Datasheet FBL2041BB Datasheet (Philips)

Page 1
INTEGRATED CIRCUITS
FBL2041 FBL2041I
3.3V BTL 7-bit Futurebus+ transceiver (standard A-port)
Product specification Supersedes data of 1998 Feb 13 IC23 Data Handbook
 
1998 May 11
Page 2
Philips Semiconductors Product specification
ns
ns
ICCSu ly Current
mA
3.3V BTL 7-bit Futurebus+ transceiver (standard A-port)

FEA TURES

• 7-bit BTL transceiver
• Separate I/O on TTL A-port
• Inverting
• Three separate pairs of driver enables in a 1 bit, 3 bit, 3 bit
arrangement
• Drives heavily loaded backplanes with equivalent load
impedances down to 10Ω.
• High drive 100mA BTL open collector drivers on B-port
• Allows incident wave switching in heavily loaded backplane buses
• Reduced BTL voltage swing produces less noise and reduces
power consumption
• Built-in precision band-gap reference provides accurate receiver
thresholds and improved noise immunity
• Compatible with IEEE Futurebus+ or proprietary BTL backplanes
• Controlled output ramp and multiple GND pins minimize ground
bounce
• Each BTL driver has a dedicated Bus GND for a signal return
• Glitch-free power up/power down operation
• Low I
current
CC
• Tight output skew
• Supports live insertion
• Pins for the optional JTAG boundary scan function are provided
• High density packaging in plastic Quad Flatpack
• 5V compatible I/O on A-port
• Industrial temperature range option available as FBL2041I

DESCRIPTION

The FBL2041/FBL2041I is a 7-bit bidirectional BTL transceiver and is intended to provide the electrical interface to a high performance wired-OR bus. The FBL2041 is an inverting transceiver.
The B-port drivers are Low-capacitance open collectors with controlled ramp and are designed to sink 100mA. Precision band gap references on the B-port insure very good noise margins by limiting the switching threshold to a narrow region centered at 1.55V .
The FBL2041/FBL2041I is pin and function compatible with FB2041 but operates at a 3.3V supply voltage, greatly reducing power consumption.
The B-port interfaces to “Backplane Transceiver Logic” (See the IEEE 1194.1 BTL standard). BTL features low power consumption by reducing voltage swing (1Vp-p, between 1V and 2V) and reduced capacitive loading by placing an internal series diode on the drivers. BTL also provides incident wave switching, a necessity for high performance backplanes.
There are three separate pairs of driver enables in a 1 bit, 3 bit, 3 bit arrangement. The TTL/BTL output drivers for bit 0 are enabled with OEA1/OEB1 OEA2/OEB2 OEA3/OEB3
The A-port operates at TTL levels with separate I/O. The 3-state A-port drivers are enabled when OEAn goes High after an extra 6ns delay which is built in to provide a break-before-make function. When OEAn goes Low, A-port drivers become High impedance without any extra delay. During power on/of f cycles, the A-port drivers are held in a High impedance state when V
The B-port has an output enable, OEB0, which affects all seven drivers. When OEB0 is High and OEBn be enabled. When OEB0 is Low or if OEBn drivers will be inactive and at the level of the backplane signal.
To support live insertion, OEB0 is held Low during power on/off cycles to insure glitch free B port drivers. Proper bias for B port drivers during live insertion is provided by the BIAS V pin when at a
3.3V level while V BIAS V pin should be tied to a V
The LOGIC GND and BUS GND pins are isolated in the package to minimize noise coupling between the BTL and TTL sides. These pins should be tied to a common ground external to the package.
Each BTL driver has an associated BUS GND pin that acts as a signal return path and these BUS GND pins are internally isolated from each other. In the event of a ground return fault, a “hard” signal failure occurs instead of a pattern dependent error that may be very infrequent and impossible to trouble-shoot.
JTAG boundary scan functionality is provided as an option with signals TMS, TCK, TDI and TDO. When this option is not present, TMS and TCK are no-connects (no bond wires) and TDI and TDO are shorted together internally.
, output drivers for bits 1–2–3 are enabled with and output drivers for bits 4–5–6 are enabled with .
is Low. If live insertion is not a requirement, the
CC
FBL2041
FBL2041I
CC
is Low the output driver will
is High, the B-port
pin.
CC
is below 1.3V.

