Datasheet CBTU0808 Datasheet (Philips)

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CBTU0808

Dual lane PCI Express port multiplexer

Rev. 01 — 2 June 2006 Product data sheet

1. General description

The CBTU0808 is a dual lane port multiplexer designed to provideconvenient and reliable
path switching for PCI Express signals. It is organized as two PCI Express lanes, each
consisting of a Transmit and Receivechannel.Each channel has four ports, two (A and B)
on the source (or host) side and two (A and B) on the destination (or device) side. Each
port provides a pair of signal lines to support PCIe differential signaling.

Using specially designed high-bandwidth and high off-isolation switch elements, source
and destination ports can be connected or isolated in three possible configurations:
source A and B to destinations A and B respectively; or source A to destination B
(remaining ports isolated), or all ports isolated.

2. Features

The switch elements are controlled by internal control logic to set switch positions in
accordance with these three configurations, selectable by CMOS inputs CTRL0 and
CTRL1 for lanes 0 and 1 respectively. Within a lane, the switch configuration is always
applied identically to both transmit and receive channels.

The CBTU0808 is packaged in a 48-ball, depopulated 9 × 9 grid, 0.5 mm ball pitch, thin
profile fine-pitch ball grid array (TFBGA) package, which (while requiring a minimum
5mm× 5 mm of board space) allows for adequate signal routing and escape using
conventional board technology.

n 2-lane wide PCI Express port multiplexer
n One transmit and one receive differential channel per lane
n Four ports per channel
n PCI Express signaling compliant
n High bandwidth: > 1 GHz
n Low OFF-feedthrough of < −35 dB at 1.25 GHz
n Low channel crosstalk of < −35 dB at 1.25 GHz
n Designed to match characteristic impedance of PCIe signaling environment
n Single 1.8 V supply operation
n ESD resilience of 2 kV HBM
n Available in 48-ball, 5 mm × 5 mm, 0.5 mm ball pitch TFBGA package, Pb-free/Green

3. Applications

n High-performance computing applications
n Port switching and docking applications

Philips Semiconductors

4. Ordering information

Table 1. Ordering information

Type number Solder process Package

Name Description Version

CBTU0808EE/G Pb-free (SnAgCu solder ball

TFBGA48 plastic thin fine-pitch ball grid array package;

compound)

5. Functional diagram

CBTU0808

CTRL[1:0]
TEST[1:0]

CONTROL AND CONFIGURATION

CBTU0808

Dual lane PCI Express port multiplexer

SOT918-1

48 balls; body 5 × 5 × 0.8 mm

channel Tx0

channel Rx0

channel Tx1

TXSA0P
TXSA0N

TXSB0P
TXSB0N

RXSA0P
RXSA0N

RXSB0P
RXSB0N

TXSA1P

TXSA1N

TXSB1P

TXSB1N

RXSA1P
RXSA1N

TXDA0P
TXDA0N

TXDB0P
TXDB0N

LANE 0

RXDA0P
RXDA0N

RXDB0P
RXDB0N

TXDA1P
TXDA1N

TXDB1P
TXDB1N

LANE 1

RXDA1P
RXDA1N

channel Rx1

RXSB1P
RXSB1N

RXDB1P
RXDB1N

002aac139

Fig 1. Functional diagram

CBTU0808_1 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.

Product data sheet Rev. 01 — 2 June 2006 2 of 16

Philips Semiconductors

6. Pinning information

6.1 Pinning

CBTU0808

Dual lane PCI Express port multiplexer

ball A1
index area

A
B
C
D
E

F
G
H

J

Fig 2. Pin configuration for TFBGA48

A

B

C

D

1

CTRL0

RXSA0P

RXSB0P

23456789

TXSB0P TXSA0P GND TXDA0P TXDB0P TEST1

GND TXSB0N TXSA0N V

RXSA0N RXDA0N

RXSB0N RXDB0N RXDB0P

CBTU0808EE/G

246891357

002aac213

Transparent top view

TXDA0N TXDB0N GND RXDA0P

DD

E

F

G

H

J

GND

TXSA1P

TXSB1P

TEST0

V

DD

TXSA1N TXDA1N TXDA1P

TXSB1N TXDB1N

GND RXSA1N RXSB1N V

RXSA1P RXSB1P GND RXDB1P RXDA1P CTRL1

RXDB1N RXDA1N GND TXDB1P

DD

V

DD

GND

002aac212

48-ball, 9 × 9 grid; top view. An empty cell indicates no ball is populated at that grid point.

