Datasheet EP9312 Datasheet (CIRRUS LOGIC)

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EP9312 Data Sheet

FEATURES

• 200-MHz ARM920T Processor

• 16-kbyte Instruction Cache

• 16-kbyte Data Cache

• Linux

• 100-MHz System Bus

• MaverickCrunch

• Floating Point, Integer, and Signal Processing

• Optimized for digital music compression and

• Hardware interlocks allow in-line coding.

• MaverickKey

• 32-bit unique ID can be used for DRM-compliant,

• Integrated Peripheral Interfaces

• 32-bit SDRAM Interface (up to 4 banks)

• 32/16-bit SRAM / FLASH / ROM

• Serial EEPROM Interface

• EIDE (up to 2 devices)

• 1/10/100 Mbps Ethernet MAC

• Three UARTs

• Three-port USB 2.0 Full-speed Host (OHCI)

• LCD and Raster Interface

• Touchscreen Interface with ADC

, Microsoft® Windows® CE-enabled MMU

™

Math Engine

Instructions

decompression algorithms.

™

IDs

128-bit random ID.

(12 Mbits per second)

Universal Platform

System-on-chip Processor

• IrDA Interface

• 8 x 8 Keypad Scanner

• One Serial Peripheral Interface (SPI) Port

• 6-channel or 2-channel Serial Audio Interface (I

• 2-channel, Low-cost Serial Audio Interface (AC'97)

• 2 High-resolution PWMs (16 bits each)

• Internal Peripherals

• 12 Direct Memory Access (DMA) Channels

• Real-time Clock with Software Trim

• Dual PLL controls all clock domains.

• Watchdog Timer

• Two General-purpose 16-bit Timers

• One General-purpose 32-bit Timer

• One 40-bit Debug Timer

• Interrupt Controller

•Boot ROM

• Package

• 352 pin PBGA

COMMUNICATIONS PORTS

http://www.cirrus.com

Serial Audio

Interface

(3) UARTs

IrDA

(3) USB

Hosts

Ethernet

MAC

DMA w/

12 CHANNEL

CRC

DMA

MaverickKey

MaverickLock

Boot ROM

EIDE

I/F

MaverickCrunch

D-Cache

Peripheral Bus

ARM920T

16KB

MMU

SRAM & Flash I/F

I-Cache

16KB

Bus

Bridge

Unified

SDRAM I/F

Clocks &

Timers

Interrupts

& GPIO

Keypad &

Touch

Screen I/F

Processor Bus

Video/LCD

Controller

USER INTERFACE

MEMORY AND STORAGE

DS515PP7

EP9312 Universal Platform SOC Processor

OVERVIEW

The EP9312 is an ARM920T-based system-on-a-chip design with a large peripheral set targeted to a variety of applications:

• Thin client computers for business and home

• Internet radio

• Internet access devices

• Industrial computers

• Specialized terminals

• Point of sale terminals

• Test and measuremen t equipment The ARM920T microprocessor core with separate 16-

kbyte, 64-way set-associative instruction and data caches is augmented by the MaverickCrunch™ coprocessor enabling high-speed floating point calculations.

MaverickKey solution to the growing concer n over s ecure w eb cont ent and commerce. With Internet security playing an important role in the delivery of digital media such as books or music, traditional software methods are quickly

™

unique hardware programmed IDs are a

becoming unreliable. The MaverickKey unique IDs provide OEMs with a method of utilizing specific hardware IDs such as those assigned for SDMI (Secure Digital Music Initiative) or any other authentication mechanism.

A high-performance 1/10/100 Mbps Ethernet media access Controller (EMAC) is included along with external

interfaces to SPI, I

S audio, Raster/LCD, IDE storage

peripherals, keypad, and touchscreen. A three-port USB

2.0 Full-speed Host (OHCI) (12 Mbits per second) and three UARTs are included as well.

The EP9312 is a high-performance, low-power, RISCbased, single-chip computer built around an ARM920T microprocessor core with a maximum operating clock rate of 200 MHz (184 MHz for industrial conditions). The ARM core operates from a 1.8 V supply, while the I/O operates at 3.3 V with power usage between 100 mW and 750 mW (dependent on speed).

Table A. Change History

Revision Date Changes

1 March 2001 Initial Release. 2 June 2001 Upgrade to revision B silicon. 3 August 2001 Upgrade to revision C silicon. 4 May 2003 Upgrade to revision D silicon. 5 December 2003 Update timing data.

6 July 2004 7 Febuary 2005 Update with most-current characterization data.

Update AC data. Add ADC data.

FEATURES .............................................................................................. ...........1

Overview .................................................................................................. ...........2

Processor Core - ARM920T ......................................................................................... 6

MaverickCrunch™ Math Engine .................................................................................. 6

MaverickKey™ Unique ID ............................................................................................ 6

General Purpose Memory Interface (SDRAM, SRAM, ROM, FLASH) ........................ 6

IDE Interface ................................................................................................................ 7

Ethernet Media Access Controller (MAC) .................................................................... 7

Serial Interfaces (SPI, I2S, and AC ’97) ....................................................................... 7

Raster/LCD Interface ................................................................................................... 7

Touch Screen Interface with 12-bit Analog-to-digital Converter (ADC) ........................ 8

64-Key Keypad Interface ............................................................................................. 8

Universal Asynchronous Receiver/Transmitters (UARTs) ............................................ 8

Triple-port USB Host .................................................................................................... 9

Two-Wire Interface ....................................................................................................... 9

Real-time Clock with Software Trim ..................................................................... ........ 9

PLL and Clocking .................................... ... ... .......................................... .... ... .............. 9

Timers ........................................................................................................................ 10

Interrupt Controller ..... ... ... .......................................................................................... 10

Dual LED Drivers .................................... ... ... .... ... ... ... .... ......................................... ... 10

General Purpose Input/Output (GPIO) ................. ... ... .... ... ... ...................................... 10

Reset and Power Management ................................................................................. 10

Hardware Debug Interface ..........................................................................................11

12-Channel DMA Controller ........................................................................................11

Internal Boot ROM ............................................................................ ... ... ....................11

EP9312

Universal Platform SOC Processor

Electrical Specifications .................................................................................12

Absolute Maximum Ratings ....................................................................................... 12

Recommended Operating Conditions ........................................................................ 12

DC Characteristics ............................................................... ... ................................... 13

Timings ................................................................................... .............. ............14

Memory Interface .... ... ... ... .... ... ... ... ... .... ... ... ... .... .......................................... ... ... ... ... ... 15

IDE Interface .............................................................................................................. 30

Ethernet MAC Interface ............................................................................................ 43

Audio Interface ........................................................................................................... 45

AC’97 ........................................ ... ... .... ... ... ... .... ......................................................... 49

LCD Interface ............................................................................................................ 50

ADC ........................................................................................................................... 51

JTAG .......................................................................................................................... 52

352 Pin BGA Package Outline .......................................................................53

352-Ball PBGA Diagram .................................................................................. 53

352 Pin BGA Pinout (Bottom View) ........................................................................... 54

Acronyms and Abbreviations ............................................................ ............61

Units of Measurement .....................................................................................61

Ordering Information ......................................................................................62

EP9312 Universal Platform SOC Processor

List of Figures

Figure 1. Timing Diagram Drawing Key .................................................................................14

Figure 2. SDRAM Load Mode Register Cycle Timing Measurement .....................................15

Figure 3. SDRAM Burst Read Cycle Timing Measurement ...................................................16

Figure 4. SDRAM Burst Write Cycle Timing Measurement ...................................................17

Figure 5. SDRAM Auto Refresh Cycle Timing Measurement ................................................ 18

Figure 6. Static Memory Single Word Read Cycle Timing Measurement ..............................19

Figure 7. Static Memory Single Word Write Cycle Timing Measurement ..............................20

Figure 8. Static Memory Multiple Word Read 8-bit Cycle Timing Measurement ....................21

Figure 9. Static Memory Multiple Word Write 8-bit Cycle Timing Measurement ....... .... ... ... ...22

Figure 10. Static Memory Multiple Word Read 16-bit Cycle Timing Measurement ................23

Figure 11. Static Memory Multiple Word Write 16-bit Cycle Timing Measurement ................24

Figure 12. Static Memory Burst Read Cycle Timing Measurement .......................................25

Figure 13. Static Memory Burst Write Cycle Timing Measurement .......................... .... ... ... ...26

Figure 14. Static Memory Single Read Wait Cycle Timing Measurement .............................27

Figure 15. Static Memory Single Write Wait Cycle Timing Measurement ..............................28

Figure 16. Static Memory Turnaround Cycle Timing Measurement .......................................29

Figure 17. Register Transfer to/from Device ................................................................. ... ......31

Figure 18. PIO Data Transfer to/from Device ............... ... .... ... ... ... .... ... ... ... .............................33

Figure 19. Initiating an Ultra DMA data-in Burst ..................... ... ... .... ... ... ... ... .... ... ...................35

Figure 20. Sustained Ultra DMA data-in Burst .......................................................................36

Figure 21. Host Pausing an Ultra DMA data-in Burst ................... .... ... ... ... ... .... ... ... ... .............36

Figure 22. Device Terminating an Ultra DMA data-in Burst ...................................................37

Figure 23. Host Terminating an Ultra DMA data-in Burst .......................................................38

Figure 24. Initiating an Ultra DMA data-out Burst .. ... ... ... .... ... ... ... .... ... ... ... .............................39

Figure 25. Sustained Ultra DMA data-out Burst .....................................................................40

Figure 26. Device Pausing an Ultra DMA data-out Burst ....... ....................................... ......... 40

Figure 27. Host Terminating an Ultra DMA data-out Burst ....................................................41

Figure 28. Device Terminating an Ultra DMA data-out Burst ....................... .... ... ... ... .... ... ... ...42

Figure 29. Ethernet MAC Timing Measurement .....................................................................44

Figure 30. TI Single Transfer Timing Measurement ............................ ...... ....... ...... ....... ...... ...46

Figure 31. Microwire Frame Format, Single Transfer ......... ... ... ... .... ... ...................................46

Figure 32. SPI Format with SPH=1 Timing Measurement .....................................................47

Figure 33. Inter-IC Sound (I2S) Timing Measurement ...........................................................48

Figure 34. AC ‘97 Configuration Timing Measurement .................... ...................................... 49

Figure 35. LCD Timing Measurement ....................................................................................50

Figure 36. ADC Transfer Function .........................................................................................51

Figure 37. JTAG Timing Measurement .................. ................................................................ 52

Figure 38. 352 Pin PBGA Pin Diagram ..................................................................................53

Figure 40. 352 PIN BGA PINOUT ...................................................................................55

List of Tables

Table A. Change History .................................. ... ... ... .... ... ... ... .... ... ... ... ... .................................. 2

Table B. General Purpose Memory Interface Pin Assignments ................ ... ... ... .... ... .............. 6

Table C.IDE Interface Pin Assignments .................................................................................. 7

Table D.Ethernet Media Access Controller Pin Assignments ................................................. 7

Table E. Audio Interfaces Pin Assignment .............................................................................. 7

Table F. LCD Interface Pin Assignments ........................ ... ... .... ... ... ... ... .... ... ... ... .... ... ... ... ... ..... 8

Table G.Touch Screen Interface with 12-bit Analog-to-Digital Converter Pin Assignments ... 8

Table H.64-Key Keypad Interface Pin Assignments .......................................................... .... . 8

Table I. Universal Asynchronous Receiver/Transmitters Pin Assignments ............................ 9

Table J. Triple Port USB Host Pin Assignments ..................................................................... 9

Table K. Two-Wire Port with EEPROM Support Pin Assignments .......................................... 9

Table L. Real-Time Clock with Pin Assignments .................................................... ... ... ... ... .... . 9

Table M. PLL and Clocking Pin Assignments ........ ... .... ... ... ... .... ... ... ... ... .... ... ......................... 10

Table N.Interrupt Controller Pin Assignment ........................................................................ 10

Table O.Dual LED Pin Assignments ............................................ ... ... ... .... ... ... ... .... ... ... ... ... ... 10

Table P. General Purpose Input/Output Pin Assignment ...................................................... 10

Table Q.Reset and Power Management Pin Assignments ................................................... 10

Table R.Hardware Debug Interface ...................................................................................... 11

Table R.352 Pin Diagram Dimensions .................................................................................. 54

Table S. Pin Descriptions ........ ... .... ... ... ... ... .... ... .......................................... ... ... .... ... ... ... ...... 59

Table T. Pin Multiplex Usage Information ............................................................................. 60

EP9312

Universal Platform SOC Processor

EP9312 Universal Platform SOC Processor

Processor Core - ARM920T

The ARM920T is a Harvard architecture processor with separate 16-kbyte instruction and data caches with an 8word line length but a unified memory. The processor utilizes a five-stage pipeline consisting of fetch, decode, execute, memory, and write stages. Key features include:

• ARM (32-bit) and Thumb (16-bit compressed) Instruction Sets

• 32-bit Advanced Microcontroller Bus Architecture (AMBA)

• 16-kbyte Instruction Cache with lockdown

• 16-kbyte Data Cache (pro grammable write-throu gh or write-back) with Lockdown

• MMU for Linux

, Microsoft® Windows® CE, and other

operating systems

• Translation Look Aside Buffers with 64 Data and 64 Instruction Entries

• Programmable Page Sizes of 1 Mbyte, 64 kbyte, 4 kbyte, and 1 kbyte

• Independent lockdown of TLB Entries

MaverickCrunch™ Math Engine

The MaverickCrunch Engine is a mixed-mode coprocessor designed primarily to accelerate the math processing required to rapidly encode digital audio formats. It accelerates single- and double-precision integer and floating point operations plus an integer multiply-accumulate (MAC) instruction that is considerably faster than the ARM920T's native MAC instruction. The ARM920T coprocessor interface is utilized thereby sharing its memory interface and instruction stream. Hardware forwarding and interlock allows the ARM to handle looping and addressing while MaverickCrunch handles computation. Features include:

• IEEE-754 single and double-precision floating point

• 32 / 64-bit integer

• Add / multiply / compare

• Integer MAC 32-bit input with 72-bit accumulate

• Integer Shifts

• Floating point to/from integer conversion

• Sixteen 64-bit register files

• Four 72-bit accumulators

MaverickKey™ Unique ID

MaverickKey unique hardware programmed IDs are a solution to the growing concern over secure web content and commerce. With Internet security playing an important role in the delivery of digital media such as books or music, traditional software methods are quick ly becoming unreliable. The MaverickKey unique IDs

provide OEMs with a method of utilizing specific hardware IDs such as those assigned for SDMI (Secure Digital Music Initiative) or any other authentication mechanism.