QUICK REFERENCE DATA

SYMBOL PARAMETER TYPICAL UNIT
t
PLH
t
PHL
t
PLH
t
PHL
C
I
OB
OL
pp
Propagation delay 4.2
AIn to Bn 3.5
Propagation delay 4.8
Bn to AOn 4.9
Output capacitance (B0 - B6 only) 6 pF
Output current (B0 - B6 only) 100 mA
Standby 5.2
AIn to Bn (outputs Low or High) 3.2
Bn to AOn (outputs Low) 13.5
Bn to AOn (outputs High) 10.7

ORDERING INFORMATION

PACKAGE
52-pin Plastic Quad Flatpack FBL2041 BB FBL2041I BB SOT379-1
1998 May 11 853-2040 19355
COMMERCIAL RANGE
VCC = 3.3V±10%; T
= 0 to +70°C
amb
VCC = 3.3V±10%; T
2
INDUSTRIAL RANGE
= –40 to +85°C
amb
DWG
No.
Page 3
Philips Semiconductors Product specification
3.3V BTL 7-bit Futurebus+ transceiver (standard A-port)

PIN CONFIGURATION

CC
V
OEB1
TCK (option)
CC
V
TDI (option)
TDO (option)
TMS (option)
BUS GND
OEB2
OEA3
LOGIC GND
AI2
AO2
LOGIC GND
AO3
LOGIC GND
AI4
AO4
LOGIC GND
AO5
LOGIC GND
AI1
AI3
CC
V
AI0
AO1
52 51 50 49 48 47 46 45 44 43 42 41 40
1 2 3 4 5 6 7
8
9 10 11 12 13
14 15 16 17 18 19 20 21 22 23 24 25 26
AI5
LOGIC GND
BIAS V
AO0
OEA1
OEB0
7-Bit Transceiver
52-lead PQFP
CC
AI6
AO6
BG V
OEA2
BG GND
B0
39 38 37 36 35 34 33
32 31 30 29 28 27
OEB3
FBL2041
FBL2041I
BUS GND B1 BUS GND B2 BUS GND B3 BUS GND B4 BUS GND
B5 BUS GND B6 N/C
SG00084

PIN DESCRIPTION

SYMBOL PIN NUMBER TYPE NAME AND FUNCTION
AI0 – AI6 51, 2, 3, 8, 9, 14, 18 Input Data inputs (TTL)
AO0 – AO6 50, 52, 4, 6, 10, 12, 16 Output 3-State outputs (TTL)
B0 – B6 40, 38, 36, 34, 32, 30, 28 I/O Data inputs/Open Collector outputs, High current drive (BTL)
OEB0 46 Input Enables the Bn outputs when High OEB1 45 Input Enables the B0 output when Low OEB2 25 Input Enables the B1 – B3 outputs when Low OEB3 26 Input Enables the B4 – B6 outputs when Low OEA1 47 Input Enables the A0 outputs when High OEA2 20 Input Enables the A1 – A3 outputs when High OEA3 24 Input Enables the A4 – A6 outputs when High
BUS GND 41, 39, 37, 35, 33, 31, 29 GND Bus ground (0V)
LOGIC GND 1, 5, 7, 11, 13, 15 GND Logic ground (0V)
LOGIC/bus V
BG V
CC
CC
BIAS V 48 Power Positive supply voltage
TMS 42 Input Test Mode Select (no-connect) TCK 44 Input Test Clock (no-connect)
TDI 22 Input Test Data In (shorted to TDO)
TDO 21 Output Test Data Out (TDI)
BG GND 19 GND BAND GAP GROUND (0V)
23, 43, 49 Power Positive supply voltage
17 Power Positive supply voltage BAND GAP
1998 May 11
3
Page 4
Philips Semiconductors Product specification
MODE
3.3V BTL 7-bit Futurebus+ transceiver (standard A-port)
FBL2041
FBL2041I

