Datasheet CAT64LC40SI-TE13, CAT64LC40SA-TE13, CAT64LC40S-TE13, CAT64LC40PI-TE13, CAT64LC40PA-TE13 Datasheet (CTLST)

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CAT64LC10/20/40
1K/2K/4K-Bit SPI Serial E2PROM
FEATURES
SPI Bus Compatible
Low Power CMOS Technology
Self-Timed Write Cycle with Auto-Clear
Hardware Reset Pin
Hardware and Software Write Protection
Commercial, Industrial and Automotive
Temperature Ranges
Power-Up Inadvertant Write Protection
RDY/
BSYBSY
BSYBSY
BSY Pin for End-of-Write Indication
1,000,000 Program/Erase Cycles
100 Year Data Retention
DESCRIPTION
The CAT64LC10/20/40 is a 1K/2K/4K-bit Serial E2PROM which is configured as 64/128/256 registers by 16 bits. Each register can be written (or read) serially by using the DI (or DO) pin. The CAT64LC10/20/40 is manufac­tured using Catalyst’s advanced CMOS E2PROM float-
ing gate technology. It is designed to endure 1,000,000 program/erase cycles and has a data retention of 100 years. The device is available in 8-pin DIP or SOIC packages.
BLOCK DIAGRAM
PIN CONFIGURATION
DIP Package (P) SOIC Package (J) SOIC Package (S)
5064 FHD F01
64LC10/20/40 F02
PIN FUNCTIONS
Pin Name Function
CS Chip Select SK Clock Input DI Serial Data Input DO Serial Data Output V
CC
+2.5V to +6.0V Power Supply GND Ground RESET Reset RDY/BUSY Ready/BUSY Status
CS SK
DI
DO
V
CC
RDY/BUSY RESET GND
1 2 3 4
8 7 6 5
CS SK
DI
DO
V
CC
RDY/BUSY RESET GND
1 2 3 4
8 7 6 5
RDY/BUSY
V
CC CS
SK
RESET GND DO DI
1 2 3 4
8 7 6 5
© 1998 by Catalyst Semiconductor, Inc. Characteristics subject to change without notice
V
CC
ADDRESS DECODER
MEMORY ARRA Y
64/128/256 x 16
DATA
REGISTER
MODE DECODE
LOGIC
CLOCK
GENERATOR
OUTPUT BUFFER
DO
SK
CS
DI
RESET
GND
RDY/BUSY
Doc. No. 25057-00 3/98
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CAT64LC10/20/40
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ABSOLUTE MAXIMUM RATINGS*
Temperature Under Bias ................. –55°C to +125°C
Storage Temperature....................... –65°C to +150°C
Voltage on any Pin with
Respect to Ground
(1)
............ –2.0V to +VCC +2.0V
VCC with Respect to Ground ............... –2.0V to +7.0V
Package Power Dissipation
Capability (Ta = 25°C)................................... 1.0W
Lead Soldering Temperature (10 secs) ............ 300°C
Output Short Circuit Current
(2)
........................ 100 mA
*COMMENT
Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions outside of those listed in the operational sections of this specification is not implied. Exposure to any absolute maximum rating for extended periods may affect device performance and reliability.
RELIABILITY CHARACTERISTICS
Symbol Parameter Min. Max. Units Reference Test Method
N
END
(3)
Endurance 1,000,000 Cycles/Byte MIL-STD-883, Test Method 1033
T
DR
(3)
Data Retention 100 Years MIL-STD-883, Test Method 1008
V
ZAP
(3)
ESD Susceptibility 2000 Volts MIL-STD-883, Test Method 3015
I
LTH
(3)(4)
Latch-Up 100 mA JEDEC Standard 17
CAPACITANCE (TA = 25°C, f= 1.0 MHz, VCC =6.0V)
Symbol Test Max. Units Conditions
C
I/O
(3)
Input/Output Capacitance (DO, RDY/BSY)8pFV
I/O
= 0V
C
IN
(3)
Input Capacitance (CS, SK, DI, RESET) 6 pF VIN = 0V
Note: (1) The minimum DC input voltage is –0.5V. During transitions, inputs may undershoot to –2.0V for periods of less than 20 ns. Maximum DC
voltage on output pins is VCC +0.5V, which may overshoot to VCC +2.0V for periods of less than 20 ns. (2) Output shorted for no more than one second. No more than one output shorted at a time. (3) This parameter is tested initially and after a design or process change that affects the parameter. (4) Latch-up protection is provided for stresses up to 100 mA on address and data pins from –1V to VCC +1V.