Fig 3. Ball mapping

CBTU0808_1 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.

Product data sheet Rev. 01 — 2 June 2006 3 of 16

Philips Semiconductors

6.2 Pin description

Table 2. Pin description

Signal group Symbol Pin Type Description

Test and
control

Signal ports TXSA0P, TXSA0N,

Power V

CBTU0808

Dual lane PCI Express port multiplexer

CTRL0 A1 CMOS
CTRL1 J9
TEST0 J1 CMOS

TEST1 A9 output Test output. Used for test purposes only.

A4, B4,

TXSB0P, TXSB0N
RXSA0P, RXSA0N,

RXSB0P, RXSB0N
TXSA1P, TXSA1N,

TXSB1P, TXSB1N
RXSA1P, RXSA1N,

RXSB1P, RXSB1N
TXDA0P, TXDA0N,

TXDB0P, TXDB0N
RXDA0P, RXDA0N,

RXDB0P, RXDB0N
TXDA1P, TXDA1N,

TXDB1P, TXDB1N
RXDA1P, RXDA1N,

RXDB1P, RXDB1N

DD

GND A5, B2,

A2, B3
B1, C2,

D1, D2
F1, F2,

H1, G2
J2, H3,

J4, H4
A6, B6,

A8, B7
B9, C8,

D9, D8
F9, F8,

H9, G8
J8, H7,

J6, H6
B5, E2,

E8, H5

B8, E1,
E9, H2,
H8, J5

input

input

signal
port

signal
port

signal
port

signal
port

signal
port

signal
port

signal
port

signal
port

power power supply pins

power ground pins

Switch configuration control inputs. See

Table 3 “Switch configuration truth table”.

Test input. Used for test purposes only.
Should beleftopen-circuit during normal
operation. An internal pull-down resistor
will default this pin to a LOW state.

Should be left open-circuit in normal
application.

Transmit ports A and B differential signal
terminals for Lane 0, Source side.

Receive ports A and B differential signal
terminals for Lane 0, Source side.

Transmit ports A and B differential signal
terminals for Lane 1, Source side.

Receive ports A and B differential signal
terminals for Lane 1, Source side.

Transmit ports A and B differential signal
terminals for Lane 0, Destination side.

Receive ports A and B differential signal
terminals for Lane 0, Destination side.

Transmit ports A and B differential signal
terminals for Lane 1, Destination side.

Receive ports A and B differential signal
terminals for Lane 1, Destination side.

CBTU0808_1 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.

Product data sheet Rev. 01 — 2 June 2006 4 of 16

Philips Semiconductors

7. Functional description

7.1 Functional description

7.1.1 General information

The CBTU0808 Dual lane PCI Express port multiplexeris designed to allow port switching
of up to two PCI Express lanes (each including a Transmit and Receive channel)
according to three switch configuration settings (described in Section 7.1.2.1). The basic
switch element of the CBTU0808 is designed integrally with its package and chip
interconnect to present an optimum characteristic on-impedance when used in a
PCI Express signaling environment, and to provide high off-port isolation and low
crosstalk.

7.1.2 Functional information

The following paragraphs describe the control and configuration possibilities available in
the CBTU0808.

7.1.2.1 Switch configuration

The position of the port switches is controlled by CMOS input signals CTRL[1:0] and can
be overridden by CMOS input TEST0 to disconnect (open) all ports between source and
destination. For a given lane, the switch positions are always identical between transmit
and receive channels. Lane 0 is controlled by CTRL0 and Lane 1 is controlled by CTRL1.
The truth table for the switch position as a function of these inputs is shown in Table 3.

CBTU0808

Dual lane PCI Express port multiplexer

Table 3. Switch configuration truth table

Inputs Function

[1]

CTRLn

LOW LOW An R

HIGH

LOW HIGH An high-Z high-Z All ports open-circuit

> LOW HIGH Test mode for internal use only do not use

[1] n is the Lane number (0 or 1).
[2] CTRL1 or CTRL0 = HIGH.

TEST0 Source ports

Bn high-Z R

[2]

LOW An high-Z R

Bn high-Z high-Z

Bn high-Z high-Z

[1]

Destination ports Comment
A B

on

high-Z SA:DA/SB:DB

on
on

(Dual Through mode)
SA:DB

(Single Cross mode)

(Disconnect mode)

CBTU0808_1 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.

