Datasheet CX11250, CX20437, CX20463 Datasheet (CONEX)

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SmartHSF
Mobile Modem
Host-Processed, V.90/K56flex CX11250 Host Side Device, CX20463 SmartDAA Optional CX20437 Voice Codec for PCI Bus/Mini PCI­Based Mobile Applications
Data Sheet
Conexant Proprietary Information
Modem Device Set with

, and

Doc. No. 100553B July 28, 2000
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SmartHSF Mobile Modem Data Sheet
Revision History
Revision Date Comments
B 7/28/2000 Revision B release.
A 4/19/2000 Initial release.
© 2000,
All Rights Reserved.
Information in this document is provided in connection with Conexant Systems, Inc. (“Conexant”) products. These materials are provided by Conexant as a service to its customers and may be used for informational purposes only. Conexant assumes no responsibility for errors or omissions in these materials. Conexant may make changes to specifications and product descriptions at any time, without notice. Conexant makes no commitment to update the information and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to its specifications and product descriptions.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Conexant’s Terms and Conditions of Sale for such products, Conexant assumes no liability whatsoever.
THESE MATERIALS ARE PROVIDED “AS IS” WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, RELATING TO SALE AND/OR USE OF CONEXANT PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, CONSEQUENTIAL OR INCIDENTAL DAMAGES, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. CONEXANT FURTHER DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS. CONEXANT SHALL NOT BE LIABLE FOR ANY SPECIAL, INDIRECT, INCIDENTAL, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS, WHICH MAY RESULT FROM THE USE OF THESE MATERIALS.
Conexant products are not intended for use in medical, lifesaving or life sustaining applications. Conexant customers using or selling Conexant products for use in such applications do so at their own risk and agree to fully indemnify Conexant for any damages resulting from such improper use or sale.
The following are trademarks of Conexant Systems, Inc.: Conexant™, the Conexant C symbol, “What’s Next in Communications Technologies”™, K56flex™, SmartDAA™, and SmartHSF. Product names or services listed in this publication are for identification purposes only, and may be trademarks of third parties. Third-party brands and names are the property of their respective owners.
For additional disclaimer information, please consult Conexant’s Legal Information posted at www.conexant.com, which is incorporated by reference.
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Conexant strives to produce quality documentation and welcomes your feedback. Please send comments and
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Contents
REVISION HISTORY .....................................................................................................................................................II
1. INTRODUCTION................................................................................................................................................. 1-1
1.1 OVERVIEW .............................................................................................................................................. 1-1
1.2 FEATURES .............................................................................................................................................. 1-4
1.2.1 General Modem Features .......................................................................................................... 1-4
1.2.2 PCI Bus Host Interface Features ............................................................................................... 1-5
1.2.3 SmartDAA Features ................................................................................................................... 1-5
1.2.4 Applications................................................................................................................................ 1-5
1.3 TECHNICAL OVERVIEW......................................................................................................................... 1-5
1.3.1 General Description ................................................................................................................... 1-5
1.3.2 Host Modem Software................................................................................................................ 1-5
1.3.3 Operating Modes........................................................................................................................ 1-6
Data/Fax Modes................................................................................................................ 1-6
Synchronous Access Mode - Video Conferencing............................................................ 1-6
TAM Mode......................................................................................................................... 1-6
Voice/Speakerphone Mode (S Models)............................................................................. 1-6
Personal Digital Cellular High Speed Mode (C Models).................................................... 1-6
PDC Packet Mode (C Models) .......................................................................................... 1-7
PHS Mode (C Models) ...................................................................................................... 1-7
cdmaOne Data Mode IS95A (C Models)........................................................................... 1-7
cdmaOne Data Packet Mode IS95B (C Models)............................................................... 1-7
GSM Mode (C Models)...................................................................................................... 1-7
1.3.4 Reference Design ...................................................................................................................... 1-7
1.4 HARDWARE DESCRIPTION ................................................................................................................... 1-7
1.4.1 CX11250 Host Side Device........................................................................................................ 1-7
1.4.2 Digital Isolation Barrier............................................................................................................... 1-8
1.4.3 CX20463 SmartDAA Line Side Device ...................................................................................... 1-8
1.4.4 CX20437 Voice Codec (S Models) ............................................................................................ 1-8
2. TECHNICAL SPECIFICATIONS......................................................................................................................... 2-1
2.1 ESTABLISHING DATA MODEM CONNECTIONS ................................................................................... 2-1
Dialing ............................................................................................................................... 2-1
Modem Handshaking Protocol.......................................................................................... 2-1
Call Progress Tone Detection ........................................................................................... 2-1
Answer Tone Detection..................................................................................................... 2-1
Ring Detection................................................................................................................... 2-1
Billing Protection ............................................................................................................... 2-1
Connection Speeds........................................................................................................... 2-1
Automode.......................................................................................................................... 2-1
2.2 DATA MODE ............................................................................................................................................ 2-1
Speed Buffering (Normal Mode) ....................................................................................... 2-1
DTE-to-Modem Flow Control............................................................................................. 2-1
Escape Sequence Detection............................................................................................. 2-1
GSTN Cleardown (V.90/K56flex, V.34, V.32 bis, V.32)..................................................... 2-2
Fall Forward/Fallback (V.90/K56flex, V.34/V.32 bis/V.32) ................................................ 2-2
Retrain............................................................................................................................... 2-2
2.3 ERROR CORRECTION AND DATA COMPRESSION............................................................................. 2-2
V.42 Error Correction ........................................................................................................ 2-2
MNP 2-4 Error Correction.................................................................................................. 2-2
V.42 bis Data Compression .............................................................................................. 2-2
MNP 5 Data Compression ................................................................................................ 2-2
2.4 FAX CLASS 1 OPERATION..................................................................................................................... 2-2
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2.5 VOICE/TAM MODE.................................................................................................................................. 2-2
2.5.1 Online Voice Command Mode ................................................................................................... 2-2
2.5.2 Voice Receive Mode .................................................................................................................. 2-3
2.5.3 Voice Transmit Mode ................................................................................................................. 2-3
2.5.4 Speakerphone Modes................................................................................................................ 2-3
2.6 FULL-DUPLEX SPEAKERPHONE (FDSP) MODE.................................................................................. 2-3
2.7 CALLER ID............................................................................................................................................... 2-3
2.8 MULTIPLE COUNTRY SUPPORT (W MODELS) .................................................................................... 2-3
2.8.1 OEM Programmable Parameters............................................................................................... 2-3
2.8.2 Blacklist Parameters .................................................................................................................. 2-4
2.9 DIAGNOSTICS......................................................................................................................................... 2-4
2.9.1 Commanded Tests..................................................................................................................... 2-4
2.10 LOW POWER SLEEP MODE .................................................................................................................. 2-4
3. HARDWARE INTERFACE.................................................................................................................................. 3-1
3.1 CX11250 HSD HARDWARE PINS AND SIGNALS.................................................................................. 3-1
3.1.1 HSD Signal Interfaces................................................................................................................ 3-1
PCI Bus/Mini PCI Host Interface ....................................................................................... 3-1
Power Detection and Switching ........................................................................................ 3-1
Serial EEPROM Interface.................................................................................................. 3-1
LSD Interface (Through DIB) ............................................................................................ 3-2
VC Interface (S Models).................................................................................................... 3-2
Telephone Handset Interface (S Models) ......................................................................... 3-2
Call Progress Speaker Interface ....................................................................................... 3-2
PDC/PDC packet Interface ............................................................................................... 3-2
PHS Interface.................................................................................................................... 3-2
CDMA Interface................................................................................................................. 3-3
GSM Interface...................................................................................................................3-3
3.1.2 HSD Interface Signals, Pin Assignments, and Signal Definitions .............................................. 3-3
MART
3.2 CX20463 S
3.2.1 LSD Signal Interfaces .............................................................................................................. 3-16
3.2.2 LSD Interface Signals, Pin Assignments, and Signal Definitions............................................. 3-16
3.3 CX20437 VC HARDWARE PINS AND SIGNALS (S MODELS) ............................................................ 3-21
3.3.1 VC Signal Interfaces ................................................................................................................ 3-21
3.3.2 VC Interface Signals, Pin Assignments, and Signal Definitions............................................... 3-21
3.4 ELECTRICAL ENVIRONMENTAL, AND TIMING SPECIFICATIONS .................................................... 3-27
3.4.1 Operating Conditions, Absolute Maximum Ratings, and Power Requirements ....................... 3-27
3.4.2 SERIAL EEPROM INTERFACE TIMING ................................................................................. 3-29
4. HOST SOFTWARE INTERFACE ....................................................................................................................... 4-1
4.1 PCI CONFIGURATION REGISTERS....................................................................................................... 4-1
4.1.1 0x00 - Vendor ID Field ............................................................................................................... 4-2
4.1.2 0x02 - Device ID Field................................................................................................................ 4-2
4.1.3 0x04 - Command Register ......................................................................................................... 4-2
4.1.4 0x06 - Status Register................................................................................................................ 4-3
4.1.5 0x08 - Revision ID Field............................................................................................................. 4-3
4.1.6 0x09 - Class Code Field............................................................................................................. 4-3
4.1.7 0x0D - Latency Timer Register .................................................................................................. 4-3
4.1.8 0x0E - Header Type Field .......................................................................................................... 4-3
4.1.9 0x28 - CIS Pointer Register ....................................................................................................... 4-3
4.1.10 0x2C - Subsystem Vendor ID Register ...................................................................................... 4-3
4.1.11 0x2E- Subsystem ID Register .................................................................................................... 4-4
4.1.12 0x34 - Cap Ptr ............................................................................................................................ 4-4
4.1.13 0x3C - Interrupt Line Register .................................................................................................... 4-4
DAA LSD HARDWARE PINS AND SIGNALS.............................................................. 3-16
HSD Interface (Through DIB).......................................................................................... 3-16
Telephone Line Interface ................................................................................................ 3-16
Speakerphone Interface.................................................................................................. 3-21
Telephone Handset/Headset Interface ........................................................................... 3-21
HSD Interface.................................................................................................................. 3-21
Caution: Handling CMOS Devices .................................................................................. 3-27
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4.1.14 0x3D - Interrupt Pin Register...................................................................................................... 4-4
4.1.15 0x3E - Min Grant Register.......................................................................................................... 4-4
4.1.16 0x3F - Max Latency Register ..................................................................................................... 4-4
4.1.17 0x40 - Capability Identifier.......................................................................................................... 4-4
4.1.18 0x41 - Next Item Pointer ............................................................................................................ 4-4
4.1.19 0x42 - PMC - Power Management Capabilities ......................................................................... 4-5
4.1.20 0x44 - PMCSR - Power Management Control/Status Register (Offset = 4)............................... 4-5
4.1.21 0x46 - PMCSR_BSE - PMCSR PCI to PCI Bridge Support Extensions..................................... 4-6
4.1.22 0x47 - Data................................................................................................................................. 4-6
4.2 BASE ADDRESS REGISTER .................................................................................................................. 4-6
4.3 SERIAL EEPROM INTERFACE............................................................................................................... 4-7
4.3.1 Supported EEPROM Sizes ........................................................................................................ 4-7
4.3.2 Definitions .................................................................................................................................. 4-8
Device ID Register ............................................................................................................ 4-8
Vendor ID Register............................................................................................................ 4-8
Subsystem Vendor ID and Subsystem Device Register ................................................... 4-8
Min_Gnt Register .............................................................................................................. 4-8
Max_Lat Register.............................................................................................................. 4-8
PMC [8:6] and PME DRV Type ......................................................................................... 4-9
Class Code Register (Class Code, Sub-class Code, Prog. I/F)........................................ 4-9
CardBus CIS Pointer (CardBus CIS pointer High, CardBus CIS pointer Low) (Not
Used)................................................................................................................................. 4-9
Data Scale PMCSR[14:13] (D0C, D1C, D2C, D3C, D0D, D1D, D2D, D3D) ..................... 4-9
Data Register (D3, D2, D1, D0 power consumed and D3, D2, D1, D0 power
dissipated)......................................................................................................................... 4-9
Load CISRAM Count (CIS _SIZE) (Not Used).................................................................. 4-9
5. PACKAGE DIMENSIONS................................................................................................................................... 5-1
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Figures
Figure 1-2. SmartHSF Modem Major Interfaces....................................................................................................................... 1-3
Figure 3-1. CX11250 HSD Hardware Interface Signals ........................................................................................................... 3-4
Figure 3-2. CX11250 HSD 100-Pin TQFP Pin Signals............................................................................................................. 3-5
Figure 3-3. CX20463 LSD Hardware Interface Signals.......................................................................................................... 3-17
Figure 3-4. CX20463 LSD 32-Pin TQFP Pin Signals ............................................................................................................. 3-17
Figure 3-5. CX20437 VC Hardware Interface Signals............................................................................................................ 3-22
Figure 3-6. CX20437 VC 32-Pin TQFP Pin Signals ............................................................................................................... 3-22
Figure 3-7. Waveforms - Serial EEPROM Interface ............................................................................................................... 3-29
Figure 5-1. Package Dimensions - 100-Pin TQFP ................................................................................................................... 5-1
Figure 5-2. Package Dimensions - 32-pin TQFP...................................................................................................................... 5-2
Tables
Table 1-1. SmartHSF Modem Models and Functions............................................................................................................... 1-2
Table 3-1. CX11250 HSD 100-Pin TQFP Pin Signals.............................................................................................................. 3-6
Table 3-2. CX11250 HSD Pin Signal Definitions...................................................................................................................... 3-9
Table 3-3. Cell Phone/Telephone Line Interface Signals ....................................................................................................... 3-15
Table 3-4. CX20463 LSD 32-Pin TQFP Pin Signals............................................................................................................... 3-18
Table 3-5. CX20463 LSD Pin Signal Definitions .................................................................................................................... 3-19
Table 3-6. CX20463 LSD DC Electrical Characteristics......................................................................................................... 3-20
Table 3-7. CX20437 VC 32-Pin TQFP Pin Signals................................................................................................................. 3-23
Table 3-8. CX20437 VC Pin Signal Definitions ...................................................................................................................... 3-24
Table 3-9. CX20437 VC Digital Electrical Characteristics...................................................................................................... 3-26
Table 3-10. CX20437 VC Analog Electrical Characteristics................................................................................................... 3-26
Table 3-11. Operating Conditions........................................................................................................................................... 3-27
Table 3-12. Absolute Maximum Ratings................................................................................................................................. 3-27
Table 3-13. Current and Power Requirements....................................................................................................................... 3-28
Table 3-14. Timing - Serial EEPROM Interface...................................................................................................................... 3-29
Table 4-1. PCI Configuration Registers.................................................................................................................................... 4-1
Table 4-2. Command Register ................................................................................................................................................. 4-2
Table 4-3. Status Register........................................................................................................................................................ 4-3
Table 4-4. Power Management Capabilities (PMC) Register ................................................................................................... 4-5
Table 4-5. Power Management Control/Status Register (PMCSR).......................................................................................... 4-5
Table 4-6. HSD Address Map................................................................................................................................................... 4-6
Table 4-7. EEPROM Content for 256 Words by 16 Bits per Word ........................................................................................... 4-7
Table 4-8. EEPROM Content for 128 Words by 16 Bits per Word ........................................................................................... 4-7
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1. INTRODUCTION
1.1 OVERVIEW
The Conexant SmartHSF Host-Processed (SoftK56) V.90/K56flex Modem Device Family with SmartDAA technology supports analog data up to 56 kbps, analog fax to 14.4 kbps, telephone answering machine (TAM), and PCI Bus/Mini PCI host interface operation. In addition, the device set optionally supports cellular phone interface (PDC high speed/PDC packet data, PHS data, CDMA/CDMA Packet data, GSM data) or voice/speakerphone. These modem devices meet the size and power requirements of the mobile environment. Table 1-1 lists the available models.
The modem operates with PSTN telephone lines in the U.S./Japan/Canada and, optionally, worldwide. Optional cellular interface supports Japanese PDC (Personal Digital Cellular) and PHS (Personal Handyphone System) phones, GSM (Global System for Mobile Communications) phones, and cdmaOne (IS-95A/IS-95B) phones. Modem and cellular data protocol software is provided.
Conexant's SmartDAA technology (patent pending) eliminates the need for a costly line transformer, relays, and opto­isolators typically used in discrete DAA (Data Access Arrangement) implementations. The SmartDAA architecture also simplifies product implementation by eliminating the need for country-specific board configurations enabling worldwide homologation of a single modem board design.
The SmartDAA system-powered DAA operates reliably without drawing power from the line, unlike line-powered DAAs which operate poorly when line current is insufficient due to long lines or poor line conditions. Enhanced features, such as monitoring of local extension status without going off-hook, are also supported.
Incorporating Conexant’s proprietary Digital Isolation Barrier (DIB) design (patent pending) and other innovative DAA features, such as Digital PBX line protection and reporting, the SmartDAA architecture simplifies application design, minimizes layout area, and reduces component cost.
For over a decade, Conexant has assisted customers with DAA technology and homologation. This expertise and system level approach has been leveraged in this product.
The SmartHSF device set, consisting of a CX11250 Host Side Device (HSD) in a 100-pin TQFP and a CX20463 SmartDAA Line Side Device (LSD) in a 32-pin TQFP, supports data/fax/TAM operation with host software-based digital signal processing and cell phone/DAA/telephone line interface functions.
The optional CX20437 Voice Codec (VC), in a 32-pin TQFP, supports voice/full-duplex speakerphone (FDSP) operation with interfaces to a microphone, speaker, and telephone handset/headset. Because some cellular interface signals and CX20437 VC interface signals share the same CX11250 HSD pins, speakerphone configuration does not support the cellular interface.
The major hardware signal interfaces are identified in Figure 1-1.
In V.90/K56flex data mode, the modem can receive data at speeds up to 56 kbps from a digitally connected V.90 or K56flex­compatible central site modem. In this mode, the modem can transmit data at speeds up to V.34 rates.
In V.34 data mode, the modem operates at line speeds up to 33.6 kbps. When applicable, error correction (V.42/MNP 2-4) and data compression (V.42 bis/MNP 5) maximize data transfer integrity and boost average data throughput. Non-error­correcting mode is also supported.
Fax Group 3 send and receive rates are supported up to 14.4 kbps with T.30 protocol.
V.80 synchronous access mode supports host-controlled communication protocols, e. g., H.324 video conferencing.
Audio recording and playback over the telephone line interface using A-Law, µ-Law, or linear coding at 8 kHz sample rate supports applications such as remote digital telephone answering machine (TAM).
This designer's guide describes the modem hardware capabilities and identifies the supporting commands. Commands and parameters are defined in the Commands Reference Manual (Doc. No. 100498, formerly identified as Doc. No. 1118).
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Table 1-1. SmartHSF Modem Models and Functions
Model/Order/Part Numbers Supported Hardware Functions (See Note 3)
Marketing Name Device Set
Order No.