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CAT64LC10/20/40
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D.C. OPERATING CHARACTERISTICS
VCC = +2.5V to +6.0V, unless otherwise specified.
Note: (1) Standby Current (ISB) = 0µA (<900nA) (2) VOH and VOL spec applies to READY/BUSY pin also
Limits
Sym. Parameter Min. Typ. Max. Units Test Conditions
I
CC
Operating Current 2.5V 0.4 mA fSK = 250 kHz EWEN, EWDS, READ 6.0V 1 mA fSK = 1 MHz
I
CCP
Program Current 2.5V 2 mA
6.0V 3 mA
I
SB
(1)
Standby Current 0 µAV
IN
= GND or V
CC
CS = V
CC
I
LI
Input Leakage Current 2 µAV
IN
= GND to V
CC
I
LO
Output Leakage Current 10 µAV
OUT
= GND to V
CC
V
IL
Low Level Input Voltage, DI –0.1 VCC x 0.3 V
V
IH
High Level Input Voltage, DI VCC x 0.7 VCC + 0.5 V
V
IL
Low Level Input Voltage, –0.1 VCC x 0.2 V CS, SK, RESET
V
IH
High Level Input Voltage, VCC x 0.8 VCC + 0.5 V CS, SK, RESET
V
OH
(2)
High Level Output Voltage 2.5V VCC – 0.3 V IOH = –10µA
6.0V VCC – 0.3 V IOH = –10µA
2.4 V IOH = –400µA
V
OL
(2)
Low Level Output Voltage 2.5V 0.4 V IOL = 10µA
6.0V 0.4 V IOL = 2.1mA
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Doc. No. 25057-00 3/98
Note: (1) This parameter is tested initially and after a design or process change that affects the parameter. (2) This parameter is sampled but not 100% tested. (3) t
PUR
and t
PUW
are the delays required from the time VCC is stable until the specified operation can be initiated.
WRITE CYCLE LIMIITS
Symbol Parameter Min. Max. Units
t
WR
Program Cycle Time 2.5V 10 ms
4.5V–6.0V 5
A.C. OPERATING CHARACTERISTICS
VCC = +2.5V to +6.0V, unless otherwise specified.