Both a specific 32-bit ID as well as a 128-bit random ID are programmed into the EP9312 through the use of laser probing technology. These IDs can then be used to match secure copyrighted content with the ID of the target device the EP9312 is powering, and then deliver the copyrighted information ov er a secure connection. I n addition, secure transactions can benefit by also matching device IDs to server IDs. MaverickKey IDs provide a level of hardware security required for today’s Internet appliances.

General Purpose Memory Interface (SDRAM, SRAM, ROM, FLASH)

The EP9312 features a unified memory address model where all memory devices are accessed over a common address/data bus. A separate internal port is dedicate d to the read-only Raster/LCD refresh engine, while the rest of the memory accesses are performed via the Processor bus. The SRAM memory controller supports 8, 16 and 32-bit devices and accommodates an internal boot ROM concurrently with 32-bit SDRAM memory.

• 1 to 4 banks of 32-bit, 66- or 100-MHz SDRAM

• One internal port dedicated to the Raster/LCD Refresh Engine (Read Only)

• Address and data bus shared between SDRAM, SRAM, ROM, and FLASH memory

• NOR FLASH memory supported

Table B. General Purpose Memory Interface Pin Assignments

Pin Mnemonic Pin Description

SDCLK SDRAM Clock SDCLKEN SDRAM Clock Enable SDCSn[3:0] SDRAM Chip Selects 3-0 RASn SDRAM RAS CASn SDRAM CAS SDWEn SDRAM Write Enable CSn[7:6] and CSn[3:0] Chip Selects 7, 6, 3, 2, 1, 0 AD[25:0] Address Bus 25-0 DA[31:0] Data Bus 31-0 DQMn[3:0] SDRAM Output Enables / Data Masks WRn SRAM Write Strobe RDn SRAM Read / OE Strobe WAITn SRAM Wait Input

EP9312

Universal Platform SOC Processor

IDE Interface

The IDE Interface provides an industry-standard connection to two AT Advanced Packet Interface (ATAPI) compliant devices. The IDE port will attach to a master and a slave device. The internal DMA controller performs all data transfers using the Multiword DMA and Ultra DMA modes. The interface supports the following operating modes:

• PIO Modes 0 thru 4

• Ultra DMA Modes 0 thru 3

Table C. IDE Interface Pin Assignments

Pin Mnemonic Pin Description

DD[15-0] IDE Data bus IDEDA[2-0] IDE Device address IDECSn[0,1] IDE Chip Select 0 and 1 DIORn IDE Read Strobe DIOWn IDE Write Strobe DMACKn IDE DMA acknowledge

Ethernet Media Access Controller (MAC)

The MAC subsystem is compliant with the ISO/TEC

802.3 topology for a single shared medium with several stations. Multiple MII-compliant PHYs are supported. Features include:

• Supports 1/10/100 Mbps transfer rates for home / small-business / large-business applications

• Interfaces to an off-chip PHY through industry standard Media Independent Interface (MII)

Table D. Ethernet Media Access Controller Pin Assignments

Pin Mnemonic Pin Description

MDC Management Data Clock MDIO Management Data I/O RXCLK Receive Clock MIIRXD[3:0] Receive Data RXDVAL Receive Data Valid RXERR Receive Data Error TXCLK Transmit Clock MIITXD[3:0] Transmit Data TXEN Transmit Enable TXERR Transmit Error CRS Carrier Sense CLD Collision Detect

Serial Interfaces (SPI, I2S, and AC ’97)

The SPI port can be configured as a master or a slave,

supporting the National Semiconductor

Texas Instruments

signaling protocols.

, Motorola®, and

The AC'97 port supports multiple codecs for multicha nnel audio output with a single stereo input. Three I

S ports

can be configured to support six-channel, 24 -bit au dio . These ports are multiplexed so that I

S port 0 will take over either the AC'97 pins or the SPI pins. The second and third I2S ports' serial input and serial output pins are multiplexed with EGPIO[4,5,6,13]. The clocks supplied in the first I2S port are also used for the second and third I2S ports.

• Normal Mode: One SPI Port and one AC’97 Port

•I

S on SSP Mode: One AC’97 Port and up to three I2S

Ports

•I

S on AC’97 Mode: One SPI Port and up to three I2S

Ports

‘

Name

SCLK1 SPI Bit Clock I2S Serial Clock SPI Bit Clock SFRM1 SPI Frame Clock I2S Frame Clock SPI Frame Clock SSPRX1 SPI Serial Input I2S Serial Input SPI Serial Input

SSPTX1

ARSTn AC'97 Reset AC'97 Reset I2S Master Clock ABITCLK AC'97 Bit Clock AC'97 Bit Clock I2S Serial Clock

ASYNC

ASDI

ASDO

Table E. Audio Interfaces Pin Assignment

Normal Mode

Description

SPI Serial Output

AC'97 Frame Clock

AC'97 Serial Input

AC'97 Serial Output

I2S on SSP

Mode

Pin Description Pin Description

I2S Serial Output SPI Serial Output (No I2S Master

Clock)

AC'97 Frame Clock

AC'97 Serial Input I2S Serial Input AC'97 Serial

Output

I2S Frame Clock

I2S Serial Output

I2S on AC'97

Mode

Raster/LCD Interface

The Raster/LCD interface provides data and interface signals for a variety of display types. It features fully programmable video interface timing for non-interlaced flat panel or dual scan displays. Resolutions up to 1024 x 768 are supported from a unified SDRAM based frame buffer. A 16-bit PWM provides control for LCD panel contrast.

EP9312 Universal Platform SOC Processor

LCD-specific features include:

• Timing and interface signals for digital LCD and TFT displays

• Full programmability for either non-interlaced or dualscan color and grayscale flat panel displays

• Dedicated data path to SDRAM controller for improved system performance

• Pixel depths of 4, 8, 16, or 24 bits per pixel or 256 levels of grayscale

• Hardware Cursor up to 64 x 64 pixels

• 256 x 18 Color Lookup Table

• Hardware Blinking

• 8-bit interface to low-end panel

Table F. LCD Interface Pin Assignments

Pin Mnemonic Pin Description

SPCLK Pixel Clock P[17:0] Pixel Data Bus [17:0]

HSYNC / LP

VCSYNC / FP BLANK Composite Blank

BRIGHT Pulse Width Modulated Brightness

Horizontal Synchronization / Line Pulse

Vertical or Composite Synchronization / Frame Pulse

Table G. Touch Screen Interface with 12-bit Analog-to-Digital

Pin Mnemonic Pin Description

Yp, Ym Touch screen ADC Y Axis SXp, SXm

SYp, SYm

Converter Pin Assignments

Touch screen ADC X Axis Voltage Feedback

Touch screen ADC Y Axis Voltage Feedback

64-Key Keypad Interface

The keypad circuitry scans an 8 x 8 array of 64 normally open, single-pole switches. Any one or two keys depressed will be de-bounced and decoded. An interrupt is generated whenever a stable set of depressed keys is detected. If the keypad is not utilized, the 16 column/row pins may be used as general purpose I/O. The Keypad interface:

• Provides scanning, debounce, and decoding for a 64key switch array.

• Scans an 8-row by 8-column matrix.

• May decode 2 keys at once.

• Generates an interrupt when a new stable key is determined.

• Also generates a 3-key reset interrupt.

Touch Screen Interface with 12-bit Analogto-digital Converter (ADC)

The touch screen interface performs all sampling, averaging, ADC range checking, and control for a wide variety of analog resistive touch screens. This controller only interrupts the processor when a meaningful change occurs. The touch screen hardware may be disabled and the switch matrix and ADC controlled directly if desired. Features include:

• Support for 4-, 5-, 7-, or 8-wire analog resistive touch screens.

• Flexibility - unused lines may be used for temperature sensing or other functions.

• Touch screen interrupt function.

Table G. Touch Screen Interface with 12-bit Analog-to-Digital

Converter Pin Assignments

Pin Mnemonic Pin Description

Xp, Xm Touch screen ADC X Axis

Table H. 64-Key Keypad Interface Pin Assignments

Pin Mnemonic

COL[7:0]

ROW[7:0]

Description

Key Matrix Column Inputs

Key Matrix Row Inputs

Alternative Usage

General Purpose I/O

Universal Asynchronous Receiver/Transmitters (UARTs)

Three 16550-compatible UARTs are supplied. Two provide asynchronous HDLC (High-level Data Link Control) protocol support for full duplex transmit and receive. The HDLC receiver handles framing, address matching, CRC checking, control-octet transparency, and optionally passes the CRC to the host at the end of the packet. The HDLC transmitter handles framing, CRC generation, and control-octet transparency. The host must assemble the frame in memory before transmission. The HDLC receiver and transmitter use the

UART FIFOs to buffer the data streams. A third IrDA compatible UART is also supplied.

• UART1 supports modem bit rates up to 115.2 Kbps, supports HDLC and includes a 16 byte FIFO for

EP9312

Universal Platform SOC Processor

receive and a 16 byte FIFO for transmit. Interrupts are generated on Rx, Tx and modem status change.

• UART2 contains an IrDA encoder operating at either the slow (up to 115 Kbps), medium (0.576 or 1.152 Mbps), or fast (4 Mbps) IR data rates. It also has a 16 byte FIFO for receive and a 16 byte FIFO for transmit.

• UART3 supports HDLC and includes a 16 byte FIFO for receive and a 16 byte FIFO for transmit. Interrupts are generated on Rx and Tx.

Table I. Universal Asynchronous Receiver/Transmitters Pin

Assignments

Pin Mnemonic Pin Name - Description

TXD0 UART1 Transmit RXD0 UART1 Receive

CTSn

DSRn / DCDn DTRn UART1 Data Terminal Ready

RTSn UART1 Ready To Send EGPIO[0] / RI UART1 Ring Indicator

TXD1 / SIROUT RXD1 / SIRIN UART2 Receive / IrDA Input

TXD2 UART3 Transmit RXD2 UART3 Receive EGPIO[3] / TENn HDLC3 Transmit Enable

UART1 Clear To Send / Transmit Enable

UART1 Data Set Ready / Data Carrier Detect

UART2 Transmit / IrDA Output

Triple-port USB Host

The USB Open Host Controller Interface (Open HCI) provides full-speed serial communications ports at a baud rate of 12 Mbits/sec. Up to 127 USB devices (printer, mouse, camera, keyboard, etc.) and USB hubs can be connected to the USB host in the USB “tiered star” topology.

This includes the following features:

• Fetches endpoint descriptors and transfer descriptors

• Accesses endpoint data from system memory

• Accesses the HC communication area

• Writes status and retire transfer descriptor

Table J. Triple Port USB Host Pin Assignments

Pin Mnemonic Pin Name - Description

USBp[2:0] USB Positive signals USBm[2:0] USB Negative Signals

Two-wire Interface

The two-wire interface provides communication and control for synchronous-serial-driven devices.

Table K. Two-Wire Port with EEPROM Support Pin Assignments

Pin Mnemonic Pin Name - Description

EECLK Two-wire Interface Clock

EEDATA Two-wire Interface Data

Alternative

Usage

General Purpose I/O

Real-time Clock with Soft ware Trim

The software trim feature on the real time clock (RTC) provides software controlled digital compensation of the

32.768 KHz input clock. This compensation is accurate to

± 1.24 sec/month.

