Datasheet EFA480C Datasheet (Excelics)

Page 1
Excelics
EFA480C
DATA SHEET
104
D
G
94
34.0
12.5
680
160
120
40
D
G
72
155
S
+34.0dBm TYPICAL OUTPUT POWER
18.0dB TYPICAL POWER GAIN AT 2GHz
0.5 X 4800 MICRON RECESSED “MUSHROOM” GATE
PASSIVATION AND PLATED HEAT SINK
Si
3N4
ADVANCED EPITAXIAL DOPING PROFILE
PROVIDES HIGH POWER EFFICIENCY, LINEARITY AND RELIABILITY
Idss SORTED IN 80mA PER BIN RANGE
ELECTRICAL CHARACTERISTICS (Ta = 25 OC)
SYMBOLS PARAMETERS/TEST CONDITIONS MIN TYP MAX UNIT
P
1dB
G
1dB
PAE
Output Power at 1dB Compression f= 2GHz Vds=8V, Ids=50% Idss f= 4GHz Gain at 1dB Compression f= 2GHz Vds=8V, Ids=50% Idss f= 4GHz Gain at 1dB Compression Vds=8V, Ids=50% Idss f= 2GHz
75
SS
100
Chip Thickness: 75 ± 13 microns All Dimensions In Microns
32.0 34.0
16.0 18.0
620
dBm
dB
%
Idss Gm Vp BVgd BVgs Rth
Saturated Drain Current Vds=3V, Vgs=0V 800 1360 1760 mA Transconductance Vds=3V, Vgs=0V 560 720 mS Pinch-off Voltage Vds=3V, Ids=10mA -2.0 -3.5 V Drain Breakdown Voltage Igd=4.8mA -12 -15 V Source Breakdown Voltage Igs=4.8mA -7 -14 V Thermal Resistance (Au-Sn Eutectic Attach) 12
MAXIMUM RATINGS AT 25OC
SYMBOLS PARAMETERS ABSOLUTE 1 CONTINUOUS2
Vds Vgs Ids Igsf Pin Tch Tstg Pt
Note: 1. Exceeding any of the above ratings may result in permanent damage.
2. Exceeding any of the above ratings may reduce MTTF below design goals.
Drain-Source Vo ltage Gate-Source Voltage Drain Current Forward Gate Current Input Power Channel Temperature Storage Temperature Total Power Dissipation
12V
-8V Idss 120mA 32dBm 175oC
-65/175oC
11.4 W
8V
-4V
1.2A 20mA @3dB Compression 150oC
-65/150oC
9.5 W
Excelics Semiconductor, Inc., 2908 Scott Blvd., Santa Clara, CA 95054 Phone: (408) 970-8664 Fax: (408) 970-8998 Web Site: www.excelics.com
o
C/W
Page 2
EFA480C
DATA SHEET
S-PARAMETERS
8V, 1/2 Idss
FREQ --- S11 --- --- S21 --- --- S12 --- --- S22 --­(GHz) MAG ANG MAG ANG MAG ANG MAG ANG
0.500 0.944 -119.8 9.669 115.5 0.023 33.8 0.515 -166.9
1.000 0.931 -149.2 5.352 97.6 0.026 24.2 0.553 -172.1
1.500 0.928 -161.0 3.646 88.3 0.027 23.1 0.564 -174.0
2.000 0.927 -167.6 2.756 81.6 0.027 24.4 0.569 -175.0
2.500 0.927 -172.0 2.213 75.9 0.028 26.6 0.574 -175.4
3.000 0.927 -175.4 1.849 70.7 0.029 29.2 0.580 -175.7
3.500 0.928 -178.1 1.587 66.0 0.030 31.9 0.585 -175.9
4.000 0.928 179.6 1.389 61.4 0.031 34.6 0.591 -176.0
4.500 0.929 177.5 1.235 57.0 0.032 37.2 0.597 -176.1
5.000 0.930 175.6 1.112 52.8 0.034 39.6 0.604 -176.3
5.500 0.931 173.9 1.010 48.7 0.035 41.9 0.612 -176.5
6.000 0.932 172.3 0.925 44.7 0.037 44.1 0.620 -176.7
6.500 0.933 170.7 0.853 40.8 0.039 46.0 0.628 -176.9
7.000 0.934 169.2 0.790 37.0 0.040 47.8 0.636 -177.2
7.500 0.935 167.7 0.735 33.3 0.042 49.4 0.645 -177.5
8.000 0.937 166.3 0.687 29.7 0.044 50.8 0.654 -177.9
8.500 0.938 164.9 0.643 26.2 0.047 52.1 0.664 -178.3
9.000 0.939 163.6 0.604 22.8 0.049 53.2 0.673 -178.8
9.500 0.941 162.3 0.569 19.5 0.051 54.1 0.683 -179.4
10.000 0.942 160.9 0.537 16.2 0.054 54.9 0.693 -179.9
Note: The data included 0.7 mils diameter Au bonding wires: 2 gate wires, 20 mils each; 2 drain wires, 12 mils each; 6 source wires, 7 mils each.
Low Distortion GaAs Power FET
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