Limits
Symbol Parameter Min. Typ. Max. Units
t
CSS
CS Setup Time 100 ns
t
CSH
CS Hold Time 100 ns
t
DIS
DI Setup Time 200 ns
t
DIH
DI Hold Time 200 ns
t
PD1
Output Delay to 1 300 ns
t
PD0
Output Delay to 0 300 ns
t
HZ
(2)
Output Delay to High Impendance 500 ns
t
CSMIN
Minimum CS High Time 250 ns
t
SKHI
Minimum SK High Time 2.5V 1000 ns
4.5V–6.0V 400
t
SKLOW
Minimum SK Low Time 2.5V 1000 ns
4.5V–6.0V 400
t
SV
Output Delay to Status Valid 500 ns
f
SK
Maximum Clock Frequency 2.5V 250 kHz
4.5V–6.0V 1000
t
RESS
Reset to CS Setup Time 0 ns
t
RESMIN
Minimum RESET High Time 250 ns
t
RESH
RESET to READY Hold Time 0 ns
t
RC
Write Recovery 100 ns
POWER-UP TIMING
(1)(3)
Symbol Parameter Min. Max. Units
t
PUR
Power-Up to Read Operation 10 µs
t
PUW
Power-Up to Program Operation 1 ms
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CAT64LC10/20/40
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INSTRUCTION SET
Instruction Opcode Address Data
Read 64LC10 10101000 A5 A4 A3 A2 A1 A0 0 0 D15 - D0
64LC20 10101000 A6 A5 A4 A3 A2 A1 A0 0 D15 - D0 64LC40 10101000 A7 A6 A5 A4 A3 A2 A1 A0 D15 - D0
Write 64LC10 10100100 A5 A4 A3 A2 A1 A0 0 0 D15 - D0
64LC20 10100100 A6 A5 A4 A3 A2 A1 A0 0 D15 - D0
64LC40 10100100 A7 A6 A5 A4 A3 A2 A1 A0 D15 - D0 Write Enable 10100011 X X X X X X X X Write Disable 10100000 X X X X X X X X [Write All Locations]
(1)
10100001 X X X X X X X X D15–D0
Figure 1. A.C. Testing Input/Output Waveform
(2)(3(4)
(CL = 100 pF)
5064 FHD F03
INPUT PULSE LEVELS REFERENCE POINTS
VCC x 0.7
VCC x 0.3
VCC x 0.8
VCC x 0.2
Note: (1) (Write All Locations) is a test mode operation and is therefore not included in the A.C./D.C. Operations specifications. (2) Input Rise and Fall Times (10% to 90%) < 10 ns. (3) Input Pulse Levels = VCC x 0.2 and VCC x 0.8. (4) Input and Output Timing Reference = VCC x 0.3 and VCC x 0.7.
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DEVICE OPERATION
The CAT64LC10/20/40 is a 1K/2K/4K-bit nonvolatile memory intended for use with all standard controllers. The CAT64LC10/20/40 is organized in a 64/128/256 x 16 format. All instructions are based on an 8-bit format. There are four 16-bit instructions: READ, WRITE, EWEN, and EWDS. The CAT64LC10/20/40 operates on a single power supply ranging from 2.5V to 6.0V and it has an on­chip voltage generator to provide the high voltage needed during a programming operation. Instructions, addresses
and data to be written are clocked into the DI pin on the rising edge of the SK clock. The DO pin is normally in a high impedance state except when outputting data in a READ operation or outputting RDY/BSY status when polled during a WRITE operation.
The format for all instructions sent to this device includes a 4-bit start sequence, 1010, a 4-bit op code and an 8­bit address field or dummy bits. For a WRITE operation,
Figure 2. Sychronous Data Timing
5064 FHD F04
64LC10/20/40 F05
Figure 3. Read Instruction Timing
* Please check the instruction set table for address
SK
DI
CS
DO
t
PD0,tPD1
t
CSS
t
DIS
t
SKHI
t
SKLOW
RESET
RDY/BUSY
t
RESS
t
RC
t
DIH
t
CSH
t
CSMIN
t
HZ
t
SV
t
SV
t
RESH
SK
DI
CS
DO
RESET
10101000 ADDRESS*
D15 D14 D1 D0
HIGH
RDY/BUSY
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a 16-bit data field is also required following the 8-bit address field.
The CAT64LC10/20/40 requires an active LOW CS in order to be selected. Each instruction must be preceded by a HIGH-to-LOW transition of CS before the input of the 4-bit start sequence. Prior to the 4-bit start sequence (1010), the device will ignore inputs of all other logical sequence.
Figure 4. Write Instruction Timing
64LC10/20/40 F06
Figure 5. Ready/
BUSYBUSY
BUSYBUSY
BUSY Status Instruction Timing
5064 FHD F07
Read
Upon receiving a READ command and address (clocked into the DI pin), the DO pin will output data one tPD after the falling edge of the 16th clock (the last bit of the address field). The READ operation is not affected by the RESET input.
