CERAMIC CHIP / HIGH VOLTAGE
Ceramic Surface Mount
KEMET's High Voltage Surface Mount Capacitors are designed to withstand high voltage applications. They
offer high capacitance with low leakage current and low ESR at high frequency. The capacitors have pure tin
(Sn) plated external electrodes for good solderability. X7R dielectrics are not designed for AC line filtering
applications. An insulating coating may be required to prevent surface arcing. These components are RoHS
compliant.
APPLICATIONS
Applications Markets
MARKETS
• Switch Mode Power Supply • Power Supply
• Input Filter • High Voltage Power Supply
• Resonators • DC-DC Converter
• Tank Circuit • LCD Fluorescent Backlight Ballast
• Snubber Circuit • HID Lighting
• Output Filter • Telecommunications Equipment
• High Voltage Coupling • Industrial Equipment/Control
• High Voltage DC Blocking • Medical Equipment/Control
• Lighting Ballast • Computer (LAN/WAN Interface)
• Voltage Multiplier Circuits • Analog and Digital Modems
• Coupling Capacitor/CUK • Automotive
OUTLINE DRAWING
Outline Drawing
W
T
L
B
S
ELECTRODES
TIN PLATE
NICKEL PLATE
CONDUCTIVE
METALLIZATION
Metric
Code
2012 0805
3216 1206
3225 1210
4520 1808
4532 1812
4564 1825
5650 2220
5664 2225
EIA Size
Code
TABLE 1 - DIMENSIONS - MILLIMETERS (in.)
L - Length W - Width B - Bandwidth
2.0 (0.079)
± 0.2 (0.008)
3.2 (0.126)
± 0.2 (0.008)
3.2 (0.126)
± 0.2 (0.008)
4.5 (0.177)
± 0.3 (0.012)
4.5 (0.177)
± 0.3 (0.012)
4.5 (0.177)
± 0.3 (0.012)
5.6 (0.224)
± 0.4 (0.016)
5.6 (0.224)
± 0.4 (0.016)
1.2 (0.049)
± 0.2 (0.008)
1.6 (0.063)
± 0.2 (0.008)
2.5 (0.098)
± 0.2 (0.008)
2.0 (0.079
± 0.2 (0.008)
3.2 (0.126)
± 0.3 (0.012)
6.4 (0.250)
± 0.4 (0.016)
5.0 (0.197)
± 0.4 (0.016)
6.4 (0.250)
± 0.4 (0.016)
0.5 (0.02
±0.25 (0.010)
0.5 (0.02)
± 0.25 (0.010)
0.5 (0.02)
± 0.25 (0.010)
0.6 (0.024)
± 0.35 (0.014)
0.6 (0.024)
± 0.35 (0.014)
0.6 (0.024)
± 0.35 (0.014)
0.6 (0.024)
± 0.35 (0.014)
0.6 (0.024)
± 0.35 (0.014)
Band
Separation
0.75 (0.030)
N/A
N/A
N/A
N/A
N/A
N/A
N/A
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
81
CERAMIC CHIP / HIGH VOLTAGE
Ceramic Surface Mount
C0G DIELECTRIC CAPACITANCE VALUES AND THICKNESS TARGETS (in.)
Capacitance
Cap
Tolerance
pF
1.0-2.4 C,D 109-249
2.7-5.1 C,D K,M 279-519
5.6-9.1 C,D J,K,M 569-919
100 F,G,J,K,M 101
110 F,G,J,K,M 111
120 F,G,J,K,M 121
130 F,G,J,K,M 131
150 F,G,J,K,M 151
160 F,G,J,K,M 161
180 F,G,J,K,M 181
200 F,G,J,K,M 201
220 F,G,J,K,M 221
240 F,G,J,K,M 241
270 F,G,J,K,M 271
300 F,G,J,K,M 301
330 F,G,J,K,M 331
360 F,G,J,K,M 361
390 F,G,J,K,M 391
430 F,G,J,K,M 431
470 F,G,J,K,M 471
510 F,G,J,K,M 511
560 F,G,J,K,M 561
620 F,G,J,K,M 621
680 F,G,J,K,M 681
750 F,G,J,K,M 751
820 F,G,J,K,M 821
910 F,G,J,K,M 911
1000 F,G,J,K,M 102
1100 F,G,J,K,M 112
1200 F,G,J,K,M 122
1300 F,G,J,K,M 132
1500 F,G,J,K,M 152
1600 F,G,J,K,M 162
1800 F,G,J,K,M 182
2000 F,G,J,K,M 202
2200 F,G,J,K,M 222
2400 F,G,J,K,M 242
2700 F,G,J,K,M 272
3000 F,G,J,K,M 302
3300 F,G,J,K,M 332
3600 F,G,J,K,M 362
3900 F,G,J,K,M 392
4300 F,G,J,K,M 432
4700 F,G,J,K,M 472
5100 F,G,J,K,M 512
5600 F,G,J,K,M 562
6200 F,G,J,K,M 622
6800 F,G,J,K,M 682
7500 F,G,J,K,M 752
8200 F,G,J,K,M 822
9100 F,G,J,K,M 912
10,000 F,G,J,K,M 103
* Contact KEMET Sales Representative for C, D, F & G Capacitance Tolerance availability.