SmartHSF/MC-PCI DS56-L155-111 11250-11 20463-12 PCI US/J/C Y Y
SmartHSF/MS-PCI DS56-L155-121 11250-11 20463-12 20437-11 PCI US/J/C N Y Y
SmartHSF/MWC-PCI DS56-L155-131 11250-11 20463-11 PCI WW Y Y Y
SmartHSF/MWS-PCI DS56-L155-141 11250-11 20463-11 20437-11 PCI WW N Y Y Y
NOTES:
1. Model options: C Cellular M Mobile S Voice/full-duplex speakerphone (FDSP) W Worldwide support including U.S./Japan/Canada
-PCI PCI Bus/Mini PCI interface
2. Supported functions (Y = Supported; – = Not supported): TAM Telephone answering machine (Voice playback and record through telephone line) FDSP Full-duplex speakerphone and voice playback and record through telephone line, handset, and mic/speaker PDC HS Personal Digital Cellular High Speed data PDC Packet Personal Digital Cellular Packet data PHS Personal Handyphone System CDMA Code Division Multiple Access GSM Global System for Mobile Communications data
3. Software configuration/functions determined by Device ID programmed into EEPROM (see Section 4.3).
4. For ordering purposes, the CX prefix may not be included in the part number for some devices. Also, the CX prefix may not appear in the part number as branded on
some devices.
Host Side
Device (HSD)
[100-Pin TQFP]
Part No.
Line Side
Device (LSD)
[32-Pin TQFP]
Part No.
Voice Codec
(VC)
[32-Pin TQFP]
Part No.
Host
Bus
DAA Type
PDC HS/
PDC Packet,
PHS,
CDMA, GSM
V.90/K56flex
Data,
V.17 Fax,
TAM
World-
wide
Voice/
FDSP
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OEM/Customer
Supplied Software
Conexant
Modem
Software
SmartHSF Mobile Modem Data Sheet
Conexant Modem Product
Conexant Modem Hardware Devices
OEM
Supplied
Hardware
Host Computer
Operating
System Software
and
Modem
Communication
Application
Software
Modem
Software
Drivers
PCI Bus/
MiniPCI
CX11250
Host Side Device (HSD)
100-Pin TQFP
SmartDAA
PCI Bus Interface
Interface
Figure 1-1. SmartHSF Modem Major Interfaces
Interface
Voice Codec
Interface
Cell
Phone
DAA Hardware
CX20463 SmartDAA
Line Side Device (LSD)
32-Pin TQFP
Digital
Isolation Barrier (DIB) Components
Rectifier
and Filter
Components
Line Side DIB
Interface
(LSDI)
Codec
Telephone
Line
Interface
CX20437
Voice Codec (VC)
32-Pin TQFP
(Optional)
Call Progress
Note: Speakerphone configuration does not support the cellular interface.
Telephone
Line Interface
Discrete
Components
Voice Relay,
HS Pickup
Detector
(Optional)
HS Hybrid
Components
(Optional)
(Mic/Speaker)
SPEAKER
Interface
(Optional)
Digital
Speaker
Circuit
(Optional)
PDC/ PDC Packet/ PHS/CDMA/
CDMA Packet/ GSM Interface
(Optional)
TELEPHONE
LINE
TIP RING
TELEPHONE
HANDSET
TIP RING
MIC SPEAKER
SOUNDUCER
PDC/PHS/ CDMA/ GSM PHONE
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1.2 FEATURES
1.2.1 General Modem Features
V.90 data modem with receive rates up to 56k bps and send rates up to V.34 rates
ITU-T V.90, K56flex, V.34 (33.6 kbps), V.32 bis, V.32, V.22 bis, V.22, V.23, and V.21; Bell 212A and 103
V.42 LAPM and MNP 2-4 error correction
V.42 bis and MNP 5 data compression
V.250 and V.251 commands
V.17 fax modem with send and receive rates up to 14.4 kbps
V.17, V.29, V.27 ter, and V.21 channel 2
EIA/TIA 578 Class 1 and T.31 Class 1.0 commands
Telephony/TAM
V.253 commands
8-bit µ-Law/A-Law coding (G.711)
8-bit/16-bit linear coding
8 kHz sample rate
Concurrent DTMF, ring, and Caller ID detection
V.80 synchronous access mode supports host-controlled communication protocols with H.324 interface support
V.8/V.8bis and V.251 commands
Cellular data hardware interface and software support (C models)
Protocol stacks for PDC high speed data, PDC packet data, PHS data, CDMA IS-95A/IS-95B data, and GSM data
API for customer-provided cellular data protocol stack
Full-duplex Speakerphone (FDSP) Mode (S models)
Microphone and speaker interface
Telephone handset/headset interface
Data/Fax/Voice call discrimination
Host software/MMX-based digital signal processing
Single configuration profile stored in host
Operates in U.S./Japan/Canada
Worldwide operation including U.S./Japan/Canada (W models)
Complies to TBR21 and other country requirements
Caller ID detection
System compatibility
Windows 95/98, Windows NT 4.0, Windows 2000, and Windows Millennium (Windows Me) operating systems
Microsoft'/Intel PC 99 Windows Hardware Designer’s Guide-compliant
Advanced Configuration and Power Interface (ACPI)
Unimodem/V compliant
Pentium 166 MHz MMX-compatible PC or greater
16 Mbyte RAM or more
Thin packages support low profile designs
CX11250 HSD: 100-pin TQFP (1.2 mm max. height)
CX20463 LSD: 32-pin TQFP (1.6 mm max. height)
CX20437 VC: 32-pin TQFP (1.6 mm max. height)
+3.3V operation with +5V tolerant digital inputs
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1.2.2 PCI Bus Host Interface Features
32-bit PCI Bus host interface
Meets PCI Local Bus Specification Rev. 2.2
PCI Bus Mastering interface
33 MHz PCI clock support
Supports Power Management
Meets PCI Bus Power Management Spec. Rev. 1.1
ACPI Power Management Registers
APM support
PME# support
Vaux/Vpci power switching support (-PCI model option)
VauxDET support
1.2.3 SmartDAA Features
Digital PBX line protection
System side powered DAA operates under poor line current supply conditions
Wake-on-ring
Ring detection
Line polarity reversal detection
Line current loss detection
Caller ID (CID) detect
Pulse dialing
Line-in-use detection – detects even while on-hook
Remote hang-up detect – for efficient call termination
Extension pickup detect
Call waiting detection
Meets worldwide DC VI Masks requirements (W models)
1.2.4 Applications
Laptop, notebook, and handheld computers
PCI Bus/Mini PCI embedded system boards
PCI Bus/Mini PCI plug-in cards
1.3 TECHNICAL OVERVIEW
1.3.1 General Description
Modem operation, including dialing, call progress, telephone line interface, telephone handset interface, PDC High Speed/GSM interface, voice/speakerphone interface, and host interface functions are supported and controlled through the V.250, V.251, and V.253-compatible command set.
The modem hardware connects to the host processor via a PCI/Mini PCI bus interface. The OEM adds a crystal circuit, EEPROM, DIB and LSD power rectifier and filter components, telephone line interface, optional telephone handset interface, optional PDC high speed/GSM interface, optional voice/speakerphone interface, and other supporting discrete components as required by the modem model and the application to complete the system.
1.3.2 Host Modem Software
The host modem software performs the following tasks:
1. General modem control, which includes command sets, fax Class 1, TAM, voice/speakerphone, error correction, data compression, GSM protocol stacks, PDC high speed data protocol stacks and phone drivers, and operating system interface functions.
2. Modem data pump signal processing, which includes data and facsimile modulation and demodulation, as well as voice sample formatting, is performed by the host processor using Conexant SoftK56 technology.
3. SmartDAA control, which includes HSD SmartDAA Interface control, LSD configuration and control, telephone line interface parameter control, and telephone line impedance control.
Configurations of the modem software are provided to support modem models listed in Table 1-1.
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1.3.3 Operating Modes
Data/Fax Modes
In V.90/K56flex data modem mode, the modem can receive data from a digital source using a V.90- or K56flex-compatible central site modem at line speeds up to 56 kbps. Asymmetrical data transmission supports sending data at line speeds up to V.34 rates. This mode can fallback to full-duplex V.34 mode, and to lower rates, as dictated by line conditions.
In V.34 data modem mode, the modem can operate in 2-wire, full-duplex, asynchronous modes at line rates up to 33.6 kbps. Data modem modes perform complete handshake and data rate negotiations. Using V.34 modulation to optimize modem configuration for line conditions, the modem can connect at the highest data rate that the channel can support from 33600 bps down to 2400 bps with automatic fallback. Automode operation in V.34 is provided in accordance with PN3320 and in V.32 bis in accordance with PN2330. All tone and pattern detection functions required by the applicable ITU or Bell standard are supported.
In V.32 bis data modem mode, the modem can operate at line speeds up to 14.4 kbps.
In fax modem mode, the modem can operate in 2-wire, half-duplex, synchronous modes and can support Group 3 facsimile send and receive speeds of 14400, 12000, 9600, 7200, 4800, and 2400 bps. Fax data transmission and reception performed by the modem are controlled and monitored through the EIA/TIA-578 Class 1 or T.31 Class 1.0 command interface. Full HDLC formatting, zero insertion/deletion, and CRC generation/checking are provided.
Synchronous Access Mode - Video Conferencing
V.80 Synchronous Access Mode (SAM) between the modem and the host/DTE is provided for host-controlled communication protocols, e.g., H.324 video conferencing applications.
Voice-call-first (VCF) before switching to a videophone call is also supported.
TAM Mode
TAM Mode features include 8-bit µ-Law, A-Law, and linear coding at 8 kHz sample rate. Full-duplex voice supports concurrent voice receive and transmit. Tone detection/generation, call discrimination, and concurrent DTMF detection are also supported. This mode supports applications such as digital TAM, voice annotation, and recording from and playback to the telephone line. ADPCM (4-bit IMA) coding is also supported to meet Microsoft WHQL logo requirements.
TAM Mode is supported by three submodes:
1. Online Voice Command Mode supports connection to the telephone line or, for S models, a microphone/speaker/handset/headset.
2. Voice Receive Mode supports recording voice or audio data input from the telephone line or, for S models, a microphone/handset/headset.
3. Voice Transmit Mode supports playback of voice or audio data to the telephone line or, for S models, a speaker/handset/headset.
Voice/Speakerphone Mode (S Models)
The S models include additional telephone handset, external microphone, and external speaker interfaces which support voice and full-duplex speakerphone (FDSP) operation.
Hands-free full-duplex telephone operation is supported in Speakerphone Mode under host control. Speakerphone Mode features an advanced proprietary speakerphone algorithm which supports full-duplex voice conversation with acoustic, line, and handset echo cancellation. Parameters are constantly adjusted to maintain stability with automatic fallback from full­duplex to pseudo-duplex operation. The speakerphone algorithm allows position independent placement of microphone and speaker. The host can separately control volume, muting, and AGC in microphone and speaker channels.
NOTE: Because some cellular interface signals and CX20437 VC interface signals share the same CX11250 HSD pins,
speakerphone configuration does not support the cellular interface.
Personal Digital Cellular High Speed Mode (C Models)
Personal Digital Cellular (PDC) High Speed Mode, implemented in host software, includes V.42 bis data compression and ARQ framing. A pass-through mode is also available to allow phone book data to be transferred to and from the PC at speeds up to 9600 bps (e.g., for editing on the PC). PDC High Speed Mode is enabled by the +WS46=20 and +CPDCM=2 AT commands and disabled by the +WS46=1 AT command.
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PDC Packet Mode (C Models)
PDC Packet Mode, implemented in host software as an optional mode of PDC, enables packet-based data communications at 28.8 kbps. PDC Packet Data Mode is enabled by the +WS46=20 and +CPDCM=3 AT commands and disabled by the +WS46=1 AT command.
PHS Mode (C Models)
PHS Data Mode is implemented in host software and supports a data rate of 32 kbps. PHS uses the PIAFS protocol stack. PHS Data Mode is enabled by the +WS46=26 AT command and disabled by the +WS46=1 AT command.
cdmaOne Data Mode IS95A (C Models)
cdmaOne Data Mode is implemented in host software and supports data rates of 9.6 kbps and 14.4 kbps. cdmaOne Data Mode is enabled by the +WS46=13 AT command and disabled by the +WS46=1 AT command.
cdmaOne Data Packet Mode IS95B (C Models)
cdmaOne Data Packet Mode is implemented in host software and supports a data rate of 64 kbps. cdmaOne Data Packet Mode is enabled by the +WS46=13 AT command and disabled by the +WS46=1 AT command.
GSM Mode (C Models)
GSM Mode, implemented in host software, supports data and fax transfer. The supported features include:
Data modem
V.21, V.23, V.22, V.22 bis, V.32
ISDN interoperability: 300 bps to 9600 bps
Transparent asynchronous mode up to 9600 bps
Non-transparent mode (RLP) up to 9600 bps
Fax modem send and receive rate up to 9600 bps
AT GSM commands (ETSI 07.07)
GSM direct connect
Driver interface for OEM-provided phone driver
Built-in parallel host (16550A UART) interface
GSM mode is enabled by the +WS46=12 AT command and disabled by the +WS46=1 AT command.
1.3.4 Reference Design
A Mini PCI Type IIIB data/fax/TAM reference design board is available to minimize application design time and costs.
The board is pretested to pass FCC Part 15, Part 68, and CTR 21 for immediate manufacturing.
A design package for the board is available in electronic form. The design package includes schematics, bill of materials (BOM), vendor parts list (VPL), board layout files in Gerber format, and complete documentation.
The design can also be used for the basis of a custom design by the OEM to accelerate design completion for rapid market entry.
1.4 HARDWARE DESCRIPTION
SmartDAA technology (patent pending) eliminates the need for a costly analog transformer, relays, and opto-isolators that are typically used in discrete DAA implementations. The programmable SmartDAA architecture simplifies product implementation in worldwide markets by eliminating the need for country-specific components.
1.4.1 CX11250 Host Side Device
The CX11250 Host Side Device (HSD), packaged in a 100-pin TQFP, includes a PCI/Mini PCI Interface and a SmartDAA Interface.
The PCI/Mini PCI interface connects directly to an embedded or external PCI/Mini PCI interface eliminating the need for additional external logic components.
The SmartDAA Interface communicates with, and supplies power and clock to, the LSD through the DIB.
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1.4.2 Digital Isolation Barrier
The OEM-supplied Digital Isolation Barrier (DIB) electrically DC isolates the HSD from the LSD and telephone line. The HSD is connected to a fixed digital ground and operates with standard CMOS logic levels. The LSD is connected to a floating ground and can tolerate high voltage input (compatible with telephone line and typical surge requirements).
The DIB transformer couples power and clock from the HSD to the LSD. (See Mobile Product Updates for qualified transformers.)
The DIB data channel supports bidirectional half-duplex serial transfer of data, control, and status information between the HSD and the LSD.
1.4.3 CX20463 SmartDAA Line Side Device
The CX20463 SmartDAA Line Side Device (LSD) includes a Line Side DIB Interface (LSDI), a coder/decoder (codec), and a Telephone Line Interface (TLI).
The LSDI communicates with, and receives power and clock from, the SmartDAA interface in the HSD through the DIB.
LSD power is received from the HSD PWRCLKP and PWRCLKN pins via the DIB through a half-wave rectifying diode and capacitive power filter circuit connected to the DIB transformer secondary winding. The CLK input is also coupled from the transformer secondary winding through a capacitor and a resistor in series.
Information is transferred between the LSD and the HSD through the DIB_P and DIB_N pins. These pins connect to the HSD DIB_DATAP and DIB_DATAN pins, respectively, through the DIB.
The TLI integrates DAA and direct telephone line interface functions and connects directly to the line TIP and RING pins, as well as to external line protection components.
Direct LSD connection to TIP and RING allows real-time measurement of telephone line parameters, such as the telephone central office (CO) battery voltage, individual telephone line (copper wire) resistance, and allows dynamic regulation of the off­hook TIP and RING voltage and total current drawn from the central office (CO). This allows the modem to maintain compliance with U.S. and worldwide regulations and to actively control the DAA power dissipation.
1.4.4 CX20437 Voice Codec (S Models)
The optional CX20437 Voice Codec (VC), packaged in a 32-pin TQFP, supports voice/full-duplex speakerphone (FDSP) operation with interfaces to a microphone and speaker and to a telephone handset/headset.
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2. TECHNICAL SPECIFICATIONS
2.1 ESTABLISHING DATA MODEM CONNECTIONS
Dialing
DTMF Dialing.
complies with Bell Publication 47001.
Pulse Dialing.
Blind Dialing.
Modem Handshaking Protocol
If a tone is not detected within the time specified in the S7 register after the last digit is dialed, the modem aborts the call attempt.
Call Progress Tone Detection
Ringback, equipment busy, and progress tones can be detected in accordance with the applicable standard represented by the country profile currently in affect.
Answer Tone Detection
Answer tone can be detected over the frequency range of 2100 ± 40 Hz in ITU-T modes and 2225 ± 40 Hz in Bell modes.
DTMF dialing using DTMF tone pairs is supported in accordance with ITU-T Q.23. The transmit tone level
Pulse dialing is supported in accordance with EIA/TIA-496-A.
The modem can blind dial in the absence of a dial tone if enabled by the X0, X1, or X3 command.
Ring Detection
A ring signal can be detected from a TTL-compatible square wave input (frequency is country-dependent).
Billing Protection
When the modem goes off-hook to answer an incoming call, both transmission and reception of data are prevented for a period of time determined by country requirement to allow transmission of the billing signal.
Connection Speeds
Data modem line speed can be selected using the +MS command in accordance with V.25 ter. The +MS command selects modulation, enables/disables automode, and selects transmit and receive minimum and maximum line speeds.
Automode
Automode detection can be enabled by the +MS command to allow the modem to connect to a remote modem in accordance with V.25 ter.
2.2 DATA MODE
Data mode exists when a telephone line connection has been established between modems and all handshaking has been completed.
Speed Buffering (Normal Mode)
Speed buffering allows a DTE to send data to, and receive data from, a modem at a speed different than the line speed. The modem supports speed buffering at all line speeds.
DTE-to-Modem Flow Control
If the modem-to-line speed is less than the DTE-to-modem speed, the modem supports XOFF/XON or RTS/CTS flow control with the DTE to ensure data integrity.
Escape Sequence Detection
The “+++” escape sequence can be used to return control to the command mode from the data mode. Escape sequence detection is disabled by an S2 Register value greater than 127.
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GSTN Cleardown (V.90/K56flex, V.34, V.32 bis, V.32)
Upon receiving GSTN Cleardown from the remote modem in a non-error correcting mode, the modem cleanly terminates the call.
Fall Forward/Fallback (V.90/K56flex, V.34/V.32 bis/V.32)
During initial handshake, the modem will fallback to the optimal line connection within K56flex/V.34/V.32 bis/V.32 mode depending upon signal quality if automode is enabled by the +MS command.
When connected in V.90/K56flex/V.34/V.32 bis/V.32 mode, the modem will fall forward or fallback to the optimal line speed within the current modulation depending upon signal quality if fall forward/fallback is enabled by the %E1 command.