Product data sheet Rev. 01 — 2 June 2006 5 of 16

Philips Semiconductors

CBTU0808

Dual lane PCI Express port multiplexer

8. Limiting values

Table 4. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

V

DD

V

I

I

IK

I

OK

I

O

I

CCC

T

stg

V

esd

[1] The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.

supply voltage −0.5 +2.5 V
input voltage
input clamping current VI< 0 V or VI>V
output clamping current VO< 0 V or VO>V

DD

DD

output current continuous; 0 V < VO< V
continuous current through each

V

or GND pin

DD

DD

[1]

−0.5 +2.5 V

- −50 mA

- ±50 mA

- ±50 mA

- ±100 mA

storage temperature −65 +150 °C
electrostatic discharge voltage Human Body Model; 1.5 kΩ; 100 pF >2 - kV

Machine Model; 0 Ω; 200 pF >200 - V

9. Recommended operating conditions

Table 5. Recommended operating conditions

Symbol Parameter Conditions Min Typ Max Unit

V

DD

V

I

V

IH

V

IL

V

ICR

V

I(dif)(p-p)

T

amb

[1] The CTRL[1:0] inputs of the device must be held at valid levels (not floating) to ensure proper device operation.
[2] V

supply voltage 1.7 - 1.9 V
input voltage TXn and RXn ports −0.25 - +1.75 V
HIGH-level input voltage CTRL[1:0], TEST inputs
LOW-level input voltage CTRL[1:0], TEST[1:0] inputs
common mode input voltage

TXn and RXn ports 0 - 1.5 V

[1]

0.65 × V

[1]

- - 0.35 × V

-V

DD

range
peak-to-peak differential

TXn and RXn ports

[2]

- - 1.2 V

input voltage
ambient temperature operating in free air 0 - +85 °C

I(dif)(p-p)

=2×|V

TX_D+

− V

|. See Paragraph 4.3.3, Table 4-5 of Ref. 1.

TX_D−

DD

DD

V
V

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Product data sheet Rev. 01 — 2 June 2006 6 of 16

Philips Semiconductors

CBTU0808

Dual lane PCI Express port multiplexer

10. Static characteristics

Table 6. Static characteristics

Over recommended operating conditions, unless otherwise noted.

Symbol Parameter Conditions Min Typ Max Unit

I

DD

supply current

Digital inputs CTRL[1:0] and TEST0

I

LI

C

i

input leakage current VI=VDD or GND - - ±5 µA
input capacitance VI=VDD or GND - - 5 pF

Signal ports TXSA0P … RXDB1N

I

LI

R

on(sw)

∆R

on(sw)

input leakage current VI=VDD or GND; TEST0 = HIGH

switch on-state resistance 8 10 12 Ω
switch on-state resistance

variation

C

S(ON)

ON-state capacitance VI= 0.9 V

(Disconnect mode)

over recommended VID (input
voltage) range

switch; simulated value of the
silicon switch only, excluding
package parasitics

[1]

--1mA

−100 - +100 µA

- 0.5 0.75 Ω

- 3.6 4.75 pF

[1] Static operating current.

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Product data sheet Rev. 01 — 2 June 2006 7 of 16

Philips Semiconductors

CBTU0808

Dual lane PCI Express port multiplexer

11. Dynamic characteristics

Table 7. Dynamic characteristics

Over recommended operating conditions, unless otherwise noted. Characterization bandwidth: 10 MHz < f

Symbol Parameter Conditions Min Typ Max Unit

t

PD

t

startup

propagation delay Figure 5 -60-ps
start-up time supply voltage valid to switch specified operating

- - 100 µs

characteristics

t

rcfg

reconfiguration time CTRL[1:0], TEST0 setting change to switch specified

- - 100 µs

operating characteristics

t

sk(o)

t

sk(edge)

t

sk(dif)

s

12

output skew time difference in propagation delay between any two ‘ON’

paths within a channel;

Figure 6

edge skew time difference of rising edge propagation delay to falling

edge propagation delay;