Note: Actual thickness dimensions may be less than stated maximum. Check the KEMET website, www.kemet.com, for additional values and chip sizes available.
*
10 C,D J,K,M 100
11 C,D J,K,M 110
12 C,D J,K,M 120
13 C,D J,K,M 130
15 C,D G,J,K,M 150
16 C,D G,J,K,M 160
18 C,D G,J,K,M 180
20 C,D G,J,K,M 200
22 C,D G,J,K,M 220
24 C,D G,J,K,M 240
27 D,F,G,J,K,M 270
30 D,F,G,J,K,M 300
33 D,F,G,J,K,M 330
36 D,F,G,J,K,M 360
39 D,F,G,J,K,M 390
43 D,F,G,J,K,M 430
47 D,F,G,J,K,M 470
51 D,F,G,J,K,M 510
56 F,G,J,K,M 560
62 F,G,J,K,M 620
68 F,G,J,K,M 680
75 F,G,J,K,M 750
82 F,G,J,K,M 820
91 F,G,J,K,M 910
pg
Series
Max
Thickness
Cap Code/
Voltage
0.050
0.050
0.065
0.065
0.065
0.065
0.101
0.101
0.101
0.101
0.080
0.080
0.080
0.080
0.080
0.080
0.067
0.067
0.067
0.067
1000
1500
2000
0.067
2500
(in)
500
1000
500
1000
1500
2000
500
1000
1500
2000
500
1000
1500
2000
2500
3000
500
0.067
3000
0.067
500
0.067
1000
1825 222018120805 1206 1210 1808
0.067
0.067
1500
2000
0.067
2500
0.067
3000
0.067
500
0.067
1000
0.067
1500
0.067
2000
0.067
2500
0.067
3000
0.067
500
0.067
1000
2225
0.067
1500
0.067
2000
0.067
2500
0.067
3000
82
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
CERAMIC CHIP / HIGH VOLTAGE
Ceramic Surface Mount
X7R DIELECTRIC CAPACITANCE VALUES AND THICKNESS TARGETS (in.)
CappFCapacitance
Tolerance
10 J,K,M 100
11 J,K,M 110
12 J,K,M 120
13 J,K,M 130
15 J,K,M 150
16 J,K,M 160
18 J,K,M 180
20 J,K,M 200
22 J,K,M 220
24 J,K,M 240
27 J,K,M 270
30 J,K,M 300
33 J,K,M 330
36 J,K,M 360
39 J,K,M 390
43 J,K,M 430
47 J,K,M 470
51 J,K,M 510
56 J,K,M 560
62 J,K,M 620
68 J,K,M 680
75 J,K,M 750
82 J,K,M 820
91 J,K,M 910
100 J,K,M 101
110 J,K,M 111
120 J,K,M 121
130 J,K,M 131
150 J,K,M 151
180 J,K,M 181
220 J,K,M 221
270 J,K,M 271
330 J,K,M 331
390 J,K,M 391
470 J,K,M 471
560 J,K,M 561
680 J,K,M 681
820 J,K,M 821
1000 J,K,M 102
1200 J,K,M 122
1500 J,K,M 152
1800 J,K,M 182
2000 J,K,M 202
2200 J,K,M 222
2700 J,K,M 272
3300 J,K,M 332
3900 J,K,M 392
4700 J,K,M 472
5600 J,K,M 562
6800 J,K,M 682
8200 J,K,M 822
10,000 J,K,M 103
12,000 J,K,M 123
15,000 J,K,M 153
18,000 J,K,M 183
22,000 J,K,M 223
27,000 J,K,M 273
33,000 J,K,M 333
39,000 J,K,M 393
47,000 J,K,M 473
56,000 J,K,M 563
62,000 J,K,M 623
68,000 J,K,M 683
82,000 J,K,M 823
100,000 J,K,M 104
120,000 J,K,M 124
150,000 J,K,M 154
180,000 J,K,M 184
220,000 J,K,M 224
pg
Series
Max
Thickness
0.050
0.050