FUNCTION TABLE

INPUTS OUTPUTS
AIn Bn* OEB0 OEB1 OEB2 OEB3 OEA1 OEA2 OEA3 AOn Bn*
L — H L L L L L L Z H**
AIn to Bn H — H L L L L L L Z L
L — H L L L H H H L H**
H — H L L L H H H H L
L — H L X X L L L Z H**
AI0 to B0 H — H L X X L L L Z L
L — H L X X H H H L H**
H — H L X X H H H H L
L — H X L X L L L Z H**
AI1 – AI3 to B1 – B3 H — H X L X L L L Z L
L — H X L X H H H L H**
H — H X L X H H H H L
L — H X X L L L L Z H**
AI4 – AI6 to B4 – B6 H — H X X L L L L Z L
L — H X X L H H H L H**
H — H X X L H H H H L
Disable Bn outputs X X L X X X X X X X H**
X X X H H H X X X X H** Disable B0 outputs X X H H X X X X X X H** Disable B1 – B3 outputs X X H X H X X X X X H** Disable B4 – B6 outputs X X H X X H X X X X H**
X L L X X X H H H H Input Bn to AOn X H L X X X H H H L Input
X L X H H H H H H H Input
X H X H H H H H H L Input
X L L X X X H X X H Input B0 to AO0 X H L X X X H X X L Input
X L X H H H H X X H Input
X H X H H H H X X L Input
X L L X X X X H X H Input B1 – B3 to AO1 – AO3 X H L X X X X H X L Input
X L X H H H X H X H Input
X H X H H H X H X L Input
X L L X X X X X H H Input B4 – B6 to AO4 – AO6 X H L X X X X X H L Input
X L X H H H X X H H Input
X H X H H H X X H L Input Disable AOn outputs X X X X X X L L L Z X Disable AO0 outputs X X X X X X L X X Z X Disable AO1 – AO3 outputs X X X X X X X L X Z X Disable AO4 – AO6 outputs X X X X X X X X L Z X
NOTES:
H = High voltage level L = Low voltage level X = Don’t care Z = High-impedance (OFF) state — = Input not externally driven H** = Goes to level of pull-up voltage B* = Precaution should be taken to ensure B inputs do not float. If they do, they are equal to Low state.
1998 May 11
4
Page 5
Philips Semiconductors Product specification
3.3V BTL 7-bit Futurebus+ transceiver (standard A-port)

LOGIC DIAGRAM

46
OEB0
45
OEB1
47
OEA1
51
AI0
50
AO0
25
OEB2
20
OEA2
2
AI1
52
AO1
3
AI2
4
AO2
TTL
Levels
AI3
AO3
8
6
FBL2041
FBL2041I
40
B0
38
B1
36
B2
34
BTL
Levels
B3
26
OEB3
24
OEA3
9
AI4
10
AO4
14
AI5
12
AO5
18
AI6
16
AO6
42
TMS
44
TCK
22
TDI
TDO
21
LOGIC V LOGIC GND = 1, 5, 7, 11, 13, 15, 19 BUS V BUS GND = 27, 29, 31, 33, 35, 37, 39, 41 BIAS V = 48
= 17, 49
CC
= 23, 43
CC
(Future JTAG Boundary Scan option)
32
B4
30
B5
28
B6
1998 May 11
SG00071
5
Page 6
Philips Semiconductors Product specification
V
In ut voltage
I
mA
VIHHigh-level in ut voltage
V
VILLow-level in ut voltage
V
IOLLow-level out ut current
mA
3.3V BTL 7-bit Futurebus+ transceiver (standard A-port)