Retrain
The modem may lose synchronization with the received line signal under poor line conditions. If this occurs, retraining may be initiated to attempt recovery depending on the type of connection.
The modem initiates a retrain if line quality becomes unacceptable if enabled by the %E command. The modem continues to retrain until an acceptable connection is achieved, or until 30 seconds elapse resulting in line disconnect.
2.3 ERROR CORRECTION AND DATA COMPRESSION
V.42 Error Correction
V.42 supports two methods of error correction: LAPM and, as a fallback, MNP 4. The modem provides a detection and negotiation technique for determining and establishing the best method of error correction between two modems.
MNP 2-4 Error Correction
MNP 2-4 is a data link protocol that uses error correction algorithms to ensure data integrity. Supporting stream mode, the modem sends data frames in varying lengths depending on the amount of time between characters coming from the DTE.
V.42 bis Data Compression
V.42 bis data compression mode operates when a LAPM or MNP connection is established.
The V.42 bis data compression employs a “string learning” algorithm in which a string of characters from the DTE is encoded as a fixed length codeword. Two dictionaries, dynamically updated during normal operation, are used to store the strings.
MNP 5 Data Compression
MNP 5 data compression mode operates during an MNP connection.
In MNP 5, the modem increases its throughput by compressing data into tokens before transmitting it to the remote modem, and by decompressing encoded received data before sending it to the DTE.
2.4 FAX CLASS 1 OPERATION
Facsimile functions operate in response to Fax Class 1 commands when +FCLASS=1 or +FCLASS=1.0.
In the fax mode, the on-line behavior of the modem is different from the data (non-fax) mode. After dialing, modem operation is controlled by fax commands. Some AT commands are still valid but may operate differently than in data modem mode.
Calling tone is generated in accordance with T.30.
2.5 VOICE/TAM MODE
Voice and audio functions are supported by the Voice Mode. Voice Mode includes three submodes: Online Voice Command Mode, Voice Receive Mode, and Voice Transmit Mode.
2.5.1 Online Voice Command Mode
This mode results from the connection to the telephone line or a voice/audio I/O device (e.g., microphone or speaker) through the use of the +FCLASS=8 and +VLS commands. After mode entry, AT commands can be entered without aborting the connection.
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2.5.2 Voice Receive Mode
This mode is entered when the +VRX command is active in order to record voice or audio data input, typically from a microphone or the telephone line.
Received analog voice samples are converted to digital form and compressed for reading by the host. AT commands control the codec sample rate.
Received analog mono audio samples are converted to digital form and formatted into 8-bit µ-Law, A Law, linear, or 4-bit IMA ADPCM format for reading by the host. AT commands control the bit length and sampling rate. Concurrent DTMF/tone detection is available.
2.5.3 Voice Transmit Mode
This mode is entered when the +VTX command is active in order to playback voice or audio data, typically to a speaker or to the telephone line. Concurrent DTMF/tone detection is available. Digitized audio data is converted to analog form.
2.5.4 Speakerphone Modes
Speakerphone modes are selected in voice mode with the following commands:
Speakerphone ON/OFF (+VSP).
Microphone Gain (+VGM=<gain>).
Speaker Gain (+VGS=<gain>).
This command turns the Speakerphone function ON (+VSP = 1) or OFF (+VSP = 0).
This command sets the microphone gain of the Speakerphone function.
This command sets the speaker gain of the Speakerphone function.
2.6 FULL-DUPLEX SPEAKERPHONE (FDSP) MODE
The modem operates in FDSP mode when +FCLASS=8 and +VSP=1 (see 2.5.4).
In FDSP Mode, speech from a microphone or handset is converted to digital form, shaped, and output to the telephone line through the line interface circuit. Speech received from the telephone line is shaped, converted to analog form, and output to the speaker or handset. Shaping includes both acoustic and line echo cancellation.
2.7 CALLER ID
Caller ID can be enabled/disabled using the +VCID command. When enabled, caller ID information (date, time, caller code, and name) can be passed to the DTE in formatted or unformatted form. Inquiry support allows the current caller ID mode and mode capabilities of the modem to be retrieved from the modem. The retrieval of the Caller ID via an explicit AT query at a later time is essential for implementing a compliant “Instantly available PC” concept.
2.8 MULTIPLE COUNTRY SUPPORT (W MODELS)
W models support modem operation in various countries. The country choice is made via the AT+GCI command or country select applet from within those installed in Windows registry. The following capabilities are provided in addition to the data modem functions previously described. Country dependent parameters are included in the .INF file for customization by the OEM Programmable Parameters
2.8.1 OEM Programmable Parameters
The following parameters are programmable:
Dial tone detection levels and frequency ranges
DTMF dialing transmit output level, DTMF signal duration, and DTMF interdigit interval parameters
Pulse dialing parameters such as make/break times, set/clear times, and dial codes
Ring detection frequency range
Blind dialing disable/enable
The maximum, minimum, and default carrier transmit level values
Calling tone, generated in accordance with V.25, may also be disabled
Call progress frequency and tone cadence for busy, ringback, congested, dial tone 1, and dial tone 2
Answer tone detection period
On-hook/off-hook, make/break, and set/clear relay control parameters
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2.8.2 Blacklist Parameters
The modem can operate in accordance with requirements of individual countries to prevent misuse of the network by limiting repeated calls to the same number when previous call attempts have failed. Call failure can be detected for reasons such as no dial tone, number busy, no answer, no ringback detected, voice (rather than modem) detected, and key abort (dial attempt aborted by user). Actions resulting from such failures can include specification of minimum inter-call delay, extended delay between calls, and maximum numbers of retries before the number is permanently forbidden ("blacklisted"). Up to 20 such numbers may be tabulated. The blacklist parameters are programmable. The current blacklisted and delayed numbers can be queried via AT*B and AT*D commands, respectively.
2.9 DIAGNOSTICS
2.9.1 Commanded Tests
Diagnostics are performed in response to the &T1 command per V.54.
Analog Loopback (&T1 Command).
DTE.
Last Call Status Report (#UD).
Data from the local DTE is sent to the modem, which loops the data back to the local
This command reports the status of the last call.
2.10 LOW POWER SLEEP MODE
When not connected in data, fax, or speakerphone mode, the HSD is placed in a low power state, i.e., Idle Mode.
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3. HARDWARE INTERFACE
3.1 CX11250 HSD HARDWARE PINS AND SIGNALS
3.1.1 HSD Signal Interfaces
PCI Bus/Mini PCI Host Interface
The Host Side Device conforms to the PCI Local Bus Specification Version 2.2 and Mini PCI Specification Draft 1.0. It is a memory slave and a bus master for PC host memory accesses (burst transactions). Configuration is by PCI configuration protocol.
The PCI Bus/Mini PCI interface signals are:
Address and data
32 bidirectional Address/Data (AD[31-0]); bidirectional
4 Bus Command and Byte Enable (CBE [3:0]); bidirectional
Bidirectional Parity (PAR); bidirectional
Interface control
Cycle Frame (FRAME#); bidirectional
Initiator Ready (IRDY#); bidirectional
Target Ready (TRDY#); bidirectional
Stop (STOP#); bidirectional
Initialization Device Select (IDSEL); input
Device Select (DEVSEL#); bidirectional
Arbitration
Request (REQ#); output
Grant (GRANT#); input
Error reporting
Parity Error (PERR#); bidirectional
System Error (SERR#); bidirectional
Interrupt
Interrupt A (INTA#); output
System
Clock (PCICLK); input
Reset (PCIRST#); input
Clock Running (CLKRUN#); input
Power Management Event (PME#), output
Power Detection and Switching
Vaux Enable (VauxEN#); output
Vpci Enable (VpciEN#); output
Vpci Detect (VpciDET); input
Vaux Detect (VauxDET); input
Serial EEPROM Interface
A serial EEPROM is required to store the Device ID, Vendor ID, Subsystem ID, Subsystem Vendor ID, and Power Management parameters for the PCI Configuration Space Header.
The EEPROM must be 2048 (128 x 16) bits or larger and be rated at 1MHz (SROMCLK is 537.6 kHz). For example, the following EEPROMs or equivalent may be used: Microchip 93LC66B (256 x 16), 93LC56B (128 x 16), Atmel AT93C66 (256 x
16), AT93C56 (128 x 16). The EEPROM is programmable by the PC via the modem.
The EEPROM interface signals are:
Serial Data Input (SROMIN); input
Serial Data Output (SROMOUT); output
Clock (SROMCLK); output
Chip Select (SROMCS); output
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LSD Interface (Through DIB)
The DIB interface signals are:
Clock and Power Positive (PWRCLKP); output
Clock and Power Negative (PWRCLKN); output
Data Positive (DIB_DATAP); input/output
Data Negative (DIB_DATAN); input/output
VC Interface (S Models)
The VC interface signals are:
Modem Sleep (IASLEEP); output
Master Clock (M_CLK); output
Voice Serial Clock (V_SCLK); input
Voice Serial Control (V_CTRL); output
Voice Serial Frame Sync (V_STROBE); input
Voice Serial Transmit Data (V_TXSIN); output
Voice Serial Receive Data (V_RXOUT); input
Telephone Handset Interface (S Models)
The telephone handset interface signals are:
Voice Relay Control (VOICE#); output
Handset Pickup Detect (H_PICKUP); input
Call Progress Speaker Interface
The call progress speaker interface signal is:
Digital speaker output (DSPKOUT); output
DSPKOUT is a square wave output in Data/Fax mode used for call progress or carrier monitoring. This output can be optionally connected to a low-cost on-board speaker, e.g., a sounducer, or to an analog speaker circuit.
PDC/PDC packet Interface
Nine lines, defined by the installed cell phone driver software, are available to support the PDC/PDC packet cellular phone interface:
Panel 1
Panel 2
ADP
CELL_RXD
CELL_TXD
TCH_CLK
TCH_TX
TCH_RX
TCH_FRAME
PHS Interface
Eleven lines, defined by the installed cell phone driver software, are available to support the PHS cellular phone interface.
ASLP
PSLP
DFCK
Ready
DSDT
USDT
BITC
UDT
DDT
UFCK
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CDMA Interface
Twelve lines, defined by the installed cell phone driver software, are available to support the CDMA cellular phone interface:
Panel 1
Panel 2
CB
CF
CJ
CC
CE
CD
Control RXD
Control TXD
BB (USART IN)
BA (USART OUT)
GSM Interface
Five lines, defined by the installed cell phone driver software, are available to support the GSM phone interface:
DA(IN)
RX-A
TX-A
TX-A
RX2-B USART
TX2-B USART
3.1.2 HSD Interface Signals, Pin Assignments, and Signal Definitions
The CX11250 HSD 100-pin TQFP hardware interface signals are shown by major interface in Figure 3-1, are shown by pin number in Figure 3-2, and are listed by pin number in Table 3-1.
The CX11250 HSD hardware interface signals are defined in Table 3-2.
Cell phone/telephone line interface signal assignments are listed in Table 3-3.
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PCI BUS/
MINI PCI
EEPROM
POWER DETECTION AND
SWITCHING CIRCUIT
+3.3V
+3.3V
+3.3V
27pF
5%
28.224 MHz
27pF
5%
CLKRUN#
C/BE0# C/BE1# C/BE2# C/BE3#
PCICLK
FRAME#
IDSEL
DEVSEL#
IRDY#
TRDY#
REQ#
INTA# STOP# PERR# SERR#
PCIRST#
VIO/+3.3V
SROMCS
SROMCLK
SROMIN
SROMOUT
VpciDET
VauxDET
VpciEN#
VauxEN#
AD0 AD1 AD2 AD3 AD4 AD5 AD6 AD7 AD8
AD9 AD10 AD11 AD12 AD13 AD14 AD15 AD16 AD17 AD18 AD19 AD20 AD21 AD22 AD23 AD24 AD25 AD26 AD27 AD28 AD29 AD30 AD31
PAR
GNT#
PME#
0.1uF
240K
SmartHSF Mobile Modem Data Sheet
74
SDXTAL1
1M
33
75
SDXTAL2
CX11250
HOST SIDE DEVICE
(HSD)
100-PIN TQFP
86
CLKRUN#
67
AD0
66
AD1
65 64 62 61 60 59 56 55 54 53 52 51 50 49 37 35 34 33 32 30 29 28 24 23 21 20 19 17 16 15 57 48 38 25 10 39 27 42 40 41 46 13 12
8 43 44 45 14
9 22 26
76 79 78 77
71 80 69 79
97
98
84
7 18 31 47 58 68 94
11 36 63 89
72 73
AD2 AD3 AD4 AD5 AD6 AD7 AD8 AD9 AD10 AD11 AD12 AD13 AD14 AD15 AD16 AD17 AD18 AD19 AD20 AD21 AD22 AD23 AD24 AD25 AD26 AD27 AD28 AD29 AD30 AD31 CBE0# CBE1# CBE2# CBE3# PCICLK FRAME# IDSEL DEVSEL# IRDY# TRDY# PAR REQ# GNT# INTA# STOP# PERR# SERR# PME# PCIRST# VIO VIO
SROMCS SROMCLK SROMIN SROMOUT
VpciDET VauxDET VpciEN# VauxEN#
PLLVDD
PLLVSS
LP_CLK
VDD VDD VDD VDD VDD VDD VDD
GND GND GND GND
SCANEN SCANMODE
V_CTRL/PANEL2 (GPIO13)
V_RXOUT/ASLP/CF (GPIO1)
V_TXSIN/PSLP/CJ (GPIO9)
V_STROBE/CC/DA(IN) (GPIO0)
VOICE#/ADP/RDY/CD(GPIO2)
SPKMUTE/CRXD/DSDT (GPIO8)
DSPKOUT/CTXD/USDT//TXA (GPIO11)
TCH_TX/UDT/TXA (GPIO5)
TCH_RX/DDT/ BB/RX2B (GPIO4)
TCH_FRAME/UFCK/BA/TX2B (GPIO3)
V_CTRL/PANEL2 (GPIO13)
V_RXOUT/ASLP/CF (GPIO1)
V_TXSIN/PSLP/CJ (GPIO9)
V_STROBE/CC/DA(IN) (GPIO0)
VOICE#/ADP/RDY/CD(GPIO2)
SPKMUTE/CRXD/DSDT (GPIO8)
DSPKOUT/CTXD/USDT//TXA (GPIO11)
TCH_TX/UDT/TXA (GPIO5)
TTCH_RX/DDT/ BB/RX2B (GPIO4)
TCH_FRAME/UFCK/BA/TX2B (GPIO3)
V_CTRL/PANEL2 (GPIO13)
V_RXOUT/ASLP/CF (GPIO1)
V_TXSIN/PSLP/CJ (GPIO9)
V_STROBE/CC/DA(IN) (GPIO0)
VOICE#/ADP/RDY/CD(GPIO2)
SPKMUTE/CRXD/DSDT (GPIO8)
DSPKOUT/CTXD/USDT//TXA (GPIO11)
TCH_TX/UDT/TXA (GPIO5)
TCH_RX/DDT/ BB/RX2B (GPIO4)
TCH_FRAME/UFCK/BA/TX2B (GPIO3)
V_CTRL/PANEL2 (GPIO13)
V_RXOUT/ASLP/CF (GPIO1)
V_TXSIN/PSLP/CJ (GPIO9)
V_STROBE/CC/DA(IN) (GPIO0)
VOICE#/ADP/RDY/CD(GPIO2)
SPKMUTE/CRXD/DSDT (GPIO8)
DSPKOUT/CTXD/USDT//TXA (GPIO11)
TCH_TX/UDT/TXA (GPIO5)
TCH_RX/DDT/ BB/RX2B (GPIO4)
TCH_FRAME/UFCK/BA/TX2B (GPIO3)
V_CTRL/PANEL2 (GPIO13)
V_RXOUT/ASLP/CF (GPIO1)
V_TXSIN/PSLP/CJ (GPIO9)
V_STROBE/CC/DA(IN) (GPIO0)
VOICE#/ADP/RDY/CD(GPIO2)
