Datasheet CD4015BMSFN3295 Datasheet (Intersil Corporation)

Page 1
7-89
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999
CD4015BMS
CMOS Dual 4-Stage Static Shift Register
With Serial Input/Parallel Output
Pinout
CD4015BMS
Functional Diagram
14
15
16
9
13 12 11 10
1 2 3 4 5
7
6
8
CLOCK B
Q4B Q3A Q2A Q1A
RESET A
VSS
DATA A
VDD
RESET B Q1B Q2B Q3B Q4A CLOCK A
DATA B
DATA A
CLOCK A
RESET A
DATA B
CLOCK B
RESET B
Q1A Q2A Q3A Q4A
Q1B
Q2B
Q3B
Q4B
VSS
VDD
7 9 6
15
1
14
5 4 3 10 13 12 11 2
16
8
4
STAGE
4
STAGE
Features
• High-Voltage Type (20V Rating)
• Medium Speed Operation 12MHz (typ.) Clock Rate at VDD - VSS = 10V
• Fully Static Operation
• 8 Master-Slave Flip-Flops Plus Input and Output Buffering
• 100% Tested For Quiescent Current at 20V
• 5V, 10V and 15V Parametric Ratings
• Standardized Symmetrical Output Characteristics
• Maximum Input Current of 1µA at 18V Over Full Pack­age-Temperature Range; 100nA at 18V and 25
o
C
• Noise Margin (Full Package-Temperature Range) =
- 1V at VDD = 5V
- 2V at VDD = 10V
- 2.5V at VDD = 15V
• Meets All Requirements of JEDEC Tentative Standard No. 13B, “Standard Specifications for Description of ‘B’ Series CMOS Devices”
Applications
• Serial-Input/Parallel-Output Data Queueing
• Serial to Parallel Data Conversion
• General-Purpose Register
Description
CD4015BMS consists of two identical, independent, 4-stage serial-input/parallel output registers. Each register has inde­pendent CLOCK and RESET inputs as well as a single serial DATA input. “Q” outputs are available from each of the four stages on both registers. All register stages are D type, mas­ter-slave flip-flops. The logic level present at the DATA input is transferred into the first register stage and shifted over one stage at each positive-going clock transition. Resetting of all stages is accomplished by a high level on the reset line. Register expansion to 8 stages using one CD4015BMS package, or to more than 8 stages using additional CD4015BMS’s is possible.
The CD4015BMS is supplied in these 16 lead outline pack­ages:
Braze Seal DIP H4X Frit Seal DIP H1F Ceramic Flatpack H6W
December 1992
File Number
3295
Page 2
7-90
Specifications CD4015BMS
Absolute Maximum Ratings Reliability Information
DC Supply Voltage Range, (VDD) . . . . . . . . . . . . . . . -0.5V to +20V
(Voltage Referenced to VSS Terminals)
Input Voltage Range, All Inputs . . . . . . . . . . . . .-0.5V to VDD +0.5V
DC Input Current, Any One Input . . . . . . . . . . . . . . . . . . . . . . . .±10mA
Operating Temperature Range. . . . . . . . . . . . . . . . -55
o
C to +125oC
Package Types D, F, K, H
Storage Temperature Range (TSTG). . . . . . . . . . . -65
o
C to +150oC
