Datasheet EMIF02-USB01 Datasheet (SGS Thomson Microelectronics)

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IPAD

MAIN APPLICATION

ESD protection and EMI filtering for USB port.

■

DESCRIPTION

The EMIF02-USB01 is a highly integrated array designed tosuppress EMI / RFI noisefor USB port filtering.

The EMIF02-USB01 flip-chip packaging means the package size is equal to the die size. That's why EMIF02-USB01 is a very small device.

Additionally, this filter includes an ESD protection circuitry which prevents the protected device from destruction when subjected to ESD surges up to 15 kV.

EMIF02-USB01

2 LINES EMI FILTER

INCLUDING ESD PROTECTION

Flip Chip package

PIN CONFIGURATION

BENEFITS

■ 2 lines low-pass-filter + 2 lines ESD protection

■ High efficiency in EMI filtering

■

Very low PCB space consuming: 2.5 mm

■

Very thin package: 0.65 mm

■

High efficiency in ESD suppression (IEC61000-4-2 level 4)

■

High reliability offered by monolithic integration

■

High reducing of parasitic elements through integration & wafer level packaging.

COMPLIES WITHTHE FOLLOWING STANDARDS : IEC61000-4-2 level 4

on input & output pins.

15kV (air discharge) 8 kV (contact discharge)

321

A B C

D E

TM : ASD is trademark of STMicroelectronics.

January 2003 - Ed: 5

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EMIF02-USB01

SCHEMATIC

(gnd pin)

Fig. 1: Filtering behavior

EMIF02-USB01: filtering response of lines C1/C3 and E1/E3

0.00

0.00 dB

-5.00

-10.00

-15.00

-20.00

-25.00

-30.00

-35.00

-40.00

-45.00

-50.00

1.0M 3.0M 10.0M 30.0M 100.0M 300.0M 1.0G 3.0G E1_E3

Frequency/Hz

C1_C3

1.3K 33R

33R

E1 E3

Fig. 2: ESD response to IEC61000-4-2 Level 4

Vin

Vout

Fig. 3: Capacitance versus reverse applied voltage

35 30

C (pF)

20 15

0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5

VR (V)

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Fig. 4: Digital crosstalk

0.00 dB

-10.00

-20.00

-30.00

-40.00

-50.00

-60.00

-70.00

-80.00

-90.00

-100.0

1.0M 3.0M 10.0M 30.0M 100.0M 300.0M 1.0G 3.0G

f/Hz

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EMIF02-USB01

ABSOLUTE MAXIMUM RATINGS (T

amb

=25°C)

Symbol Parameter and test conditions Value Unit

stg

ELECTRICAL CHARACTERISTICS (T

ESD discharge IEC61000-4-2, air discharge ESD discharge IEC61000-4-2, contact discharge

Junction temperature Operating temperature range Storage temperature range

=25°C)

amb

125 °C

-40 to + 85 °C

-55 to +150 °C

Symbol Parameter

Rd I

Breakdown voltage Leakage current @ V Stand-off voltage Clamping voltage Dynamic impedance Peak pulse current

slope: 1/Rd

Symbol Test conditions Min. Typ. Max. Unit

line

1,R2

IR=1mA VRM=3V @0V Tolerance ± 5% Tolerance ± 5%

0.1 0.5 µA 40 45 pF

33.0 Ω

1.30 kΩ

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APLAC MODELS

Fig. 5: Aplac model of resistors

EMIF02-USB01

3.8nH

0.15nH

cap_33R

0.3nH

cap_33R

Csub

rsub_1k3

rsub_33R

R_1k3

bulk

R_33R

rsub_33R

bulk

R_33R

rsub_33R

bulk

rsub_1k3

Csub

0.23nH

cap_33RCsub

0.7nH

cap_33RCsub

Fig. 6: Aplac model of the diodes

A1, A3, B2, C1, C3, E1, E3

0.15nH

D02_usb

Lgnd_D

D2 bulk

D02_Nw

Rsub_D

Fig. 7: Aplac model of bumps & ground connections

Cbump Rsubump

I/O

bulk

100m

bulk

caphole

Lbump Rbump

Lhole

Rhole

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EMIF02-USB01

Fig. 8: Aplac model parameters

aplacvar R_33R 33.9

aplacvar R_33R 33.9 aplacvar cap_33R 1.2pF

aplacvar cap_33R 1.2pF

aplacvar R_1k3 1.3k

aplacvar Cz29pF

aplacvar Cz29pF aplacvar Rsub_D 100

aplacvar Rsub_D 100

aplacvar Csub0.3pF

aplacvar Csub0.3pF aplacvar Rsub_33R 15

aplacvar Rsub_33R 15 aplacvar Rsub_1k3 50

aplacvar Rsub_1k3 50

aplacvar lhole 10pH

aplacvar lhole 10pH aplacvar Rhole400m

aplacvar Rhole400m aplacvar Caphole0.4pF

aplacvar Caphole0.4pF aplacvar Lgnd_D 150pH

aplacvar Lgnd

aplacvar Lbump50pH

aplacvar Lbump50pH aplacvar Rbump50m

aplacvar Rbump50m aplacvar Cbump1.5pF

aplacvar Cbump1.5pF aplacvar Rsubump150

aplacvar Rsubump150

Model D02_Nw BV=100 IBV=1m CJO=6.8p M=0.3333 RS=2 VJ=0.6 TT=100n

ORDER CODE

EMIF 02 - USB 01

Electro Magnetic Interference Filter

Model D02_usb BV=16 IBV=1m CJO=Cz M=0.3333 RS=2 VJ=0.6 TT=100n

Fig. 9: Comparison between Aplac simulations and measured frequency response.

0.00 dB

-5.00

-10.00

-15.00

-20.00

-25.00

-30.00

-35.00

-40.00

-45.00

-50.00

1.0M 3.0M 10.0M 30.0M 100.0M 300.0M 1.0G 3.0G Aplac: C1/C3

f/Hz

simulation

measure

Meas: C1_C3_symm

Version

PACKAGE MECHANICAL DATA

495µm ± 50

Nb of lines

1.27mm ± 50µm

USB port fonction

315 ± 50700 ± 50

1.97mm ± 50µm

650µm ± 65

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EMIF02-USB01

MARKING

220

365

FFT

240

PACKING

8 +/- 0.3

Dot identifying Pin A1 location*

yww

xxx

All dimensions in mm

4 +/- 0.1

yww

User direction of unreeling

yww

xxx

4 +/- 0.1

1.5 +/- 0.1

xxx

All dimensions in µm

OTHER INFORMATION

Ordering code Marking Package Weight Base qty Delivery mode

1.75 +/- 0.1

3.5 +/- 0.1

EMIF02-USB01 FFT Flip Chip 3.35 mg 5000 Tape& reel (7”)

Note: More packing informations are available in the application note AN1235: ''Flip-Chip CSP: Package description and recommandations for use''

Informationfurnishedisbelievedtobeaccurateandreliable.However,STMicroelectronicsassumesnoresponsibilityforthe consequences of useofsuch information nor for any infringement of patents or other rights of third parties which may result from its use. No license is grantedby implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.

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