Write
After receiving a WRITE op code, address and data, the device goes into the AUTO-Clear cycle and then the
* Please check instruction set table for address
SK
DI
CS
DO
RESET
10100100 ADDRESS* D15 D0
RDY/BUSY
SK
DI
CS
DO
RESET
WRITE INSTRUCTION NEXT INSTRUCTION
HIGH
LOW
RDY/BUSY
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WRITE cycle. The RDY/BSY pin will output the BUSY status (LOW) one tSV after the rising edge of the 32nd clock (the last data bit) and will stay LOW until the write cycle is complete. Then it will output a logical “1” until the next WRITE cycle. The RDY/BSY output is not affected by the input of CS.
An alternative to get RDY/BSY status is from the DO pin. During a write cycle, asserting a LOW input to the CS pin will cause the DO pin to output the RDY/BSY status. Bringing CS HIGH will bring the DO pin back to a high impedance state again. After the device has completed a WRITE cycle, the DO pin will output a logical “1” when
the device is deselected. The rising edge of the first “1” input on the DI pin will reset DO back to the high impedance state again.
The WRITE operation can be halted anywhere in the operation by the RESET input. If a RESET pulse occurs during a WRITE operation, the device will abort the operation and output a READY status.
NOTE: Data may be corrupted if a RESET occurs while the device is BUSY. If the reset occurs before the BUSY period, no writing will be initiated. However, if RESET occurs after the BUSY period, new data will have been written over the old data.
Figure 6. RESET During
BUSYBUSY
BUSYBUSY
BUSY Instruction Timing
Figure 7. EWEN Instruction Timing
64LC10/20/40 F08
5064 FHD F09
* Please check instruction set table for address
SK
DI
CS
DO
RESET
10100100 ADDRESS* D15 D0
t
WR
RDY/BUSY
SK
DI
CS
DO
RESET
10100011
HIGH-Z
HIGH
RDY/BUSY
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RESET
The RESET pin, when set to HIGH, will reset or abort a WRITE operation. When RESET is set to HIGH while the WRITE instruction is being entered, the device will not execute the WRITE instruction and will keep DO in High­Z condition.
When RESET is set to HIGH, while the device is in a clear/write cycle, the device will abort the operation and will display READY status on the RDY/BSY pin and on the DO pin if CS is low.
The RESET input affects only the WRITE and WRITE ALL operations. It does not reset any other operations such as READ, EWEN and EWDS.
ERASE/WRITE ENABLE and DISABLE
The CAT64LC10/20/40 powers up in the erase/write disabled state. After power-up or while the device is in an erase/write disabled state, any write operation must be preceded by an execution of the EWEN instruction. Once enabled, the device will stay enabled until an EWDS has been executed or a power-down has occured. The EWDS is used to prevent any inadvertent over­writing of the data. The EWEN and EWDS instructions have no affect on the READ operation and are not affected by the RESET input.
Figure 8. EWDS Instruction Timing
5064 FHD F10
ORDERING INFORMATION
64LC10/20/40 F11
Notes: (1) The device used in the above example is a 64LC10SI-TE13 (SOIC, Industrial Temperature, Tape & Reel)
SK
DI
CS
DO
RESET
10100000
HIGH-Z
HIGH
RDY/BUSY
Prefix Device # Suffix
64LC10
S
I
TE13
Product Number
64LC10: 1K 64LC20: 2K 64LC40: 4K
Tape & Reel
TE13: 2000/Reel
Package
P: PDIP S: SOIC (JEDEC) J: SOIC (JEDEC)
Temperature Range
Blank = Commercial (0˚C to +70˚C) I = Industrial (-40˚C to +85˚C) A = Automotive (-40˚ to +105˚C)*
CAT
* -40˚C to +125˚C is available upon request
Optional Company ID
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