Lead Temperature (During Soldering) . . . . . . . . . . . . . . . . . +265
o
C At Distance 1/16 ± 1/32 Inch (1.59mm ± 0.79mm) from case for 10s Maximum
Thermal Resistance . . . . . . . . . . . . . . . . θ
ja
θ
jc
Ceramic DIP and FRIT Package. . . . . 80oC/W 20oC/W
Flatpack Package . . . . . . . . . . . . . . . . 70
o
C/W 20oC/W
Maximum Package Power Dissipation (PD) at +125oC
For TA = -55
o
C to +100oC (Package Type D, F, K). . . . . . 500mW
For TA = +100
o
C to +125oC (Package Type D, F, K) . . . . .Derate
Linearity at 12mW/oC to 200mW
Device Dissipation per Output Transistor . . . . . . . . . . . . . . . 100mW
For TA = Full Package Temperature Range (All Package Types)
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +175oC
TABLE 1. DC ELECTRICAL PERFORMANCE CHARACTERISTICS
PARAMETER SYMBOL CONDITIONS (NOTE 1)
GROUP A
SUBGROUPS TEMPERATURE
LIMITS
UNITSMIN MAX
Supply Current IDD VDD = 20V, VIN = VDD or GND 1 +25
o
C-10µA
2 +125oC - 1000 µA
VDD = 18V, VIN = VDD or GND 3 -55oC-10µA
Input Leakage Current IIL VIN = VDD or GND VDD = 20 1 +25
o
C -100 - nA
2 +125oC -1000 - nA
VDD = 18V 3 -55oC -100 - nA
Input Leakage Current IIH VIN = VDD or GND VDD = 20 1 +25oC - 100 nA
2 +125oC - 1000 nA
VDD = 18V 3 -55oC - 100 nA Output Voltage VOL15 VDD = 15V, No Load 1, 2, 3 +25oC, +125oC, -55oC - 50 mV Output Voltage VOH15 VDD = 15V, No Load (Note 3) 1, 2, 3 +25oC, +125oC, -55oC 14.95 - V Output Current (Sink) IOL5 VDD = 5V, VOUT = 0.4V 1 +25oC 0.53 - mA Output Current (Sink) IOL10 VDD = 10V, VOUT = 0.5V 1 +25oC 1.4 - mA Output Current (Sink) IOL15 VDD = 15V, VOUT = 1.5V 1 +25oC 3.5 - mA Output Current (Source) IOH5A VDD = 5V, VOUT = 4.6V 1 +25oC - -0.53 mA Output Current (Source) IOH5B VDD = 5V, VOUT = 2.5V 1 +25oC - -1.8 mA Output Current (Source) IOH10 VDD = 10V, VOUT = 9.5V 1 +25oC - -1.4 mA Output Current (Source) IOH15 VDD = 15V, VOUT = 13.5V 1 +25oC - -3.5 mA N Threshold Voltage VNTH VDD = 10V, ISS = -10µA 1 +25oC -2.8 -0.7 V P Threshold Voltage VPTH VSS = 0V, IDD = 10µA 1 +25oC 0.7 2.8 V Functional F VDD = 2.8V, VIN = VDD or GND 7 +25oC VOH >
VDD/2
VOL < VDD/2
V VDD = 20V, VIN = VDD or GND 7 +25oC VDD = 18V, VIN = VDD or GND 8A +125oC VDD = 3V, VIN = VDD or GND 8B -55oC
Input Voltage Low (Note 2)
VIL VDD = 5V, VOH > 4.5V, VOL < 0.5V 1, 2, 3 +25oC, +125oC, -55oC - 1.5 V
Input Voltage High (Note 2)
VIH VDD = 5V, VOH > 4.5V, VOL < 0.5V 1, 2, 3 +25oC, +125oC, -55oC 3.5 - V
Input Voltage Low (Note 2)
VIL VDD = 15V, VOH > 13.5V,
VOL < 1.5V
1, 2, 3 +25oC, +125oC, -55oC- 4 V
Input Voltage High (Note 2)
VIH VDD = 15V, VOH > 13.5V,
VOL < 1.5V
1, 2, 3 +25oC, +125oC, -55oC11 - V
NOTES: 1. All voltages referenced to device GND, 100% testing being
implemented.