ABSOLUTE MAXIMUM RATINGS

Operation beyond the limits set forth in this table may impair the useful life of the device. Unless otherwise noted these limits are over the operating free-air temperature range.
SYMBOL
V
T
V
I
OUT
OUT
STG
CC
IN
IN
Supply voltage –0.5 to +4.6 V
p
Input current VIN 0 –50 Voltage applied to output in High output state –0.5 to +7.0 V Current applied to output in AO0 – AO6 64, –64 Low output state/High output state B0 – B6 200 Storage temperature –65 to +150 °C

RECOMMENDED OPERATING CONDITIONS

SYMBOL PARAMETER
T
V
I
C
amb
Supply voltage 3.0 3.3 3.6 3.0 3.3 3.6 V
CC
p
p
I
Input clamp current –18 –18 mA
IK
High-level output current AO0 – AO6 –32 –32 mA
OH
p
Output capacitance on B port 6 7 6 7 pF
OB
Operating free-air temperature range 0 +70 –40 +85 °C
PARAMETER RATING UNIT
AI0 – AI6, OEB0, OEBn, OEAn –0.5 to +7.0
B0 – B6 –0.5 to +3.5 V
COMMERCIAL LIMITS
VCC = 3.3V±10%;
T
= 0 to +70°C
amb
MIN TYP MAX MIN TYP MAX
Except B0–B6 2.0 2.0 B0 – B6 1.62 1.55 1.62 1.55 Except B0–B6 0.8 0.8 B0 – B6 1.47 1.47
AO0 – AO6 +32 +32 B0 – B6 100 100
INDUSTRIAL LIMITS
VCC = 3.3V±10%;
T
= –40 to +85°C
amb
FBL2041
FBL2041I
UNIT
1998 May 11
6
Page 7
Philips Semiconductors Product specification
SYMBOL
PARAMETER
UNIT
I
(
BIASV
)
IOLOFF
Power up current
A
SYMBOL
PARAMETER
TEST CONDITIONS
1
UNIT
I
Power-off output current
B0
B6
3
voltage
AO0
AO6
3
B0
B6
V
IIInput leakage current
A
ICCSupply current (total)
mA
3.3V BTL 7-bit Futurebus+ transceiver (standard A-port)
FBL2041
FBL2041I

LIVE INSERTION SPECIFICA TIONS

LIMITS
MIN TYP MAX
V
BIASV
BIASV
V
I
I
Bias pin voltage
Bias pin (I DC current
Bus voltage during prebias B0 – B8 = 0V, Bias V = 3.3V 1.62 2.1 V
Bn
Fall current during prebias B0 – B8 = 2V, Bias V = 1.3 to 2.5V 1 µA
LM
Rise current during prebias B0 – B8 = 1V, Bias V = 3 to 3.6V –1 µA
HM
BIASV
) input
IBnPEAK Peak bus current during insertion
p
t
Input glitch rejection VCC = 3.3V 1.0 1.35 ns
GR

