Datasheet CBT16213 Datasheet (Philips)

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INTEGRATED CIRCUITS

CBT16213

24-bit bus exchange switch
with 12-bit output enables

Objective specification 2001 Jan 19

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Philips Semiconductors Objective specification

24-bit bus exchange switch
with 12-bit output enables

FEATURES

•5 Ω switch connection between two ports

•TTL compatible control input levels

•Package options include plastic shrink small outline (SSOP) and

thin shrink small outline (TSSOP)

QUICK REFERENCE DATA

SYMBOL PARAMETER

C

t

PLH

t

PHL

C

OUT

I

CCZ

IN

Propagation delay
An to Yn

Input capacitance VI = 0 V or V
Output capacitance Outputs disabled; VO = 0 V or V
Total supply current Outputs disabled; VCC = 5.5 V 3 µA

CL = 50 pF; VCC = 5 V 0.25 ns

CBT16213

DESCRIPTION

The CBT16213 provides 24 bits of high-speed TTL-compatible bus
switching or exchanging. The low on-state resistance of the switch
allows connections to be made with minimal propagation delay.

The CBT16213 operates as 24-bit bus switch or a 12-bit bus
exchanger, which provides data exchanging between the four signal
ports via the data-select (S0–S2) terminals.

The CBT16213 is characterized for operation from –40 to +85 °C.

CONDITIONS

T

= 25 °C; GND = 0 V

amb

CC

CC

TYPICAL UNIT

4.5 pF

11.5 pF

ORDERING INFORMATION

PACKAGES TEMPERATURE RANGE OUTSIDE NORTH AMERICA NORTH AMERICA DWG NUMBER

56-Pin Plastic SSOP Type III –40 to +85 °C CBT16213DL CBT16213DL SOT371-1
56-Pin Plastic TSSOP Type II –40 to +85 °C CBT16213DGG CBT16213DGG SOT364-1

FUNCTION TABLE

S2 S1 S0 A1 A2 FUNCTION

L L L Z Z Disconnect
L L H B1 Z A1 = B1
L H L B2 Z A1 = B2

L H H Z B1 A2 = B1
H L L Z B2 A2 = B2
H L H A2 & B2 A1 & B2 A1 = A2 = B2
H H L B1 B2 A1 = B1, A2 = B2
H H H B2 B1 A1 = B2, A2 = B1

H = High voltage level
L = Low voltage level

Z = High impedance “off” state

LOGIC SYMBOL

254

1A1

353

1A2

1

S0

56

S1

55

S2

1 of 12 Channels

FLOW CONTROL

1B1

1B2

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Philips Semiconductors Objective specification

24-bit bus exchange switch
with 12-bit output enables

PIN CONFIGURATION

1A1

1A2
2A1
2A2
3A1
3A2

GND

4A1

4A2
5A1

5A2
6A1

6A2
7A1

7A2

V
8A1

GND

8A2

9A1
9A2

10A1
10A2
11A1

11A2

12A1
12A2

1

S0

2
3

4
5

6
7
8

9
10
11
12
13
14
15
16
17

CC

18
19
20
21

22

23
24
25

26

27
28

56
55
54

53
52

51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36

35

34

33
32

31

30
29

S1
S2

1B1
1B2
2B1
2B2
3B1
GND
3B2

4B1
4B2

5B1
5B2

6B1
6B2

7B1

7B2
8B1
GND
8B2

9B1
9B2

10B1
10B2
11B1

11B2

12B1
12B2

CBT16213

PIN DESCRIPTION

PIN NUMBER SYMBOL NAME AND FUNCTION

1, 56, 55 S0, S1, S2 Data select

2, 4, 6, 9, 11, 13, 15,

18, 21, 23, 25, 27

3, 5, 7, 10, 12, 14, 16,

20, 22, 24, 26, 28

54, 52, 50, 47, 45, 43,

41, 39, 36, 34, 32, 30

53, 51, 48, 46, 44, 42,

40, 37, 35, 33, 31, 29

8, 19, 38, 49 GND Ground (0 V)

17 V

1A1–12A1 A1 channel

1A2–12A2 A2 channel

1B1, 12B1 B1 channel

1B2, 12B2 B2 channel

CC

Positive supply voltage

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Philips Semiconductors Objective specification

SYMBOL

PARAMETER

UNIT

24-bit bus exchange switch
with 12-bit output enables

ABSOLUTE MAXIMUM RATINGS

SYMBOL

V

CC

I

IK

V

V

OUT

I

OUT

T

stg

NOTES:

1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability .

2. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create ju nction
temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150 °C.

3. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

DC supply voltage –0.5 to +7.0 V
DC input diode current VI < 0 –50 mA
DC input voltage

I

DC output voltage
DC output current output in Low state 128 mA
Storage temperature range –65 to +150 °C

PARAMETER CONDITIONS RATING UNIT

3

3

RECOMMENDED OPERATING CONDITIONS

V

T

CC

V

V

amb

DC supply voltage 4.0 5.5 V
High-level input voltage 2.0 — V

IH

Low-level Input voltage — 0.8 V

IL

Operating free-air temperature range –40 +85 °C

1, 2

–0.5 to +7.0 V

output in Off or High state –0.5 to +5.5 V

LIMITS

Min Max

CBT16213

2001 Jan 19

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Philips Semiconductors Objective specification

IIInput leakage current

A

C

V

V

A to B or B to A

r

3

Ω

A1 to A2

t

Propagation dela

1

t

t

24-bit bus exchange switch
with 12-bit output enables

DC ELECTRICAL CHARACTERISTICS

SYMBOL PARAMETER TEST CONDITIONS T

V

I

CC

∆I

C

Input clamp voltage VCC = 4.5 V; II = –18 mA — — –1.2 V

IK

p

Quiescent supply current
Additional supply current per

CC

input pin
Control pins VI= 3 V or 0 V — 4.5 — pF

I

2

VCC = 0 V; VI = 5.5 V — — 10
VCC = 5.5 V; VI = GND or 5.5 V — — ±1

2

VCC = 5.5 V; IO = 0 V, VI = VCC or GND — — 3 µA
VCC = 5.5 V, one input at 2.7 V,

other inputs at VCC or GND

Power-off leakage current,

IO(OFF)

B port
Power-off leakage current,

= 3 V or 0 V; S0, S1, or S2 =

O

;

CC

A port

VCC = 4.0 V; V1 = 2.4 V; II = 15 mA — 14 21
VCC = 4.5 V; V1 = 0 V; II = 64 mA — 5 7
VCC = 4.5 V; V1 = 0 V; II = 30 mA — 5 7
VCC = 4.5 V; V1 = 2.4 V; II = 15 mA — 8 15

on

VCC = 4.0 V; V1 = 2.4 V; II = 15 mA — 22 33
VCC = 4.5 V; V1 = 0 V; II = 64 mA — 10 14
VCC = 4.5 V; V1 = 0 V; II = 30 mA — 10 14
VCC = 4.5 V; V1 = 2.4 V; II = 15 mA — 16 22

NOTES:

1. All typical values are at V

2. This is the increase in supply current for each input that is at the specified TTL voltage level rather than V

= 5 V, T

CC

amb

= 25 °C

3. Measured by the voltage drop between the A and the B terminals at the indicated current through the switch.
On-state resistance is determined by the lowest voltage of the two (A or B) terminals.

= –40 °C to +85 °C UNIT

amb

Min Typ

— — 2.5 mA

— 11.5 — pF

— 11.5 — pF

CC

LIMITS

1

or GND.