Figure 7

differential skew time difference in propagation delay between two

reverse transmission
coefficient

members of a differential pair;
Differential mode ON insertion loss; ON-state

f = 50 MHz −0.8 - - dB

Figure 8

--40ps

--40ps

--5ps

f = 625 MHz −2- - dB
f ≤ 1.25 GHz −3.3 - - dB

s

21

forward transmission
coefficient

Differential mode ON insertion loss; ON-state

f = 50 MHz −0.8 - - dB
f = 625 MHz −2- - dB
f ≤ 1.25 GHz −3.3 - - dB

s

11

input reflection
coefficient

Differential mode ON return loss; ON-state

f = 50 MHz - - −20 dB
f = 625 MHz - - −8dB
f ≤ 1.25 GHz - - −6.0 dB

s

22

output reflection
coefficient

Differential mode ON return loss; ON-state

f = 50 MHz - - −20 dB
f = 625 MHz - - −8dB
f ≤ 1.25 GHz - - −6.0 dB

s

12

reverse transmission
coefficient

Differential mode port-to-port crosstalk;
ON/OFF-state

f=50MHz - - −35 dB
f = 625 MHz - - −35 dB
f = 1.25 GHz - - −35 dB

s

21

forward transmission
coefficient

Differential mode port-to-port crosstalk;
ON/OFF-state

f=50MHz - - −35 dB
f = 625 MHz - - −35 dB
f = 1.25 GHz - - −35 dB

oper

< 6 GHz.

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Product data sheet Rev. 01 — 2 June 2006 8 of 16

Philips Semiconductors

CBTU0808

Dual lane PCI Express port multiplexer

Table 7. Dynamic characteristics

Over recommended operating conditions, unless otherwise noted. Characterization bandwidth: 10 MHz < f

…continued

oper

< 6 GHz.

Symbol Parameter Conditions Min Typ Max Unit

s

12

reverse transmission
coefficient

Differential mode off-port feedthrough; OFF-state

f=50MHz - - −35 dB
f = 625 MHz - - −35 dB
f = 1.25 GHz - - −35 dB

s

21

forward transmission
coefficient

Differential mode off-port feedthrough; OFF-state

f=50MHz - - −35 dB
f = 625 MHz - - −35 dB
f = 1.25 GHz - - −35 dB

0

s

, s21,

11

, s

s

12

22

(dB)

−6

−12

−18

(1)

(2)

002aac278

−24
0 5.003.751.25 2.50

f (GHz)

(1) insertion loss
(2) return loss

Fig 4. S parameters

1.8 V

output

0.9 V 0.9 Vinput
0 V

t

PLH

V

ref

t

PHL

V

V

ref

V

002aac274

OH

OL

output

output

Fig 5. Propagation delay Fig 6. Output skew

t

sk(o)

V

OH

V

OL

V

OH

V

OL

002aac275

CBTU0808_1 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.

Product data sheet Rev. 01 — 2 June 2006 9 of 16

Philips Semiconductors

CBTU0808

Dual lane PCI Express port multiplexer

input

output

Fig 7. Edge skew Fig 8. Differential skew

12. Test information

Fig 9. Test circuit

1.8 V

OH

OL

input

t

sk(dif)

input

TXDx, RXDx

0.9 V 0.9 V

C

6 pF

L

50 Ω

002aac273

0.9 V 0.9 V

t

PLH

t

=

sk(edge)

|t

rising − t

sk(edge)

sk(edge)

TXSx, RXSx

t

PHL

falling|

0 V

V

0.9 V0.9 V
V

002aac277

DUT

CL represents board and jig and does not indicate additional capacitance.
All input pulses are supplied by generators having the following characteristics:

PRR ≤ 10 MHz; Zo=50Ω; slew rate = 2.5 V/ns

0.9 V0.9 V

t

sk(dif)

1.8 V

0 V

1.8 V

0 V

002aac276

CBTU0808_1 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.

Product data sheet Rev. 01 — 2 June 2006 10 of 16

Philips Semiconductors

13. Package outline

CBTU0808

Dual lane PCI Express port multiplexer

TFBGA48: plastic thin fine-pitch ball grid array package; 48 balls; body 5 x 5 x 0.8 mm

B A

∅ v

e

E

M

AC

M

C∅ w

e

2

A

A

1

B

ball A1
index area

ball A1
index area

D

e

1

e

J
H

G

F
E
D
C
B
A

246813579

b

SOT918-1

A

2

detail X

C

y

C

1

y

X

0 2.5 5 mm

scale

DIMENSIONS (mm are the original dimensions)

A

UNIT

mm 1.15

OUTLINE
VERSION

SOT918-1 MO-195- - - - - -

max

A

0.25

0.15

A

1

b D E e

2

0.90

0.35

5.1

0.75

0.25

IEC JEDEC JEITA

4.9

5.1

4.9

e

e

1

4

0.5

REFERENCES

v

2

0.15w0.05y0.08

4

y

0.1

1

EUROPEAN

PROJECTION

ISSUE DATE

05-09-21
05-10-13

Fig 10. Package outline SOT918-1 (TFBGA48)

CBTU0808_1 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.