DC ELECTRICAL CHARACTERISTICS

Over recommended operating free-air temperature range unless otherwise noted.
I
OFF
V
V
V
I
I
OZH
I
OZL
NOTES:
1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operation conditions for the applicable type.
2. All typical values are at V
3. Due to test equipment limitations, actual test conditions are V
4. Unused pins are at V
5. For B port input voltage between 3 and 5 volt; I is active).
High level output current B0 – B6 VCC = MAX, VIL = MAX, VOH = 1.9V 100 µA
OH
p
High-level output
OH
Low-level output voltage
OL
Input clamp voltage VCC = MIN, II = I
IK
AO0 – AO6
Control pins VCC = 3.6V; VI = VCC or GND ±1.0
p
Control/ AI0 – AI6 VCC = 0V or 3.6V; VI = 5.5V 10 AI0 – AI6 VCC = 3.6V; VI = V Note 4 VCC = 3.6V; VI = 0V –5
High-level input current B0 – B6
IH
I
Low-level input current B0 – B6 VCC = MAX, VI = 0.75V -100 µA
IL
Off-state output current AO0 – AO6 VCC = MAX, VO =3V 5 µA Off-state output current AO0 – AO6 VCC = MAX, VO = 0.5V -5 µA
I
CCZ
I
pp
= 3.3V, TA = 25°C.
CC
or GND.
CC
CCB
I
CCL
I
CCH
Voltage dif ference between the Bias voltage and VCC after the PCB is plugged in.
– – 0.5 V
VCC = 0 V, Bias V = 3.6V 1.2 mA VCC = 3.3V, Bias V = 3.6V 10 µA
VCC = 0 to 3.3V, B0 – B8 = 0 to 2.0V, Bias V = 2.7 to 3.6V, OEB0 = 0.8V, tr = 2ns
V
= 0 to 3.3V, OEB0 = 0.8V 100
CC
V
= 0 to 1.2V, OEB0 = 0 to 5V 100
CC
LIMITS
2
–
MIN TYP
VCC = 0V, VIL = MAX, VOH = 1.9V 100 µA VCC = 0V , VIL = MAX, VOH = 1.9V @ 85°C 300 µA VCC = MIN to MAX; IOH = -100µA VCC –0.2 V VCC = MIN; IOH = -8mA 2.4 V VCC = MIN; IOH = -32mA 2.0 V
–
–
VCC = MIN; IOL = 16mA 0.4 V VCC = MIN; IOL = 32mA 0.5 V VCC = MIN, IOL = 4mA 0.5 VCC = MIN, IOL = 100mA 0.75 1.0 1.20
= –18mA –0.85 -1.2 V
IK
CC
VCC = MAX, VI = 1.9V 100 µA VCC = MAX, VI = 3.5V , note 5 100 mA VCC = MAX; VI = 3.75V @ –40°C 100 mA
VCC = MAX 5.2 13.5 VCC = MAX, outputs Low or High 3.2 9.0 VCC = MAX, outputs Low 13.5 19.5 VCC = MAX, outputs High 10.7 16.0
= 1.8V and VIL = 1.3V for the B side.
IH
will be greater than 100mA but the part will continue to function normally (clamping circuit
IH
10 mA
µ
MAX
1
µ
1998 May 11
7
Page 8
Philips Semiconductors Product specification
TEST
amb
,
3.3V BTL 7-bit Futurebus+ transceiver (standard A-port)

