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FRD Type : EC11FS2
FEATURES
FEATURES
FEATURESFEATURES
* Miniature Size,Surface Mount Device
* Ultra-Fast Recovery
* Low Forward Voltage Drop
* Low Power Loss, High Efficiency
* High Surge Capability
* Packaged in 12mm Tape and Reel
* Not Rolling During Assembly
EC11FS2
EC11FS2EC11FS2
OUTLINE DRAWING
Maximum Ratings Approx Net Weight:0.06g
Rating Symbol EC11FS2 Unit
Repetitive Peak Reverse Voltage
Non-repetitive Peak Reverse Voltage
Average Rectified Output Current IO
RMS Forward Current
Surge Forward Current I
V
RRM
V
220
RSM
0.81
I
1.57
F(RMS)
20
FSM
Ta=25°C *1
1.0
Ta=34°C *2
50Hz Half Sine Wave,1cycle
Non-repetitive
200
Operating JunctionTemperature Range Tjw -40 to +150
Storage Temperature Range T
-40 to +150
stg
Electrical • Thermal Characteristics
Characteristics Symbol Conditions Min. Typ. Max. Unit
Peak Reverse Current
Peak Forward Voltage
Reverse Recovery Time
Thermal Resistance Rth
*1 Glass Epoxy Substrate Mounted (Soldering Lands=2x2mm,Both Sides)
*2 Alumina Substrate Mounted (Soldering Lands=2x2mm,Both Sides)
I
V
trr
Tj= 25°C, V
RM
Tj= 25°C, I
FM
= 1A, -di/dt= 50A/µs, Ta= 25°C
I
FM
Junction to Ambient
(j-a)
= V
RM
= 1.0A
FM
RRM
*1 - - 157
*2 - - 108
V
V
50Hz Half Sine
Wave Resistive Load
A
A
A
°C
°C
- - 10
µA
- - 0.98 V
- - 30 ns
/W
°C
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EC11FS2 OUTLINE DRAWING (Dimensions in mm)
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