0.065
0.065
0.065
0.065
0.080
0.080
0.080
0.080
0.080
0.080
0.080
0.080
0.080
0.080
0.067
0.067
0.067
0.067
1000
1500
2000
0.067
2500
(in)
Cap Code/
Voltage
500
1000
500
1000
1500
2000
500
1000
1500
2000
500
1000
1500
2000
2500
3000
500
0.067
3000
1825 222018120805 1206 1210 1808
0.067
0.067
0.067
500
1000
1500
0.067
2000
0.067
2500
0.067
3000
2225
0.067
0.067
0.067
0.067
0.067
0.067
0.067
0.067
0.067
500
1000
1500
2000
2500
3000
500
1000
1500
Note: Actual thickness dimensions may be less than stated maximum.
Check the KEMET website, www.kemet.com, for additional values and chip sizes available.
0.067
2000
0.067
2500
0.067
3000
KEMET HIGH VOLTAGE SURFACE MOUNT CHIP (VOLTAGE CODES C,D,F,G,H, and Z)
THICKNESS AND REELING QUANTITIES
Chip size
EIA Metric
0805 2012 0.055 1.27 8 2,500 10,000
1206 3216 0.065 1.65 8 2,000 8,000
1210 3225 0.101 2.57 8 2,000 8,000
1808 4520 0.080 2.03 12 1,000 4,000
1812/1813 4532 0.067 1.70 12 1,000 4,000
1825 4564 0.067 1.70 12 1,000 4,000
2220 5650 0.067 1.70 12 1,000 4,000
2225 5664 0.067 1.70 12 1,000 4,000
Max.
Thickness (in)
Max.
Thickness (mm)
Tape Width
(mm)
Qty per Reel
7" Plastic
Qty per Reel
13" Plastic
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
83
CERAMIC CHIP / HIGH VOLTAGE
CAPACITOR ORDERING INFORMATION
Capacitor Ordering Information
Style
Style
C - Ceramic
Chip Size
Chip Size
0805; 1206; 1210; 1808;
1812; 1825; 2220; 2225
Specification
Specification
C - Standard
Capacitance Code, pF
Capacitance Code, pF
First two digits represent significant figures.
Third digit specifies number of zeros. 100 pF = 101.
(Use “9” for 1.0 through 9.9 pF)
(Use “8” for 0.1 through .99 pF)
Capacitance Tolerance
Capacitance Tolerance
C = ±0.25pF* J = ±5%
D = ±0.5pF* K = ±10%
F = ±1%* M = ±20%
G = ±2%*
* Contact KEMET Sales for availability.
Property Specification
Capacitance
Cap Tolerance
DF
Voltage Ratings 500 V, 1000 V, 1500 V, 2000 V, 2500 V, 3000 V
Operating Temperature Range From -55C to +125C
25ºC IR @ 500V
125ºC IR @ 500V
-55ºC TCC
+125ºC TCC
Dielectric Strength
Ripple Current Consult KEMET Sales Representative
C 0805 C 102 K C R A C
G – (C0G) (±30ppm/C) (-55°C +125°C)
ELECTRICAL PARAMETERS
Electrical Parameters
C0G: 1 pF to 0.010 µF
X7R: 10 pf to 0.22 µF
25°C, 1.0 ± 0.2 Vrms, 1 kHz (1 MHz for ≤ 1000 pF (C0G only)
C0G: C*, D*, F*, G*, J, K, M * Contact KEMET Sales for availability.