Product data sheet Rev. 01 — 2 June 2006 11 of 16

Philips Semiconductors

14. Soldering

14.1 Introduction to soldering surface mount packages

There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is recommended.

14.2 Reflow soldering

Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.

Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)
vary between 100 seconds and 200 seconds depending on heating method.

Typical reflow temperatures range from 215 °Cto260°C depending on solder paste
material. The peak top-surface temperature of the packages should be kept below:

CBTU0808

Dual lane PCI Express port multiplexer

Table 8. SnPb eutectic process - package peak reflow temperatures (from

July 2004)

Package thickness Volume mm3 < 350 Volume mm3≥ 350

< 2.5 mm 240 °C+0/−5 °C 225 °C+0/−5 °C
≥ 2.5 mm 225 °C+0/−5 °C 225 °C+0/−5 °C

Table 9. Pb-free process - package peak reflow temperatures (from

2004)

Package thickness Volume mm3 < 350 Volume mm3 350 to

< 1.6 mm 260 °C + 0 °C 260 °C + 0 °C 260 °C + 0 °C

1.6 mm to 2.5 mm 260 °C + 0 °C 250°C + 0 °C 245 °C + 0 °C
≥ 2.5 mm 250 °C + 0 °C 245 °C + 0 °C 245 °C + 0 °C

Moisture sensitivity precautions, as indicated on packing, must be respected at all times.

14.3 Wave soldering

Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering method was specifically
developed.

2000

J-STD-020C

J-STD-020C

Volume mm3 > 2000

July

If wave soldering is used the following conditions must be observed for optimal results:

• Use a double-wave soldering method comprising a turbulent wave with high upward

pressure followed by a smooth laminar wave.

• For packages with leads on two sides and a pitch (e):

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Product data sheet Rev. 01 — 2 June 2006 12 of 16

Philips Semiconductors

– larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be

– smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the

The footprint must incorporate solder thieves at the downstream end.

• For packages with leads on four sides, the footprint must be placed at a 45° angle to

the transport direction of the printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.

Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 °C
or 265 °C, depending on solder material applied, SnPb or Pb-free respectively.

A mildly-activated flux will eliminate the need for removal of corrosive residues in most
applications.

CBTU0808

Dual lane PCI Express port multiplexer

parallel to the transport direction of the printed-circuit board;

transport direction of the printed-circuit board.

14.4 Manual soldering

Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage
(24 V or less) soldering iron applied to the flat part of the lead. Contact time must be
limited to 10 seconds at up to 300 °C.

When using a dedicated tool, all other leads can be soldered in one operation within
2 seconds to 5 seconds between 270 °C and 320 °C.

14.5 Package related soldering information

Table 10. Suitability of surface mount IC packages for wave and reflow soldering methods

Package

BGA, HTSSON..T
SSOP..T

DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP,
HSQFP, HSSON, HTQFP, HTSSOP, HVQFN,
HVSON, SMS

PLCC
LQFP, QFP, TQFP not recommended
SSOP, TSSOP, VSO, VSSOP not recommended
CWQCCN..L

[1]

[3]

[3]

, TFBGA, VFBGA, XSON

[5]

, SO, SOJ suitable suitable

, LBGA, LFBGA, SQFP,

[8]

, PMFP

[9]

, WQCCN..L

[8]

Soldering method
Wave Reflow

not suitable suitable

not suitable

not suitable not suitable

[2]

[4]

[5][6]
[7]

suitable

suitable
suitable

[1] For more detailed information on the BGA packages refer to the

order a copy from your Philips Semiconductors sales office.

[2] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the

maximum temperature (with respect to time) and body size of the package, there is a risk that internal or
external package cracks may occur due to vaporization of the moisture in them (the so called popcorn
effect). For details, refer to the Drypack information in the

Packages; Section: Packing Methods

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Product data sheet Rev. 01 — 2 June 2006 13 of 16

.

(LF)BGA Application Note

Data Handbook IC26; Integrated Circuit

(AN01026);

Philips Semiconductors

[3] These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no

account be processed through more than one soldering cycle or subjected to infrared reflow soldering with
peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package
body peak temperature must be kept as low as possible.

[4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the

solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.

[5] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave

direction. The package footprint must incorporate solder thieves downstream and at the side corners.

