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Wide band directional coupler with ISO port
Features
■ 50 Ω nominal input / output impedance
■ Wide operating frequency range
(824 MHz to 2170 MHz)
■ Low Insertion Loss (< 0.2 dB)
■ 34 dB typical coupling factor
■ High directivity (typical 25 dB)
■ High ESD robustness
(IEC 61000-4-2 Level 4)
■ Flip-Chip package
■ Small footprint: 1300 x 1000 µm
CPL-WB-00D3
Figure 1. Pin configuration (top view)
Benefits
■ Very low profile (< 690 µm)
■ Lead-free package
■ High RF performance
■ RF module size reduction
Applications
■ Quad band power amplifier module
■ Quad band front end module
■ GSM / WCDMA mobile phone
123
RF
GND
OUT
ATN. ATN.
ISO
GND
CPLD
RF
IN
A
B
Description
The CPL-WB-00D3 is a wide band directional
coupler designed to measure RF antenna output
power in GSM / WCDMA / TD-SCDMA
applications. This CPL has been customized for
wide band operating frequencies (EGSM and
CELL, PCS, DCS, TD-SCDMA, WCDMA Band I)
with less than 0.2 dB insertion losses in the
transmit bandwidth (824 MHz to 2170 MHz).
The CPL-WB-00D3 has been designed using
STMicroelectronics IPD (integrated passive
device) technology on non conductive glass
substrate to optimize RF performance. The device
is delivered 100% tested in tape and reel.
April 2011 Doc ID 018753 Rev 1 1/8
www.st.com
8
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Characteristics CPL-WB-00D3
1 Characteristics
Table 1. Absolute maximum rating (limiting values)
Symbol Parameter
IN
Input Power RF
IN
P
ESD ratings IEC 61000-4-2 (C = 150 pF, R = 330 Ω, 10 shots
with both polarities and each condition, cumulative method)
V
ESD (IEC)
V
ESD (HBM)
V
ESD (MM)
V
ESD (CDM)
T
OP
Table 2. Electrical characteristics (T
ISO and CPLD pins connected to ground:
RF
RF
IN
IN
, RF
, RF
, air discharge
OUT
, contact discharge
OUT
Human body model, JESD22-A114F, all I/O 2 kV
Machine model, JESD22-A115-A, all I/O 100 V
Charge device model, JESD22-C101-C, all I/O 500 V
Operating temperature -30 +85 ºC
= 25 °C) - impedances
amb
Symbol Parameter
Value
Min. Typ. Max.
35 dBm
±15
±8
Value
Min. Typ. Max.
Unit
kV
kV
Unit
Z
OUT
Z
Z
CPLD
Z
OUT
Table 3. Electrical characteristics (T
Nominal output impedance 50 Ω
Nominal input impedance 50 Ω
IN
Nominal coupling impedance 50 Ω
Nominal ISO impedance 50 Ω
= 25 °C) - RF performance
amb
Value
Symbol Parameter Test condition
Min. Typ. Max.
Frequency range
f
I
L
R
L
CPLD
(bandwidth)
Insertion loss in bandwidth From 824 MHz to 2170 MHz 0.1 0.2 dB
Return loss in bandwidth From 824 MHz to 2170 MHz 15 dB
Coupling factor (including
attenuator)
From 824 MHz to 915 MHz 35 39 dB
From 1710 MHz to 2025 MHz 28 33 dB
824 2170 MHz
(824 to 849 MHz) (880 to 915 MHz)
Ripple
Coupling ripple in
individual band
(1710 to 1785 MHz) (1850 to
1910 MHz) (1880 to 2025 MHz)
0.5 dB
(1920 to 1980 MHz)
DIR Coupler directivity From 824 MHz to 2025 MHz 20 25 dB
Unit
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Page 3
CPL-WB-00D3 Characteristics
1.1 RF measurement (on reference evaluation board)
Measurements done on reference evaluation board under 50 Ω, de-embedding at
CPL-WB-00D3 bumps.
Figure 2. Insertion loss
dB
-0.0
-0.05
-0.1
-0.15
-0.2
-0.25
-0.3
Figure 3. Coupling and isolation
dB
-26
F (MHz)
2170
20351901176616321497136212281093959824
-28
-30
-32
-34
-36
-38
-40
7.0E8 2.1E91.9E91.7E91.5E91.3E91.1E99.0E8 2.5E92.3E9
Figure 4. Directivity
34
32
30
28
26
24
22
20
18
8.0E8 2.0E91.8E91.6E91.4E91.2E91.0E9 2.2E9
F (Hz)
F (Hz)
Doc ID 018753 Rev 1 3/8
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Reference evaluation board CPL-WB-00D3
2 Reference evaluation board
Figure 5. CPW lines (W = 127 µm with gap to gnd = 100 µm) on top layer + GND on
layer 2
● Material: 4 layers FR4 with solder mask on top and bottom layer
● Substrate thickness: 0.8 mm
● Line lengths: 14.3 mm
● TRL cal kit available
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CPL-WB-00D3 Package information
3 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
.
Figure 6. Package dimensions (bump side)
630 µm ± 60 µm
595 µm
450 µm
255 µm
1.3 mm ± 50µm
1.0 mm ± 50 µm
Figure 7. Footprint Figure 8. Marking
Copper pad Diameter:
220 µm recommended,
260 µm max
Solder stencil opening: 220 µm
Solder mask opening :
320 µm recommendation
Dot, ST logo
= ECOPACK status
xx = marking
z = manufacturing location
yww = datecode
(y = year
ww = week)
xyxwz
w
Doc ID 018753 Rev 1 5/8
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Package information CPL-WB-00D3
Figure 9. Flip Chip tape and reel specifications
Dot identifying Pin A1 location
2.0
0.22
1.4
ST
xxz
8.0
yww
1.1
0.71
All dimensions are typical values in mm
User direction of unreeling
Note: More information is available in the application note:
AN1235: “Flip Chip: package description and recommendations for use”
4.0
ST ST
xxz
yww
4.0
Ø 1.55
xxz
yww
1.75
3.5
6/8 Doc ID 018753 Rev 1
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CPL-WB-00D3 Ordering information
4 Ordering information
Table 4. Ordering information
Order code Marking Base qty Delivery mode
CPL-WB-00D3 RX 5000 Tape and reel
5 Revision history
Table 5. Document revision history
Date Revision Changes
21-Apr-2010 1 Initial release.
Doc ID 018753 Rev 1 7/8
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CPL-WB-00D3
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