X7R: J, K, M
C0G: 0.1% Max
X7R: 2.5% Max
100 GΩ or 1000 MΩ-µF, whichever is less
10 GΩ or 100 MΩ-µF, whichever is less
X7R: + 15%
C0G: + 30 ppm / ºC
150% of Rated Voltage for Rated Voltage <1000 V
120% of Rated Voltage for Rated Voltage >=1000V
pF
From -55ºC to +125ºC
End Metallization
End Metallization
C = Standard
Failure Rate Level
Failure Rate Level
A = Not Applicable
Temperature Characteristic
Temperature Characteristic
Designated by Capacitance
Change over Temperature Range
R – X7R (±15%) (-55°C +125°C)
Voltage
C = 500V G = 2000V
D = 1000V Z = 2500V
F = 1500V H = 3000V
Voltage
84
MARKING
Marking
These chips are supplied unmarked. If required, they can be supplied LASER-marked at an extra cost.
Details on the marking format is located on page 97.
Packaging
PACKAGING
KEMET High Voltage Surface Mount MLCC are available packaged in tape and reel configuration, or bulk
bag as outlined on page 83. Please consult factory for waffle packaging options.
SOLDERING PROCESS
Soldering Process
The 0805 and 1206 case sizes are suitable for either reflow or wave soldering processes. Sizes 1210 and
larger should be limited to reflow soldering only. All sizes incorporate the standard KEMET barrier layer of
pure nickel with an overplating of pure tin (Sn) for excellent solderability and resistance to solder leaching of
the termination.
Recommended Solder Pad Dimensions
RECOMMENDED SOLDER PAD DIMENSIONS
Chip Size
0805 3.30 0.130 0.70 0.028 1.60 0.063 1.30 0.051
1206 4.50 0.177 1.50 0.059 2.00 0.079 1.50 0.059
1210 4.50 0.177 1.50 0.059 2.90 0.114 1.50 0.059
1808 5.90 0.232 2.30 0.091 2.40 0.094 1.80 0.071
1812 5.90 0.232 2.30 0.091 3.70 0.146 1.80 0.071
1825 5.90 0.232 2.30 0.091 6.90 0.272 1.80 0.071
2220 7.00 0.276 3.30 0.130 5.50 0.217 1.85 0.073
2225 7.00 0.276 3.30 0.130 6.80 0.268 1.85 0.073
T (Total Length) S (Separation W (Pad Width)
mm in. mm in. mm in. mm in.
L (Pad Length)
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
CERAMIC CHIP CAPACITORS
Packaging Information
Tape & Reel Packaging
g
®
KEMET
KEMET offers Multilayer Ceramic Chip Capacitors
packaged in 8mm and 12mm plastic tape on 7" and
13" reels in accordance with EIA standard 481-1:
Taping of surface mount components for automatic
handling. This packaging system is compatible with all
tape fed automatic pick and place systems. See page 78
for details on reeling quantities for commercial chips
and page 87 for MIL-PRF-55681 chips.
handling. This packaging system is compatible with all
tape fed automatic pick and place systems. See page 81
for details on reeling quantities for commercial chips
and page 90 for MIL-PRF-55681 chips.
Anti-Static Reel
Embossed Carrier*
0402 and 0603 case sizes
available on punched paper only.
Chip Orientation
in Pocket
(except 1825 Commercial, and 1825 & 2225 Military)
178mm (7.00")
330mm (13.00")
Grid
Grid
placement
courtyard
Placement
Courtyard
X
X
Y
8mm ±.30
(.315 ±.012")
or
or
12mm ±.30
(.472 ±.012")
* Punched paper carrier used for 0402 and 0603 case size.
Anti-Static Cover Tape
(.10mm (.004") Max Thickness)
SURFACE MOUNT LAND DIMENSIONS - CERAMIC CHIP CAPACITORS - MM
Z
Dimension
C
C
0402
0603
0805
1206
1210
1812
1825
2220
2225
G
G
Z
Y
Z
Calculation Formula
Z = Lmin + 2Jt + Tt
G = Smax - 2Jh -Th
X = Wmin + 2Js + Ts
Tt, Th, Ts = Combined tolerances
2.14
2.78
3.30
4.50
4.50
5.90
5.90
7.00
7.00
G
0.28
0.68
0.70
1.50
1.50
2.30
2.30
3.30
3.30
X
0.74
1.08
1.60
2.00
2.90
3.70
6.90
5.50
6.80
Y(ref)
0.93
1.05
1.30
1.50
1.50
1.80
1.80
1.85
1.85
C(ref)
1.21
1.73
2.00
3.00
3.00
4.10
4.10
5.15
5.15
Z
3.18
3.70
4.90
4.90
Embossment
Wave SolderReflow Solder
G
X
Not Recommended
0.68
0.80
0.70
1.10
1.50
1.40
1.50
2.00
Not Recommended
Y(ref)