AC ELECTRICAL CHARACTERISTICS

A PORT LIMITS
FBL2041
COMMERCIAL
T
= 0 to +70°C,
amb
VCC = 3.3V±10%,
SYMBOL PARAMETER
CONDITION
Tm = +25°C,
Vcc = 3.3V,
CL = 50pf, RL = 500Ω
CL = 50pF, RL = 500Ω
MIN TYP MAX MIN MAX MIN MAX
t
PLH
t
PHL
t
PZH
t
PZL
t
PHZ
t
PLZ
t
TLH
t
THL
Propagation delay, Bn to AOn
Output enable time, OEA to AOn
Output disable time, OEA to AOn
Transition time, AOn Port (10% to 90% or 90% to 10%)
Waveform 1, 2
Waveform 4, 5
Waveform 4, 5
Test Circuit
and Waveforms
3.9
4.0
5.3
2.4
3.5
2.3
0.7
0.5
4.8
4.9
6.6
4.4
4.8
3.1
1.8
1.6
5.8
6.0
8.0
8.0
6.0
3.9
3.0
2.0
3.7
3.8
5.0
2.1
3.4
2.2
0.7
0.5
6.4
6.7
8.6
8.5
6.5
4.3
3.0
2.0
Output skew between
tSK(o)
receivers in same package
1
Waveform 3 0.7 1.5 1.5 1.5 ns
B PORT LIMITS
SYMBOL PARAMETER
t
PLH
t
PHL
t
PLH
t
PHL
t
PLH
t
PHL
t
TLH
t
THL
tSK(o)
Propagation delay, AIn to Bn
Enable/disable time, OEB0 to Bn
Enable/disable time, OEB1 to Bn
Transition time, Bn Port (1.3V to 1.8V)
Output skew between drivers in same package
SYMBOL PARAMETER
t
PLH
t
PHL
t
PLH
t
PHL
t
PLH
t
PHL
t
TLH
t
THL
tSK(o)
Propagation delay, AIn to Bn
Enable/disable time, OEB0 to Bn
Enable/disable time, OEB1 to Bn
Transition time, Bn Port (1.3V to 1.8V)
Output skew between drivers in same package
TEST
CONDITION
Waveform 1, 2
Waveform 2
Waveform 1
Test Circuit
and Waveforms
Waveform 3 1.5 1.5 1.5 ns
1
TEST
CONDITION
Waveform 1, 2
Waveform 2
Waveform 1
Test Circuit
and Waveforms
Waveform 3 1.5 1.5 1.5 ns
1
T
= +25°C,
amb
VCC = 3.3V,
CD = 30pF, RU = 9Ω
3.3
4.2
3.5
4.9
4.3
5.1
3.8
2.4
0.9
5.2
4.5
5.8
5.3
6.1
4.7
3.0
1.5
2.7
4.0
3.4
4.2
2.9
1.2
0.4
T
= 0 to +70°C,
amb
VCC = 3.3V±10%,
CD = 30pF, RU = 9Ω
2.9
2.5
3.6
3.1
3.9
2.6
1.2
0.4
6.0
5.0
6.6
6.0
6.9
5.5
3.0
1.5
RU = 16.5Ω RU = 16.5Ω RU = 16.5Ω UNIT
3.3
4.2
2.7
4.0
3.4
4.2
2.9
1.2
0.4
3.6
4.9
4.3
5.1
3.8
2.4
0.9
5.1
4.5
5.8
5.3
6.1
4.7
3.0
1.5
3.0
2.5
3.6
3.1
3.9
2.6
1.2
0.4
6.0
5.0
6.6
6.0
6.8
5.5
3.0
1.5
NOTES:
1.  t
actual – tPMactual for any data input to output path compared to any other data input to output path where N and M are either LH or
PN
HL. Skew times are valid only under same test conditions (temperature, V
, loading, etc.).
CC
FBL2041I
INDUSTRIAL
T
= –40 to +85°C,
amb
VCC = 3.3V±10%,
CL = 50pF, RL = 500Ω
2.8
2.7
4.5
1.1
2.7
1.4
0.7
0.5
T
= –40 to +85°C,
amb
VCC = 3.3V±10%,
CD = 30pF, RU = 9Ω
1.8
1.7
2.8
2.5
2.9
1.9
1.2
0.4
1.8
1.7
2.7
2.5
3.0
1.9
1.2
0.4
FBL2041
FBL2041I
UNIT
6.9
7.0
9.0
9.0
7.0
4.7
3.0
2.0
6.7
5.6
7.1
6.4
7.3
6.0
3.0
1.5
6.7
5.6
7.1
6.4
7.3
6.0
3.0
1.5
ns
ns
ns
ns
UNIT
ns
ns
ns
ns
ns
ns
ns
ns
1998 May 11
8
Page 9
Philips Semiconductors Product specification
3.3V BTL 7-bit Futurebus+ transceiver (standard A-port)

