
Excelics
EFA480C
DATA SHEET
Low Distortion GaAs Power FET
104
D
G
94
34.0
12.5
680
160
120
40
D
G
72
155
S
+34.0dBm TYPICAL OUTPUT POWER
•
18.0dB TYPICAL POWER GAIN AT 2GHz
•
0.5 X 4800 MICRON RECESSED “MUSHROOM” GATE
•
PASSIVATION AND PLATED HEAT SINK
Si
•
3N4
ADVANCED EPITAXIAL DOPING PROFILE
•
PROVIDES HIGH POWER EFFICIENCY,
LINEARITY AND RELIABILITY
Idss SORTED IN 80mA PER BIN RANGE
•
ELECTRICAL CHARACTERISTICS (Ta = 25 OC)
SYMBOLS PARAMETERS/TEST CONDITIONS MIN TYP MAX UNIT
P
1dB
G
1dB
PAE
Output Power at 1dB Compression f= 2GHz
Vds=8V, Ids=50% Idss f= 4GHz
Gain at 1dB Compression f= 2GHz
Vds=8V, Ids=50% Idss f= 4GHz
Gain at 1dB Compression
Vds=8V, Ids=50% Idss f= 2GHz
75
SS
100
Chip Thickness: 75 ± 13 microns
All Dimensions In Microns
32.0 34.0
16.0 18.0
620
dBm
dB
%
Idss
Gm
Vp
BVgd
BVgs
Rth
Saturated Drain Current Vds=3V, Vgs=0V 800 1360 1760 mA
Transconductance Vds=3V, Vgs=0V 560 720 mS
Pinch-off Voltage Vds=3V, Ids=10mA -2.0 -3.5 V
Drain Breakdown Voltage Igd=4.8mA -12 -15 V
Source Breakdown Voltage Igs=4.8mA -7 -14 V
Thermal Resistance (Au-Sn Eutectic Attach) 12
MAXIMUM RATINGS AT 25OC
SYMBOLS PARAMETERS ABSOLUTE 1 CONTINUOUS2
Vds
Vgs
Ids
Igsf
Pin
Tch
Tstg
Pt
Note: 1. Exceeding any of the above ratings may result in permanent damage.
2. Exceeding any of the above ratings may reduce MTTF below design goals.
Drain-Source Vo ltage
Gate-Source Voltage
Drain Current
Forward Gate Current
Input Power
Channel Temperature
Storage Temperature
Total Power Dissipation
12V
-8V
Idss
120mA
32dBm
175oC
-65/175oC
11.4 W
8V
-4V
1.2A
20mA
@3dB Compression
150oC
-65/150oC
9.5 W
Excelics Semiconductor, Inc., 2908 Scott Blvd., Santa Clara, CA 95054
Phone: (408) 970-8664 Fax: (408) 970-8998 Web Site: www.excelics.com
o
C/W

EFA480C
DATA SHEET
S-PARAMETERS
8V, 1/2 Idss
FREQ --- S11 --- --- S21 --- --- S12 --- --- S22 --(GHz) MAG ANG MAG ANG MAG ANG MAG ANG
0.500 0.944 -119.8 9.669 115.5 0.023 33.8 0.515 -166.9
1.000 0.931 -149.2 5.352 97.6 0.026 24.2 0.553 -172.1
1.500 0.928 -161.0 3.646 88.3 0.027 23.1 0.564 -174.0
2.000 0.927 -167.6 2.756 81.6 0.027 24.4 0.569 -175.0
2.500 0.927 -172.0 2.213 75.9 0.028 26.6 0.574 -175.4
3.000 0.927 -175.4 1.849 70.7 0.029 29.2 0.580 -175.7
3.500 0.928 -178.1 1.587 66.0 0.030 31.9 0.585 -175.9
4.000 0.928 179.6 1.389 61.4 0.031 34.6 0.591 -176.0
4.500 0.929 177.5 1.235 57.0 0.032 37.2 0.597 -176.1
5.000 0.930 175.6 1.112 52.8 0.034 39.6 0.604 -176.3
5.500 0.931 173.9 1.010 48.7 0.035 41.9 0.612 -176.5
6.000 0.932 172.3 0.925 44.7 0.037 44.1 0.620 -176.7
6.500 0.933 170.7 0.853 40.8 0.039 46.0 0.628 -176.9
7.000 0.934 169.2 0.790 37.0 0.040 47.8 0.636 -177.2
7.500 0.935 167.7 0.735 33.3 0.042 49.4 0.645 -177.5
8.000 0.937 166.3 0.687 29.7 0.044 50.8 0.654 -177.9
8.500 0.938 164.9 0.643 26.2 0.047 52.1 0.664 -178.3
9.000 0.939 163.6 0.604 22.8 0.049 53.2 0.673 -178.8
9.500 0.941 162.3 0.569 19.5 0.051 54.1 0.683 -179.4
10.000 0.942 160.9 0.537 16.2 0.054 54.9 0.693 -179.9
Note: The data included 0.7 mils diameter Au bonding wires:
2 gate wires, 20 mils each; 2 drain wires, 12 mils each; 6 source wires, 7 mils each.
Low Distortion GaAs Power FET