CBT16213

Max

µ

AC CHARACTERISTICS

GND = 0 V; tR; CL = 50 pF

NOTES:

1. This parameter is warranted but not production tested. The propagation delay is based on the RC time constant of the typical on-state

2001 Jan 19

SYMBOL PARAMETER

FROM

(INPUT)

TO

(OUTPUT)

VCC = +5.0 V ± 0.5 V VCC = 4.0 V

Min Max Min Max

A or B B or A — 0.25 — 0.25 ns

dis

pd

en

p

Output enable time
to High and Low level

Output disable time
from High and Low level

y

A1 A2 — 0.5 — 0.5 ns

S A or B 3.2 11.1 — 12.4 ns

S0 A2 and B2 4 10.9 — 13.3 ns

S A or B 2.3 11.9 — 12.4 ns

S0 A2 and B2 5.7 12 — 12.8 ns

resistance of the switch and a load capacitance of 50 pF, when driven by an ideal voltage source (zero output impedance).

5

UNIT

Philips Semiconductors Objective specification

24-bit bus exchange switch
with 12-bit output enables

AC WAVEFORMS

VM = 1.5 V, VIN = GND to 3.0 V

t

t

PHZ

PLZ

1.5 V

t

PHL

V

V

OL

OH

+ 0.3 V

– 0.3 V

SA00029

INPUT

OUTPUT

1.5 V

t

PLH

1.5 V 1.5 V

Waveform 1. Input (An) to Output (Yn) Propagation Delays

Output Control

(Low-level

enabling

Output

Waveform 1

S1 at 7 V

(see Note)

Output

Waveform 2

S1 at Open

(see Note)

1.5 V 1.5 V

t

PZL

1.5 V

t

PZH

1.5 V

Note:

Waveform 1 is for an output with internal conditions such that
the output is low except when disabled by the output control.

Waveform 2 is for an output with internal conditions such that
the output is high except when disabled by the output control.

Waveform 2. 3-State Output Enable and Disable Times

3 V

0 V

V

OH

V

OL

SA00028

3 V

0 V

3.5 V

V

OL

V

OH

0 V

TEST CIRCUIT AND WAVEFORMS

From Output
Under Test

C

= 50 pF

L

DEFINITIONS

= Load capacitance includes jig and probe capacitance;

C

L

see AC CHARACTERISTICS for value.

500 Ω

500 Ω

Load Circuit

TEST S1

t

pd

t

PLZ/tPZL

t

PHZ/tPZH

open

7 V

open

CBT16213

7 V

S1

Open

GND

SA00012

2001 Jan 19

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Philips Semiconductors Objective specification

24-bit bus exchange switch
with 12-bit output enables

SSOP56: plastic shrink small outline package; 56 leads; body width 7.5 mm SOT371-1

CBT16213

2001 Jan 19

7

Philips Semiconductors Objective specification

24-bit bus exchange switch
with 12-bit output enables

TSSOP56: plastic thin shrink small outline package; 56 leads; body width 6.1 mm SOT364-1

CBT16213

2001 Jan 19

8

Philips Semiconductors Objective specification

24-bit bus exchange switch
with 12-bit output enables

CBT16213

NOTES

2001 Jan 19

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Philips Semiconductors Objective specification

24-bit bus exchange switch
with 12-bit output enables

Data sheet status

Data sheet
status

Objective
specification

Preliminary
specification

Product
specification

Product
status

Development

Qualification

Production

Definition

This data sheet contains the design target or goal specifications for product development.
Specification may change in any manner without notice.

This data sheet contains preliminary data, and supplementary data will be published at a later date.
Philips Semiconductors reserves the right to make changes at any time without notice in order to
improve design and supply the best possible product.

This data sheet contains final specifications. Philips Semiconductors reserves the right to make
changes at any time without notice in order to improve design and supply the best possible product.

CBT16213

[1]

[1] Please consult the most recently issued datasheet before initiating or completing a design.

Definitions

Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For

detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one

or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.

Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.

Disclaimers

Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can

reasonably be expected to result in personal injury . Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.

Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.

Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone [phone]

 Copyright Philips Electronics North America Corporation 2001

All rights reserved. Printed in U.S.A.

Date of release: 01–01

Document order number:

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

2001 Jan 19

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