Note: A real time clock must be connected to RTCXTALI or

the EP9312 device will not boot.

Table L. Real-Time Clock with Pin Assignments

Pin Mnemonic Pin Name - Description

RTCXTALI Real-Time Clock Oscillator Input RTCXTALO Real-Time Clock Oscillator Output

• Compliance with the USB 2.0 specification

• Compliance with the Open HCI Rev 1.0 specification

• Supports both low speed (1.5 Mbps) and full speed (12 Mbps) USB device connections

• Root HUB integrated with 3 downstream USB ports

• Transceiver buf fers integrated, over-current protection

PLL and Clocking

The Processor and the Peripheral Clocks operate from a single 14.7456 MHz crystal.

The Real Time Clock operates from a 32.768 KHz external oscillator.

on ports

• Supports power management

• Operates as a master on the bus

The Open HCI host controller initializes the master DMA transfer with the AHB bus:

EP9312 Universal Platform SOC Processor

Table M. PLL and Clocking Pin Assignments

Pin Mnemonic Pin Name - Description

XTALI Main Oscillator Input XTALO Main Oscillator Output VDD_PLL Main Oscillator Power GND_PLL Main Oscillator Ground

Timers

The Watchdog Timer ensures proper operation by requiring periodic attention to prevent a reset-on-timeout.

Two 16-bit timers operate as free-running down counters or as periodic timers for fixed-interval interrupts and have a range of 0.03 ms to 4.27 seconds.

One 32-bit timer, plus a 6-bit prescale counter, has a range of 0.03 µs to 73.3 hours.

One 40-bit debug timer , plu s a 6-bit pre scale counter, has a range of 1.0 µs to 12.7 days.

Interrupt Controller

The interrupt controller allows up to 64 interrupts to generate an Interrupt Request (IRQ) or Fast Interrupt Request (FIQ) signal to the processor core. Thirty-two hardware priority assignments are provided fo r assisting IRQ vectoring, and two levels are provided for FIQ vectoring. This allows time-critical interrupts to be processed in the shortest time possible. Internal interrupts may be programmed as active high or active low level sensitive inputs. External interrupts may be programmed as active-high level-sensitive, active-low level-sensitive, rising-edge-triggered, falling-edgetriggered, or combined rising/falling-edge-triggered.

Dual LED Drivers

Two pins are assigned specifically to drive external LEDs.

Table O. Dual LED Pin Assignments

Pin Mnemonic

GRLED Green LED General Purpose I/O REDLED Red LED General Purpose I/O

Pin Name -

Description

Alternative Usage

General Purpose Input/Output (GPIO)

The 16 EGPIO pins may each be configured individually as an output, an input, or an interrupt input.

There are 23 pins that may alternatively be used as input, output, but do not support interrupts. These pins are:

• Key Matrix ROW[7:0], COL[7:0]

• Ethernet MDIO

• Both LED Outputs

• Two-wire Clock and Data

• SLA [1:0]

6 pins may alternatively be used as inputs only:

• CTSn, DSRn / DCDn

• 4 Interrupt Lines

2 pins may alternatively be used as outputs only:

•RTSn

•ARSTn

Table P. General Purpose Input/Output Pin Assignment

Pin Mnemonic Pin Name - Description

EGPIO[15:0]

Expanded General Purpose Input / Output Pins with Interrupts

• Supports 64 interrupts from a variety of sources (such as UARTs, GPIO, and key matrix)

• Routes interrupt sources to either the ARM920T’s IRQ or FIQ (Fast IRQ) inputs

Reset and Power Management

The chip may be reset through the PRSTn pin or through the open drain common reset pin, RSTOn.

• Four dedicated off-chip interrupt lines INT[3:0] operate as level-sensitive interrupts

• Any of the 16 GPIO lines maybe configured to generate interrupts

• Software-supported priority mask for all FIQs and

Clocks are managed on a peripheral-by-peripheral basis and may be turned off to conserve power.

The processor clock is dynamically adjustable from 0 to 200 MHz (184 MHz for industrial conditions).

IRQs

Table Q. Reset and Power Management Pin Assignments

Table N. External Interrupt Controller Pin Assignment

Pin Mnemonic Pin Name - Description

INT[3:0] External Interrupt 3-0

Pin Mnemonic Pin Name - Description

PRSTn Power On Reset RSTOn

User Reset In/Out – Open Drain – Preserves Real Time Clock value

EP9312

Universal Platform SOC Processor

Hardware Debug Interface

The JTAG interface allows use of ARM’s Multi-ICE or other in-circuit emulators.

Table R. Hardware Debug Interface

Pin Mnemonic Pin Name - Description

TCK JTAG Clock TDI JTAG Data In TDO JTAG Data Out TMS JTAG Test Mode Select TRSTn JTAG Port Reset

12-channel DMA Controller

The DMA module contains 12 separate DMA channels. Ten of these may be used for peripheral-to-memory or memory-to-peripheral access. Two of these are dedicated to memory-to-memory transfers. Each DMA channel is connected to the 16-bit DMA request bus.

The request bus is a collection of requests, Serial Audio and UARTs. Each DMA channel can be used independently or dedicated to any request signal. For each DMA channel, source and destination addressing can be independently programmed to increment, decrement, or stay at the same value. All DMA addresses are physical, not virtual addresses.

Internal Boot ROM

The Internal 16 Kbyte ROM allows booting from FLASH memory, SPI or UART. Consult the EP93xx User’s Guide for operational details.

EP9312 Universal Platform SOC Processor

Electrical Specifications

Absolute Maximum Ratings

(All grounds = 0 V, all voltages with respect to 0 V)

Parameter Symbol Min Max Unit

RVDD

Power Supplies

Total Power Dissipation (Note 1) - 2 W Input Current per Pin, DC (Except supply pins) - ±10 mA Output current per pin, DC -±50mA Digital Input voltage (Note 2) -0.3 RVDD+0.3 V Storage temperature -40 +125 °C

Note: 1. Includes all power generated by AC and/or DC output loading.

2. The power supply pins are at recommended maximum values.

3. At ambient temperatures above 70° C, total power dissipation must be limited to less than 2.5 Watts.

CVDD

VDD_PLL

VDD_ADC

3.96

2.16

3.96

V V V V

WARNING: Operation beyond these limits may result in permanent damage to the device.

Normal operation is not guaranteed at these extremes.

Recommended Operating Conditions

(All grounds = 0 V, all voltages with respect to 0 V)

Parameter Symbol Min Typ Max Unit

RVDD

Power Supplies

Operating Ambient Temperature - Commercial Operating Ambient Temperature - Industrial Processor Clock Speed - Commercial FCLK - - 200 MHz

Processor Clock Speed - Industrial FCLK - - 184 MHz System Clock Speed - Commercial HCLK - - 100 MHz System Clock Speed - Industrial HCLK - - 92 MHz

CVDD

VDD_PLL

VDD_ADC

3.0

1.65

3.0 0+25+70°C

-40 +25 +85 °C

3.3

1.80

3.3

3.6

1.94

3.6

V V V V

DC Characteristics

(TA = 0 to 70° C; CVDD = VDD_PLL = 1.8; RVDD = 3.3 V; All grounds = 0 V; all voltages with respect to 0 V unless otherwise noted)

Parameter Symbol Min Max Unit

High level output voltage Iout = -4 mA (Note 4) Low level output voltage Iout = 4 mA High level input voltage (Note 5) Low level input voltage (Note 5) High level leakage current Vin = 3.3 V (Note 5) Low level leakage current Vin = 0 (Note 5)

Parameter Min Typ Max Unit

Power Supply Pins (Outputs Unloaded)

Power Supply Current: CVDD / VDD_PLL Total

RVDD

Low-Power Mode Supply Current CVDD / VDD_PLL Total

RVDD

EP9312

Universal Platform SOC Processor

0.85 × RVDD - V

-0.15 × RVDD V

0.65 × RVDD VDD + 0.3 V

-0.3 0.35 × RVDD V

-10µA

--10µA

190

1.0

240

3.5 2

mA mA

Note: 4. For open drain pins, high level output voltage is dependent on the external load.

5. All inputs that do not include internal pull-ups or pull-downs, must be externally driven for proper operation (See Table S on

page 59). If an input is not driven, it should be tied to power or ground, depending on the particular function. If an I/O pin is not

driven and programmed as an input, it should be tied to power or ground through its own resistor.

EP9312 Universal Platform SOC Processor

Timings

Timing Diagram Conventions

This data sheet contains one or more timing diagrams. The following key explains the components used in these diagrams. Any variations are clearly labelle d when they occur. Therefore, no additional meaning should be attached unless specifically stated.

Clock

High to Low

High/Low to High

Bus Change

Bus Valid

Undefined/Invalid

Valid Bus to Tristate

Bus/Signal Omission

Figure 1. Timing Diagram Drawing Key

Timing Conditions

Unless specified otherwise, the following conditions are true for all timing measurem e nts.

•T

= 0 to 70° C

• CVDD = VDD_PLL = 1.8V

•RVDD = 3.3V

• All grounds = 0 V

• Logic 0 = 0 V, Logic 1 = 3.3 V

• Output loading = 50 pF

• Timing reference levels = 1.5 V

• The Processor Bus Clock (HCLK) is programmable and is set by the user. The freq uency is typ ically between 33 MHz and 100 MHz (92 MHz for industrial conditions).

EP9312

Universal Platform SOC Processor

Memory Interface

Figure 2 through Figure 5 define the timings associated with all phases of the SDRAM. The following table contains the

values for the timings of each of the SDRAM modes.

Parameter Symbol Min Typ Max Unit

SDCLK high time SDCLK low time SDCLK rise/fall time Signal delay from SDCLK rising edge time Signal hold from SDCLK rising edge time DQMn delay from SDCLK rising edge time DQMn hold from SDCLK rising edge time DA valid setup to SDCLK rising edge time DA valid hold from SDCLK rising edge time

clk_high

clk_low

clkrf

DQd

DQh

DAs

DAh

-24ns

--8ns

1--ns

--8ns 1--ns 2--ns 3--ns

(t (t

HCLK HCLK

) / 2 ) / 2

-ns

SDRAM Load Mode Register Cycle

SDCLK

SDCSn

RASn

CASn

SDWEn

DQMn

clkrf

clk_low

clk_high

OP-Code

Figure 2. SDRAM Load Mode Register Cycle Timing Measurement

EP9312 Universal Platform SOC Processor

SDRAM Burst Read Cycle

SDCLK

SDCSn

RASn

CASn

SDWEn

DQMn

CL = 2

DQMn

CL = 3

CL = 2

clk_low

DQd

DAs

DAh

n n + 1 n + 2 n + 3

clk_high

clkrf

DQh

CL = 3

DAs

DAh

n n + 1 n + 2 n + 3

Figure 3. SDRAM Burst Read Cycle Timing Measurement

SDRAM Burst Write Cycle

SDCLK

SDCSn

RASn

CASn

SDWEn

EP9312

Universal Platform SOC Processor

clk_low

clk_high

clkrf

DQMn

n n +1 n + 2 n + 3

Figure 4. SDRAM Burst Write Cycle Timing Measurement

EP9312 Universal Platform SOC Processor

SDRAM Auto Refresh Cycle

SDCLK

SDCSn

RASn

CASn

SDWEn

clk_low

clk_high

clkrf

7bde

Note: Chip select shown as bus to illustrate multiple devices being put into auto refresh in one access

Figure 5. SDRAM Auto Refresh Cycle Timing Measurement

Static Memory Single Word Read Cycle

Parameter Symbol Min Typ Max Unit

AD setup to CSn assert time AD hold from CSn deassert time RDn assert time CSn to RDn delay time CSn assert to DQMn assert delay time DA setup to RDn deassert time DA hold from RDn deassert time

See “Timing Conditions” on page 14 for definition of HCLK.

