
DIODE Type : EC10DS1
FEATURES
FEATURES
FEATURESFEATURES
* Miniature Size,Surface Mount Device
* High Surge Capability
* Low Forward Voltage Drop
* Low Reverse Leakage Current
* Packaged in 12mm Tape and Reel
* Not Rolling During Assembly
EC10DS1
EC10DS1EC10DS1
OUTLINE DRAWING
Maximum Ratings Approx Net Weight:0.06g
Rating Symbol EC10DS1 Unit
Repetitive Peak Reverse Voltage
Non-repetitive Peak Reverse Voltage
Average Rectified Output Current IO
RMS Forward Current
Surge Forward Current I
V
RRM
V
250
RSM
0.74
I
1.57
F(RMS)
25
FSM
Ta=25 °C *1
1.0
Ta=25 °C *2
50Hz Half Sine Wave,1cycle
Non-repetitive
100
Operating JunctionTemperature Range Tjw -40 to +150
Storage Temperature Range T
-40 to +150
stg
Electrical • Thermal Characteristics
Characteristics Symbol Conditions Min. Typ. Max. Unit
Peak Reverse Current
Peak Forward Voltage
Thermal Resistance Rth
*1 Glass Epoxy Substrate Mounted (Soldering Lands=2x2mm,Both Sides)
*2 Alumina Substrate Mounted (Soldering Lands=2x2mm,Both Sides)
I
V
Tj= 25°C, V
RM
Tj= 25°C, I
FM
Junction to Ambient
(j-a)
= V
RM
= 1.0A
FM
RRM
*1 - - 157
*2 - - 108
V
V
50Hz Half Sine
Wave Resistive Load
A
A
A
°C
°C
- - 10
µA
- - 1.1 V
/W
°C

EC10DS1 OUTLINE DRAWING (Dimensions in mm)