2. Go/No Go test with limits applied to inputs
3. For accuracy, voltage is measured differentially to VDD. Limit is 0.050V max.
Page 3
7-91
Specifications CD4015BMS
TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS
PARAMETER SYMBOL CONDITIONS (NOTE 1, 2)
GROUP A
SUBGROUPS TEMPERATURE
LIMITS
UNITSMIN MAX
Propagation Delay Clock To Q
TPHL1 TPLH1
VDD = 5V, VIN = VDD or GND 9 +25oC - 320 ns
10, 11 +125oC, -55oC - 432 ns
Propagation Delay Reset To Q
TPHL2 VDD = 5V, VIN = VDD or GND 9 +25oC - 400 ns
10, 11 +125oC, -55oC - 540 ns
Transition Time TTHL
TTLH
VDD = 5V, VIN = VDD or GND 9 +25oC - 200 ns
10, 11 +125oC, -55oC - 270 ns
Maximum Clock Input Frequency
FCL VDD = 5V, VIN = VDD or GND 9 +25oC 3 - MHz
10, 11 +125oC, -55oC 3/1.35 - MHz
NOTES:
1. CL = 50pF, RL = 200K, Input TR, TF < 20ns.
2. -55oC and +125oC limits guaranteed, 100% testing being implemented.
TABLE 3. ELECTRICAL PERFORMANCE CHARACTERISTICS
PARAMETER SYMBOL CONDITIONS NOTES TEMPERATURE
LIMITS
UNITSMIN MAX
Supply Current IDD VDD = 5V, VIN = VDD or GND 1, 2 -55oC, +25oC- 5 µA
+125oC - 150 µA
VDD = 10V, VIN = VDD or GND 1, 2 -55oC, +25oC- 10µA
+125oC - 300 µA
VDD = 15V, VIN = VDD or GND 1, 2 -55oC, +25oC- 10µA
+125oC - 600 µA
Output Voltage VOL VDD = 5V, No Load 1, 2 +25oC, +125oC,
-55oC
-50mV
Output Voltage VOL VDD = 10V, No Load 1, 2 +25oC, +125oC,
-55oC
-50mV
Output Voltage VOH VDD = 5V, No Load 1, 2 +25oC, +125oC,
-55oC
4.95 - V
Output Voltage VOH VDD = 10V, No Load 1, 2 +25oC, +125oC,
-55oC
9.95 - V
Output Current (Sink) IOL5 VDD = 5V, VOUT = 0.4V 1, 2 +125oC 0.36 - mA
-55oC 0.64 - mA
Output Current (Sink) IOL10 VDD = 10V, VOUT = 0.5V 1, 2 +125oC 0.9 - mA
-55oC 1.6 - mA
Output Current (Sink) IOL15 VDD = 15V, VOUT = 1.5V 1, 2 +125oC 2.4 - mA
-55oC 4.2 - mA
Output Current (Source) IOH5A VDD = 5V, VOUT = 4.6V 1, 2 +125oC - -0.36 mA
-55oC - -0.64 mA
Output Current (Source) IOH5B VDD = 5V, VOUT = 2.5V 1, 2 +125oC - -1.15 mA
-55oC - -2.0 mA
Output Current (Source) IOH10 VDD = 10V, VOUT = 9.5V 1, 2 +125oC - -0.9 mA
-55oC - -1.6 mA
Output Current (Source) IOH15 VDD =15V, VOUT = 13.5V 1, 2 +125oC - -2.4 mA
-55oC - -4.2 mA
Input Voltage Low VIL VDD = 10V, VOH > 9V , VOL < 1V 1, 2 +25oC, +125oC,