ADs

ADh

RDpw

RDd

DQMd

DAs

DAh

EP9312

Universal Platform SOC Processor

0--ns

HCLK

--3ns

--1ns

+ 12

HCLK

0--ns

HCLK

× (WST1 + 2)

--ns

-ns

CSn

WRn

RDn

DQMn

WAIT

ADs

RDd

DQMd

DAs

Figure 6. Static Memory Single Word Read Cycle Timing Measurement

ADh

RDd

DAh

EP9312 Universal Platform SOC Processor

Static Memory Single Word Write Cycle

Parameter Symbol Min Typ Max Unit

AD setup to WRn assert time AD hold from WRn deassert time

WRn deassert to CSn deassert time CSn to WRn assert delay time WRn assert time CSn to DQMn assert delay time WRn deassert to DA transition time WRn assert to DA valid

CSn

WRn

ADs

WRd

ADs

ADh

CSh

WRd

WRpw

DQMd

DAh

DAV

- 3

HCLK

× 2

HCLK

--2ns

--1ns

HCLK

--8ns

WRpw

HCLK

--ns

× (WST1 + 1)

CSh

-ns

ADh

RDn

DQMn

WAIT

DQMd

DAV

Figure 7. Static Memory Single Word Write Cycle Timing Measurement

DAh

Static Memory 32-bit Read on 8-bit External Bus

Parameter Symbol Min Typ Max Unit

AD setup to CSn assert time CSn assert to Address transition time Address assert time AD transition to CSn deassert time AD hold from CSn deassert time RDn assert time CSn to RDn delay time CSn assert to DQMn assert delay time DA setup to AD transition time DA setup to RDn deassert time DA hold from AD transition time DA hold from RDn deassert time

ADs

AD1

AD2

AD3

ADh

RDpwL

RDd

DQMd

DAs1

DAs2

DAh1

DAh2

HCLK

-- 3ns

-- 1ns

15 - - ns

+ 12

HCLK

0- -ns 0- -ns

× (WST1 + 1)

HCLK

× (WST1 + 1)

HCLK

× (WST1 + 2)

HCLK

× (4 × WST1 + 5)

HCLK

EP9312

Universal Platform SOC Processor

--ns

-ns

CSn

WRn

RDn

DQMn

WAIT

ADs

DAs1

AD1

RDd

DQMd

AD2

DAh1

DAs1

AD2

DAh1

DAs1

AD3

DAh1

Figure 8. Static Memory Multiple Word Read 8-bit Cycle Timing Measurement

ADh

RDd

DAs2

DAh2

EP9312 Universal Platform SOC Processor

Static Memory 32-bit Write on 8-bit External Bus

Parameter Symbol Min Typ Max Unit

AD setup to WRn assert time WRn/DQMn deassert to AD transition time AD hold from WRn deassert time CSn hold from WRn deassert time CSn to WRn assert delay time WRn assert time WRn deassert time CSn to DQMn assert delay time DQMn assert time DQMn deassert time WRn / DQMn deassert to DA transition time WRn / DQMn assert to DA valid time

ADs

ADd

ADh

CSh

WRd

WRpwL

WRpwH

DQMd

DQMpwL

DQMpwH

DAh

DAV

− 3-

HCLK

× 2

--ns

-ns + 6

HCLK

7--ns

--2ns × (WST1 + 1)

HCLK

× 2(t

HCLK

-ns

× 2) + 14

HCLK

--1ns × (WST1 + 1)

HCLK

-ns

× 2) + 7

HCLK

-ns

--8ns

CSn

WRn

RDn

DQMn

WAIT

ADs

WRd

DQMd

WRpwL

DQMpwL

DAV

WRpwH

DQMpwH

DAh

ADd

WRpwL

DQMpwL

DAV

WRpwH

DQMpwH

DAh

ADd

WRpwL

DQMpwL

DAV

Figure 9. Static Memory Multiple Word Write 8-bit Cycle Timing Measurement

WRpwH

DQMpwH

DAh

ADd

DAV

CSh

ADh

DAh

Static Memory 32-bit Read on 16-bit External Bus

Parameter Symbol Min T yp Max Unit

AD setup to CSn assert time CSn assert to AD transition time AD transition to CSn deassert time AD hold from CSn deassert time RDn assert time CSn to RDn delay time CSn assert to DQMn assert delay time DA setup to AD transition time DA to RDn deassert time DA hold from AD transition time DA hold from RDn deassert time

ADs

ADd1

ADd2

ADh

RDpwL

RDd

DQMd

DAs1

DAs2

DAh1

DAh2

HCLK

--3ns

--1ns

15 - - ns

+ 12

HCLK

0--ns 0--ns

× (WST1 + 1)

HCLK

× (WST1 + 2)

HCLK

× ((2 × WST1) + 3)

HCLK

EP9312

Universal Platform SOC Processor

-ns

--ns

-ns

--ns

CSn

WRn

RDn

DQMn

WAIT

ADs

ADd1

RDd

DQMd

Figure 10. Static Memory Multiple Word Read 16-bit Cycle Timing Measurement

RDpwl

DAs1

DAh1tDAs2

ADd2

DQMh

RDh

DAh2

ADh

EP9312 Universal Platform SOC Processor

Static Memory 32-bit Write on 16-bit External Bus

Parameter Symbol Min Typ Max Unit

ADs

ADd

ADh

CSh

WRd

WRpwL

WRpwH

DQMd

DQMpwL

DQMpwH

DAh1

DAV

HCLK

– 3 -

× 2 -

-t

-ns

HCLK

+ 6

-ns

--2ns

× (WST1 + 1)

HCLK

-ns

× 2) + 14

HCLK

--1ns

× (WST1 + 1)

HCLK

-ns

× 2) + 7

HCLK

-ns

8ns

CSn

WRn

RDn

DQMn

WAIT

ADs

WRd

DQMd

DAV

WRpwL

DQpwL

DAh

WRpwH

DQpwH

ADd

DAV

WRpwL

DQpwL

ADh

CSh

DAh

Figure 11. Static Memory Multiple Word Write 16-bit Cycle Timing Measurement

Universal Platform SOC Processor

Static Memory Burst Read Cycle

Parameter Symbol Min Typ Max Unit

CSn assert to Address 1 transition time Address assert time AD transition to CSn deassert time AD hold from CSn deassert time CSn to RDn delay time CSn to DQMn assert delay time DA setup to AD transition time DA setup to CSn deassert time DA hold from AD transition time DA hold from RDn deassert time

Note: These characteristics are valid when the Page Mode Enable (Burst Mode) bit is set. See the U ser's Guide for details.

ADd1

ADd2

ADd3

ADh

RDd

DQMd

DAs1

DAs2

DAh1

DAh2

HCLK

--3ns

--1ns

15 - - ns

+ 12

HCLK

0--ns 0--ns

× (WST1 + 1)

HCLK

× (WST2 + 1)

HCLK

× (WST1 + 2)

HCLK

--ns

EP9312

-ns

CSn

WRn

RDn

DQMn

WAIT

ADs

RDd

DQMd

ADd1

DAs1

ADd2

DAh1

DAs1

DAh1

ADd2

DAs1

ADd3

DAh1

DAs2

DAh2

ADh

Figure 12. Static Memory Burst Read Cycle Timing Measurement

EP9312 Universal Platform SOC Processor

Static Memory Burst Write Cycle

Parameter Symbol Min Typ Max Unit

AD setup to WRn assert time AD hold from WRn deassert time WRN/DQMn deassert to AD transition time CSn hold from WRn deassert time CSn to WRn assert delay time CSn to DQMn assert delay time DQMn assert time DQMn deassert time WRn assert time WRn deassert time WRn/DQMn deassert to DA transition time WRn/DQMn assert to DA valid time

ADs

ADh

ADd

CSh

WRd

DQMd

DQpwL

DQpwH

WRpwL

WRpwH

DAh

DAv

Note: These characteristics are valid when the Page Mode Enable (Burst Mode) bit is set. See the User's Guide for details.

HCLK

− 3 × 2

× (WST1 + 1)

HCLK

× (WST1 + 11)

HCLK

+ 6

HCLK

2ns 1ns

× 2) + 14

HCLK

× 2) + 7

HCLK

8ns

ns ns ns ns

ns ns ns ns ns

CSn

WRn

DQMn

WAIT

DQMd

ADs

WRd

DAv

WRpwL

DQpwL

ADd

WRpwH

DQpwH

DAh

ADh

CSh

Figure 13. Static Memory Burst Write Cycle Timing Measurement

Static Memory Single Read Wait Cycle

Parameter Symbol Min Typ Max Unit

CSn assert to WAIT time WAIT assert time WAIT to CSn deassert delay time

CSn

WRn

WAITd

WAITpw

CSnd

Universal Platform SOC Processor

HCLK

× 2 × 3

HCLK

× (WST1-2)

× 510

× 5

HCLK

EP9312

ns ns ns

RDn

DQMn

WAIT

WAITd

Figure 14. Static Memory Single Read Wait Cycle Timing Measurement

WAITpw

CSnd

EP9312 Universal Platform SOC Processor

Static Memory Single Write Wait Cycle

Parameter Symbol Min Typ Max Unit

WAIT to WRn deassert delay time CSn assert to WAIT time WAIT assert time WAIT to CSn deassert delay time

CSn

WRn

WRd

WAITd

WAITpw

CSnd

× 2

HCLK

× 2

HCLK

× 3

HCLK

WRd

HCLK

× 4

HCLK

× (WST1-2)

× 510

× 5

HCLK

ns ns ns ns

RDn

DQMn

WAIT

WAITd

Figure 15. Static Memory Single Write Wait Cycle Timing Measurement

WAITpw

CSnd

Static Memory Turnaround Cycle

Parameter Symbol Min Typ Max Unit

CSnX deassert to CSnY assert time

Notes: 1. X and Y represent any two chip select numbers.

2. IDCY occurs on read-to-write and write-to-read.

3. IDCY is honored when going from a asynchronous device (CSx) to a synchronous device (/SDCSy).

CSnX

CSnY

BTcyc

EP9312

Universal Platform SOC Processor

× (IDCY+1)

BTcyc

HCLK

-ns

WRn

RDn

DQMn

WAIT

Figure 16. Static Memory Turnaround Cycle Timing Measurement

EP9312 Universal Platform SOC Processor

IDE Interface

Parameter Symbol

Cycle time (min) (Notes 1, 4, 5) Address valid to DIORn / DIOWn setup (min) (Note 4) DIORn / DIOWn pulse width 8-bit (min) (Note 1, 4) DIORn / DIOWn recovery time (min) (Note 1, 4) DIOWn data setup (min) (Note 4) DIOWn data hold (min) DIORn data setup (min) DIORn data hold (min) DIORn data high impedance state (max) (Note 2, 4) DIORn / DIOWn to address valid hold (min) (Note 4) Read Data Valid to IORDY (min)

active (if IORDY initially low after t IORDY Setup time (Note 3, 4) IORDY Pulse Width (max) (Note 4) IORDY assertion to release (max) DIOWn assert to data valid (max)

) (Note 4)

DDV

Mode 0

(in ns)

1250 1250 1250 1250 1250

Mode 1

(in ns)

Mode 2

(in ns)

600 383 330 180 120

70 50 30 30 25

290 290 290 80 70

---7025

60 45 30 30 20

00000

20 20 20 20 20

00000 30 30 30 30 30 20 15 10 10 10

00000

35 35 35 35 35

55555 10 10 10 10 10

Note: 1. t0 is the minimum total cycle time, t2 is the minimum DIORn / DIOWn assertion time, and t2i is the minimum DIORn / DIOWn

negation time. A host implementation shall lengthen t

and/or t2i to ensure that t0 is equal to or greater than the value

reported in the devices IDENTIFY DEVICE data. A device implementation shall support any legal host implementation.

Mode 3

(in ns)

Mode 4

(in ns)

2. This parameter specifies the time from the negation edge of DIORn to the time that the data bus is released by the device.

3. The delay from the activation of DIORn or DIOWn until the state of IORDY is first sampled. If IORDY is inactive then the host shall wait until IORDY is active before the register transfer cycle is completed. If the device is not driving IORDY negated at

after the activation of DIORn or DIOWn, then t5 shall be met and tRD is not applicable. If the device is driving IORDY

the t

negated at the time t

after the activation of DIORn or DIOWn, then tRD shall be met and t5 is not applicable.

4. Timings based upon software control. See User’s Guide.

5. ATA / ATAPI standards prior to ATA / ATAPI-5 inadvertently specified an incorrect value for mode 2 time t

by utilizing the

16-bit PIO value.

6. All IDE timing is based upon HCLK = 100 MHz.

ADDR valid

(Note 1)

DIORn/

DIOWn

WRITE

DD (7:0)

(Note 2)

READ

DD (7:0)

(Note 2)

IORDY

(Note 3,3-1)

IORDY

(Note 3,3-2)

EP9312

Universal Platform SOC Processor

DDV

IORDY

(Note 3,3-3)

Note: 1. Device address consists of signals IDECS0n, IDECS1n and IDEDA (2:0)

2. Data consists of DD (7:0)

3. The negation of IORDY by the device is used to extend the register transfer cycle. The determination of whether the cycle is to be extended is made by the host after t

are described in the following three cases:

3-1 Device never negates IORDY, devices keeps IORDY released: no wait is generated. 3-2 Device negates IORDY before t

and may be asserted for no more than t

3-3 Device negates IORDY before t

before release: wait generated. The cycle completes after IORDY is reasserted. For cycles where a wait is generated and DIORn is asserted, the device shall place read data on DD (7:0) for t

Figure 17. Register Transfer to/from Device

from the assertion of DIORn or DIOWn. The assertion and negation or IORDY

, but causes IORDY to be asserted before tA. IORDY is released prior to negation

before release: no wait generated.

. IORDY is released prior to negation and may be asserted for no more than t

before asserting IORDY.