[6] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is

definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65mm.

[7] Wavesoldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger

than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

[8] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered

pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.

[9] Hot bar soldering or manual soldering is suitable for PMFP packages.

15. Abbreviations

CBTU0808

Dual lane PCI Express port multiplexer

Table 11. Abbreviations

Acronym Description

CMOS Complementary Metal Oxide Semiconductor
PCI Peripheral Component Interconnect
PCIe PCI Express
DUT Device Under Test
ESD ElectroStatic Discharge
HBM Human Body Model
PRR Pulse Repetition Rate
MM Machine Model

16. References

[1] PCI Express Base Specification, Rev 1.1 — Revision 1.1, March 2005.

17. Revision history

Table 12. Revision history

Document ID Release date Data sheet status Change notice Supersedes

CBTU0808_1 20060602 Product data sheet - -

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Product data sheet Rev. 01 — 2 June 2006 14 of 16

Philips Semiconductors

18. Legal information

18.1 Data sheet status

CBTU0808

Dual lane PCI Express port multiplexer

Document status

Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.

[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL

[1][2]

Product status

18.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in
modifications or additions. Philips Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local Philips Semiconductors
sales office. In case of any inconsistency or conflict with the short data sheet,
the full data sheet shall prevail.

18.3 Disclaimers

General — Information in this document is believed to be accurate and

reliable. However, Philips Semiconductors does not give any representations
or warranties, expressed or implied, as to the accuracy or completeness of
such information and shall have no liability for the consequences of use of
such information.

Right to make changes — Philips Semiconductors reserves the right to
make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.

Suitability for use — Philips Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or

[3]

http://www.semiconductors.philips.com.

Definition

malfunction of a Philips Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. Philips Semiconductors accepts no liability for inclusion and/or use
of Philips Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is for the customer’s own risk.

Applications — Applications that are described herein for any of these
products are for illustrative purposes only. Philips Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.

Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and and
operation of the device at these or any other conditions above those given in
the Characteristics sections of this document is not implied. Exposure to
limiting values for extended periods may affect device reliability.

Terms and conditions of sale — Philips Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at

http://www.semiconductors.philips.com/profile/terms, including those

pertaining to warranty, intellectual property rights infringement and limitation
of liability, unless explicitly otherwise agreed to in writing by Philips
Semiconductors. In case of any inconsistency or conflict between information
in this document and such terms and conditions, the latter will prevail.

No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyanceor implication of any license under any copyrights, patents
or other industrial or intellectual property rights.

18.4 Trademarks

Notice: All referencedbrands,product names, service names and trademarks
are the property of their respective owners.

19. Contact information

For additional information, please visit: http://www.semiconductors.philips.com
For sales office addresses, send an email to: [email protected]

CBTU0808_1 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.

Product data sheet Rev. 01 — 2 June 2006 15 of 16

Philips Semiconductors

20. Contents

1 General description . . . . . . . . . . . . . . . . . . . . . . 1

2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

4 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2

6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 3

6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4

7 Functional description . . . . . . . . . . . . . . . . . . . 5

7.1 Functional description. . . . . . . . . . . . . . . . . . . . 5

7.1.1 General information . . . . . . . . . . . . . . . . . . . . . 5

7.1.2 Functional information . . . . . . . . . . . . . . . . . . . 5

7.1.2.1 Switch configuration . . . . . . . . . . . . . . . . . . . . . 5

8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6

9 Recommended operating conditions. . . . . . . . 6

10 Static characteristics. . . . . . . . . . . . . . . . . . . . . 7

11 Dynamic characteristics . . . . . . . . . . . . . . . . . . 8

12 Test information. . . . . . . . . . . . . . . . . . . . . . . . 10

13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11

14 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

14.1 Introduction to soldering surface mount

packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

14.2 Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 12

14.3 Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 12

14.4 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 13

14.5 Package related soldering information . . . . . . 13

15 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 14

16 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

17 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 14

18 Legal information. . . . . . . . . . . . . . . . . . . . . . . 15

18.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15

18.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

18.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 15

18.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 15

19 Contact information. . . . . . . . . . . . . . . . . . . . . 15

20 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

CBTU0808

Dual lane PCI Express port multiplexer

Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.

© Koninklijke Philips Electronics N.V. 2006. All rights reserved.

For more information, please visit: http://www.semiconductors.philips.com.
For sales office addresses, email to: [email protected].

Date of release: 2 June 2006

Document identifier: CBTU0808_1