1.25
1.50
1.70
1.70
Smin
1.93
2.20
3.20
3.20
Packaging
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
93
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
Performance Notes
1. Cover Tape Break Force: 1.0 Kg Minimum.
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Tape Width Peel Strength
8 mm 0.1 Newton to 1.0 Newton (10g to 100g)
12 mm 0.1 Newton to 1.3 Newton (10g to 130g)
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier
tape shall be 165 to 180 from the plane of the carrier tape. During peeling, the carrier and/or cover tape
shall be pulled at a velocity of 300 ±10 mm/minute.
3. Reel Sizes: Molded tantalum capacitors are available on either 180 mm (7") reels (standard) or 330 mm (13")
reels (with C-7280). Note that 13” reels are preferred.
4. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes.
Refer to EIA-556.
Embossed Carrier Tape Configuration: Figure 1
NOTES
1. B1 dimension is a reference dimension for tape feeder clearance only.
2. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of
embossment location and hole location shall be applied independent of each other.
3. Tape with components shall pass around radius “R” without damage (see sketch A). The minimum trailer length (Fig. 2) may require
additional length to provide R min. for 12 mm embossed tape for reels with hub diameters approaching N min. (Table 2)
4. The cavity defined by A
0
, B0, and K0shall be configured to surround the part with sufficient clearance such that the chip does not pro-
trude beyond the sealing plane of the cover tape, the chip can be removed from the cavity in a vertical direction without mechanical
restriction, rotation of the chip is limited to 20 degrees maximum in all 3 planes, and lateral movement of the chip is restricted to 0.5 mm
maximum in the pocket (not applicable to vertical clearance.)
Table 1 — EMBOSSED TAPE DIMENSIONS (Metric will govern)
Constant Dimensions — Millimeters (Inches)
Tape Size D
0
EP0P
2
T Max T1Max
8 mm 1.5 1.75 ±0.10 4.0 ±0.10 2.0 ±0.05 0.600 0.100
and +0.10 -0.0
12 mm (0.059 (0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002) (0.024) (0.004)
+0.004, -0.0)
Variable Dimensions — Millimeters (Inches)
Tape Size Pitch B1Max. D1Min. F P
1
R Min. T2Max W A0B0K
0
Note 1 Note 2 Note 3 Note 4
8 mm Single 4.4 1.0 3.5 ±0.05 4.0 ±0.10 25.0 2.5 8.0 ±0.30
(4 mm)
(0.173) (0.039) (0.138 ±0.002) (0.157 ±0.004) (0.984) (0.098) (.315 ±0.012)
12 mm Double 8.2 1.5 5.5 ±0.05 8.0 ±0.10 30.0 4.6 12.0 ±0.30
(8 mm) (0.323) (0.059) (0.217 ±0.002) (0.315 ±0.004) (1.181) (0.181) (0.472 ±0.012)
TANTALUM, CERAMIC AND
ALUMINUM CHIP CAPACITORS
Packaging Information
94
Embossed Carrier Tape Configuration (cont.)
Sketch D: Tape Camber (Top View)
Allowable camber to be 1 mm/250 mm.
Table 2 – REEL DIMENSIONS (Metric will govern)
Figure 3: Reel Dimensions (Metric Dimensions will govern)
Tape Size A Max B* Min C D* Min N Min W
1
W2Max W
3
8 mm 330.0 1.5 13.0 ± 0.20 20.2 50.0 8.4 14.4 7.9 Min
(12.992) (0.059) (0.512 ± 0.008) (0.795) (1.969) +1.5, -0.0 (0.567) (0.311)
See (0.331 10.9 Max
Note 3 +0.059, -0.0) (0.429)
12 mm 330.0 1.5 13.0 ± 0.20 20.2 Table 1 12.4 18.4 11.9 Min
(12.992) (0.059) (0.512 ± 0.008) (0.795) +2.0, -0.0 (0.724) (0.469)
(0.488 15.4 Max
+0.078, -0.0) (0.606)
TANTALUM, CERAMIC AND
ALUMINUM CHIP CAPACITORS
Packaging Information
Figure 2:
Tape Leader
& Trailer
Dimensions
(Metric
Dimensions
Will Govern)
400mm (15.75) Min.