EP9312 Universal Platform SOC Processor

PIO Data Transfers

Parameter Symbol

Cycle time (min) (Note 1, 4) Address valid to DIORn / DIOWn setup (min) (Note 4) DIORn / DIOWn 16-bit (min) (Note 1, 4) DIORn / DIOWn recovery time (min) (Note 1, 4) DIOWn data setup (min) (Note 4) DIOWn data hold (min) DIORn data setup (min) DIORn data hold (min) DIORn data high impedance state (max) (Note 2, 4) DIORn / DIOWn to address valid hold (min) (Note 4) Read Data Valid to IORDY (min)

active (if IORDY initially low after t IORDY Setup time (Note 3, 4) IORDY Pulse Width (max) (Note 4) IORDY assertion to release (max) DIOWn assert to data valid (max)

) (Note 4)

DDV

t t t

t t t t

t t t

Mode 0

(in ns)

0 1 2

3 4 5 6

A B C

600 383 240 180 120

165 125 100 80 70

1250 1250 1250 1250 1250

Mode 1

(in ns)

Mode 2

(in ns)

70 50 30 30 25

---7025

60 45 30 30 20

00000

20 20 20 20 20

00000 30 30 30 30 30 20 15 10 10 10

00000

35 35 35 35 35

55555 10 10 10 10 10

Note: 1. t0 is the minimum total cycle time, t2 is the minimum DIORn / DIOWn assertion time, and t2i is the minimum DIORn / DIOWn

negation time. A host implementation shall lengthen t

and/or t2i to ensure that t0 is equal to or greater than the value

reported in the devices IDENTIFY DEVICE data. A device implementation shall support any legal host implementation.

2. This parameter specifies the time from the negation edge of DIORn to the time that the data bus is released by the device.

after the activation of DIORn or DIOWn, then t5 shall be met and tRD is not applicable. If the device is driving IORDY

negated at the time t

after the activation of DIORn or DIOWn, then tRD shall be met and t5 is not applicable.

4. Timings based upon software control. See User’s Guide.

5. All IDE timing is based upon HCLK = 100 MHz.

Mode 3

(in ns)

Mode 4

(in ns)

ADDR valid

(Note 1)

DIORn/

DIOWn

WRITE

DD(15:0)

(Note 2)

READ

DD(15:0)

(Note 2)

IORDY

(Note 3,3-1)

IORDY

(Note 3,3-2)

EP9312

Universal Platform SOC Processor

DDV

IORDY

(Note 3,3-3)

Note: 1. Device address consists of signals IDECS0n, IDECS1n and IDEDA (2:0)

2. Data consists of DD (15:0)

3. The negation of IORDY by the device is used to extend the register transfer cycle. The determination of whether the cycle is to be extended is made by the host after t

are described in the following three cases:

3-1 Device never negates IORDY, devices keeps IORDY released: no wait is generated. 3-2 Device negates IORDY before t

and may be asserted for no more than t

3-3 Device negates IORDY before t

before release: wait generated. The cycle completes after IORDY is reasserted. For cycles where a wait is generated and DIORn is asserted, the device shall place read data on DD (15:0) for t

Figure 18. PIO Data Transfer to/from Device

from the assertion of DIORn or DIOWn. The assertion and negation or IORDY

, but causes IORDY to be asserted before tA. IORDY is released prior to negation

before release: no wait generated.

. IORDY is released prior to negation and may be asserted for no more than t

before asserting IORDY.

EP9312 Universal Platform SOC Processor

Ultra DMA Data Transfer

Figure 19 through Figure 28 define the timings associated with all phases of Ultra DMA bursts. The following table

contains the values for the timings for each of the Ultra DMA modes. Timing reference levels = 1.5 V

Parameter Symbol

Cycle time allowing for asymmetry and clock variations (from DSTROBE edge to DSTROBE edge)

Two-cycle time allowing for clock variations (from rising edge to next rising edge or from falling edge to next falling edge of DSTROBE)

Cycle time allowing for asymmetry and clock variations (from HSTROBE edge to HSTROBE edge)

Two-cycle time allowing for clock variations (from rising edge to next rising edge or from falling edge to next falling edge of HSTROBE)

Data setup time at recipient (Read) Data hold time at recipient (Read) Data valid setup time at sender (Write) (Note 2)

(from data valid until STROBE edge) Data valid hold time at sender (Write) (Note 2)

(from STROBE edge until data may become invalid) First STROBE time (for device to first negate DSTROBE from STOP

during a data in burst) Limited interlock time (Note 3) Interlock time with minimum (Note 3) Unlimited interlock time (Note 3) Maximum time allowed for output drivers to release

(from asserted or negated) Minimum delay time required for output Drivers to assert or negate (from released) Envelope time (from DMACKn to STOP and HDMARDYn during data in

burst initiation and from DMACKn to STOP during data out burst initiation) Ready-to-final-STROBE time (no STROBE edges shall be sent this long

after negation of DMARDYn) Ready-to-pause time

(that recipient shall wait to pause after negating DMARDYn) Maximum time before releasing IORDY Minimum time before driving STROBE (Note 4) Setup and hold times for DMACKn (before assertion or negation) Time from STROBE edge to negation of DMARQ or assertion of STOP

(when sender terminates a burst)

CYCRD

2CYCRD

CYCWR

2CYCWR

DVS

DVH

MLI

ZAH

ZAD

ENV

RFS

IORDYZ

ZIORDY

ACK

Mode 0

(in ns)

Mode 1

(in ns)

Mode 2

(in ns)

Mode 3

(in ns)

min max min max min max min max

112 - 73 - 54 - 39 -

230 - 154 - 115 - 86 -

230 - 170 - 130 - 100 -

460 - 340 - 260 - 200 -

15-10-7-7-

8-8-8-8-

70 - 48 - 30 - 20 -

6-6-6-6-

0 230 0 200 0 170 0 130 0 150 0 150 0 150 0 100

20 - 20 - 20 - 20 -

0-0-0-0-

-10-10-10-10

20 - 20 - 20 - 20 -

0-0-0-0-

20 70 20 70 20 70 20 55

-75-70-60-60

160 - 125 - 100 - 100 -

-20-20-20-20

0-0-0-0-

20 - 20 - 20 - 20 50 - 50 - 50 - 50 -

Note: 1. Timing parameters shall be measured at the connector of the sender or receiver to which the parameter applies.

2. The test load for t

DVS

and t

shall be a lumped capacitor load with no cable or receivers. Timing for t

DVH

DVS

and t

DVH

shall be

met for all capacitive loads from 15 to 40 pf where all signals have the same capacitive load value.

3. t

, t

and tLI indicate sender-to-recipient or recipient-to-sender interlocks, i.e., either sender or recipient is waiting for the

MLI

other to respond with a signal before proceeding. t time-out that has a defined minimum. t

4. t

may be greater than t

ZIORDY

ENV

is a limited time-out that has a defined maximum.

since the device has a pull up on IORDYn giving it a known state when released.

is an unlimited interlock that has no maximum time value. t

is a limited

MLI

5. All IDE timing is based upon HCLK = 100 MHz.

DMARQ

(device)

DMACKn

(host)

STOP

(host)

HDMARDYn

(host)

DSTROBE

(device)

DD (15:0)

ACK

ZIORDY

ENV

EP9312

Universal Platform SOC Processor

ZAD

DVS

DVH

IDEDA[2:0]

ACK

IDECS0n,

IDECS1n

Note: The definitions for the DIOWn:STOP, DIORn:HDMARDYn:HSTROBE and IORDY:DDMARDYn:DSTROBE signal lines are not

in effect until DMARQ and DMACKn are asserted.

Figure 19. Initiating an Ultra DMA data-in Burst

EP9312 Universal Platform SOC Processor

DSTROBE

(device)

DVH

DD (15:0)

(device)

DSTROBE

(host)

DD (15:0)

(host)

Note: DD (15:0) and DSTROBE signals are shown at both the host and the device to emphasize that cable settling time as well as

cable propagation delay shall not allow the data signals to be considered stable at the host until some time after they are driven by the device.

2CYCRD

CYCRD

DVS

Figure 20. Sustained Ultra DMA data-in Burst

CYCRD

DVH

2CYCRD

DVS

DVH

DMARQ

(device)

DMACKn

(host)

STOP

(host)

HDMARDYn

(host)

DSTROBE

(device)

DD(15:0)

(device)

RFS

Figure 21. Host Pausing an Ultra DMA data-in Burst

DMARQ

(device)

DMACKn

(host)

Universal Platform SOC Processor

MLI

EP9312

ACK

STOP

(host)

ACK

HDMARDYn

(host)

DSTROBE

(device)

ZAH

DD (15:0)

DVS

CRC

IDEDA[2:0]

ACK

IDECS0n,

IDECS1n

Note: The definitions for the DIOWn:STOP, DIORn:HDMARDYn:HSTROBE and IORDY :DDMARDYn:DSTROBE signal lines are no

longer in effect after DMARQ and DMACKn are negated.

Figure 22. Device Terminating an Ultra DMA data-in Burst

IORDYZ

DVH

EP9312 Universal Platform SOC Processor

DMARQ

(device)

DMACKn

(host)

STOP

(host)

HDMARDYn

(host)

RFS

DSTROBE

(device)

DD (15:0)

MLI

ZAH

MLI

DVS

ACK

IORDYZ

DVH

CRC

IDEDA[2:0]

ACK

IDECS0n,

IDECS1n

Note: The definitions for the DIOWn:STOP, DIORn:HDMARDYn:HSTROBE and IORDY :DDMARDYn:DSTROBE signal lines are no

longer in effect after DMARQ and DMACKn are negated.

Figure 23. Host Terminating an Ultra DMA data-in Burst

DMARQ

(device)

DMACKn

(host)

EP9312

Universal Platform SOC Processor

ACK

ENV

STOP

(host)

ZIORDY

DDMARDYn

(device)

HSTROBE

(host)

ACK

DD (15:0)

DVS

IDEDA[2:0]

ACK

IDECS0n,

IDECS1n

Note: The definitions for the DIOWn:STOP, DIORn:HDMARDYn:HSTROBE and IORDY:DDMARDYn:DSTROBE signal lines are not

in effect until DMARQ and DMACKn are asserted.

Figure 24. Initiating an Ultra DMA data-out Burst

DVH

EP9312 Universal Platform SOC Processor

HSTROBE

(host)

DVH

DD (15:0)

(host)

HSTROBE

(device)

DD (15:0)

(device)

Note: DD (15:0) and HSTROBE signals are shown at both the device and the host to emphasize that cable settling time as well as

cable propagation delay shall not allow the data signals to be considered stable at the device until some time after they are driven by the host.

2CYCWR

CYCWR

DVS

Figure 25. Sustained Ultra DMA data-out Burst

CYCWR

DVH

DVS

2CYCWR

DVH

DMARQ

(device)

DMACKn

(host)

STOP

(host)

DDMARDYn

(device)

HSTROBE

(host)

DD (15:0)

(host)

Note: 1. The device may negate DMARQ to request termination of the Ultra DMA burst no sooner than t

negated.

2. If the t

RFS

timing is not satisfied, the device may receive zero, one, or two more data words from the host.

Figure 26. Device Pausing an Ultra DMA data-out Burst

after DDMARDYn is

DMARQ

(device)

DMACKn

(host)

STOP

(host)

DDMARDYn

(device)

HSTROBE

(host)

DD (15:0)

(host)

EP9312

Universal Platform SOC Processor

DVS

MLI

ACK

IORDYZ

ACK

DVH

CRC

IDEDA[2:0]

ACK

IDECS0n,

IDECS1n

Note: The definitions for the DIOWn:STOP, IORDY:DDMARDYn:DSTROBE and DIORn:HDMARDYn:HSTROBE signal lines are no

longer in effect after DMARQ and DMACKn are negated.

Figure 27. Host Terminating an Ultra DMA data-out Burst

EP9312 Universal Platform SOC Processor

DMARQ

(device)

DMACKn

(host)

STOP

(host)

DDMARDYn

(device)

HSTROBE

(host)

DD (15:0)

(host)

IDEDA[2:0]

IDECS0n,

IDECS1n

Note: The definitions for the DIOWn:STOP, IORDY:DDMARDYn:DSTROBE and DIORn:HDMARDYn:HSTROBE signal lines are no

RFS

longer in effect after DMARQ and DMACKn are negated.