SPKMUTE/CRXD/DSDT (GPIO8)
DSPKOUT/CTXD/USDT//TXA (GPIO11)
TCH_TX/UDT/TXA (GPIO5)
TCH_RX/DDT/ BB/RX2B (GPIO4)
TCH_FRAME/UFCK/BA/TX2B (GPIO3)
PWRCLKP
PWRCLKN
DIB_DATAP
DIB_DATAN
DRESET# (GPOL0)
M_CLK/PANEL1 (GPIO12)
V_SCLK/CB (GPIO7)
IASLEEP/DFCK/CE/RXA Binary Audio In (GPIO10)
TCH_CLK/BITC (GPIO6)
DRESET# (GPOL0)
M_CLK/PANEL1 (GPIO12)
V_SCLK/CB (GPIO7)
IASLEEP/DFCK/CE/RXA Binary Audio In (GPIO10)
TCH_CLK/BITC (GPIO6)
DRESET# (GPOL0)
M_CLK/PANEL1 (GPIO12)
V_SCLK/CB (GPIO7)
IASLEEP/DFCK/CE/RXA Binary Audio In (GPIO10)
TCH_CLK/BITC (GPIO6)
DRESET# (GPOL0)
M_CLK/PANEL1 (GPIO12)
V_SCLK/CB (GPIO7)
IASLEEP/DFCK/CE/RXA Binary Audio In (GPIO10)
TCH_CLK/BITC (GPIO6)
DRESET# (GPOL0)
M_CLK/PANEL1 (GPIO12)
V_SCLK/CB (GPIO7)
IASLEEP/DFCK/CE/RXA Binary Audio In (GPIO10)
TCH_CLK/BITC (GPIO6)
92
93
91
90
95 5 6 3 2 4 1 96 88 100 99 87 81 82 83 85
95 5 6 3 2 4 1 96 88 100 99 87 81 82 83 85
95 5 6 3 2 4 1 96 88 100 99 87 81 82 83 85
95 5 6 3 2 4 1 96 88 100 99 87 81 82 83 85
95 5 6 3 2 4 1 96 88 100 99 87 81 82 83 85
PWRCLKP
PWRCLKN
DIB_DATAP
DIB_DATAN
POR M_CLKIN M_CNTRLSIN M_SCK M_RXOUT M_TXSIN M_STROBE SLEEP Binary Audio Source VOICE RELAY MUTE SPEAKER
CALL PROG DIGITAL AUDIO NC NC NC NC
NC
Panel 1
Panel 2
NC NC NC NC NC NC
ADP
CELL_RXD
CELL_TXD
TCH_CLK
TCH_TX
TCH_RX
TCH_FRAME
NC NC NC NC
ASLP
PSLP
NC
DFCK
NC
RDY
DSDT
USDT
BITC
UDT
DDT
UFCK
NC
Panel 1
Panel 2
CB
CF
CJ
CC
CE
NC
CD
Control RXD
Control TXD
NC NC
BB (USART IN)
BA (USART OUT)
NC NC NC NC NC NC
DA(IN)
RX-A
NC NC NC
TX-A
NC
TX-A
RX2-B USART
TX2-B USART
DIGITAL ISOLATION BARRIER (DIB)
TELEPHONE LINE
INTERFACE
CONFIGURATION
VOICE CODEC (VC) 20437 32-PIN TQFP
SPEAKER CIRCUIT
PDC/PDC PACKET
INTERFACE
CONFIGURATION
PDC PHONE
PHS
INTERFACE
CONFIGURATION
PHS PHONE
CDMA/CDMA PACKET
INTERFACE
CONFIGURATION
CDMA PHONE
GSM
INTERFACE
CONFIGURATION
GSM PHONE
100553_F3-1_ HIS 11250 100T
3-4
Figure 3-1. CX11250 HSD Hardware Interface Signals
Conexant
100553B
Page 23
SmartHSF Mobile Modem Data Sheet
SPKMUTE/CRXD/DSDT (GPIO8)
DRESET# (GPOL0)
PLLVSS
VOICE#/ADP/RDY/CD (GPIO2)
VDD
PLLVDD
IASLEEP/DFCK/CE/RXA
PWRCLKN
PWRCLKP
DIB_DATAN
GND
DIB_DATAP
TCH_FRAME/UFCK/BA/TX2B (GPIO3)
Bin Audio In (GPIO10)
DSPKOUT/CTXD/USDT (GPIO11)
CLKRUN#
LP_CLK
TCH_RX/DDT/BB/RX2B (GPIO4)
TCH_TX/UDT/TXA(GPIO5)
TCH_CLK/BITC (GPIO6)
VauxDET
SROMCLK
SROMIN
SROMOUT
SROMCS
V_STROBE/CC/DA(IN) (GPIO0)
V_RXOUT/ASLP/CF (GPIO1)
V_SCLK/CB (GPIO2)
V_TXSIN/PSLP/CJ (GPIO9)
M_CLK/PANEL1 (GPIO12)
V_CTRL/PANEL2 (GPIO13)
VDD
INTA#
PCIRST#
PCICLK
GND
GNT#
REQ#
PME#
AD31
AD30
AD29
VDD
AD28
AD27
AD26
VIO
AD25
AD24
CBE3#
99
100
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
VIO
IDSEL
98
28
AD23
97
29
AD22
96
30
AD21
95
31
VDD
94
32
AD20
93
33
AD19
90
89
92
91
CX11250
36
37
34
35
GND
AD16
AD18
AD17
88
38
CBE2#
87
86
39
40
IRDY#
FRAME#
85
84
41
42
TRDY#
DEVSEL#
83
82
43
44
STOP#
PERR#
81
45
SERR#
80
46
PAR
79
47
VDD
78
77
48
49
AD15
CBE1#
76
50
AD14
SDXTAL2
75
SDXTAL1
74
SCANMODE
73
SCANEN
72
VPCIDET
71
VauxEN#
70
VpciEN#
69
VDD
68
AD0
67
AD1
66
AD2
65
AD3
64
GND
63
AD4
62
AD5
61
AD6
60
AD7
59
VDD
58
CBE0#
57
AD8
56
AD9
55
AD10
54
AD11
53
AD12
52
AD13
51
100553B
Figure 3-2. CX11250 HSD 100-Pin TQFP Pin Signals
Conexant
100553_F3-2_ PO-11250-100TQFP
3-5
Page 24
SmartHSF Mobile Modem Data Sheet
Table 3-1. CX11250 HSD 100-Pin TQFP Pin Signals
Pin Signal Label I/O Type Interface Pin Signal Label I/O Type Interface
1 V_STROBE/
CC/ DA(IN) (GPIO0)
2V_RXOUT/
ASLP/ CF (GPIO1)
3V_SCLK/
CB (GPIO2)
4V_TXSIN/
PSLP/ CJ (GPIO9)
5 M_CLK/
PANEL1 (GPIO12)
6 V_CTRL/
PANEL2
(GPIO13) 7 VDD PWR +3.3V 57 CBE0# I/Opts PCI Bus: CBE0# 8 INTA# Opod PCI Bus: INTA# 58 VDD PWR +3.3V 9 PCIRST# Ip PCI Bus: PCIRST# 59 AD7 I/Opts PCI Bus: AD7 10 PCICLK Ip PCI Bus: PCICLK 60 AD6 I/Opts PCI Bus: AD6 11 GND GND GND 61 AD5 I/Opts PCI Bus: AD5 12 GNT# Ipts PCI Bus: GNT# 62 AD4 I/Opts PCI Bus: AD4 13 REQ# Opts PCI Bus: REQ# 63 GND GND GND 14 PME# Opod PCI Bus: PME# 64 AD3 I/Opts PCI Bus: AD3 15 AD31 I/Opts PCI Bus: AD31 65 AD2 I/Opts PCI Bus: AD2 16 AD30 I/Opts PCI Bus: AD30 66 AD1 I/Opts PCI Bus: AD1 17 AD29 I/Opts PCI Bus: AD29 67 AD0 I/Opts PCI Bus: AD0 18 VDD PWR +3.3V 68 VDD PWR +3.3V 19 AD28 I/Opts PCI Bus: AD28 69 VpciEN# Ot2 Pwr Detection/Switching Ckt
Itpd Telephone Line: VC M_STROBE
CDMA Phone: CC GSM Phone: DA(IN)
Itk Telephone Line: VC M_RXOUT
PHS Phone: ASLP CDMA Phone: CF
Itpd Telephone Line: VC M_SCK
CDMA Phone: CB
Ot2 Telephone Line: VC M_TXSIN
PHS Phone: PSLP CDMA Phone: CJ
Ot2 VC Telephone Line: VC M_CLKIN
PDC Phone: Panel 1 CDMA Phone: Panel 1
Ot2 Telephone Line: VC M_CNTRLSIN
PDC Phone: Panel 2 CDMA Phone: Panel 2
51 AD13 I/Opts PCI Bus: AD13
52 AD12 I/Opts PCI Bus: AD12
53 AD11 I/Opts PCI Bus: AD11
54 AD10 I/Opts PCI Bus: AD10
55 AD9 I/Opts PCI Bus: AD9
56 AD8 I/Opts PCI Bus: AD8
20 AD27 I/Opts PCI Bus: AD27 70 VauxEN# Ot2 Pwr Detection/Switching Ckt 21 AD26 I/Opts PCI Bus: AD26 71 VpciDET Itpd Pwr Detection/Switching Ckt 22 VIO PWR PCI Bus: VI/O or +3.3V 72 SCANEN Itpd GND 23 AD25 I/Opts PCI Bus: AD25 73 SCANMODE Itpd GND 24 AD24 I/Opts PCI Bus: AD24 74 SDXTAL1 Ix Crystal or Clock Circuit 25 CBE3# I/Opts PCI Bus: CBE3# 75 SDXTAL2 Ox Crystal or NC (if SDXTAL1 connected
26 VIO PWR PCI Bus: VI/O or +3.3V 76 SROMCS Ot2 SROM: Chip Select (CS) 27 IDSEL Ip PCI Bus: IDSEL 77 SROMOUT Ot2 SROM: Data In (DI) 28 AD23 I/Opts PCI Bus: AD23 78 SROMIN Itpu SROM: Data Out (DO) 29 AD22 I/Opts PCI Bus: AD22 79 SROMCLK Ot2 SROM: Clock (SK) 30 AD21 I/Opts PCI Bus: AD21 80 VauxDET Itpd Pwr Detection/Switching Ckt 31 VDD PWR +3.3V 81 TCH_CLK/
BITC (GPIO6)
32 AD20 I/Opts PCI Bus: AD20 82 TCH_TX/
UDT/ TXA (GPIO5)
33 AD19 I/Opts PCI Bus: AD19 83 TCH_RX/
DDT/ BB/ RX2B (GPIO4)
34 AD18 I/Opts PCI Bus: AD18 84 LP_CLK RC
Itpu/Ot12 PDC Phone: TCH_CLK
Itpu/Ot12 PDC Phone: TCH_TX K
Itpu/Ot12 PDC Phone: TCH_RX
to Clock Circuit)
PHS Phone: BITC
PHS Phone: UDT GSM Phone: TXA
PHS Phone: DDT CDMA Phone: BB_RXD GSM Phone: RX2-B
+3.3V through 240 K
3-6
Conexant
100553B
Page 25
SmartHSF Mobile Modem Data Sheet
Table 3-1. CX11250 HSD 100-Pin TQFP Pin Signals (Continued)
Pin Signal Label I/O Type Interface Pin Signal Label I/O Type Interface
35 AD17 I/Opts PCI Bus: AD17 85 TCH_FRAME/
UFCK/ BA/ TX2B
(GPIO3) 36 GND GND GND 86 CLKRUN# I/Opod PCI Bus: CLKRUN# 37 AD16 I/Opts PCI Bus: AD16 87 DSPKOUT/
CTXD/
USDT/
TXA
(GPIO11) 38 CBE2# I/Opts PCI Bus: CBE2# 88 Bin Audio In
(GPIO10) 39 FRAME# I/Opsts PCI Bus: FRAME# 89 GND GND GND 40 IRDY# I/Opsts PCI Bus: IRDY# 90 DIB_DATAN Idd/Odd DIB: Data Negative Channel 41 TRDY# I/Opsts PCI Bus: TRDY# 91 DIB_DATAP Idd/Odd DIB: Data Positive Channel 42 DEVSEL# I/Opsts PCI Bus: DEVSEL# 92 PW RCLKP Odpc DIB: Transformer primary winding
43 STOP# I/Opsts PCI Bus: STOP# 93 PWRCLKN Odpc DIB: Transformer primary winding
44 PERR# I/Opsts PCI Bus: PERR# 94 VDD PWR +3.3V 45 SERR# I/Opod PCI Bus: SERR# 95 DRESET#
(GPOL0) 46 PAR I/Opts PCI Bus: PAR 96 IASLEEP/
DFCK/
CE/
RXA 47 VDD PWR +3.3V 97 PLLVDD PWR 48 CBE1# I/Opts PCI Bus: CBE1# 98 PLLVSS GND GND 49 AD15 I/Opts PCI Bus: AD15 99 SPKMUTE/
CRXD/
DSDT (GPIO8)
50 AD14 I/Opts PCI Bus: AD14 100 VOICE#/ADP/
RDY/CD (GPIO2)
Itpu/Ot12 PDC Phone: TCH_FRAME
PHS Phone: UFCK CDMA Phone: BA_TXD GSM Phone: TX2-B
Ot12 Telephone Line: Spkr circuit
PDC Phone: CELL_TXD PHS Phone: USDT CDMA Phone: Control TXD GSM: TX-A
Itpu Line Interface: Binary Audio Source
non-dotted terminal
dotted terminal
Ot2 VC: POR
Ot2 Telephone Line: VC SLEEP
PHS Phone: DFCK CDMA Phone: CE GSM Phone: RX-A
+3.3V and to GND through 0.1 µF
It/Ot12 Telephone Line: Spkr Circuit (Out);
Vaux Mode Power Select (In) PDC Phone: CELL_RXD PHS Phone: DSDT CDMA Phone: Control RXD
Ot12 Telephone Line: Voice Relay Control
PDC Phone: ADP PHS Phone: RDY CDMA Phone: CD
100553B
Conexant
3-7
Page 26
SmartHSF Mobile Modem Data Sheet
NOTES:
1. I/O Types
I/Opod Digital input/output, PCI, open drain (PCI type = o/d)
I/Opsts Digital input/output, PCI, sustained three-state (PCI type = s/t/s)
I/Opts Digital input/output, PCI, three-state (PCI type = t/s)
Idd input, DIB, data channel
Ip Digital input, PCI, totem pole (PCI type = in)
Ipts Digital input, PCI, (PCI type = t/s)
It Digital input, TTL-compatible
Itk Digital input, TTL-compatible, internal keeper
Itpd Digital input, TTL-compatible, internal 75k ± 25k Ω pull-down
Itpu Digital input, TTL-compatible, internal 75k ± 25k Ω pull-up It/Ot2 Digital input, TTL-compatible/digital output, TTL-compatible, 2 mA, Z
It/Ot12 Digital input, TTL-compatible/digital output, TTL-compatible, 12 mA, Z
Ix Crystal/clock input
Odpc Output, DIB power and clock channel
Odd Output, DIB data channel
Ood Digital output, open drain
Opod Digital output, PCI, open drain (PCI type =o/d)
Opts Digital output, PCI, three-state (PCI type = t/s) Ot2 Digital output, TTL-compatible, 2 mA, Z
Ot12 Digital output, TTL-compatible, 12 mA, Z
Ox Crystal output
2. Interface Legend:
NC No internal pin connection DIB Digital Isolation Barrier VC Voice Codec
3. All references to PCI Bus also apply to Mini PCI unless otherwise specified.
INTERNAL
INTERNAL
= 120
= 32
= 120
INTERNAL
INTERNAL
= 32
3-8
Conexant
100553B
Page 27
SmartHSF Mobile Modem Data Sheet
Table 3-2. CX11250 HSD Pin Signal Definitions
Label Pin I/O I/O Type Signal Name/Description
SYSTEM
SDXTAL1 SDXTAL2
VDD 7, 18, 31, 47,
GND 11, 36, 63, 89 G GND
VIO 22, 26 P PWR
LP_CLK 84 RC
PLLVDD 97 P PWR
PLLGND 98 G GND
SCANEN 72 I Itpd
SCANMODE 73 I Itpd
CLKRUN# 86 I I/Opod,
VpciDET 71 I Itpd
VauxDET 80 I Itpd
VpciEN# 69 O Ot2
VauxEN# 70 O Ot2
SROMCLK 79 O Ot2
SROMCS 76 O Ot2
SROMIN 78 I Itpu
SROMOUT 77 O Ot2
74 75
58, 68, 94
I O
PPWR
Ix Ox
(o/d)
Crystal/Clock In and Crystal Out.
crystal or clock circuit. Connect SDXTAL2 to the 28.224000 MHz crystal circuit or leave open if SDXTAL1 is connected to a clock circuit.
Digital Supply Voltage.
Digital Ground.
I/O Signaling Voltage Reference.
internally for PCI clamping.
Low Power Clock RC Circuit.
Digital Supply Voltage.
Digital Ground.
Scan Enable.
Scan Mode
Clock Running.
and an open drain output used to request starting or speeding up CLK. Connect to GND for PCI Bus designs. Connect to CLKRUN# pin for Mini PCI designs.
POWER DETECTION
Vpci Detect.
to be ignored. Connect this pin to the PCI Bus +5V pins for PCI Bus designs or to PCI 3.3V for Mini PCI designs. VpciDET is deasserted when the PCI Bus enters the B3 state.
This pin may alternatively be directly driven in embedded designs by using a logical signal, either +5V or +3.3V level, to indicate when the PCI Bus is in a B3 state. Driving this pin low synchronously to the PCI clock or when the PCI clock is stopped also allows the HSD to be put into a very low power mode. Using this method, if modem operation is not required, modem power consumption can be reduced even while the PCI Bus is in power state B0.
Vaux Detect.
to PCI Bus: Vaux. At device power on (POR), if D3_Cold bit in the EEPROM is a 1, PMC[15] is set to a 1 if VauxDET is high or PMC[15] is cleared to a 0 if VauxDET is low.
Vpci Enable.
that switch between Vaux and Vpci for different power states and for retail designs where the target PC may or may not support Vaux.
Vaux Enable.
that switch between Vaux and Vpci for different power states and for retail designs where the target PC may or may not support Vaux.
SERIAL EEPROM INTERFACE
Serial ROM Shift Clock.
Serial ROM Chip Select.
Serial ROM Device Status and Data Out.
through 1 kΩ if using a +5V EEPROM.
Serial ROM Instruction, Address, and Data In.
Connect to GND.
. Connect to GND.
The VpciDET input indicates when PCI cycles and PCIRST# are
Active high input used to detect the presence of Vaux. Connect
Active low output used to enable Vpci FET. For use in designs
Active low output used to enable Vaux FET. For use in designs
Connect to +3.3V.
Connect to digital ground.
Connect to +3.3V and to GND through 0.1 µF.
Connect to digital ground.
CLKRUN# is an input used to determine the status of CLK
Connect to SROM SK input (frequency: 537.6 kHz).
Connect to SROM CS input.
Connect SDXTAL1 to a 28.224000 MHz
Connect to PCI Bus VI/O or +3.3V. Used
Connect to +3.3V through 240 KΩ.
Connect to SROM DO output,
Connect to SROM DI input.
100553B
Conexant
3-9
Page 28
SmartHSF Mobile Modem Data Sheet
Table 3-2. CX11250 HSD Pin Signal Definitions (Continued)
Label Pin I/O I/O Type Signal Name/Description
PCI BUS INTERFACE
PCICLK 10 I Ip
PCIRST# 9 I Ip
AD[31:0] 15-17, 19-21,
CBE0# CBE1# CBE2# CBE3#
PAR 46 I/O I/Opts
FRAME# 39 I/O I/Opsts
IRDY# 40 I/O I/Opsts
TRDY# 41 I/O I/Opsts
STOP# 43 I/O I/Opsts
IDSEL 27 I Ip
DEVSEL# 42 I/O I/Opsts
REQ# 13 O Opts
GNT# 12 I Ipts
PERR# 44 I/O I/Opsts
SERR# 45 O Opod
INTA# 8 O Opod
PME# 14 O Opod
STSCHG# 14 O Opod
23-24, 28-30, 32-35, 37, 49­56, 59-62, 64­67
57 48 38 25
I/O I/Opts
I/O I/Opts
(in)
(in)
(t/s)
(t/s)
(t/s)
(s/t/s)
(s/t/s)
(s/t/s)
(s/t/s)
(in)
(s/t/s)
(t/s)
(t/s)
(s/t/s)
(o/d)
(o/d)
(o/d)
(o/d)
PCI Bus Clock.
transactions on PCI. Connect to PCI Bus: CLK.
PCI Bus Reset.
sequencers, and signals to a consistent reset state. Connect to PCI Bus: RST#.
Multiplexed Address and Data.
same PCI pins. Connect to PCI Bus: AD[31-0].
Bus Command and Bus Enable.
multiplexed on the same PCI pins. During the address phase of a transaction, CBE[3:0]# define the bus command. During the data phase, CBE[3:0]# are used as Byte Enables. Connect to PCI Bus: CBE[3:0]#.
Parity is even parity across AD[31:00] and CBE[3:0]#. The master
Parity.
drives PAR for address and write data phases; the Bus Interface drives PAR for read data phases. Connect to PCI Bus: PAR.
Cycle Frame.
beginning and duration of an access. Connect to PCI Bus: FRAME#.
Initiator Ready.
ability to complete the current data phase of the transaction. IRDY# is used in conjunction with TRDY#. Connect to PCI Bus: IRDY#.
Target Ready.
complete the current data phase of the transaction. TRDY# is used in conjunction with IRDY#. Connect to PCI Bus: TRDY#.
STOP# is asserted to indicate the Bus Interface is requesting the master
Stop.
to stop the current transaction. Connect to PCI Bus: STOP#.
Initialization Device.
read and write transactions. Connect to PCI Bus: IDSEL.