20°
1mm (0.039) Max.
1mm (0.039) Max.
250mm (9.843)
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
Packaging
95
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
CERAMIC CHIP CAPACITORS
Packaging Information
Punched Carrier (Paper Tape) Configuration (Ceramic Chips Only):
10 pitches cumulative
tolerance on tape
±0.2 (±0.008)
2
Center lines
of cavity
T
1
0.10
(.004)
(.030)
Max.
G
1
0.75
Min.
G
G
2
0.75
(.030)
Min.
E
2
Tape
Size
8mm
and
12mm
Bottom
Tape
Cover
D
0
1.5
+0.10, -0.0
(.059
+0.004, -0.0)
T
To p
Tape
Cover
T
1
User Direction of Feed
Table 1: 8 & 12mm Punched Tape
Constant Dimensions - Millimeters (Inches)
E
1.75 ±0.10
(.069 ±0.004)
P
0
D
0
A
0
B
0
P
1
Max. Cavity Size
See Note 1
Table 1
P
(Metric Dimensions Will Govern)
P
0
4.0 ± 0.10
(.157 ± 0.004)
P
2
2.0 ± 0.05
(.079 ± 0.002)
F
W
R Min.
25 (.984)
See Note 2
Table 1
Tape
Size
8mm
1/2
Pitch
8mm 4.0 ± 0.10
12mm 4.0 ± 0.10
12mm
Double
Pitch
Note:
1. A0, B0 and T determined by the maximum dimensions to the ends of the terminals extending from the
body and/or the body dimensions of the component. The clearance between the ends of the terminals or
body of the component to the sides and depth of the cavity (A0, B0 and T) must be within 0.05mm (.002)
minimum and 0.50mm (.020) maximum. The clearance allowed must also prevent rotation of the component
within the cavity of not more than 20 degrees (see sketches A and B).
2. Tape with components shall pass around radius "R" without damage.
3. KEMET nominal thicknesses are: 0402 = 0.6mm and all others 0.95mm minimum.
Sketch A:
Bending Radius
See Note 2
Table 1
P
1
2.0 ± 0.10
(.079 ±.004)
See Require-
ments
Section 3.3 (d)
(0.157 ± .004)
(0.157 ± .004)
8.0 ± 0.10
(0.315 ± .004)
R
(Min.)
Table 1: 8 & 12mm Punched Tape
(
Metric Dimensions Will Govern)
Variable Dimensions - Millimeters (Inches)
F
3.5 ± 0.05
(.138 ± .002)
5.5 ± 0.05
(.217 ± .002)
20°
W
8.0 ± 0.3
(.315 ± 0.012)
12.0 ± 0.3
(.472 ± .012)
Sketch B:
Max. Component
Rotation - Front
Cross Sectional View
A
0B0
See Note 1
Table 1
T
1.1mm (.043)
Max. for Paper
Base Tape and
1.6mm (.063)
Max. for NonPaper Base
Compositions.
See Note 3.
Component Rotation - Top View
Sketch C:
Maximum
component rotation.
20°
Typical
component
center line
96
CERAMIC CHIP CAPACITORS
Packaging Information
Bulk Cassette Packaging (Ceramic Chips only)
(Meets Dimensional Requirements IEC-286-6 and EIAJ 7201)
10*
110 ± 0.7
53.3*
1.5 ±
2.0 ±
3.0 ±
6.8 ± 0.1
8.8 ± 0.1
12.0 ± 0.1
Unit: mm
* Reference
0.1
0
0
0.1
0.2
0
0
0.2
0
0.2
36 ±
31.5 ±
Table 1 – Capacitor Dimensions for Bulk
Cassette Packaging – Millimeters
Metric
Size
Code
1005
1608
2012
Terminations: KEMET nickel barrier layer with a tin overplate.
EIA
Size
Code
0402
0603
0805
Length
L
1.0 ± 0.05
1.6 ± 0.07
2.0 ± 0.10
WidthWThicknessTBandwidth
0.5 ± 0.05
0.8 ± 0.07
1.25 ± 0.10
0.5 ± .05
0.8 ± .07
0.6 ± .10
0.2 to 0.4
0.2 to 0.5
0.5 to 0.75
Table 2 – Capacitance Values Available
In Bulk Cassette Packaging
All
All
200
100
50
200
100
50
25
16
25
16
Min.