Figure 28. Device Terminating an Ultra DMA data-out Burst

MLI

DVS

ACK

IORDYZ

DVH

CRC

ACK

Ethernet MAC Interface

Parameter Symbol

TXCLK cycle time TXCLK high time TXCLK low time TXCLK to signal transition delay time TXCLK rise/fall time RXCLK cycle time RXCLK high time RXCLK low time RXDVAL / RXERR setup time RXDVAL / RXERR hold time RXCLK rise/fall time MDC cycle time MDC high time MDC low time MDC rise/fall time MDIO setup time (STA sourced) MDIO hold time (STA sourced) MDC to MDIO signal transition delay time

(PHY sourced)

TX_per

TX_high

TX_low

TXd

TXrf

RX_per

RX_high

RX_low

RXs

RXh

RXrf

MDC_per

MDC_high

MDC_low

MDCrf

MDIOs

MDIOh

MDIOd

EP9312

Universal Platform SOC Processor

Min Typ Max

10 Mbit

mode

100 Mbit

mode

10 Mbit

mode

100 Mbit

mode

10 Mbit

mode

100 Mbit

mode

--40040--ns 140 14 200 20 260 26 ns 140 14 200 20 260 26 ns

0 0 10 10 25 25 ns

----55ns

--40040--ns 140 14 200 20 260 26 ns 140 14 200 20 260 26 ns

1010----ns 1010----ns

----55ns

--400400--ns 160160----ns 160160----ns

----55ns

1010----ns 1010----ns

----300300ns

Unit

STA - Station - Any device that contains an IEEE 802.11 conforming Medium Access Control (MAC) and physical layer

(PHY) interface to the wireless medium.

PHY - Ethernet physical layer interface.

EP9312 Universal Platform SOC Processor

TXCLK

TXD[3:0]/

TXEN/

TXERR

RXCLK

RXD[3:0]/

RXDVAL/

RXERR

MDC

TXd

RXs

TX_high

TX_per

RXh

TX_low

RX_low

RX_per

RX_high

MDIO

(Sourced

by STA)

MDC

MDIO

(Sourced

by PHY)

MDC_high

MDC_per

MDC_low

MDIOd

Figure 29. Ethernet MAC Timing Measurement

MDIOs

MDIOh

Audio Interface

The following table contains the values for the timings of each of the SPI modes.

Parameter Symbol Min Typ Max Unit

SCLK cycle time SCLK high time SCLK low time SCLK rise/fall time Data from master valid delay time Data from master setup time Data from master hold time Data from slave setup time Data from slave hold time

Note: The tspix_clk is programmable by the user.

clk_per

clk_high

clk_low

clkrf

DMd

DMs

DMh

DSs

DSh

- tspix_clk - ns

- (tspix_clk) / 2 - ns

- (tspix_clk) / 2 - ns 1-8ns

--3ns 20 - - ns 40 - - ns 20 - - ns 40 - - ns

EP9312

Universal Platform SOC Processor

EP9312 Universal Platform SOC Processor

Texas Instruments’ Synchronous Serial Format

clk_per

clk_high

SCLK

clk_low

SFRM

clkrf

SSPTXD/

SSPRXD

Microwire

SCLK

SFRM

SSPTXD

SSPRXD

clk_high

MSB

clk_per

clk_low

MSB LSB

4 to 16 bits

Figure 30. TI Single Transfer Timing Measurement

clkrf

LSB

8-bit control

MSB LSB

4 to 16 bits output data

Figure 31. Microwire Frame Format, Single Transfer

Motorola SPI

SCLK

(SPO=0)

SCLK

(SPO=1)

clk_high

clk_per

clk_low

EP9312

Universal Platform SOC Processor

clkrf

SSPTXD

(master)

SSPRXD

(slave)

SFRM

DMs

DMd

DMh

LSBMSB

DSs

DSh

MSB LSB

Figure 32. SPI Format with SPH=1 Timing Measurement

EP9312 Universal Platform SOC Processor

Inter-IC Sound - I2S

Parameter Symbol Min Typ Max Unit

SCLK cycle time SCLK high time SCLK low time SCLK rise/fall time SCLK to LRCLK assert delay time Hold between SCLK assert then LRCLK deassert

Hold between LRCLK deassert then SCLK assert SDI to SCLK deassert setup time SDI from SCLK deassert hold time SCLK assert to SDO delay time SDO from SCLK assert hold time

clk_per

clk_high

clk_low

clkrf

LRd

LRh

SDIs

SDIh

SDOd

SDOh

i2s_clk

) / 2 ) / 2

-ns

148ns

--3ns

0--ns

12 - - ns

0--ns

--9ns

1--ns

Note: t

SCLK

LRCLK

SDI

SDO

is programmable by the user.

i2s_clk

clk_high

clk_per

LRd

clk_low

SDOd

SDIs

LRh

SDOh

SDIh

clkrf

Figure 33. Inter-IC Sound (I

S) Timing Measurement

AC’97

Parameter Symbol Min Typ Max Unit

ABITCLK input cycle time ABITCLK input high time ABITCLK input low time ABITCLK input rise/fall time ASDI setup to ABITCLK falling ASDI hold after ABITCLK falling ASDI input rise/fall time ABITCLK rising to ASDO / ASYNC valid, C ASYNC / ASDO rise/fall time, C

= 55 pF t

clk_hightclk_low

clk_per

= 55 pF t

clk_per

clk_high

clk_low

clkrf

rfin

rfout

EP9312

Universal Platform SOC Processor

- 81.4 - ns 36 - 45 ns 36 - 45 ns

2-6ns 10 - - ns 10 - - ns

2-6ns

2 - 15 ns

2-6ns

ABITCLK

ASDI

ASDO

ASYNC

clkrf

rfout

Figure 34. AC ‘97 Configuration Timing Measurement

rfout

rfin

rfout

EP9312 Universal Platform SOC Processor

LCD Interface

Parameter Symbol Min Typ Max Unit

SPCLK rise/fall time SPCLK rising edge to control signal transition time SPCLK rising edge to data transition time Data valid time

clkr

2-8ns

--3ns

- - 10 ns

SPCLK

-ns

SPCLK

HSYNC/

V_CSYNC/

BLANK/ BRIGHT

P [17:0]

clkrf

Figure 35. LCD Timing Measurement

clkrf

Universal Platform SOC Processor

ADC

Parameter Comment Value Units

Resolution Integral non-linearity 0.01%

Offset error ±15 mV Full scale error 0.2%

Maximum sample rate

Channel switch settling time Noise (RMS) - typical 120 µV

Note: ADIV refers to bit 16 in the KeyTchClkDiv register.

ADIV = 0 means the input clock to the ADC module is equal to the external 14.7456 MHz clock divided by 4. ADIV = 1 means the input clock to the ADC module is equal to the external 14.7456 MHz clock divided by 16.

61A8

No missing codes

Range of 0 to 3.3 V

ADIV = 0 ADIV = 1

50K counts (approximate)

3750

925 500

Samples per second Samples per second

EP9312

µs

0000 FFFF

9E58

A/D Converter Transfer Function

(approximately ±25,000 counts)

Figure 36. ADC Transfer Function

Vref/2 Vref

Using the ADC: This ADC has a state-machine based conversion en gine that automates the conversion process. The initiator for a

conversion is the read access of the TSXYResult register by the CPU. The data returned from reading this register contains the result as well as the status bit indicating the state of the ADC. However, this peripheral requires a delay between each successful conve rsion and the issue of the next conversion command, or else the returned value of successive samples may not reflect the analog input. Since the state of the ADC state machine is r eturned through the same channel used to initiate the conversion process, there must be a delay inserted after every complete conversion. Note that reading TSXYResult during a conversion will not affect the result of the ongoing process.

The following is a recommended procedure for safely polling the ADC from software:

1. Read the TSXYResult register into a local variable to initiate a conversion.

2. If the value of bit 31 of the local variable is '0' then repeat step 1.

3. Delay long enough to meet the maximum sample rate as shown above.

4. Mask the local variable with 0xFFFF to remove extraneous data.

5. If signed mode is used, do a sign extend of the lower halfword.

6. Return the sampled value.

EP9312 Universal Platform SOC Processor

JTAG

Parameter Symbol Min Max Units

TCK clock period TCK clock high time TCK clock low time TMS / TDI to clock rising setup time Clock rising to TMS / TDI hold time JTAG port clock to output JTAG port high impedance to valid output JTAG port valid output to high impedance

TMS

clk_per

clk_high

clk_low

JPs

JPh

JPco

JPzx

JPxz

100 - ns

50 - ns 50 - ns 20 - ns 45 - ns

-30ns

TDI

TCK

TDO

clk_high

JPzx

clk_per

clk_low

JPs

JPco

Figure 37. JTAG Timing Measurement

JPh

JPxz

352 Pin BGA Package Outline

352-Ball PBGA Diagram

E3 E

EP9312

Universal Platform SOC Processor

Ø Ø

0.30

0.10

C C

Øb

DETAIL B

-B-

-A-

(Top View)

(Bottom View)

-C-

Figure 38. 352 Pin PBGA Pin Diagram

DETAIL A'

ddd

EP9312 Universal Platform SOC Processor

Table R. 352 Pin Diagram Dimensions

Symbol

dimension in mm dimension in inches

MIN NOM MAX MIN NOM MAX

A 2.20 2.30 2.50 0.087 0.092 0.098 A1 - 0.60 - - 0.0 24 A2 1.12 1.17 1.22 0.044 0.046 0.048

b - 0.75 - - 0.030 -

c 0.51 0.56 0.61 0.020 0.022 0.024

D 26.80 27.00 27.20 1.055 1.063 1.071 D1 - 24.13 - - 0.950 D2 23.80 24.00 24.20 0.937 0.945 0.953 D3 17.95 18.00 18.05 0.707 0.709 0.711

E 26.80 27.00 27.20 1.055 1.063 1.071 E1 - 24.13 - - 0.950 E2 23.80 24.00 24.20 0.937 0.945 0.953 E3 17.95 18.00 18.05 0.707 0.709 0.711

e - 1.27 - - 0.050 -

ddd - - 0.15 - - 0.006

q 30° TYP 30° TYP

Note: 1. Controlling Dimension: Millimeter.

2. Primary Datum C and seating plane are defined by the spherical crowns of the solder balls.

3. Dimension b is measured at the maximum solder ball diameter, parallel to Primary Datum C.

4. There shall be a minimum clearance of 0.25 mm between the edge of the solder ball and the body edge.

5. Reference Document: JEDEC MO-151, BAL-2

352 Pin BGA Pinout (Bottom View)

The following table shows the 352 pin BGA pinout. (For better understanding, compare the coordinates on the x and y axis on Figure 40, "352 PIN BGA PINOUT", on page 55 with Figure 38, "352 Pin PBGA Pin Diagram", on page 53.

• VDD_core is CVDD.

• VDD_ring is RVDD.

• All core and ring grounds are connected together and are labe lled GND.

• Other special power requirements are clearly labelled (i.e. H18=ADC_VDD and H19=ADC_GND).

• NC means that the pin is not connected.

Figure 40. 352 PIN BGA PINOUT

1 2 34 5678910111213141516171819 20

AD[10

Y HSYNC DD[1] DD[12] P[2] AD[15] DA[6] DA[4]

W P[12] P[9] DD[0] P[5] P[3] DA[7] DA[5]

RVD

CVD

RVD

AD[1

AD[14]AD[12

GND

CVD

CVDDCVD

RDN

V P[16] P[11] P[8] DD[15] DD[13] P[1]

U AD[0] P[15] P[10] P[7] P[6] P[4] P[0]

T DA[8] BLANK P[13] SPCLK

R AD[2] AD[1] P[17] P[14] RVDD

P AD[4] DA[10] DA[9] BRIGHT RVDD

N DA[13] DA[12] DA[11] AD[3] CVDD

M AD[7] DA[14] AD[6] AD[5] CVDD GND GND GND GND GND GND GND COL[4] COL[3] COL[6] CSN[0] M

L DA[18] DA[17] DA[16] DA[15] GND GND GND GND GND GND GND CVDD COL[5] COL[7] RSTON PRSTN L K AD[22] DA[20] AD[21] DA[19] RVDD GND GND GND GND GND GND CVDD SYM SYP SXM SXP K

J DA[21]

DQMN[

SDCSN[0]SDCSN[1]SDWE

SDCSN[

E AD[23] DA[23] DA[26] CSN[6] GND GND

D AD[24] DA[25] DD[11]

C CSN[1] CSN[3] AD[20] DA[29] DD[10] DD[6] DD[2] MDC

B CSN[2] DA[31] DA[30] DA[27] DD[7] DD[3] WRN MDIO

A CSN[7] DA[28] AD[18] DD[8] DD[4]

DQMN[0]DQMN[

CASN RASN

DA[22] DA[24] AD[25] RVDD GND

1 2 34 5678910111213141516171819 20

DQMN[2

SDCSN[

SDCLK RVDD

SDCLK

V_CSYNCDD[1

GND GND GND GND GND GND GND CVDD

]

CVDD GND GND GND GND GND GND RVDD

AD[19] DD[9] DD[5]

DA[1] AD[8]

]

AD[11

]

AD[13

]

CVD

GND GND GND GND GND GND GND GND XTALO COL[0] COL[1] COL[2] N

AD[16]MIIRXD[2]MIITXD[

MIIRXD[

RXCLKMIIRXD[0]RXDVALMIITXD[

IDECS1NIDEDA[

AD[9]

IDECS0NIDEDA[

DA[2]

DA[3] DA[0] DSRN BOOT[1] NC SSPRX1 INT[1]

RVDD GND GND RVDD CVDD GND INT[0]

RVDD GND GND RVDD CVDD CVDD GND ASDI DIOWN

TXCLK

RXERR

IDEDA[

TXEN NC NC NC

MIITXD[

DTRN TDO BOOT[0] EEDAT ASDO SFRM1 RDLED USBP[1] ABITCLK Y

TCK TMS EECLK SCLK1 GRLED INT[3] SLA[1] SLA[0] RXD[2] W

TDI GND ASYNC SSPTX1 INT[2] RTSN USBP[0] CTSN TXD[0] V

NC NC NC NC NC NC USBP[2] IORDY DMACKN C

CRS NC NC NC NC

TXERR CLD NC NC NC

PWMO

USBM[1

CVDD GND RVDD RVDD ROW[0] ROW[3]

RVDD RVDD XTALI

RVDD RVDD EGPIO[7]

CVDD GND GND EGPIO[2]

EGPIO[

14]

USBM[0] RXD[1] TXD[1] ROW[1] U

RXD[0] TXD[2] ROW[2] ROW[4] T

]

PLL_VD

RTCXTA

RTCXTALOADC_VDDADC_G

NC USBM[2] ARSTN DIORN EGPIO[1] D

EGPIO[1

EGPIO[12]EGPIO[

XM YP YM J

EGPIO[9]EGPIO[10]EGPIO[11

EGPIO[4]EGPIO[6

EGPIO[0]EGPIO[3

NC WAITN TRSTN B

15]

PLL_GN

ROW[6] ROW[7] P

]

NC NC A

ROW[5] R

XP H

]

EGPIO[8] F

EGPIO[5] E

Universal Platform SOC

EP9312

EP9312 Universal Platform SOC Processor

Pin List

The following Plastic Ball Grid Array (PBGA) ball assignment table is sorted in order of ball.