Device Select.
has decoded its address as the target of the current access. As an input, DEVSEL# indicates whether any device on the bus has been selected. Connect to PCI Bus: DEVSEL#.
t. REQ# is used to indicate to the arbiter that this agent desires use of
Reques
the bus. Connect to PCI Bus: REQ#.
GNT# is used to indicate to the agent that access to the bus has been
Grant.
granted. Connect to PCI Bus: GNT#.
Parity Error.
PCI Bus: PERR#.
System Error.
parity errors, data parity errors on the Special Cycle command, or any other system error where the result will be catastrophic. Connect to PCI Bus: SERR#.
Interrupt A.
Connect to PCI Bus: INTA#.
Power Management Event.
(selected by the PME DRV bit in the EEPROM) asserted when a valid ring signal is detected and the PME_En bit of the PMCSR is a 1. This signal should be used only if the target PCI Bus supports power management wake-up event. Connect to the PCI Bus: PME#.
Status Changed.
RRdy/-Bsy bit (PRR1) in the Pin Replacement Register (PRR) and to the setting of the ReqAttn bit (ESR4) in the Extended Status Register (ESR).
The PCICLK (PCI Bus CLK signal) input provides timing for all
Active low input asserted to initialize PCI-specific registers,
Address and Data are multiplexed on the
Bus Command and Byte Enables are
FRAME# is driven by the current master to indicate the
IRDY# is used to indicate the initiating agent’s (bus master’s)
TRDY# is used to indicate s the Bus Interface’s ability to
IDSEL input is used as a chip select during configuration
When actively driven, DEVSEL# indicates the driving device
PERR# is used for the reporting of data parity errors. Connect to
SERR# is an open drain output asserted to report address
INTA# is an open drain output asserted to request an interrupt.
Active low open drain or active high TTL output
Active low output asserted to alert the host to changes in the
3-10
Conexant
100553B
Page 29
SmartHSF Mobile Modem Data Sheet
Table 3-2. CX11250 HSD Pin Signal Definitions (Continued)
Label Pin I/O I/O Type Signal Name/Description
DIB INTERFACE
PWRCLKP 92 O Odpc
PWRCLKN 93 O Odpc
DIB_DATAP 91 I/O Idd/Odd
DIB_DATAN 90 I/O Idd/Odd
TELEPHONE LINE (DAA)/AUDIO INTERFACE
DRESET# (GPOL0)
M_CLK/PANEL1 (GPIO12)
V_CTRL/PANEL 2 (GPIO13)
V_SCLK/CB (GPIO2)
V_RXOUT/ASLP/ CF (GPIO1)
V_TXSIN/PSLP/ CJ (GPIO9)
V_STROBE/CC/ DA(IN) (GPIO0)
IASLEEP/ DFCK/CE/RXA
VOICE#/ADP/ RDY/CD (GPIO2)
SPKMUTE/ CRXD/DSDT/ (GPIO8)
DSPKOUT/ CTXD/ USDT/CNTL_TX D (GPIO11)
Bin Audio In (GPIO10)
95 O Ot2
5OOt2
6OOt2
3 I Itpd
2IIt
4OOt2
1 I Itpd
96 O Ot2
100 O Ot12
99 I/O It/Ot12
87 O Ot12
88 I Itpu
Clock and Power Positive.
DIB transformer primary winding non-dotted terminal.
Clock and Power Negative.
DIB transformer primary winding dotted terminal.
Data Positive.
and LSD. Connect to LSD through DIB data positive channel components.
Data Negative.
and LSD. Connect to LSD through DIB data negative channel components.
Modem Reset.
Master Clock Output
Voice Control Output.
Voice Serial Clock input.
Voice Serial Receive Data Input.
Voice Serial Transmit Data Output.
Voice Serial Frame Sync Input.
Modem Sleep.
Voice Relay Control.
open voice relay. The polarity of this output is configurable.
Speaker Mute/Vaux Mode Power Select.
turn off (mute) the speaker during normal operation. Applicable to S models only.
Upon device reset, this pin is temporarily an input and is sampled. If sampled high and VauxDET is high, VpciEN# will be asserted when the device is in D0. If sampled low (e.g., SPKMUTE signal is pulled down to GND through 10k Ω) and VauxDET is high, VauxEN# will be asserted when the device is in D0. VauxEN# is always asserted when VauxDET is high in D3 with PME enabled. Either VauxEN# or VpciEN#, but not both, can be asserted at the same time.
Call Progress (Digital Speaker) Output.
the received analog input signal digitized to TTL high or low level by an internal comparator. This signal is used for call progress or carrier monitoring. This output can be optionally connected to a low-cost on-board speaker, e.g., a sounducer, or to an analog speaker circuit.
Binary Audio Input.
Transfers data, control, and status information between HSD
Transfers data, control, and status information between HSD
Connect to VC POR pin.
Connect to VC SLEEP pin.
Provides clock and power to the LSD. Connect to
Provides clock and power to the LSD. Connect to
. Connect to VC M_CLKIN pin.
Connect to VC M_CNTRLSIN pin.
Connect to VC M_SCK pin.
Connect to VC M_RXOUT pin.
Connect to VC M_TXSIN pin.
Connect to VC M_STROBE pin.
Output (typically active low) used to control the normally
Binary audio source.
Output (typically active low) used to
The DSPKOUT digital output reflects
100553B
Conexant
3-11
Page 30
SmartHSF Mobile Modem Data Sheet
Table 3-2. CX11250 HSD Pin Signal Definitions (Continued)
Label Pin I/O I/O Type Signal Name/Description
PDC/PDC PACKET PHONE INTERFACE
M_CLK/PANEL1 (GPIO12)
V_CTRL/PANEL 2 (GPIO13)
VOICE#/ADP/ RDY/CD (GPIO2)
SPKMUTE/ CRXD/ DSDT/ (GPIO8)
DSPKOUT/ CTXD/USDT/ (GPIO11)
TCH_CLK/BITC (GPIO6)
TCH_TX/UDT/ TXA(GPIO5)
TCH_RX/DDT/ BB_RXD/RX2B (GPIO4)
TCH_FRAME/ UFCK/BA_TXD/ TX2B (GPIO3)
V_RXOUT/ASLP/ CF (GPIO1)
V_TXSIN/PSLP/ CJ (GPIO9)
IASLEEP/DFCK/ CE/RXA
VOICE#/ADP/ RDY/CD(GPIO2)
SPKMUTE/ CRXD/DSDT (GPIO8)
DSPKOUT/ CTXD/USDT (GPIO11)
TCH_CLK/ BITC (GPIO6)
TCH_TX/UDT/ TXA (GPIO5)
TCH_RX/DDT/ BB_RXD/RX2B (GPIO4)
TCH_FRAME/ UFCK/BA_TXD/ TX2B (GPIO3)
5 O Itpu/Ot12
6 O Itpu/Ot12
100 O Ot12
99 I It/Ot12
87 O Ot12
81 I Itpu/Ot12
82 O Itpu/Ot12
83 I Itpu/Ot12
85 I Itpu/Ot12
2IIt
4 O It/Ot2
96 I It/Ot2
100 O Ot12
99 I It/Ot12
87 O Ot12
81 I Itpu/Ot12
82 O Itpu/Ot12
83 I Itpu/Ot12
85 I Itpu/Ot12
Panel 1.
Panel 2.
ADP.
CELL_RXD.
CELL_TXD.
TCH_CLK.
TCH_TX.
TCH_RX.
TCH_FRAME.
PHS PHONE INTERFACE
ASLP.
PSLP.
DFCK.
Ready.
DSDT.
USDT.
BITC.
UDT.
DDT.
UFCK.
Defined by the PDC firmware driver.
Defined by the PDC firmware driver.
Defined by the PDC firmware driver.
Defined by the PDC firmware driver.
Defined by the PDC firmware driver.
Defined by the PDC firmware driver.
Defined by the PDC firmware driver.
Defined by the PDC firmware driver.
Defined by the PDC firmware driver.
Defined by the PHS firmware driver.
Defined by the PHS firmware driver.
Defined by the PHS firmware driver.
Defined by the PHS firmware driver.
Defined by the PHS firmware driver.
Defined by the PHS firmware driver.
Defined by the PHS firmware driver.
Defined by the PHS firmware driver.
Defined by the PHS firmware driver.
Defined by the PHS firmware driver.
3-12
Conexant
100553B
Page 31
SmartHSF Mobile Modem Data Sheet
Table 3-2. CX11250 HSD Pin Signal Definitions (Continued)
Label Pin I/O I/O Type Signal Name/Description
CDMA PHONE INTERFACE
M_CLK/PANEL1 (GPIO12)
V_CTRL/PANEL 2 (GPIO13)
V_SCLK/CB (GPIO2)
V_RXOUT/ASLP/ CF (GPIO1)
V_TXSIN/PSLP/ CJ (GPIO9)
V_STROBE/CC/ DA(IN) (GPIO0)
IASLEEP/DFCK/ CE/RXA
VOICE#/ADP/ RDY/CD(GPIO2)
SPKMUTE/ CRXD/DSDT/ (GPIO8)
DSPKOUT/ CTXD/USDT/ (GPIO11)
TCH_RX/DDT/ BB/RX2B (GPIO4)
TCH_FRAME/ UFCK/BA/TX2B (GPIO3)
V_STROBE/CC/ DA(IN) (GPIO0)
IASLEEP/DFCK/ CE/RXA
DSPKOUT/ CTXD/USDT/ TXA(GPIO11)
TCH_TX/UDT/ TXA(GPIO5)
TCH_RX/DDT/ BB/RX2B (GPIO4)
TCH_FRAME/ UFCK/BA/ TX2B (GPIO3)
5 O Itpu/Ot12
6 O Itpu/Ot12
3 I Itpd
2IIt
4OOt2
1 I Itpd
96 I Ot2
100 O Ot12
99 I It/Ot12
87 O Ot12
83 I Itpu/Ot12
85 O Itpu/Ot12
1 I Itpd
96 I It/Ot2
87 O Ot12
82 O Itpu/Ot12
83 I Itpu/Ot12
85 O Itpu/Ot12
Panel 1.
Panel 2.
CB.
CF.
CJ.
CC.
CE.
CD.
Control RXD.
Control TXD.
BB (USART IN).
BA (USART OUT).
GSM PHONE INTERFACE
DA(IN).
RX-A.
TX-A.
TX-A.
RX2-B USART.
TX2-B USART.
Defined by the CDMA firmware driver.
Defined by the CDMA firmware driver.
Defined by the CDMA firmware driver.
Defined by the CDMA firmware driver.
Defined by the CDMA firmware driver.
Defined by the CDMA firmware driver.
Defined by the CDMA firmware driver.
Defined by the CDMA firmware driver.
Defined by the CDMA firmware driver.
Defined by the CDMA firmware driver.
Defined by the CDMA firmware driver.
Defined by the CDMA firmware driver.
Defined by the GSM firmware driver.
Defined by the GSM firmware driver.
Defined by the GSM firmware driver.
Defined by the GSM firmware driver.
Defined by the GSM firmware driver.
Defined by the GSM firmware driver.
100553B
Conexant
3-13
Page 32
SmartHSF Mobile Modem Data Sheet
Table 3-2. CX11250 HSD Pin Signal Definitions (Continued)
NOTES:
1. I/O Types
I/Opod Digital input/output, PCI, open drain (PCI type = o/d)
I/Opsts Digital input/output, PCI, sustained three-state (PCI type = s/t/s)
I/Opts Digital input/output, PCI, three-state (PCI type = t/s)
Idd input, DIB, data channel
Ip Digital input, PCI, totem pole (PCI type = in)
Ipts Digital input, PCI, (PCI type = t/s)
It Digital input, TTL-compatible
Itpd Digital input, TTL-compatible, internal 75k ± 25k Ω pull-down
Itpu Digital input, TTL-compatible, internal 75k ± 25k Ω pull-up It/Ot2 Digital input, TTL-compatible/digital output, TTL-compatible, 2 mA, Z
It/Ot12 Digital input, TTL-compatible/digital output, TTL-compatible, 12 mA, Z
Ix Crystal/clock input
Odpc Output, DIB power and clock channel
Odd Output, DIB data channel
Ood Digital output, open drain
Opod Digital output, PCI, open drain (PCI type =o/d)
Opts Digital output, PCI, three-state (PCI type = t/s) Ot2 Digital output, TTL-compatible, 2 mA, Z
Ot12 Digital output, TTL-compatible, 12 mA, Z
Ox Crystal output
2. Interface Legend: NC = No internal pin connection RESERVED = No external connection allowed (may have internal connection).
3. All references to PCI Bus also apply to Mini PCI unless otherwise specified.
INTERNAL
INTERNAL
= 120
= 32
= 120
INTERNAL
INTERNAL
= 32
3-14
Conexant
100553B
Page 33
SmartHSF Mobile Modem Data Sheet
A
Table 3-3. Cell Phone/Telephone Line Interface Signals
Application Signal and I/O Direction
PSTN Selected PDC/PDC Packet
Pin Pin Name PSTN
95 DRESET# (GPOL0) DRESET# O - - - - - - - -
5 M_CLK/PANEL1
(GPIO12)
6 V_CTRL/PANEL2
(GPIO13) 3 V_SCLK/CB (GPIO7) V_SCLK I - - - - CB I - ­2 V_RXOUT/ASLP/CF
(GPIO1) 4 V_TXSIN/PSLP/CJ
(GPIO9) 1V_STROBE/CC/
DA(IN) (GPIO0)
96 IASLEEP/DFCK/CE/RXA IASLEEP O - - DFCK I CE I RX-A I
100 VOICE#/ADP/RDY/CD
(GPIO2)
99 SPKMUTE/CRXD/
DSDT (GPIO8)
87 DSPKOUT/CTXD/
USDT/TXA (GPIO11)
81 TCH_CLK/BITC (GPIO6) - - TCH_CLK I BITC I - ­82 TCH_TX/UDT/TXA
(GPIO5)
83 TCH_RX/DDT/BB/RX2B
(GPIO4)
85 TCH_FRAME/UFCK/
BA/TX2B (GPIO3)
Signal
M_CLK O Panel 1 O - - Panel 1 O - -
V_CTRL O Panel 2 O - - Panel 2 O - -
V_RXOUT I - - ASLP I CF I - -
V_TXSIN O - - PSLP O CJ O - -
V_STROBE I - - - - CC I DA(IN) I
VOICE# O ADP O RDY O CD O - -
SPKMUTE O CELL_RXD I DSDT I Control RXD I - -
DSPKOUT O CELL_TXD O USDT O Control TXD O TX-A O
PSTN
I/O
- - TCH_TX O UDT O - TX-A O
- - TCH_RX I DDT I BB
- - TCH_FRAME I UFCK I BA
Selected
PDC/
PDC packet
Signal
PHS Selected CDMA Selected GSM Selected
PDC
I/O
PHS
Signal
PHS
I/O
CDMA Signal
(USART IN)
(USART OUT)
CDM
I/O
IRX2-B USART I
OTX2-B USART O
GSM
Signal
GSM
I/O
100553B
Conexant
3-15
Page 34
SmartHSF Mobile Modem Data Sheet
3.2 CX20463 SmartDAA LSD HARDWARE PINS AND SIGNALS
3.2.1 LSD Signal Interfaces
HSD Interface (Through DIB)
The DIB interface signals are:
Clock (CLK); input
Digital Power (PWR+); input power
Digital Ground (DGND); digital ground
Data Positive (DIB_P); input
Data Negative (DIB_N); input
Telephone Line Interface
The telephone line interface signals are:
RING AC Coupled (RAC1); input
TIP AC Coupled (TAC1); input
Electronic Inductor Resistor (EIR); output
TIP and RING DC Measurement (TRDC); input
DAC Output Voltage (DAC); output
Electronic Inductor Capacitor (EIC)
Electronic Inductor Output (EIO)
Electronic Inductor Feedback (EIF)
Resistive Divider Midpoint (DCF)
Transmit Analog Output (TXA); output
Receive Analog Input (RXI); input
Receiver Gain (RXG); output
MOV Enable (MOVEN); output
Worldwide Impedance 0 (ZW0); input
US Impedance 0 (ZUS0); input
Transmit Feedback (TXF); input
Transmit Output (TXO); output
3.2.2 LSD Interface Signals, Pin Assignments, and Signal Definitions
LSD 32-pin TQFP hardware interface signals are shown by major interface in Figure 3-3, are shown by pin number in Figure 3-4, and are listed by pin number in Table 3-4.
LSD hardware interface signals are defined in Table 3-5.
LSD pin signal digital electrical characteristics are defined in Table 3-6.
3-16
Conexant
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Page 35
PWRCLKN
PWRCLKP
DIB_DATAP
DIB_DATAN
DIGITAL
ISOLATION
BARRIER
C110
R112
C112
(DIB)
POWER AND
CLOCK
CHANNEL
DATA
CHANNEL
C22
C24
R120
D2
NOTES:
1. Consult applicable reference design for exact
component placement and values.