Cap
Value
All
All
109
109
109
221
221
221
221
221
104
104
Case
Size Dielectric
0402
0603
0805
19.0*
5.0*
Voltage
All
All
C0G
X7R
Y5V
Minimum
B
S
0.3
0.7
0.75
Separation
Number of
Pcs/Cassette
50,000
15,000
10,000
Max.
Cap
Value
All
All
181
331
102
392
103
273
104
104
224
224
Alpha
Character
CAPACITOR MARKING TABLE
(Marking Optional - Not Available
for 0402 Size or Y5V Dielectric)
Numeral
A
B
C
D
E
F
G
H
J
K
L
M
N
P
Q
R
S
T
U
V
W
X
Y
Z
a
b
d
e
f
m
n
t
y
Capacitance (pF) For Various Numeral Identifiers
9 01 2 3 4 5
0.10
1.0
10
100
1000
0.11
0.12
0.13
0.15
0.16
0.18
0.20
0.22
0.24
0.27
0.30
0.33
0.36
0.39
0.43
0.47
0.51
0.56
0.62
0.68
0.75
0.82
0.91
0.25
0.35
0.40
0.45
0.50
0.60
0.70
0.80
0.90
1.1
1.2
1.3
1.5
1.6
1.8
2.0
2.2
2.4
2.7
3.0
3.3
3.6
3.9
4.3
4.7
5.1
5.6
6.2
6.8
7.5
8.2
9.1
2.5
3.5
4.0
4.5
5.0
6.0
7.0
8.0
9.0
11
110
12
120
13
130
15
150
16
160
18
180
20
200
22
220
24
240
27
270
30
300
33
330
36
360
39
390
43
430
47
470
51
510
56
560
62
620
68
680
75
750
82
820
91
910
25
250
35
350
40
400
45
450
50
500
60
600
70
700
80
800
90
900
1100
1200
1300
1500
1600
1800
2000
2200
2400
2700
3000
3300
3600
3900
4300
4700
5100
5600
6200
6800
7500
8200
9100
2500
3500
4000
4500
5000
6000
7000
8000
9000
10,000
11,000
12,000
13,000
15,000
16,000
18,000
20,000
22,000
24,000
27,000
30,000
33,000
36,000
39,000
43,000
47,000
51,000
56,000
62,000
68,000
75,000
82,000
91,000
25,000
35,000
40,000
45,000
50,000
60,000
70,000
80,000
90,000
100,000
110,000
120,000
130,000
150,000
160,000
180,000
200,000
220,000
240,000
270,000
300,000
330,000
360,000
390,000
430,000
470,000
510,000
560,000
620,000
680,000
750,000
820,000
910,000
250,000
350,000
400,000
450,000
500,000
600,000
700,000
800,000
900,000
6
1,000,000
1,100,000
1,200,000
1,300,000
1,500,000
1,600,000
1,800,000
2,000,000
2,200,000
2,400,000
2,700,000
3,000,000
3,300,000
3,600,000
3,900,000
4,300,000
4,700,000
5,100,000
5,600,000
6,200,000
6,800,000
7,500,000
8,200,000
9,100,000
2,500,000
3,500,000
4,000,000
4,500,000
5,000,000
6,000,000
7,000,000
8,000,000
9,000,000
7
10,000,000
11,000,000
12,000,000
13,000,000
15,000,000
16,000,000
18,000,000
20,000,000
22,000,000
24,000,000
27,000,000
30,000,000
33,000,000
36,000,000
39,000,000
43,000,000
47,000,000
51,000,000
56,000,000
62,000,000
68,000,000
75,000,000
82,000,000
91,000,000
25,000,000
35,000,000
40,000,000
45,000,000
50,000,000
60,000,000
70,000,000
80,000,000
90,000,000
Laser marking is available as an extra-cost option for
most KEMET ceramic chips. Such marking is two
sided, and includes a K to identify KEMET, followed by
two characters (per EIA-198 - see table below) to
identify the capacitance value. Note that marking is
not available for size 0402 nor for any Y5V chip. In
addition, the 0603 marking option is limited to the K
only.
KA3
Example shown is 1,000 pF capacitor.
Packaging
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
97
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