-55oC
-3V
Page 4
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Specifications CD4015BMS
Input Voltage High VIH VDD = 10V, VOH > 9V, VOL < 1V 1, 2 +25oC, +125oC,
-55oC
+7 - V
Propagation Delay Clock To Q
TPHL1 TPLH1
VDD = 10V 1, 2, 3 +25
o
C - 160 ns
VDD = 15V 1, 2, 3 +25
o
C - 120 ns
Propagation Delay Reset To Q
TPHL2 VDD = 10V 1, 2, 3 +25oC - 200 ns
VDD = 15V 1, 2, 3 +25oC - 160 ns
Transition Time TTHL
TTLH
VDD = 10V 1, 2, 3 +25oC - 100 ns VDD = 15V 1, 2, 3 +25oC - 80 ns
Maximum Clock Input Frequency
FCL VDD = 10V 1, 2, 3 +25oC 6 - MHz
VDD = 15V 1, 2, 3 +25oC 8.5 - MHz
Minimum Data Setup Time
TS VDD = 5V 1, 2, 3 +25oC - 70 ns
VDD = 10V 1, 2, 3 +25oC - 40 ns VDD = 15V 1, 2, 3 +25oC - 30 ns
Clock Rise and Fall Time TRCL
TFCL
VDD = 5V 1, 2, 3 +25oC-15µs VDD = 10V 1, 2, 3 +25oC-15µs VDD = 15V 1, 2, 3 +25oC-15µs
Minimum Clock Pulse Width
TWCL VDD = 5V 1, 2, 3 +25oC - 180 ns
VDD = 10V 1, 2, 3 +25oC - 80 ns VDD = 15V 1, 2, 3 +25oC - 50 ns
Minimum Reset Pulse Width
TWR VDD = 5V 2, 3 +25oC - 200 ns
VDD = 10V 2, 3 +25oC - 80 ns VDD = 15V 2, 3 +25oC - 60 ns
Input Capacitance CIN Any Input 1, 2 +25oC - 7.5 pF
NOTES:
1. All voltages referenced to device GND.
2. The parameters listed on Table 3 are controlled via design or process and are not directly tested. These parameters are characterized on initial design release and upon design changes which would affect these characteristics.
3. CL = 50pF, RL = 200K, Input TR, TF < 20ns.
TABLE 4. POST IRRADIATION ELECTRICAL PERFORMANCE CHARACTERISTICS
PARAMETER SYMBOL CONDITIONS NOTES TEMPERATURE
LIMITS
UNITSMIN MAX
Supply Current IDD VDD = 20V, VIN = VDD or GND 1, 4 +25oC-25µA N Threshold Voltage VNTH VDD = 10V, ISS = -10µA 1, 4 +25oC -2.8 -0.2 V N Threshold Voltage
Delta
VNTH VDD = 10V, ISS= -10µA 1, 4 +25oC-±1V
P Threshold Voltage VPTH VSS = 0V, IDD = 10µA 1, 4 +25oC 0.2 2.8 V P Threshold Voltage
Delta
VPTH VSS = 0V, IDD = 10µA 1, 4 +25oC-±1V
Functional F VDD = 18V, VIN = VDD or GND 1 +25oC VOH >
VDD/2
VOL < VDD/2
V
VDD = 3V, VIN = VDD or GND
Propagation Delay Time TPHL
TPLH
VDD = 5V 1, 2, 3, 4 +25oC - 1.35 x
+25oC
Limit
ns
NOTES: 1. All voltages referenced to device GND.