2. R125 is usually installed.
3. R124 is usually removed.
SmartHSF Mobile Modem Data Sheet
10
RAC2 TAC2
RAC1 TAC1
CX20463
SMARTDAA
LINE SIDE
DAC
TRDC
DEVICE
(LSD)
27
31
24
26
25 23
28
29
30
32-PIN TQFP
CLK
PWR+
AVDD
DVDD
DGND AGND
DIB_P
DIB_N
POR
R32
D4
C70
C26
R125
DVDD
R124R110
C30 C28
C72C62
GND_LSD
R34
R36
AGND_LSD
DVDD
RXG
TXA
MOVEN (GPIO1)
ZW0
ZUS0
TXO TXF
DCF
VREF
RBIAS
GPIO2
NC
12
NC
9
Ring
11
Filter
15 2 6 5 21 22
3 4 18
32
14 17 20 19
16
8
7
13
1
AGND_LSD
C42
C44
Electronic
Inductor,
Off-Hook,
Pulse Dial,
and TIP and
RING VI
Control
Echo
Cancellation
and
Receiver
Pulse Dial
Voltage
Protection
(Country Specific)
Impedance
Matching
and
Transmitter
C74
AGND_LSD
R54
AGND_LSD
NC
Safety
and EMI
Protection
AGND_LSD
C45
C76
AGND_LSD
Telephone
Line
Connector
TIP RING
EIR EIC
EIO
EIF
RXI
VC
Figure 3-3. CX20463 LSD Hardware Interface Signals
DGND
DVDD
CLK
DIB_P
DIB_N
POR
PWR+
MOVEN (GPIO1)
25
26
27
28
29
30
31
32
24
GPIO2
EIC
RXI
RXG
TRDC
DAC
VREF
1
2
3
4
5
6
7
CX20463
VC
8
9
RAC1
10
RAC2
11
TAC1
12
TAC2
14
13
ZW0
RBIAS
15
EIR
16
DCF
23
22
21
20
19
18
17
AVDD
AGND
EIF
EIO
TXO
TXF
TXA
ZUS0
100491F3-7 PO-20463-32T
Figure 3-4. CX20463 LSD 32-Pin TQFP Pin Signals
100491_F3-09_HI CX20463
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Conexant
3-17
Page 36
SmartHSF Mobile Modem Data Sheet
Table 3-4. CX20463 LSD 32-Pin TQFP Pin Signals
Pin Signal Label I/O Type Interface
1 GPIO2 It/Ot12 NC 2 EIC Oa Telephone Line Interface Components 3 RXI Ia Telephone Line Interface Components 4 RXG Oa Telephone Line Interface Components 5 TRDC Oa Telephone Line Interface Components 6 DAC Oa Telephone Line Interface Components 7 VC REF VREF through C42 and to AGND_LSD through C44 and C74 8 VREF REF VC through C42 and to AGND_LSD through C45 and C76 9 RAC1 Ia Diode bridge top AC connection (RING) through R2 and C2 10 RAC2 Ia NC 11 TAC1 Ia Diode bridge bottom AC connection (TIP) through R4 and C4 12 TAC2 Ia NC 13 RBIAS Ia AGND_LSD through R54 14 ZW0 Ia Telephone Line Interface Components 15 EIR Ot12 Telephone Line Interface Components 16 DCF Ia AGND_LSD 17 ZUS0 Ia Telephone Line Interface Components 18 TXA Oa Telephone Line Interface Components 19 TXF Ia Telephone Line Interface Components 20 TXO Oa Telephone Line Interface Components 21 EIO Oa Telephone Line Interface Components 22 EIF Ia Telephone Line Interface Components 23 AGND AGND_LSD AGND_LSD 24 AVDD PWR LSD DVDD pin 25 DGND GND_LSD DIB transformer secondary winding undotted terminal through diode D2 and R120 in series
26 DVDD PWR LSD AVDD pin, to GND_LSD through C28, C30, and C72 in parallel, and to DIB
27 CLK I DIB transformer secondary winding undotted terminal through C26 and R32 in series, and
28 DIB_P I/O DIB C22 through R34 29 DIB_N I/O DIB C24 through R36 30 POR It LSD DVDD pin 31 PWR+ PW R DIB transformer secondary winding dotted terminal through R125 and to GND_LSD
32 MOVEN (GPIO1) Ot12 Telephone Line Interface Components
NOTES:
1. I/O types*: Ia Analog input It Digital input, TTL-compatible (See Table 3-6) Oa Analog output
Ot12 Digital output, TTL-compatible, 12 mA, Z
AGND_LSD Isolated LSD Analog Ground GND_LSD Isolated LSD Digital Ground
2. Refer to applicable reference design for exact component placement and values.
and to GND_LSD
transformer secondary winding dotted terminal through R124.
through R120 shared with LSD DGND pin through diode D2
through zener diode D4 and C70 in parallel
INTERNAL
= 32 Ω (See Table 3-6)
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Page 37
SmartHSF Mobile Modem Data Sheet
Table 3-5. CX20463 LSD Pin Signal Definitions
Label Pin I/O Type Signal Name/Description
SYSTEM SIGNALS
AVDD 24 PWR
AGND 23 AGND_LSD
POR 30 It
VREF 8 REF
VC 7 REF
CLK 27 I
PWR+ 31 PWR
DVDD 26 PWR
DGND 25 GND_LSD
DIB_P 28 I/O
DIB_N 29 I/O
RAC1, TAC1
RAC2 TAC2
EIR 15 Oa
EIC 2 Oa
DAC 6 Oa
TRDC 5 Ia
EIO 21 Oa
EIF 22 Ia
RXG 4 Oa
RXI 3 Ia
TXA 18 Oa
MOVEN (GPIO1) 32 Ot12
RBIAS 13 Ia
DCF 16 Ia
9, 11
10, 12
Ia, Ia
Ia, Ia
Analog Power Supply.
LSD Analog Ground. LSD Analog Ground.
GND_LSD/AGND_LSD tie point and to the analog ground plane.
Power-On Reset.
Output Reference Voltage.
C45 and C76. Ensure a very close proximity between C42 and C45 and the VREF pin.
Output Middle Reference Voltage.
through C44 and C74. Ensure a very close proximity between C44 and the VC pin. Use a short path and a wide trace to AGND_LSD pin.
DIB INTERFACE SIGNALS
Provides input clock, AC-coupled, to the LSD. Connect to DIB transformer
Clock.
secondary winding undotted terminal through R32 and C26 in series, and through R120 shared with LSD DGND pin through diode D2.
Digital Power Input
DIB transformer secondary winding dotted terminal through R125, and to GND_LSD though zener diode D4 and C70 in parallel.
Digital Power
terminal through R124, and to GND_LSD through C28, C30, and C72 in parallel.
LSD Digital Ground.
through diode D2 in series with R120, and to GND_LSD at the GND_LSD/AGND_LSD tie point.
Data and Control Positive.
R34 on the LSD side. DIB_P and DIB_N signals are differential, and ping-pong between DIB and HSD (half duplex).
Data and Control Negative.
R36 on LSD side. DIB_P and DIB_N signals are differential, and ping-pong between DIB and HSD (half duplex).
TIP AND RING INTERFACE
RING1 AC Coupled and TIP1 AC Coupled.
used to detect ring. Connect RAC1 to the diode bridge AC top connection (RING) through R2 and C2.
Connect TAC1 to the diode bridge AC bottom connection (TIP) through R4 and C4.
RING2 AC Coupled and TIP2 AC Coupled.
Electronic Inductor Resistor.
Electronic Inductor Capacitor Switch.
dialing and to ground all other times. This is needed to eliminate pulse dial interference from the electronic inductor AC filter capacitor.
DAC Output Voltage.
TIP and RING DC Measurement.
internally to extract TIP and RING DC voltage and Line Polarity Reversal (LPR) information.
Electronic Inductor Output.
offhook, pulse dial, and DC IV mask operation.
Electronic Inductor Feedback.
Receiver Gain.
Receive Analog Input.
Transmit Analog Output.
MOV Enable
use. Leave open if the product is not intended for Australia, Poland, or Italy.
Receiver Bias.
Resistive Divider Midpoint.
. Connect to pin 24 (AVDD), to DIB transformer secondary winding dotted
. Connect to pulse dial voltage protection circuit for Australia/Poland/Italy
Connect to the LSD DVDD pin.
Connect to LSD DVDD pin.
Connect to VC through C42 and to AGND_LSD through
Connect to VREF through V42 and to AGND_LSD
. Provides unregulated input digital power to the LSD. Connect to
Connect to DIB transformer secondary winding undotted terminal
Connect to HSD DIB_DATAP through C22 in the DIB and
Connect to HSD DIB_DATAN through C24 in the DIB and
Electronic inductor resistor switch.
Internally switched to no connect when pulse
Output voltage of the reference DAC.
Input on-hook voltage (from a resistive divider). Used
Calculated voltage is applied to this output to control
Electronic inductor feedback.
Receiver operational amplifier output.
Receiver operational amplifier inverting input.
Transmit signal used for canceling echo in the receive path.
Connect to GND through R54.
Connect to LSD analog ground.
Connect to AGND_LSD at the
AC-coupled voltage from telephone line
Not used. Leave open.
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Conexant
3-19
Page 38
SmartHSF Mobile Modem Data Sheet
Table 3-5. CX20463 LSD Pin Signal Definitions (Continued)
Label Pin I/O Type Signal Name/Description
TELEPHONE LINE INTERFACE (CONTINUED)
ZW0 14 Ia
ZUS0 17 Ia
TXO 20 Oa
TXF 19 Ia
GPIO2 1 It/Ot12
NOTES:
1. I/O types*: Ia Analog input It Digital input, TTL-compatible (see Table 3-6) Oa Analog output
Ot12 Digital output, TTL-compatible, 12 mA, Z
AGND_LSD Isolated LSD Analog Ground GND_LSD Isolated LSD Digital Ground
2. Refer to applicable reference design for exact component placement and values.
Worldwide Impedance 0.
matching for worldwide countries.
US Impedance 0.
Transmit Output.
transmitter transistor (Q6).
Transmit Feedback.
General Purpose I/O 2
INTERNAL
Outputs transmit signal and impedance matching signal; connect to
NOT USED
Table 3-6. CX20463 LSD DC Electrical Characteristics
Parameter Symbol Min. Typ. Max. Units Test Conditions
Input Voltage Low V
Input Voltage Low V
Input Voltage High V
Output Voltage Low V
Output Voltage High V
Input Leakage Current -10 10 µA
Output Leakage Current (High Impedance) -10 10 µA
GPIO Output Sink Current at 0.4 V maximum 2.4 - mA
GPIO Output Source Current at 2.97 V minimum 2.4 - mA
GPIO Rise Time/Fall Time 20 100 ns
Test conditions unless otherwise noted:
1. Test Conditions unless otherwise stated: VDD = +3.3 ± 0.3 VDC; TA = 0°C to 70°C; external load = 50 pF
IN
IL
IH
OL
OH
Input signal used to provide line complex impedance
Input signal used to provide line impedance matching for U.S.
Connect to emitter of transmitter transistor (Q6).
. Leave open if not used.
= 32 Ω (see Table 3-6)
-0.30 3.60 V VDD = +3.6V
––1.0V
1.6 V
0 0.33 V
2.97 V
3-20
Conexant
100553B
Page 39
SmartHSF Mobile Modem Data Sheet
3.3 CX20437 VC HARDWARE PINS AND SIGNALS (S MODELS)
Microphone and analog speaker interface signals, as well as telephone handset/headset interface signals are provided to support functions such as speakerphone mode, telephone emulation, microphone voice record, speaker voice playback, and call progress monitor.
3.3.1 VC Signal Interfaces
Speakerphone Interface
The following signals are supported:
Speaker Out (M_SPKR_OUT); analog output - Should be used in speakerphone designs where sound quality is important
Microphone (M_MIC_IN); analog input
Telephone Handset/Headset Interface
The following interface signals are supported:
Telephone Input (M_LINE_IN), input (TELIN) –Optional connection to a telephone handset interface circuit
Telephone output (M_LINE_OUTP); output (TELOUT) - Optional connection to a telephone handset interface circuit
Center Voltage (VC); output reference voltage
HSD Interface
The following interface signals are supported:
Reset (POR); input
Sleep (SLEEP); input
Master Clock (M_CLKIN); input
Serial Clock (M_SCK); output
Control (M_CNTRLSIN); input
Serial Frame Sync (M_STROBE); output
Serial Transmit Data (M_TXSIN); input
Serial Receive Data (M_RXOUT); output
3.3.2 VC Interface Signals, Pin Assignments, and Signal Definitions
VC 32-pin TQFP hardware interface signals are shown by major interface in Figure 3-5, are shown by pin number in Figure 3-6, and are listed by pin number in Table 3-7.
VC hardware interface signals are defined in Table 3-8.
VC pin signal DC electrical characteristics are defined in Table 3-9.
VC pin signal analog electrical characteristics are defined in Table 3-10.
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Conexant
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SmartHSF Mobile Modem Data Sheet
CX11250
HSD
IASLEEP
DRESET#
M_CLK
V_SCLK
V_STROBE
V_TXSIN
V_RXOUT
V_CTRL
+3.3V
VAA (+3.3V)
GND
AGND
1
4 19 21 23 20 22 18
17 25
5
28 26
6 27
SLEEP POR M_CLKIN M_SCK M_STROBE M_TXSIN M_RXOUT M_CNTRLSIN
VDD VDD
MAVDD
VSS SET3V_BAR2
MAVSS VSUB
M_DIG_SPEAKER
CX20437
VOICE CODEC
(VC)
32-PIN TQFP
M_MIC_IN
M_SPKR_OUT
M_LINE_IN
M_LINE_OUTP
M_LINE_OUTM
VREF
VC
M_MIC_BIAS
M_RELAYA M_RELAYB
M_ACT90
M_1BIT_OUT
D_LPBK_BAR
NC NC NC
2
13 3
14 9
10
11
NC
MIC SPKOUT
TELIN
TELOUT
NC
FERRITE
AUDIO CIRCUIT
HANDSET INTERFACE
VC_HAND
0.1
10
12
FERRITE
0.1 10
15 24 16 29 30 31
NC
AGND
7 8 32
100533_F3-5_HI_20437 32T
Figure 3-5. CX20437 VC Hardware Interface Signals
VSUB
VSS
M_ACT90
M_1BIT_OUT
28
29
30
27
14
13
12
11
VC
VREF
M_MIC_IN
M_LINE_IN
SET3V_BAR2
26
15
M_MIC_BIAS
M_DIG_SPEAKER
SLEEP
M_SPKR_OUT
POR
MAVDD
MAVSS
NC
NC
NC
32
1
2
3
4
5
6
7
8
9
M_LINE_OUTP
D_LPBK_BAR
31
CX20437
10
M_LINE_OUTM
Figure 3-6. CX20437 VC 32-Pin TQFP Pin Signals
VDD
25
24
23
22
21
20
19
18
17
16
M_RELAYB
100491 F3-8 PO-CX20437
M_RELAYA
M_STROBE
M_RXOUT
M_SCK
M_TXSIN
M_CLKIN
M_CNTRLSIN
VDD
3-22
Conexant
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SmartHSF Mobile Modem Data Sheet
Table 3-7. CX20437 VC 32-Pin TQFP Pin Signals
Pin Signal Label I/O I/O Type Interface
1 SLEEP I Itpd HSD: IASLEEP 2 M_DIG_SPEAKER O Ot2 NC 3 M_SPKR_OUT O Oa Speaker interface circuit 4 POR I Itpu HSD: DRESET# 5 MAVDD PWR VAA (+3.3V) 6 MAVSS AGND AGND 7NC NC 8NC NC 9 M_LINE_OUTP (TELOUT) O Oa Handset interface circuit 10 M_LINE_OUTM O Oa NC 11 VREF REF VC through capacitors
12 VC REF AGND through ferrite bead and capacitors and to and to handset interface
13 M_MIC_IN I Ia Microphone interface circuit 14 M_LINE_IN (TELIN) I Ia Handset interface circuit 15 M_MIC_BIAS NC 16 M_RELAYB NC 17 VDD PWR +3.3V 18 M_CNTRLSIN I Itpd HSD: V_CTRL 19 M_CLKIN I Itpd HSD: M_CLK 20 M_TXSIN I Itpd HSD: V_TXSIN 21 M_SCK O Ot2 HSD: V_SCLK 22 M_RXOUT O Ot2 HSD: V_RXOUT 23 M_STROBE O Ot2 HSD: V_STROBE 24 M_RELAYA O Ot2od NC 25 VDD PWR +3.3V 26 M_SET3V_BAR2 I Itpu GND 27 VSUB AGND AGND 28 VSS GND GND 29 M_ACT90 I Itpu NC 30 M_1BIT_OUT O Ot2 NC 31 D_LPBK_BAR I Itpu NC 32 NC NC
NOTES:
1. I/O types: Ia Analog input It Digital input, TTL-compatible Itpd Digital input, TTL-compatible, internal 75k ± 25k Ω pull-down Itpu Digital input, TTL-compatible, internal 75k ± 25k Ω pull-up
It/Ot2 Digital input, TTL-compatible/digital output, TTL-compatible, 2 mA, Z
It/Ot12 Digital input, TTL-compatible/digital output, TTL-compatible, 12 mA, Z
Oa Analog output Ot2 Digital output, TTL-compatible, 2 mA, Z
Ot12 Digital output, TTL-compatible, 12 mA, Z
AGND Analog Ground GND Digital Ground See CX20437 VC Digital Electrical Characteristics (Table 3-9) and CX20437 VC Analog Electrical Characteristics (Table 3-10).
2. Interface Legend: HSD Host Side Device
circuit (VC_HAND) through ferrite bead
INTERNAL
INTERNAL
= 120
INTERNAL
INTERNAL
= 32
= 120
= 32
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SmartHSF Mobile Modem Data Sheet
Table 3-8. CX20437 VC Pin Signal Definitions
Label Pin I/O Type Signal Name/Description
SYSTEM SIGNALS
VDD 17, 25 PWR
MAVDD 5 PWR
VSS 28 GND
MAVSS 6 AGND
VSUB 27 GND
POR 4 Itpu
SET3V_BAR2 26 Itpu
SLEEP 1 Itpd
M_CLKIN 19 Itpd
M_SCK 21 Ot2
M_CNTRL_SIN 18 Itpd
M_STROBE 23 Ot2
M_TXSIN 20 Itpd
M_RXOUT 22 Ot2
TELEPHONE LINE (DAA)/AUDIO INTERFACE AND REFERENCE VOLTAGE
M_LINE_OUTP 9 O(DF)
M_LINE_IN 14 I(DA)
M_MIC_IN 13 I(DA)
M_SPKR_OUT 3 O(DF)
VREF 11 REF
VC 12 REF
Digital Power Supply.
Analog Power Supply.
Digital Ground.
Analog Ground.
Analog Ground.
Power-On Reset.
Set +3.3V Analog Reference.
HSD INTERCONNECT
IA Sleep.
Master Clock Input
Serial Clock Output.
Control Input.
Serial Frame Sync.
Serial Transmit Data.
Serial Receive Data.
Telephone Handset Out (TELOUT).
handset circuit. The output can drive a 300 Ω load.
Telephone Handset Out (TELIN).
handset circuit.
Microphone Input.
Modem Speaker Analog Output.
analog input signal. The M_SPKR_OUT on/off and three levels of attenuation are controlled by bits in DSP RAM. When the speaker is turned off, the M_SPKR_OUT output is clamped to the voltage at the VC pin. The M_SPKR_OUT output can drive an impedance as low as 300 ohms. In a typical application, the M_SPKR_OUT output is an input to an external LM386 audio power amplifier.
High Voltage Reference.
Ensure a very close proximity between these capacitors and VREF pin.
Low Voltage Reference.
parallel combination of 10 µF and 0.1 µF (ceramic). Ensure a very close proximity between these capacitors and VC pin. Use a short path and a wide trace to AGND pin. Also connect to handset interface circuit (VC_HAND) through a ferrite bead.
Active high sleep input. Connect to HSD IASLEEP pin.
Connect to +3.3V and digital circuits power supply filter.
Connect to +3.3V and analog circuits power supply filter.
Connect to GND.
Connect to AGND.
Connect to AGND.
Active low reset input. Connect to Host RESET#.
Connect to GND.
. Connect to HSD M_CLK pin.
Connect to HSD V_SCLK pin.
Connect to HSD V_CTRL pin.
Connect to HSD V_STROBE pin.
Connect to HSD V_TXSIN pin.
Connect to HSD V_RXOUT pin.
Single-ended analog data output to the telephone
Single-ended analog data input from the telephone
Single-ended from the microphone circuit.
The M_SPKR_OUT analog output reflects the received
Connect to VC through 10 µF and 0.1 µF (ceramic) in parallel.