AC WAVEFORMS

VM = 1.55V for Bn, VM = 1.5V for all others.
V
AIn, Bn or Bn
OEBn
AOn or Bn
M
t
PLH
Waveform 1. Propagation Delay for Data or
Output Enable to Output
AIn, Bn
OEB0
AOn, Bn
V
M
t
PHL
V
M
t
PHL
V
M
V
M
SG00101
OEA
AOn
Waveform 4. 3-State Output Enable Time to High Level and
Output Disable Time from High Level
V
M
t
PLH
V
M
V
M
OEA
AOn
FBL2041
FBL2041I
V
M
t
PZH
V
M
t
PZL
V
M
t
PHZ
V
M
V
M
t
V
M
VOH -0.3V
OV
SG00104
PLZ
VOL +0.3V
SG00102
Waveform 2. Propagation Delay for Data or
Output Enable to Output
AIn, Bn
AOn, Bn
V
M
tSK(o)
V
M
SG00103
Waveform 3. Output Skews
SG00105
Waveform 5. 3-State Output Enable Time to Low Level and
Output Disable Time from Low Level
1998 May 11
9
Page 10
Philips Semiconductors Product specification
3.3V BTL 7-bit Futurebus+ transceiver (standard A-port)

TEST CIRCUIT AND WAVEFORMS

V
CC
BIAS
V
PULSE
GENERATOR
V
IN
R
T
D.U.T.
V
OUT
Test Circuit for 3-State Outputs on A Port
SWITCH POSITION FOR ALL A-PORTS
TEST SWITCH
t t
t
PULSE
GENERATOR
PLH, PLZ,
PHZ,
t
PHL
t
PZL
t
PZH
V
IN
BIAS
V
R
T
OPEN
CLOSED
GND
V
CC
D.U.T.
2.0V (for RU = 9 Ω)
2.1V (for RU = 16.5 Ω)
V
OUT
Test Circuit for Outputs on B Port
R
R
C
L
R
U
C
D
6.0V
L
L
NEGATIVE PULSE
POSITIVE PULSE
Family
FB+
90%
10%
V
M
10%
90%
V
M
VM = 1.55V for Bn, VM = 1.5V for all others.
INPUT PULSE REQUIREMENTS
Low V
A Port
DEFINITIONS:
RL= Load Resistor; see AC CHARACTERISTICS for value. CL= Load capacitance includes jig and probe capacitance; see AC
CHARACTERISTICS for value.
R
= Termination resistance should be equal to Z
T
CD= Load capacitance includes jig and probe capacitance; see AC
CHARACTERISTICS for value.
RU= Pull up resistor; see AC CHARACTERISTICS for value.
t
W
(tf)
t
THL
t
(tr)
TLH
t
W
Input Pulse Definitions
Rep. RateAmplitude t
0.0V
1.0VB Port
1MHz3.0V 1MHz2.0V
FBL2041
FBL2041I
90%
V
M
10%
90%
V
M
10%
t
TLHtTHL
W
2.5ns
500ns
2.5ns500ns
of pulse generators.
OUT
t
TLH
t
THL
V
IN
LOW V
(tr)
(tf)
V
IN
LOW V
2.5ns
2.5ns
SG00090
1998 May 11
10
Page 11
Philips Semiconductors Product specification
3.3V BTL 7-bit Futurebus+ transceiver (standard A port)
FBL2041
FBL2041I

QFP52: plastic quad flat package; 52 leads (lead length 1.6 mm); body 10 x 10 x 2.0 mm SOT379-1

1998 May 11
11
Page 12
Philips Semiconductors Product specification
3.3V BTL 7-bit Futurebus+ transceiver (standard A port)

Data sheet status

Data sheet status
Objective specification
Preliminary specification
Product specification
Product status
Development
Qualification
Production
Definition
This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice.
This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make chages at any time without notice in order to improve design and supply the best possible product.
This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product.
[1]
FBL2041
FBL2041I
[1] Please consult the most recently issued datasheet before initiating or completing a design.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury . Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
Philips Semiconductors 811 East Arques Avenue P.O. Box 3409 Sunnyvale, California 94088–3409 Telephone 800-234-7381
Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
Date of release: 05-98
Document order number: 9397 750 -03938
 
1998 May 11
12
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