Y-HW
n=50
80
20
60
40
Distribution (%)
20
0
0
123 456 78 9 10
℃
Release time
Operate time
4
Page 5
FBR59-HW Series
0
0
20
40
60
80
100
123456789101112
Operate voltage
Release voltage
FBR59ND12-Y-HWn=5020
℃
Distribution of operate/release voltage
0
0
20
40
60
80
100
5101520253035404550
Distribution of contact resistance
0
0
20
40
60
80
100
12345678910
Distribution of operate/release time
Coil temperature rise
FBR59ND12-Y-HWn=5020
℃
FBR59ND12-Y-HWn=5020
℃
Operate time
Release time
Operate/release voltage (VDC)Contact resistance (mΩ)Time (ms)
Distribution (%)
Distribution (%)
Distribution (%)
Coil temperature rise (
Coil temperature rise (
17
16
15
14
13
12
11
10
9
8
7
6
Applied voltage (V)
5
4
3
2
1
0
-4020 40 60 80 100 120 140-20 0
60A continuous current
45A continuous current
Applicable
voltage range
Operate voltage (cool coil)
Max. coil temperature +180
Ambient temperature (℃)
7.3V max. at 20
℃
Coil temperature rise
(ambient temperature 25℃)
1000
)
℃
100
10
Applied current 60A
FBR59ND12-Y-HW
45A
30A
15A
0A
℃
Contact current capacityOperating range
10000
1000
100
Applied time (sec.)
10
1
1101000
AWG10 x 2
(connect a wire on each terminal)
25
85
125
Current (A)
Coil temperature rise
(ambient temperature 85℃)
1000
)
℃
100
10
Applied current 60A
FBR59ND12-Y-HW
℃
℃
℃
FBR59ND12-Y-HW
45A
30A
15A
0A
25
℃
(ambient temperature 25℃)
50
)
℃
25
Coil temperature rise (
0
0
51015202530
Applied time (min.)
FBR59ND12-Y-HW
Applied voltage 16V
12V
8V
1
0.1110
1
0.1110
Coil power (W)Coil power (W)
5
Page 6
Shock resistance characteristics
FBR59-HW Series
1000
Applied shock 980m/s
800
)
2
600
400
Shock level (m/s
200
Specification 98m/s
0
X1
X2
Vibration resistance characteristics
100
Acceleration (m/s
10
2
)
2
2
Y1
Shock direction
1 0.51.50.10.01
Z1
Z2
Double amplitude (mm)
No chattering in
10~1000Hz
2
100m/s
area
Shock application time: 6±1ms half-sine wave
Test conditions: Coil energized(12VDC) and de-energized
Shock direction: see diagram below
Detection level: chatter >1ms
Y1Y2Y2
X2
X1
Z1
Z2
Make contact (coil de-energized)
Make contact (coil energized)
Frequency : 10 to 1000Hz
Test conditions: Coil energized(12VDC) and de-energized
Shock direction: see diagram below
Detection level: chatter >1ms
Y
X
Z
Specification
10~55Hz
Sweep frequency
1000Hz Max.
1
10100100010000
Frequency(Hz)
6
Page 7
FBR59-HW Series
GENERAL INFORMATION
1. ROHS Compliance
• All relays produced by Fujitsu Components are compliant with RoHS directive 2011/65/EU including amend-
ments.
• Use of Cadmium in electrical contacts is exempted as per Annex III of the RoHS directive 2001/65/EU.
Please consider expiry date of exemption. Relays with Cadmium containing contacts are not to be used for
new designs.
• All relays are lead-free. Please refer to Lead-Free Status Info for older date codes at:
• Characteristic data is not guaranteed values, but measured values of samples from production line.
2. Recommended lead free solder condition
• Lead free solder plating on relay terminals is Sn-3.0Ag-0.5Cu, unless otherwise specied. This material has
been veried to be compatible with PbSn assembly process.
• Recommended solder for assembly: Sn-3.0Ag-0.5Cu.
Flow Solder Condition:
Pre-heating: maximum 120˚C
within 90 sec.
Soldering: dip within 5 sec. at
255˚C ± 5˚C solder bath
Relay must be cooled by air immediately
after soldering
Re-Flow Solder Condition:
Solder by Soldering Iron:
Soldering Iron 30-60W
Temperature: maximum 340-360˚C
Duration: maximum 3 sec.
Applicable for FBR59NDxx-Y-HW-RW only
We highly recommend that you conrm your actual solder conditions
Important notes for reow soldering:
• Temperature shall be measured at PC board upper surface
• Temperature at PC board upper surface may be changed depending on size
of PC board, components mounted on the PC board and/ or heating method
Please perform the conrmation test with your actual PC boards
• This reow solder condition is applicable only for reow-capable relays. Do not reow
reow-incapable relays
• Recommended solder for assembly: Sn-3.0 Ag-0.5 Cu.
3. Moisture Sensitivity
• Moisture Sensitivity Level standard is not applicable to electromechanical relays, unless otherwise indicat-
ed. -RW THR relay will be shipped in moisture barrier bag.
4. Tin Whiskers
• Dipped SnAgCu solder is known as presenting a low risk to tin whisker development. No considerable
length whisker was found by our in house test.
7
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FBR59-HW Series
Fujitsu Components International Headquarter Ofces
FUJITSU COMPONENTS AMERICA, INC
2290 North First Street, Suite 212
San Jose, CA 95131, USA
Tel: (1-408) 745-4900
Fax: (1-408) 745-4970
Email: components@us.fujitsu.com
Web: us.fujitsu.com/components
FUJITSU ELECTRONIC COMPONENTS (SHANGHAI) CO., LTD.
Unit 4306, InterContinental Center
100 Yu Tong Road, Shanghai 200070,
China
Tel: (86-21) 3253 0998
Fax: (86-21) 3253 0997
Email: fcal@sg.fujitsu.com
Web: www.fujitsu.com/sg/products/devices/components
Hong Kong
FUJITSU COMPONENTS HONG KONG CO., LTD
Unit 506, Inter-Continental Plaza
No.94 Granville Road, Tsim Sha Tsui, Kowloon,
Hong Kong
Tel: (852) 2881-8495
Tex: (852) 2894-9512
Email: fcal@sg.fujitsu.com
Web: www.fujitsu.com/sg/products/devices/components/
The contents, data and information in this datasheet are provided by Fujitsu Component Ltd. as a service only to its user and only for general
information purposes.
The use of the contents, data and information provided in this datasheet is at the users’ own risk.
Fujitsu has assembled this datasheet with care and will endeavor to keep the contents, data and information correct, accurate, comprehensive,
complete and up to date.
Fujitsu Components Europe B.V. and afliated companies do however not accept any responsibility or liability on their behalf, nor on behalf of its
employees, for any loss or damage, direct, indirect or consequential, with respect to this datasheet, its contents, data, and information and related
graphics and the correctness, reliability, accuracy, comprehensiveness, usefulness, availability and completeness thereof.
Nor do Fujitsu Components Europe B.V. and afliated companies accept on their behalf, nor on behalf of its employees, any responsibility or liability
for any representation or warrant of any kind, express or implied, including warranties of any kind for merchantability or tness for particular use,
with respect to these datasheets, its contents, data, information and related graphics and the correctness, reliability, accuracy, comprehensiveness,
usefulness, availability and completeness thereof. Rev. August 14th, 2017
8
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