Connect to analog ground through ferrite bead in series with a
3-24
Conexant
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SmartHSF Mobile Modem Data Sheet
Table 3-8. CX20437 VC Pin Signal Definitions (Continued)
Label Pin I/O Type Signal Name/Description
NOT USED
M_DIG_SPEAKER 2 Ot2
M_LINE_OUTM 10 Oa
M_RELAYA 24 Ot
M_RELAYB 16 Ot
M_MIC_BIAS 15 Oa
M_ACT90 29 Itpu
M_1BIT_OUT 30 Ot2
D_LPBK_BAR 31 It
NC 7, 8, 32 NC
NOTES:
1. I/O types: Ia Analog input It Digital input, TTL-compatible Itpd Digital input, TTL-compatible, internal 75k ± 25k Ω pull-down Itpu Digital input, TTL-compatible, internal 75k ± 25k Ω pull-up
It/Ot2 Digital input, TTL-compatible/digital output, TTL-compatible, 2 mA, Z
It/Ot12 Digital input, TTL-compatible/digital output, TTL-compatible, 12 mA, Z
Oa Analog output Ot2 Digital output, TTL-compatible, 2 mA, Z
Ot12 Digital output, TTL-compatible, 12 mA, Z
AGND Analog Ground GND Digital Ground See CX20437 VC Digital Electrical Characteristics (Table 3-9) and CX20437 VC Analog Electrical Characteristics (Table 3-10).
2. Interface Legend: HSD Host Side Device
Not Used.
Not Used.
Not Used.
Not Used.
Not Used.
Not Used.
Not Used.
Not Used.
Internal No Connect.
Leave open.
Leave open.
Leave open.
Leave open.
Leave open.
Leave open.
Leave open.
Leave open.
INTERNAL
INTERNAL
= 120
= 32
= 120
INTERNAL
INTERNAL
= 32
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Table 3-9. CX20437 VC Digital Electrical Characteristics
Parameter Symbol Min. Typ. Max. Units Test Conditions
Input Voltage Low V
Input Voltage Low V
Input Voltage High V
Output Voltage Low V
Output Voltage High V
Input Leakage Current -10 10 µA
Output Leakage Current (High Impedance) -10 10 µA
Test conditions unless otherwise noted:
1. Test Conditions unless otherwise stated: VDD = +3.3 ± 0.3 VDC; TA = 0°C to 70°C; external load = 50 pF
IN
IL
IH
OL
OH
Table 3-10. CX20437 VC Analog Electrical Characteristics
Signal Name Type Characteristic Value
M_LINE_IN (TELIN), I (DA) Input Impedance
M_MIC_IN AC Input Voltage Range 1.1 VP-P
Reference Voltage +1.35 VDC
M_LINE_OUTP (TELOUT) O (DD) Minimum Load
Maximum Capacitive Load 0 µF Output Impedance
AC Output Voltage Range
Reference Voltage +1.35 VDC DC Offset Voltage ± 200 mV
M_SPKR_OUT O (DF) Minimum Load
Maximum Capacitive Load 0.01 µF Output Impedance
AC Output Voltage Range 1.4 VP-P Reference Voltage +1.35 VDC DC Offset Voltage ± 20 mV
Test conditions unless otherwise noted:
1. Test Conditions unless otherwise stated: VDD = +3.3 ± 0.3 VDC; MAVDD = +3.3 ± 0.3 VDC, TA = 0°C to 70°C
-0.30 VDD+0.3 V
-0.30 VDD+0.3 V
0.4*VDD V
0–0.4V
0.8*VDD VDD V
> 70K
300
10
1.4 VP-P (with reference to ground and a 600 Ω load)
300
10
Parameter Min Typ Max Units
DAC to Line Driver output (600Ω load, 3dB in SCF and CTF) SNR/SDR at:
4Vp-p differential 2Vp-p differential
-10dBm differential
DAC to Speaker Driver output (150Ω load, 3dB in SCF and CTF, -6dB in speaker driver) SNR/SDR at:
2Vp-p 1Vp-p
-10dBm
Line Input to ADC (6dB in AAF) SNR/SDR at –10 dBm 80/95 dB Input Leakage Current (analog inputs) -10 10
Output Leakage Current (analog outputs) -10 10
3-26
Conexant
88/85 82/95
72/100
88/75 82/80 72/83
dB
dB
A
µ
A
µ
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3.4 ELECTRICAL ENVIRONMENTAL, AND TIMING SPECIFICATIONS
1.1.1 Operating Conditions, Absolute Maximum Ratings, and Power Requirements
The operating conditions are specified in Table 3-11.
The absolute maximum ratings are listed in Table 3-12.
The current and power requirements are listed in Table 3-13.
Table 3-11. Operating Conditions
Parameter Symbol Limits Units
Supply Voltage V
Operating Temperature Range T
Table 3-12. Absolute Maximum Ratings
Parameter Symbol Limits Units
Supply Voltage V
Input Voltage V
Storage Temperature Range T
Analog Inputs V
Voltage Applied to Outputs in High Impedance (Off) State V
DC Input Clamp Current I
DC Output Clamp Current I
Static Discharge Voltage (25°C) V
Latch-up Current (25°C) I
* VIO = +3.3V ± 0.3V or +5V ± 5%.
TRIG
DD
A
DD
IN
STG
IN
HZ
IK
OK
ESD
+3.0 to +3.6 VDC
0 to +70 °C
-0.5 to +4.0 VDC
-0.5 to (VIO +0.5)* VDC
-55 to +125 °C
-0.3 to (MAVDD + 0.5) VDC
-0.5 to (VIO +0.5)* VDC
±20 mA
±20 mA
±2500 VDC
±400 mA
Caution: Handling CMOS Devices
These devices contain circuitry to protect the inputs against damage due to high static voltages. However, it is advised that normal precautions be taken to avoid application of any voltage higher than maximum rated voltage.
An unterminated input can acquire unpredictable voltages through coupling with stray capacitance and internal cross talk. Both power dissipation and device noise immunity degrades. Therefore, all inputs should be connected to an appropriate supply voltage.
Input signals should never exceed the voltage range from 0.5V or more negative than GND to 0.5V or more positive than VDD. This prevents forward biasing the input protection diodes and possibly entering a latch up mode due to high current transients.
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Table 3-13. Current and Power Requirements
Conditions Current Power
CX11250 HSD + CX20463 LSD
Device State (Dx)
and Bus State (Bx)
D0, B0 On Running Yes 38.4 42.2 127 152
D0, B0 On Running No 10.4 11.4 34.3 41.0
D3, B0 On Running No 8.3 9.2 27.4 33.1
D3, B1 On Running No 8.3 9.2 27.4 33.1
D3, B2, B3 (D3hot) On Stopped No 8.3 9.2 27.4 33.1
D3, B3 (D3cold) Off Stopped No 2.4 2.7 7.9 9.7
NOTES:
Operating voltage: VDD = +3.3V ± 0.3V. Test conditions: VDD = +3.3 VDC for typical values; VDD = +3.6 VDC for maximum values. Definitions:
PCI Bus Power On: PCI Bus +5V and +3.3V on (modem normally powered by +3.3V from PCI Bus +3.3V
Mini PCI Bus Power On: PCI Bus +3.3V on (modem normally powered by +3.3V from PCI Bus +3.3V; PCIRST# not asserted.
PCI Clock (PCICLK) Running: PCI Bus signal PCICLK running (PCI Bus and Mini PCI Bus only).
Line connection: Yes: Off-hook, IA powered.
Device States: D3: Low power state. Suspend state can change the system power state; the resulting power state depends
Device and Bus States: D0, B0: Any PCI transaction, PCICLK running, VCC present.
Refer to the PCI Bus Power Management Interface Specification for additional information.
PCI Bus
Power
or regulated down from PCI Bus +5V); PCIRST# not asserted. Off: PCI Bus +5V and +3.3V off (modem normally powered by +3.3V from Vaux or Vpci); PCIRST# asserted.
Off: PCI Bus +3.3V off (modem normally powered by +3.3V from Vaux or Vpci); PCIRST# asserted.
Stopped: PCI Bus signal PCICLK stopped (off) (PCI Bus and Mini PCI Bus only).
No: On-hook, IA powered down.
on the system architecture (OS, BIOS, hardware) and system configuration (i.e., other PCI installed cards). D0: Full power state.
D3, B1: No PCI Bus transactions, PCICLK running, VCC present. D3, B2, B3: No PCI transactions, PCICLK stopped, VCC may be present. D3, B3: No PCI transactions, PCICLK stopped, no VCC.
PCI Clock
(PCICLK)
Line
Connection
Typical
Current (mA)
Maximum
Current (mA)
Typical
Power (mW)
Power (mW)
Maximum
3-28
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3.4.2 SERIAL EEPROM INTERFACE TIMING
The serial EEPROM interface timing is listed in Table 3-14 and is shown in Figure 3-7.
Table 3-14. Timing - Serial EEPROM Interface
Symbol Parameter Min Typ. Max Units Test Condition
t
CSS
t
CSH
t
DIS
t
DIH
t
PD0
t
PD1
t
DF
t
SV
t
SKH
t
SKL
Endurance
NOTES:
1. Minimum times for HSD outputs when PCI clock = 33 MHz (times increase with decreasing PCI clock frequency).
2. No requirement.
3. Timing controlled by software for programming of EEPROM. No requirement for EEPROM read into HSD.
Chip select setup 200 (Note 1) ns
Chip select hold 500 (Note 1) ns
Data input setup 200 (Note 1) ns
Data input hold 1600 ns
Data input delay 50 ns
Data input delay 50 ns
Data input disable time Note 2 ns
Status valid Note 3 ns
Clock high 900 (Note 1) ns
Clock low 900 (Note 1) ns
6–Cycles
10
SROMCS (CS)
SROMCLK (SK)
SROMOUT (DI)
SROMIN (DO) (READ)
SROMIN (DO) (PROGRAM)
t
CSS
t
t
SV
DIS
t
PD0
t
SKH
t
DIH
t
SKL
t
Figure 3-7. Waveforms - Serial EEPROM Interface
PD1
t
CSH
t
DF
t
DF
1219F3-7 WF-EEPROM
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4. HOST SOFTWARE INTERFACE
4.1 PCI CONFIGURATION REGISTERS
The PCI Configuration registers are located in the HSD. Table 4-1 identifies the configuration register contents that are supported in the HSD:
Table 4-1. PCI Configuration Registers
Bit
Offset
(Hex)
00 Device ID Vendor ID
04 Status (see Table 4-2) Command (see Table 4-3)
08 Class Code Revision ID
0C Not Implemented Header Type Latency Timer Not Implemented
10 Base Address 0 - Memory (HSD)
14 Base Address 1 – I/O (Dummy)
18 Unused Base Address Register
1C Unused Base Address Register
20 Unused Base Address Register
24 Unused Base Address Register
28 CIS Pointer (Not used)
2C Subsystem ID Subsystem Vendor ID
30 Not Implemented
34 Reserved Cap Ptr
38 Reserved
3C Max Latency Min Grant Interrupt Pin Interrupt Line
40 Power Management Capabilities (PMC)
44 Data PMCSR_BSE = 0
31:24 23:16 15:8 7:0
Next Item Ptr = 0 Capability ID =01h
(see Table 4-4)
Bridge Support
Extensions
Power Management
Control/Status Register (PMCSR)
(see Table 4-5)
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4.1.1 0x00 - Vendor ID Field
This 16-bit read-only field identifying the device manufacturer is loaded from the serial EEPROM after reset events. The value is 14F1 for Conexant.
4.1.2 0x02 - Device ID Field
This 16-bit read-only field identifying the particular device is loaded from the serial EEPROM after reset events. The default Device ID if serial EEPROM is not loaded is 0x1085.
4.1.3 0x04 - Command Register
Command Register
15 – 10 9 8 7 6 5 4 3 2 1 0
Reserved r/w r/w 0 r/w 0 0 0 r/w R/w r/w
r/w indicates the bit is read or write.
The Command Register bits are described in Table 4-2.
Table 4-2. Command Register
Bit Description
0 Controls a device’s response to I/O Space accesses. A value of 0 disables the device response. A value
of 1 allows the device to respond to I/O Space accesses. The bit state is 0 after PCIRST# is deasserted.
1 Controls a device’s response to Memory Space accesses. A value of 0 disables the device response. A
value of 1 allows the device to respond to Memory Space accesses. The bit state is 0 after PCIRST# is deasserted.
2 Controls a device’s ability to act as a master on the PCI Bus. A value of 0 disables the device from
generating PCI accesses. A value of 1 allows the device to behave as a bus master. The bit state is 0 after PCIRST# is deasserted.
5-3 Not Implemented.
6 This bit controls the device’s response to parity errors. When the bit is set, the device must take its
normal action when a parity error is detected. When the bit is 0, the device must ignore any parity errors that it detects and continue normal operation. The bit state is 0 after PCIRST# is deasserted.
7 This bit is used to control whether or not a device does address/data stepping. This bit is read only from
the PCI interface. It is loaded from the serial EEROM after PCIRST# is deasserted.
8 This bit is an enable bit for the SERR# driver. A value of 0 disables the SERR# driver. A value of 1
enables the SERR# driver. The bit state is 0 after PCIRST# is deasserted.
9 This bit controls whether or not a master can do fast back-to-back transactions to different devices. A
value of 1 means the master is allowed to generate fast back-to-back transactions to different agents as described in Section 3.4.2 of the PCI 2.1 specification. A value of 0 means fast back-to-back transactions are only allowed to the same agent. The bit state is 0 after PCIRST# is deasserted.
15-10 Reserved
4-2
Conexant
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4.1.4 0x06 - Status Register
Status Register Bits
15 14 13 12 11 10 – 9 8 7 6 5 4 3 - 0
r/c r/c r/c r/c r/c 01 r/c 0 0 0 1 0000
r/c indicates the bit is readable and clearable (by writing a ‘1’ to corresponding bit position)
The Status Register bits are described in Table 4-3.
Status register bits may be cleared by writing a ‘1’ in the bit position corresponding to the bit position to be cleared. It is not possible to set a status register bit by writing from the PCI Bus. Writing a ‘0’ has no effect in any bit position.
Table 4-3. Status Register
Bit Description
3-0 Reserved
4 Extended capabilities = 1.
7-5 Not Implemented.
8 This bit is only implemented by bus masters. It is set when three conditions are met: 1) the bus agent
asserted PERR# itself or observed PERR# asserted; 2) the agent setting the bit acted as the bus master for the operation in which the error occurred; and 3) the Parity Error Response bit (Command Register) is set.
10-9 These bits encode the timing of DEVSEL#. 01 is supported corresponding to medium speed.
11 Signaled Target Abort. Not implemented.
12 Received Target Abort. This bit must be set by a master device whenever its transaction is terminated with
Target-Abort.
13 Received Master Abort. This bit must be set by a master device whenever its transaction (except for
Special Cycle) is terminated with Master-Abort.
14 Signaled System Error. This bit must be set whenever the device asserts SERR#.
15 Detected Parity Error. This bit must be set by the device whenever it detects a parity error, even if parity
error handling is disabled (as controlled by bit 6 in the Command register).
4.1.5 0x08 - Revision ID Field
This 8-bit read-only field identifying the device revision number is hardcoded in the device.
4.1.6 0x09 - Class Code Field
This 24-bit field, contains three 8-bit sub-fields. The upper byte is a base class code: 07 indicates a communications controller. The middle byte is a sub-class code: 80 indicates “other” type of device. The lower byte is 00 which indicates no register level programming defined. The value of the entire Class Code field is 0x078000.
4.1.7 0x0D - Latency Timer Register
The Latency Timer register specifies, in units of PCI Bus clocks, the value of the Latency Timer for this PCI Bus master. This register has 5 read/write bits (MSBs) plus 3 bits of hardwired zero (LSBs). The Latency Timer Register is loaded into the PCI Latency counter each time FRAME# is asserted to determine how long the master is allowed to retain control of the PCI Bus. This register is loaded by system software. The default value for Latency Timer is 00.
4.1.8 0x0E - Header Type Field
Hardwired to 00.
4.1.9 0x28 - CIS Pointer Register
This register points to the CIS memory located in the HSD’s memory space.
4.1.10 0x2C - Subsystem Vendor ID Register
Subsystem Vendor ID register is supported. Loaded from the serial EEPROM after PCIRST# is deasserted.
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4.1.11 0x2E- Subsystem ID Register
Subsystem ID register is supported. Loaded from the serial EEPROM after PCIRST# is deasserted.
4.1.12 0x34 - Cap Ptr
Capabilities Pointer (CAP_PTR) at offset 0x34 containing hardcoded value 0x40.
4.1.13 0x3C - Interrupt Line Register
The Interrupt Line register is a read/write 8-bit register. POST software will write the value of this register as it initializes and configures the system. The value in this register indicates which of the system interrupt controllers the device’s interrupt pin is connected to.
4.1.14 0x3D - Interrupt Pin Register
The Interrupt Pin register tells which interrupt pin the device uses. The value of this register is 0x01, indicating that INTA# will be used.
4.1.15 0x3E - Min Grant Register
The Min Grant register is used to specify the devices desired settings for Latency Timer values. The value specifies a period of time in units of 0.25 microsecond. Min Grant is used for specifying the desired burst period assuming a 33 MHz clock. This register is loaded from the serial EEPROM after PCIRST# is deasserted.
4.1.16 0x3F - Max Latency Register
The Max Latency register is used to specify the devices desired settings for Latency Timer values. The value specifies a period of time in units of 0.25 microsecond. Min Latency specifies how often the device needs to gain access to the PCI Bus. This register is loaded from the serial EEPROM after PCIRST# is deasserted.
4.1.17 0x40 - Capability Identifier
The Capability Identifier is set to 01h to indicate that the data structure currently being pointed to is the PCI Power Management data structure.
4.1.18 0x41 - Next Item Pointer
The Next Item Pointer register describes the location of the next item in the function’s capability list. The value given is an offset into the function’s PCI Configuration Space. The value of 00h indicates there are no additional items in the capabilities list.
4-4
Conexant
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4.1.19 0x42 - PMC - Power Management Capabilities
The HSD contains power management as described in the PCI Power Management Specification, Revision 1.0 Draft, dated Mar 18, 1997.
The HSD Configuration registers include the following Power Management features:
Status register bit 4 set to 1 to indicate support for New Capabilities
Capabilities Pointer (CAP_PTR) at offset 0x34 containing hardcoded value 0x40
Power Management Register block at offset 0x40 and 0x44 (see Table 4-1)
The Power Management Capabilities register is a 16-bit read-only register which provides information on the capabilities of the function related to power management (Table 4-4).
Table 4-4. Power Management Capabilities (PMC) Register
Bit R/W Description
2:0 R
3R
4 R Reserved (= 0).
5 R DSI (Device Specific Initialization). Loaded from serial EEPROM.
8:6 R Aux. Current. Loaded from serial EEPROM.
9 R D1_Support. When set to a 1, the HSD device supports D1 power state (loaded from serial EEPROM).
10 R D2_ Support. When set to a 1, the HSD device supports D2 power state (loaded from serial EEPROM).
15:11 R
Version. 010b indicates compliance with Revision 1.0 of the
Specification.