2. CL = 50pF, RL = 200K, Input TR, TF < 20ns.
3. See Table 2 for +25oC limit.
4. Read and Record
TABLE 3. ELECTRICAL PERFORMANCE CHARACTERISTICS (Continued)
PARAMETER SYMBOL CONDITIONS NOTES TEMPERATURE
LIMITS
UNITSMIN MAX
Page 5
7-93
Specifications CD4015BMS
TABLE 5. BURN-IN AND LIFE TEST DELTA PARAMETERS +25OC
PARAMETER SYMBOL DELTA LIMIT
Supply Current - MSI-2 IDD ± 1.0µA Output Current (Sink) IOL5 ± 20% x Pre-Test Reading Output Current (Source) IOH5A ± 20% x Pre-Test Reading
TABLE 6. APPLICABLE SUBGROUPS
CONFORMANCE GROUP
MIL-STD-883
METHOD GROUP A SUBGROUPS READ AND RECORD
Initial Test (Pre Burn-In) 100% 5004 1, 7, 9 IDD, IOL5, IOH5A Interim Test 1 (Post Burn-In) 100% 5004 1, 7, 9 IDD, IOL5, IOH5A Interim Test 2 (Post Burn-In) 100% 5004 1, 7, 9 IDD, IOL5, IOH5A
PDA (Note 1) 100% 5004 1, 7, 9, Deltas
Interim Test 3 (Post Burn-In) 100% 5004 1, 7, 9 IDD, IOL5, IOH5A
PDA (Note 1) 100% 5004 1, 7, 9, Deltas Final Test 100% 5004 2, 3, 8A, 8B, 10, 11 Group A Sample 5005 1, 2, 3, 7, 8A, 8B, 9, 10, 11 Group B Subgroup B-5 Sample 5005 1, 2, 3, 7, 8A, 8B, 9, 10, 11, Deltas Subgroups 1, 2, 3, 9, 10, 11
Subgroup B-6 Sample 5005 1, 7, 9
Group D Sample 5005 1, 2, 3, 8A, 8B, 9 Subgroups 1, 2 3
NOTE: 1. 5% Parameteric, 3% Functional; Cumulative for Static 1 and 2.
TABLE 7. TOTAL DOSE IRRADIATION
CONFORMANCE GROUPS
MIL-STD-883
METHOD
TEST READ AND RECORD
PRE-IRRAD POST-IRRAD PRE-IRRAD POST-IRRAD
Group E Subgroup 2 5005 1, 7, 9 Table 4 1, 9 Table 4
TABLE 8. BURN-IN AND IRRADIATION TEST CONNECTIONS
FUNCTION OPEN GROUND VDD 9V ± -0.5V
OSCILLATOR
50kHz 25kHz
Static Burn-In 1 Note 1
2 - 5, 10 - 13 1, 6 - 9, 14, 15 16
Static Burn-In 2 Note 1
2 - 5, 10 - 13 8 1, 6, 7, 9, 14 - 16
Dynamic Burn­In Note 1
- 6, 8, 14 16 2 - 5, 10 - 13 1, 9 7, 15
Irradiation Note 2
2 - 5, 10 - 13 8 1, 6, 7, 9, 14 - 16
NOTE:
1. Each pin except VDD and GND will have a series resistor of 10K ± 5%, VDD = 18V ± 0.5V
2. Each pin except VDD and GND will have a series resistor of 47K ± 5%; Group E, Subgroup 2, sample size is 4 dice/wafer, 0 failures, VDD = 10V ± 0.5V
Page 6
94
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
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NORTH AMERICA
Intersil Corporation P. O. Box 883, Mail Stop 53-204 Melbourne, FL 32902 TEL: (321) 724-7000 FAX: (321) 724-7240
EUROPE
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Specifications CD4015BMS
Logic Diagram
FIGURE 1. CD4015BMS LOGIC DIAGRAM
TRUTH TABLE
CL D R Q1 Qn
0 0 0 Qn-1 1 0 1 Qn-1 X 0 Q1 Qn (No Change)
XX100
X = Don’t care Case
DQ
QCL
R
p n
CL
CL
D
DQ CL
Q
R
CL
CL
Q
DQ
QCL
R
DQ
QCL
R
DQ
QCL
R
p n
CL