Ball Signal Ball Signal Ball Signal Ball Signal

A1 CSN[7] E9 RVDD L3 DA[16] T13 CVDD A2 DA[28] A3 AD[18] A4 DD[8] A5 DD[4] A6 AD[17] A7 RDN A8 RXCLK

A9 MIIRXD[0 ] A10 RXDVAL A11 MIITXD[2] A12 TXERR A13 CLD A14 NC A15 NC A16 NC A17 EGPIO[12] A18 EGPIO[15] A19 NC A20 NC

B1 CSN[2]

B2 DA[31]

B3 DA[30]

B4 DA[27]

B5 DD[7]

B6 DD[3]

B7 WRN

B8 MDIO

B9 MIIRXD[1 ] B10 RXERR B11 MIITXD[1] B12 CRS B13 NC B14 NC B15 NC B16 NC B17 EGPIO[13] B18 NC B19 WAITN B20 TRSTN

C1 CSN[1] C2 CSN[3]

E10 GND L4 DA[15] T14 GND

E11 GND L5 GND T15 INT[0] E12 RVDD L8 GND T16 USBM[1] E13 CVDD L9 GND T17 RXD[0] E14 CVDD L10 GND T18 TXD[2] E15 GND L11 GND T19 ROW[2] E16 ASDI L12 GND T20 ROW[4] E17 DIOWN L13 GND U1 AD[0] E18 EGPIO[0] L16 CVDD U2 P[15] E19 EGPIO[3] L17 COL[5] U3 P[10] E20 EGPIO[5] L18 COL[7] U4 P[7]

F1 SDCSN[3] L19 RSTON U5 P[6] F2 DA[22] L20 PRSTN U6 P[4] F3 DA[24] M1 AD[7] U7 P[0] F4 AD[25] M2 DA[14] U8 AD[13] F5 RVDD M3 AD[6] U9 DA[3] F6 GND M4 AD[5] U10 DA[0]

F7 CVDD M5 CVDD U11 DSRN F14 CVDD M8 GND U12 BOOT[1] F15 GND M9 GND U13 NC F16 GND M10 GND U14 SSPRX1 F17 EGPIO[2] M11 GND U15 INT[1] F18 EGPIO[4] M12 GND U16 PWMOUT F19 EGPIO[6] M13 GND U17 USBM[0] F20 EGPIO[8] M16 GND U18 RXD[1]

G1 SDCSN[0] M17 COL[4] U19 TXD[1] G2 SDCSN[1] M18 COL[3] U20 ROW[1] G3 SDWEN M19 COL[6] V1 P[16] G4 SDCLK M20 CSN[0] V2 P[11] G5 RVDD N1 DA[13] V3 P[8]

G6 RVDD N2 DA[12] V4 DD[15] G15 RVDD N3 DA[11] V5 DD[13] G16 RVDD N4 AD[3] V6 P[1] G17 EGPIO[7] N5 CVDD V7 AD[14] G18 EGPIO[9] N6 CVDD V8 AD[12] G19 EGPIO[10] N8 GND V9 DA[2] G20 EGPIO[11] N9 GND V10 IDECS0N

H1 DQMN[3] N10 GND V11 IDEDA[2]

H2 CASN N11 GND V12 TDI

H3 RASN N12 GND V13 GND

H4 SDCSN[2] N13 GND V14 ASYNC

Universal Platform SOC Processor

Ball Signal Ball Signal Ball Signal Ball Signal

C3 AD[20] H5 CVDD N15 GND V15 SSPTX1 C4 DA[29] C5 DD[10] C6 DD[6] C7 DD[2] C8 MDC C9 MIIRXD[3]

C10 TXCLK

C11 MIITXD[0] C12 NC C13 NC C14 NC C15 NC C16 NC C17 NC C18 USBP[2] C19 IORDY C20 DMACKN

D1 AD[24] D2 DA[25] D3 DD[11] D4 SDCLKEN D5 AD[19] D6 DD[9] D7 DD[5] D8 AD[16] D9 MIIRXD[2]

D10 MIITXD[3]

D11 TXEN D12 NC D13 NC D14 NC D15 EGPIO[14] D16 NC D17 USBM[2] D18 ARSTN D19 DIORN D20 EGPIO[1]

E1 AD[23] E2 DA[23] E3 DA[26] E4 CSN[6] E5 GND E6 GND E7 CVDD E8 CVDD

H8 GND N16 GND V16 INT[2]

H9 GND N17 XTALO V17 RTSN H10 GND N18 COL[0] V18 USBP[0] H11 GND N19 COL[1] V19 CTSN H12 GND N20 COL[2] V20 TXD[0] H13 GND P1 AD[4] W1 P[12] H16 RVDD P2 DA[10] W2 P[9] H17 RTCXTALO P3 DA[9] W3 DD[0] H18 ADC_VDD P4 BRIGHT W4 P[5] H19 ADC_GND P5 RVDD W5 P[3] H20 XP P6 RVDD W6 DA[7]

J1 DA[21] P15 RVDD W7 DA[5] J2 DQMN[0] P16 RVDD W8 AD[11] J3 DQMN[1] P17 XTALI W9 AD[9] J4 DQMN[2] P18 PLL_VDD W10 IDECS1N J5 GND P19 ROW[6] W11 IDEDA[1] J8 GND P20 ROW[7] W12 TCK J9 GND R1 AD[2] W13 TMS

J10 GND R2 AD[1] W14 EECLK

J11 GND R3 P[17] W15 SCLK1 J12 GND R4 P[14] W16 GRLED J13 GND R5 RVDD W17 INT[3] J16 CVDD R6 RVDD W18 SLA[1] J17 RTCXTALI R7 GND W19 SLA[0] J18 XM R8 CVDD W20 RXD[2] J19 YP R13 CVDD Y1 HSYNC J20 YM R14 GND Y2 DD[1]

K1 AD[22] R15 RVDD Y3 DD[12] K2 DA[20] R16 RVDD Y4 P[2] K3 AD[21] R17 ROW[0] Y5 AD[15] K4 DA[19] R18 ROW[3] Y6 DA[6] K5 RVDD R19 PLL_GND Y7 DA[4] K8 GND R20 ROW[5] Y8 AD[10]

K9 GND T1 DA[8] Y9 DA[1] K10 GND T2 BLANK Y10 AD[8] K11 GND T3 P[13] Y11 IDEDA[0] K12 GND T4 SPCLK Y12 DTRN K13 GND T5 V_CSYNC Y13 TDO K16 CVDD T6 DD[14] Y14 BOOT[0] K17 SYM T7 GND Y15 EEDAT K18 SYP T8 CVDD Y16 ASDO K19 SXM T9 RVDD Y17 SFRM1 K20 SXP T10 GND Y18 RDLED

L1 DA[18] T11 GND Y19 USBP[1]

L2 DA[17] T12 RVDD Y20 ABITCLK

EP9312

EP9312 Universal Platform SOC Processor

The following section focuses on the EP9312 pin signals from two viewpoints - the pin usage and pad characteristics, and the pin multiplexing usage. The first table (Table S) is a summary of all the EP9312 pin signals. The second table (Table T) illustrates the pin signal multiplexing and configuration options.

Ta b l e S is a summary of the EP9312 pin signals, which

illustrates the pad type and pad pull type (if any). The symbols used in the table are defined as follo ws. (Note: A blank box means Not Applicable (NA) or, for Pull Type, No Pull (NP).)

Under the Pad Type column:

• A - Analog pad

•P - Power pad

• G - Ground pad

• I - Pin is an input only

• I/O - Pin is input/output

• 4mA - Pin is a 4 mA output driver

• 8mA - Pin is an 8 mA output driver

• 12mA - Pin is an 12 mA output driver See the text description for additional information about

bi-directional pins. Under the Pull Type Column:

• PU - Resistor is a pull up to the RVDD supply

• PD - Resistor is a pull down to the RGND supply

EP9312

Universal Platform SOC Processor

Pin Name Block

TCK JTAG I PD JTAG clock in TDI JTAG I PD JTAG data in TDO JTAG 4ma JTAG data out TMS JTAG I PD JTAG test mode select TRSTn JTAG I PD JTAG reset BOOT[1:0] System I PD Boot mode select in XTALI PLL A Main oscillator input XTALO PLL A Main oscillator output VDD_PLL PLL P Main oscillator power, 1.8V GND_PLL PLL G Main oscillator ground RTCXTALI RTC A RTC oscillator input RTCXTALO RTC A RTC oscillator output WRn P BUS 4ma SRAM Write strobe out RDn PBUS 4ma SRAM Read / OE strobe out WAITn PBUS I PU SRAM Wait in AD[25:0] PBUS 8ma Shared Address bus out DA[31:0] PBUS 8ma PU Shared Data bus in/out CSn[3:0] PBUS 4ma PU Chip select out CSn[7:6] PBUS 4ma PU Chip select out DQMn[3:0] PBUS 8ma Shared data mask out SDCLK SDRAM 8ma SDRAM clock out SDCLKEN SDRAM 8ma SDRAM clock enable out SDCSn[3:0] SDRAM 4ma SDRAM chip selects out RASn SDR AM 8ma SDRAM RAS out CASn SDR AM 8ma SDRAM CAS out SDWEn SDRAM 8ma SDRAM write enable out P[17:0] Raster 4ma PU Pixel data bus out SPCLK Raster 12ma PU Pixel clock in/out HSYNC Raster 8ma PU Horizontal synchronization / line pulse out

V_CSYNC Raster 8ma PU

BLANK Raster 8ma PU Composite blanking signal out BRIGHT Raster 4ma PWM brightness control out PWMOUT PWM 8ma Pulse width modulator output Xp, Xm ADC A Touchscreen ADC X axis Yp, Ym ADC A Touchscreen ADC Y axis sXp, sXm ADC A Touchscreen ADC X axis feedback sYp, sYm ADC A Touchscreen ADC Y axis feedback VDD_ADC ADC P Touchscreen ADC power, 3.3V GND_ADC ADC G Touchscreen ADC ground COL[7:0] Key 8ma PU Key matrix column inputs ROW[7:0] Key 8ma PU Key matrix row outputs USBp[2:0] USB A USB positive signals USBm[2:0] USB A USB negative signals TXD0 UART1 4ma Transmit out RXD0 UART1 I PU Receive in CTSn UART1 I PU Clear to send / transmit enable DSRn UART1 I PU Data set ready / Data Carrier Detect DTRn UART1 4ma Data Terminal Ready output

Table S. Pin Descriptions

Pad

Pull

Type

Vertical or composite synchronization / frame pulse out

Description

Table S. Pin Descriptions (Continued)