PME Clock. Hard coded to 0 to indicate that the PCI clock is
These 5 bits indicate which power states allow assertion of PME (loaded from serial EEPROM). A value of
0 for any bit indicates that the function cannot assert the PME# signal while in that power state.
Bit 11: 1 = PME# can be asserted from D0
Bit 12: 1 = PME# can be asserted from D1
Bit 13: 1 = PME# can be asserted from D2
Bit 14: 1 = PME# can be asserted from D3hot
Bit 15: 1 = PME# can be asserted from D3cold.
PCI Power Management Interface
required for PME generation.
not
4.1.20 0x44 - PMCSR - Power Management Control/Status Register (Offset = 4)
This 16-bit register is used to manage the PCI function’s power management state as well as to enable/monitor power management events (Table 4-5).
Table 4-5. Power Management Control/Status Register (PMCSR)
Bit R/W Description
1:0 R/W Power State.
00 = D0
01 = D1
10 = D2
11 = D3. 7:2 R Reserved (= 000000b).
8 R/W PME_En. A 1 enables PME assertion.
12:9 R/W Data_Select. Selects Data and Data Scale fields.
14:13 R Data Scale. Associated with Data field. Loaded from serial EEPROM.
15:11 R/C PME_Status. This bit is sticky when PME assertion from D3_cold is supported.
PME_Status = 1 indicates PME asserted by the HSD device. Writing 1 clears PME_Status. Writing 0 has no effect.
R: Bit(s) is (are) read only. R/W: Bit(s) is (are) readable and writeable. R/C: Bit(s) is (are) readable, and clearable by writing 1 (bit may not be set by writing).
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4.1.21 0x46 - PMCSR_BSE - PMCSR PCI to PCI Bridge Support Extensions
PMCSR_BSE is cleared to 0 to indicate that bus power/clock control policies have been disabled.
4.1.22 0x47 - Data
This register is used to report the state dependent data requested by the Data_Select field. The value of this register is scaled by the value reported by the Data_Scale field.
4.2 BASE ADDRESS REGISTER
HSD provides a single Base Address Register. The Base Address Register is a 32-bit register that is used to access the HSD register set. Bits 3:0 are hard-wired to 0 to indicate memory space. Bits 15-4 will be hard-wired to 0. The remaining bits (31 -
16) will be read/write. This specifies that this device requires a 64k byte address space. After reset, the Base Address Register contains 0x00000000.
The 64k byte address space used by the HSD is divided into 4k-byte regions. Each 4k-byte region is used as Table 4-6.
Table 4-6. HSD Address Map
Address
[15:12]
0x0 0x0-0xfff BASIC2 Registers Buffers, control, and status registers
0x1 0x0-0xfff CIS Memory Data loaded from Serial EEPROM for Card Bus applications
0x2 0x0-0xfff DSP Scratch Pad Access to DSP scratch pad registers
0x3 0x0-0xfff Reserved
0x4 0x0-0xfff Reserved
0x5-0xF 0x0-0xfff Reserved.
Address
[11:0]
Region Name Description
4-6
Conexant
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4.3 SERIAL EEPROM INTERFACE
The PCI Configuration Space Header and Power Management registers customizable fields are loaded from EEPROM during Power On Reset and during D3 to D0 power transition soft reset. If the EEPROM is missing, default hard-coded values are used. This section describes how the EEPROM content maps into the registers. The PCI Configuration Space Header and Power Management information is used by the PC BIOS/Windows OS to find the driver for this board and also to find out the extent PCI Power Management is typically supported on the modem board.
Obtain the appropriate EEPROM.TXT file (unique to each software configuration) from the local Conexant sales office.
4.3.1 Supported EEPROM Sizes
Two EEPROM sizes are supported: 256 by 16 bit (e.g., 93LC66B) as shown in Table 4-7 and 128 by 16 bit (e.g., 93LC56B) as shown in Table 4-8. The difference is the 256-word version supports modem default country selection from the EEPROM whereas the 128-word version does not.
The EEPROM text file used by the DOS4GW B2EPROM program utility lists the EEPROM content 8 bits per line in hexadecimal format. The least significant 8 bits are listed first followed by the most significant 8 bits of the 16-bit word.
Table 4-7. EEPROM Content for 256 Words by 16 Bits per Word
Address 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
00 Device ID 01 Vendor ID 02 Subsystem Device ID 03 Subsystem Vendor ID 04 Max_Lat Min_Gnt 05 Don’t Care PMC
06 Sub-Class Code Prog. I/F 07 CardBus CIS Pointer High (Not used, don’t care) 08 CardBus CIS Pointer Low (Not used, don’t care) 09 D0C D1C D2C D3C D0D D1D D2D D3D 0A D3 power consumed D2 power consumed 0B D1 power consumed D0 power consumed 0C D3 power dissipated D2 power dissipated 0D D1 power dissipated D0 power dissipated 0E D3_
0F-FE Don’t Care Don’t Care
FF Don’t Care Don’t Care
Cold
D3_
Hot
D2 D1 D0 D2_
bit 8
PMC
bit 7
State
PMC
bit 6
D1_
State
PME DRV
DSI Load CISRAM Count
Class Code
Table 4-8. EEPROM Content for 128 Words by 16 Bits per Word
Address 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
00 Device ID 01 Vendor ID 02 Subsystem Device ID 03 Subsystem Vendor ID 04 Max_Lat Min_Gnt 05 Don’t Care PMC
06 Sub-Class Code Prog. I/F 07 CardBus CIS Pointer High (Not used, don’t care) 08 CardBus CIS Pointer Low (Not used, don’t care) 09 D0C D1C D2C D3C D0D D1D D2D D3D 0A D3 power consumed D2 power consumed 0B D1 power consumed D0 power consumed 0C D3 power dissipated D2 power dissipated 0D D1 power dissipated D0 power dissipated 0E D3_
0F-7F Don’t Care Don’t Care
Cold
D3_
Hot
D2 D1 D0 D2_
100553B
bit 8
PMC
bit 7
State
Conexant
PMC
bit 6
D1_
State
PME DRV
DSI Load CISRAM Count (Not Used, don’t care)
Class Code
4-7
Page 56
SmartHSF Mobile Modem Data Sheet
4.3.2 Definitions
Device ID Register
This mandatory 16-bit register identifies the type of device and is assigned by Conexant. Valid values are:
Modem-Interface Modem Part Number Device ID Comments
U.S./Japan/Canada Only
SmartHSF/MC-PCI CX11250-11 + 20463-12 2493 Data/Fax SmartHSF/MC-PCI CX11250-11 + 20463-12 2494 Data/Fax/Remote TAM SmartHSF/MC-PCI CX11250-11 + 20463-12 2193 Data/Fax/Cellular SmartHSF/MC-PCI CX11250-11 + 20463-12 2194 Data/Fax/Remote TAM/Cellular SmartHSF/MS-PCI CX11250-11 + 20463-12 + 20437-11 2495 Data/Fax/Voice/Speakerphone SmartHSF/MS-PCI CX11250-11 + 20463-12 + 20437-11 2496 Full-Featured minus Handset
Worldwide including U.S./Japan/Canada
SmartHSF/MWC-PCI CX11250-11 + 20463-11 24A3 Data/Fax SmartHSF/MWC-PCI CX11250-11 + 20463-11 24A4 Data/Fax/Remote TAM SmartHSF/MWC-PCI CX11250-11 + 20463-11 21A3 Data/Fax/Cellular SmartHSF/MWC-PCI CX11250-11 + 20463-11 21A4 Data/Fax/Remote TAM/Cellular SmartHSF/MWS-PCI CX11250-11 + 20463-11 + 20437-11 24A5 Data/Fax/Voice/Speakerphone SmartHSF/MWS-PCI CX11250-11 + 20463-11 + 20437-11 24A6 Full-Featured minus Handset
The CX prefix may not be included in the part number for some devices. Also, the CX prefix may not appear in the part number as
NOTE:
branded on some devices.
Vendor ID Register
This mandatory 16-bit register identifies the manufacturer of the device. The value in this read-only register is assigned by a central authority (i.e., the PCI SIG) that controls the issuance of the numbers. The value is 14F1 for Conexant.
Subsystem Vendor ID and Subsystem Device Register
The subsystem vendor ID is obtained from the SIG, while the vendor supplies its own subsystem device ID. These values are supplied by OEM. Until these values are assigned, Conexant uses default values for Subsystem Vendor ID and Subsystem Device ID which are the same as Vendor ID and Device ID, respectively.
A PCI functional device may be contained on a card or be embedded within a subsystem. Two cards or subsystems that use the same PCI functional device core logic would have the same vendor and device IDs. These two optional registers are used to uniquely identify the add-in card or subsystem that the functional device resides within. Software can then distinguish the difference between cards or subsystems manufactured by different vendors but with the same PCI functional device on the card or subsystem. A value of zero in these registers indicates that there isn’t a subsystem vendor and subsystem ID associated with the device.
Min_Gnt Register
This register is assigned by Conexant. The value is 00.
This register is optional for a bus master and not applicable to non-master devices. This register indicates how long the master would like to retain PCI Bus ownership whenever it initiates a transaction. The value hardwired into this register indicates how long a burst period the device needs (in increments of 250 ns). A value of zero indicates the device has no stringent requirements in this area. This information is useful in programming the algorithm to be used in the PCI Bus arbiter (if it is programmable).
Max_Lat Register
This register is assigned by Conexant. The value is 00.
This register is optional for a bus master and not applicable to non-master devices. The specification states that this read-only register specifies “how often” the device needs access to the PCI Bus (in increments of 250 ns). A value of zero indicates the device has no stringent requirements for the data. This register could be used to determine the priority-level the bus arbiter assigns to the master.
4-8
Conexant
100553B
Page 57
SmartHSF Mobile Modem Data Sheet
PMC [8:6] and PME DRV Type
These fields are assigned by Conexant.
PMC [8:6]:
been implemented by this function then 1) reads of this field must return a value of “000b” 2) Data Register takes precedence over this field for 3.3Vaux current requirements. If PME# generation from D3cold is not supported by the function (PMC(15)=0), then this field must return a value of “000b” when read. The value is 000b.
PME DRV Type:
is 1.
Class Code Register (Class Code, Sub-class Code, Prog. I/F)
This register is always mandatory and is assigned by Conexant. The value is 07 for Class Code, 80 for Sub-class code, and 00 for Prog. I/F.
This register is a 24-bit read-only register divided into three sub-registers: base class, sub-class, and Prog. I/F (programming interface). The register identifies the basic function of the device via the base class (i.e. for modems: Simple Communications Controller), a more specific device sub-class (i.e. for modems: Other Communications Device), and in some cases a register­specific programming interface (not used for modems).
CardBus CIS Pointer (CardBus CIS pointer High, CardBus CIS pointer Low) (Not Used)
This read-only register is not used.
Data Scale PMCSR[14:13] (D0C, D1C, D2C, D3C, D0D, D1D, D2D, D3D)
This value is supplied by the OEM since Conexant implements the Data Register. Until these values are assigned, Conexant uses a default value 0000.
This field is required for any function that implements the Data Register. The data scale is a 2- bit read-only field which indicates the scaling factor to be used when interpreting the value of the Data Register. The value and meaning of this field will vary depending on which data value has been selected by the Data_Select field (PMCSR[12:09]). There are 4 data scales to select 1) 0 = unknown 2) 1 = 0.1x, 3) 2 = 0.01x, 4) 3 = 0.001x where x is defined by the Data Select Field.
This 3- bit field reports the 3.3Vaux auxiliary current requirements for the PCI function. If the Data Register has
This bit sets the driving capability of the PME pin (0 = active high TTL, 1 = active low Open Drain). The value
Data Register (D3, D2, D1, D0 power consumed and D3, D2, D1, D0 power dissipated)
This value is supplied by the OEM since Conexant implements the Data Register. Until these values are assigned, Conexant uses a default value of 0000000000000000.
The Data Register is an optional, 8-bit read-only register that provides a mechanism for the function to report state dependent operating data such as power consumed or heat dissipation. Typically the data returned through the Data register is a static copy (look up table, for example) of the function’s worst case “DC characteristics” data sheet. This data, when made available to system software could then be used to intelligently make decisions about power budgeting, cooling requirements, etc. The data returned by the data register is selected by the Data Select field (PMCSR[12:09]).
Load CISRAM Count (CIS _SIZE) (Not Used)
This register is not used.
PMC[15:9, 5] (D3_Cold, D3_Hot, D2, D1, D0, D2_Support, D1_Support, DSI)
PMC[15:11]: PME_Support (D3_Cold, D3_Hot, D2, D1, D0)-
may assert PME#. A value of 0b for any bit indicates that the function is not capable of asserting the PME# signal while in that power state. D2 and D1 must be 0 since the modem does not support these states. The rest of the values are supplied by the OEM and the values depend upon the systems in which the modem will be installed. Conexant uses a default value of 49. This is for a system which does not support D3cold but supports D3hot.
When D3_Cold is a 1, PMC[15] is set to a 1 if VauxDET is high at device power on reset (POR) or is reset to a 0 if VauxDET is low at POR. When D3_Cold is a 0, PMC[15] is always 0, regardless of the VauxDET level.
PMC[10] (D2_Support):
not support this state and therefore this field must be 0.
PMC[9] (D1_Support):
support this state and therefore this field must be 0.
If this bit is a 1 then function supports the D2 Power Management State. Currently the modems do
If this bit is a 1 then function supports the D1 Power Management State. Currently the modems do not
This 5-bit field indicates the power states in which the function
100553B
Conexant
4-9
Page 58
SmartHSF Mobile Modem Data Sheet
DSI:
The Device Specific Initialization bit indicates whether special initialization of this function is required (beyond the
standard PCI configuration header) before the generic class device driver is able to use it. This bit should always be set to “1”.
NOTE:
For more information, refer to PCI Bus Power Management Interface Specification.
4-10
Conexant
100553B
Page 59
SmartHSF Mobile Modem Data Sheet
5. PACKAGE DIMENSIONS
The 100-pin TQFP package dimensions are shown in Figure 5-1.
The 32-pin TQFP package dimensions are shown in Figure 5-2.
16.00 ± 0.15
14.00 ± 0.05
12.00 REF
PIN 1
REF
0.50 REF
1.00 ± .05
0.10 ± .05
COPLANARITY = 0.08 MAX.
0.500 BSC
13.87 ± 0.05
14.00 ± 0.05
DETAIL A
0.22 ± 0.05
+0.15, -0.10
1.00 REF
0.60
12.00 REF
0.14 ± .03
16.00 ± 0.15
14.00 ± 0.05
DETAIL A
13.87 ± 0.05
Ref. 100-PIN TQFP (GP00-D530)
14.00 ± 0.05
PD-TQFP-100-D530 (032699)
100553B
Figure 5-1. Package Dimensions - 100-Pin TQFP
Conexant
5-1
Page 60
SmartHSF Mobile Modem Data Sheet
D
D1 D2
PIN 1 REF
D
D1
D2
D1
e
b
DETAIL A
Millimeters
Min.
1.6 MAX
0.05
1.4 REF
8.75
7.0 REF
5.6 REF
0.5
1.0 REF
0.80 BSC
0.30
0.13
0.10 MAX
Max.
0.15
9.25
0.75
0.40
0.19
Dim.
A
D1
A2
A
c
A1
L
A1 A2 D D1 D2 L L1 e b c Coplanarity
Ref: 32-PIN TQFP (GP00-D262)
* Metric values (millimeters) should be used for PCB layout. English values (inches) are converted from metric values and may include round-off errors.
Inches*
Min.
0.0630 MAX
0.0020
0.0059
0.0551 REF
0.3445
0.3642
0.2756 REF
0.2205 REF
0.0197
0.0295
0.0394 REF
0.0315 BSC
0.0118
0.0157
0.0051
0.0075
0.004 MAX
Max.
L1
DETAIL A
PD-TQFP-32 (040395)
Figure 5-2. Package Dimensions - 32-pin TQFP
5-2
Conexant
100553B
Page 61
NOTES
Page 62
0.0
Sales
Offi
ces
Further Information
literature@conexant.com (800) 854-8099 (North America) (949) 483-6996 (International) Printed in USA
WorldHeadquarters
Conexant Systems, Inc. 4311 Jamboree Road Newport Beach, CA 92660-3007 Phone: (949) 483-4600 Fax 1: (949) 483-4078 Fax 2: (949) 483-4391
Americas U.S. North west/
Pacific Northwest – Santa Clara
Phone: (408) 249-9696 Fax: (408) 249-7113
U.S. Southwest – Los Angeles
Phone: (805) 376-0559 Fax: (805) 376-8180
U.S. Southwest – Orange County
Phone: (949) 483-9119 Fax: (949) 483-9090
U.S. Southwest – San Diego
Phone: (858) 713-3374 Fax: (858) 713-4001
U.S. North Central – Illinois
Phone: (630) 773-3454 Fax: (630) 773-3907
U.S. South Central – Texas
Phone: (972) 733-0723 Fax: (972) 407-0639
U.S. Northeast– Massachusetts
Phone: (978) 367-3200 Fax: (978) 256-6868
U.S. Southeast – North Carolina
Phone: (919) 858-9110 Fax: (919) 858-8669
U.S. Southeast – Florida/
South America Phone: (727) 799-8406 Fax: (727) 799-8306
U.S.Mid-Atlantic– Pennsylvania
Phone: (215) 244-6784 Fax: (215) 244-9292
Canada – Ontario
Phone: (613) 271-2358 Fax: (613) 271-2359
Europe Europe Central – Germany
Phone: +49 89 829-1320 Fax: +49 89 834-2734
Europe North – England
Phone: +44 1344 486444 Fax: +44 1344 486555
Europe – Israel/Greece
Phone: +972 9 9524000 Fax: +972 9 9573732
Europe South – France
Phone: +33 1 41 44 36 51 Fax: +33141443690
Europe Mediterranean – Italy
Phone: +39 02 93179911 Fax: +39 02 93179913
Europe – Sweden
Phone: +46 (0) 8 5091 4319 Fax: +46 (0) 8 590 041 10
Europe – Finland
Phone: +358 (0) 9 85 666 435 Fax: +358 (0) 9 85 666 220
Asia – Pacific Taiwan
Phone: (886-2) 2-720-0282 Fax: (886-2) 2-757-6760
Australia
Phone: (61-2) 9869 4088 Fax: (61-2) 9869 4077
China–Central
Phone: 86-21-6361-2515 Fax: 86-21-6361-2516
China–South
Phone: (852) 2 827-0181 Fax: (852) 2 827-6488
China – South (Satellite)
Phone: (86) 755-5182495
China–North
Phone: (86-10) 8529-9777 Fax: (86-10) 8529-9778
India
Phone: (91-11) 692-4789 Fax: (91-11) 692-4712
Korea
Phone: (82-2) 565-2880 Fax: (82-2) 565-1440
Korea (Satellite)
Phone: (82-53) 745-2880 Fax: (82-53) 745-1440
Singapore
Phone: (65) 737 7355 Fax: (65) 737 9077
Japan
Phone: (81-3) 5371 1520 Fax: (81-3) 5371 1501
www.conexant.com
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