CL
p n
CL
CL
p n
CL
CL
VDD
VSS
CL
R
Q
13Q1 (5) 12Q2 (4) 11Q3 (3) 2Q4 (10)
15
DATA
(7)
*
1
CLOCK
(9)
*
14
RESET
(6)
*
*ALL INPUTS ARE PROTECTED
BY CMOS PROTECTION NETWORK
Page 7
7-95
CD4015BMS
Typical Performance Characteristics
FIGURE 2. TYPICAL OUTPUT LOW (SINK) CURRENT
CHARACTERISTICS
FIGURE 3. MINIMUM OUTPUT LOW (SINK) CURRENT
CHARACTERISTICS
FIGURE 4. TYPICAL OUTPUT HIGH (SOURCE) CURRENT
CHARACTERISTICS
FIGURE 5. MINIMUM OUTPUT HIGH (SOURCE) CURRENT
CHARACTERISTICS
FIGURE 6. TYPICAL TRANSITION TIME AS A FUNCTION OF
LOAD CAPACITANCE
FIGURE 7. TYPICAL PROPAGATION DELAY TIME AS A
FUNCTION OF LOAD CAPACITANCE
10V
5V
AMBIENT TEMPERATURE (TA) = +25oC
GATE-TO-SOURCE VOLTAGE (VGS) = 15V
0 5 10 15
15
10
5
20
25
30
DRAIN-TO-SOURCE VOLTAGE (VDS) (V)
OUTPUT LOW (SINK) CURRENT (IOL) (mA)
AMBIENT TEMPERATURE (TA) = +25oC
GATE-TO-SOURCE VOLTAGE (VGS) = -5V
10V
5V
OUTPUT LOW (SINK) CURRENT (IOL) (mA)
15
12.5
10
7.5
5
2.5
0 5 10 15
DRAIN-TO-SOURCE VOLTAGE (VDS) (V)
-10V
-15V
AMBIENT TEMPERATURE (TA) = +25oC
GATE-TO-SOURCE VOLTAGE (VGS) = -5V
0
-5
-10
-15
DRAIN-TO-SOURCE VOLTAGE (VDS) (V)
-20
-25
-30
0-5-10-15
OUTPUT HIGH (SOURCE) CURRENT (IOH) (mA)
-10V
-15V
AMBIENT TEMPERATURE (TA) = +25oC
0
-5
-10
-15
DRAIN-TO-SOURCE VOLTAGE (VDS) (V)
0-5-10-15
OUTPUT HIGH (SOURCE) CURRENT (IOH) (mA)
GATE-TO-SOURCE VOLTAGE (VGS) = -5V
AMBIENT TEMPERATURE (TA) = +25oC
LOAD CAPACITANCE (CL) (pF)
0 40 60 80 10020
0
50
100
150
200
SUPPLY VOLTAGE (VDD) = 5V
10V 15V
TRANSITION TIME (tTHL, tTLH) (ns)
AMBIENT TEMPERATURE (TA) = +25oC
LOAD CAPACITANCE (CL) (pF)
0 40 60 80 10020
50
100
150
200
SUPPLY VOLTAGE (VDD) = 5V
PROPAGATION DELAY TIME (tPHL, tPLH) (ns)
15V
10V
250
Page 8
7-96
CD4015BMS
Chip Dimensions and Pad Layout
FIGURE 8. TYPICAL POWER DISSIPATION AS
A FUNCTION OF FREQUENCY
Typical Performance Characteristics (Continued)
CL = 50pF CL = 15pF
AMBIENT TEMPERATURE (TA) = +25oC
SUPPLY VOLTAGE (VDD) = 15V
10V
5V
10V
tr, tf = 20ns RL = 200k
1
2468102468
10
2
2468
10
3
2468
10
4
2468
CLOCK INPUT FREQUENCY (fCL) (kHz)
10
5
10
10
2
2
8 6 4
10
3
2
8 6 4
10
4
2
8 6 4
10
5
2
8 6 4
POWER DISSIPATION (PD) (µW)
Dimensions in parentheses are in millimeters and are derived from the basic inch dimensions as indicated. Grid graduations are in mils (10
-3
inch)
METALLIZATION: Thickness: 1 1kÅ14kÅ, AL. PASSIVATION: 10.4kÅ - 15.6kÅ, Silane BOND PADS: 0.004 inches X 0.004 inches MIN DIE THICKNESS: 0.0198 inches - 0.0218 inches DIE SIZE: X = 80 (77 - 85) = (1.956 - 2.159)
Y = 98 (95 - 103) = (2.413 - 2.616)
13
3
14
15
12
1110
2
1
16
4
5
6
7
8 9
98
80
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