Pad

Pin Name Block

RTSn UART1 4ma Ready to send TXD1 UART2 4ma Transmit / IrDA output RXD1 UART2 I PU Receive / IrDA input TXD2 UART3 4ma Transmit RXD2 UART3 I PU Receive MDC EMAC 4ma Management data clock MDIO EMAC 4ma PU Management data input/output RXCLK EMAC I PD Receive clock in MIIRXD[3:0] EMAC I PD Receive data in RXDVAL EMAC I PD Receive data valid RXERR EMAC I PD Receive data error TXCLK EMAC 4ma PU Transmit clock in MIITXD[3:0] EMAC I PD Transmit data out TXEN EMAC 4ma PD Transmit enable TXERR EMAC 4ma PD Transmit error CRS EMAC I PD Carrier sense CLD EMAC I PU Collision detect GRLED LED 12ma Green LED RDLED LED 12ma Red L ED EECLK EEPROM 4ma PU EEPROM / Two-wire Interface clock EEDAT EEPROM 4ma PU EEPROM / Two-wire Interface data ABITCLK AC97 8ma PD AC97 bit clock ASYNC AC97 8ma PD AC97 frame sync ASDI AC97 I PD AC97 Primary input ASDO AC97 8ma PU AC97 output ARSTn AC97 8ma AC97 reset SCLK1 SPI1 8ma PD SPI bit clock SFRM1 SPI1 8ma PD SPI Frame Clock SSPRX1 SPI1 I PD SPI input SSPTX1 SPI1 8ma SPI output INT[3:0] INT I PD External interrupts PRSTn Syscon I PU Power on reset RSTOn Syscon 4ma User Reset in out - open drain SLA[1:0] EEPROM 4ma Flash programming voltage control EGPIO[15:0] GPIO I/O, 4ma PU Enhanced GPIO DD[15:8] IDE 8ma PU IDE data bus DD7 IDE 8ma PD IDE data bus DD[6:0] IDE 8ma PU IDE data bus IDEDA[2:0] IDE 8ma IDE Device address output IDECS0n IDE 8ma IDE Chip Select 0 output IDECS1n IDE 8ma IDE Chip Select 1 output DIORn IDE 8ma IDE Read strobe output DIOWn IDE 8ma IDE Write strobe output DMACKn IDE 8ma IDE DMA acknowledge output IORDY IDE I PU IDE ready input CVDD Power P Digital power, 1.8V RVDD Power P Digital power, 3.3V CGND Ground G Digital ground RGND Ground G Digital ground

Type

Pull

Type

Description

EP9312 Universal Platform SOC Processor

Table T illustrates the pin signal multiplexing and configuration options.

Table T. Pin Multiplex Usage Information

Physical

Pin Name

COL[7:0] GPIO GPIO Port D[7:0]

ROW[7:0] GPIO GPIO Port C[7:0]

EGPIO[0] Ring Indicator Input RI EGPIO[1] 1Hz clock monitor CLK1HZ EGPIO[2] IDE DMA request DMARQ EGPIO[3] Transmit Enable output / HDLC clocks TENn / HDLCCLK1 / HDLCCLK3 EGPIO[4] I2S Transmit Data 1 SDO1 EGPIO[5] I2S Receive Data 1 SDI1 EGPIO[6] I2S Transmit Data 2 SDO2 EGPIO[7] DMA Request 0 DREQ0 EGPIO[8] DMA Acknowledge 0 DACK0

EGPIO[9] DMA EOT 0 DEOT0 EGPIO[10] DMA Request 1 DREQ1 EGPIO[11] DMA Acknowledge 1 DACK1 EGPIO[12] DMA EOT 1 DEOT1 EGPIO[13] I2S Receive Data 2 SDI2 EGPIO[14] PWM 1 output PWMOUT1 EGPIO[15] IDE Device active / present DASP

ABITCLK I2S Serial clock SCLK

ASYNC I2S Frame Clock LRCK

ASDO I2S Transmit Data 0 SDO0

ASDI I2S Receive Data 0 SDI0 ARSTn I2S Master clock MCLK SCLK1 I2S Serial clock SCLK

SFRM1 I2S Frame Clock LRCK SSPTX1 I2S Transmit Data 0 SDO0 SSPRX1 I2S Receive Data 0 SDI0

IDEDA[2:0] GPIO GPIO Port E[7:5]

IDECS0n GPIO GPIO Port E[4] IDECS1n GPIO GPIO Port E[3]

DIORn GPIO GPIO Port E[2]

DD[7:0] GPIO GPIO Port H[7:0]

DD[15:12] GPIO GPIO Port G[7:4]

SLA[1:0] GPIO GPIO Port G[3:2]

EEDAT GPIO GPIO Port G[1]

EECLK GPIO GPIO Port G[0]

Description Multiplex signal name

EP9312

Universal Platform SOC Processor

Acronyms and Abbreviations

The following tables list abbreviations and acronyms used in this data sheet.

Term Definition

ADC Analog-to-Digital Converter

ALT Alternative

AMBA Advanced Micro-controller Bus Architecture

ATAPI ATA Packet Interface

CODEC COder / DECoder

CRC Cyclic Redundancy Check

DAC Digital-to-Analog Converter

DMA Direct-Memory Access

EBUS External Memory Bus

EEPROM Electronically Erasable Programmable Read Only Memory

EMAC Ethernet Media Access Controller

Term Definition

OHCI Open Host Controller Interface

PHY Ethernet PHYsical layer interface

PIO Programmed I/O

RISC Reduced Instruction Set Computer

SDMI Secure Digital Music Initiative

SDRAM Synchronous Dynamic RAM

SPI Serial Peripheral Interface

SRAM Static Random Access Memory

Station - Any device that contains an IEEE 802.11

STA

TFT Thin Film Transistor

TLB Translation Lookaside Buffer

USB Universal Serial Bus

conforming Medium Access Control (MAC) and physical layer (PHY) interface to the wireless medium

FIFO First In / First Out

FIQ Fast Interrupt Request

FLASH Flash memory

GPIO General Purpose I/O

HDLC High-level Data Link Control

I/F Interface

IC Integrated Circuit

ICE In-Circuit Emulator

IDE Integrated Drive Electronics

IEEE Institute of Electronics and Electrical Engineers

IrDA Infrared Data Association

IRQ Standard Interrupt Request

ISO International Standards Organization

JTAG Joint Test Action Group

LFSR Linear Feedback Shift Register

MII Media Independent Interface

MMU Memory Management Unit

Inter-IC Sound

Units of Measurement

Symbol Unit of Measure

°C

Hz Hertz = cycle per second Kbps Kilobits per second kbyte Kilobyte kHz KiloHertz = 1000 Hz Mbps Megabits per second MHz MegaHertz = 1,000 kHz

µA

µs

pF VVolt

WWatt

degree Celsius

-3

Watts

-12

-6

Ampere

-3

Ampere

-9

seconds

Farads

microAmpere = 10

microsecond = 1,000 nanoseconds = 10

milliAmpere = 10

millisecond = 1,000 microseconds = 10

milliWatt = 10

nanosecond = 10

picoFarad = 10

-6

seconds

-3

seconds

EP9312 Universal Platform SOC Processor

Ordering Information

The order numbers for the device are:

EP9312-CB 0 EP9312-CBZ 0 EP9312-IB -40 EP9312-IBZ -40

°C to +70°C 352-pin PBGA °C to +70°C 352-pin PBGA Lead Free °C to +85°C 352-pin PBGA °C to +85°C 352-pin PBGA Lead Free

EP9312 — CBZ

Lead Material: Z = Lead Free

Part Number

Product Line: Embedded Processor

Note: Go to the Cirrus Logic Internet site at http://www.cirrus.com to find contact information for your local sales representative.

Package Ty pe: B = 352-Ball, Plastic Ball Grid Array (27 mm x 27 mm)

Temperature Range: C = Commercial Version E = Extended Operating Version

I = Industrial Operating Version

Contacting Cirrus Logic Support

For all product questions and inquiries contact a Cirrus Logic Sales Representative.

To find one nearest you go to www.cirrus.com

IMPORTANT NOTICE "Preliminary" product information describes products that are in production, but for which full characterization data is not yet available. Cirrus Logic, Inc. and its subsidiaries

("Cirrus") believe that the information contained in this document is accurate and reliable. However, the information is subject to change without notice and is provided "AS IS" without warranty of any kind (express or implied). Customers are advised to obtain the latest version of relevant informat ion to verify, be fore placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgment, including those pertaining to warranty, indemnificatio n, and limitation of liability. No resp onsibility is assumed by Cirrus for the use of this information, including use of this information as the basis for manufac tur e or s ale of an y it ems, o r for i nfri ngemen t of pate nts o r oth er r ight s of thi rd p art ies. Thi s docume nt i s t he pr oper ty of Cir rus and by fur ni shin g this information, Cirrus grants no license, express or implied under any patents, mask work rights, copyrights, trademarks, trade secrets or other intellectual property rights. Cirrus owns the copyrights associated with the inform ation contained herein and gives consent for copies to be made of the information only for use within your organization with respect to Cirrus integrated circuits or other products of Cirrus. This consent does not extend to other copying such as copying for general distribution, advertising or promotional purposes, or for creating any work for resale.

CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERT Y OR ENVIRONMENTAL DAMAGE ("CRITICAL APP LICATIONS"). CIRRUS PRODUCTS ARE NOT DESIGNED, AUTHORIZED OR WARRANTED FOR USE IN AIRCRAFT SYSTEMS, MILITARY APPLICATIONS, PRODUCTS SURGICALLY IMPLANTED INTO THE BODY, AUTOMOTIVE SAFETY OR SECURITY DEVICES, LIFE SUPPORT PRODUCTS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF CIRRUS PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE FULLY AT THE CUSTOMER'S RISK AND CIRRUS DISCLAIMS AND MAKES NO WAR RANTY, EXPRESS, STATUTORY OR IMPLIED, INCLUDING THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR PARTICULAR PURPOSE, WITH REGARD TO ANY CIRRUS PRODUCT THAT IS USED IN SUCH A MANNER. IF THE CUSTOMER OR CUSTOMER'S CUSTOMER USES OR PERMITS THE USE OF CIRRUS PRODUCTS IN CRITICAL APPLICATIONS, CUSTOMER AGREES, BY SUCH USE, TO FULLY INDEMNIFY CIRRUS, ITS OFFICERS, DIRECTORS, EMPLOYEES, DISTRIBUTORS AND OTHER AGENTS FROM ANY AND ALL LIABILITY, INCLUDING ATTORNEYS' FEES AND COSTS, THA T MA Y RE SULT FROM OR ARISE IN CONNECTION WITH THESE USES.

Cirrus Logic, Cirrus, MaverickCrunch, MaverickKey, and th e Cirrus Lo gic logo desig ns are trad em arks of Cirru s Logic, Inc. All other brand and product names in this document may be trademarks or service marks of their respective owners.

Microsoft and Windows are registered trademarks of Microsoft Corporation. Microwire is a trademark of National Semiconductor Corp. National Semiconductor is a registered trademark of National Semiconductor Corp. Texas Instruments is a registered trademark of Texas Instruments, Inc. Motorola and SPI are registered trademark s of Moto ro la, Inc. LINUX is a registered trademark of Linus Torvalds.

Datasheet EP9312 Datasheet (CIRRUS LOGIC)

Specifications and Main Features

Frequently Asked Questions

User Manual

FEATURES

OVERVIEW

Table of Contents

List of Figures

List of Tables

Processor Core - ARM920T

MaverickCrunch™ Math Engine

MaverickKey™ Unique ID

General Purpose Memory Interface (SDRAM, SRAM, ROM, FLASH)

IDE Interface

Ethernet Media Access Controller (MAC)

Raster/LCD Interface

64-Key Keypad Interface

Universal Asynchronous Receiver/Transmitters (UARTs)

Triple-port USB Host

Two-wire Interface

Real-time Clock with Soft ware Trim

PLL and Clocking

Timers

Interrupt Controller

Dual LED Drivers

General Purpose Input/Output (GPIO)

Reset and Power Management

Hardware Debug Interface

12-channel DMA Controller

Internal Boot ROM

Electrical Specifications

Absolute Maximum Ratings

Recommended Operating Conditions

DC Characteristics

Timings

Timing Diagram Conventions

Timing Conditions

Memory Interface

SDRAM Load Mode Register Cycle

SDRAM Burst Read Cycle

SDRAM Burst Write Cycle

SDRAM Auto Refresh Cycle

Static Memory Single Word Read Cycle

Static Memory Single Word Write Cycle

Static Memory 32-bit Read on 8-bit External Bus

Static Memory 32-bit Write on 8-bit External Bus

Static Memory 32-bit Read on 16-bit External Bus

Static Memory 32-bit Write on 16-bit External Bus

Static Memory Burst Read Cycle

Static Memory Burst Write Cycle

Static Memory Single Read Wait Cycle

Static Memory Single Write Wait Cycle

Static Memory Turnaround Cycle

IDE Interface

PIO Data Transfers

Ultra DMA Data Transfer

Ethernet MAC Interface

Audio Interface

Texas Instruments’ Synchronous Serial Format

Microwire

Motorola SPI

AC’97

LCD Interface

JTAG

352 Pin BGA Package Outline

352-Ball PBGA Diagram

352 Pin BGA Pinout (Bottom View)

Acronyms and Abbreviations

Units of Measurement

Ordering Information