Page 1
Philips Semiconductors Product specification
Silicon Diffused Power Transistor BU4525AX
GENERAL DESCRIPTION
Enhanced performance, new generation, high-voltage, high-speed switching npn transistor in a plastic full-pack
envelope intended for use in horizontal deflection circuits of colour television receivers and p.c monitors. Features
exceptional tolerance to base drive and collector current load variations resulting in a very low worst case
dissipation.
QUICK REFERENCE DATA
SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT
V
V
I
I
P
V
I
t
C
CM
Csat
f
CESM
CEO
tot
CEsat
Collector-emitter voltage peak value VBE = 0 V - 1500 V
Collector-emitter voltage (open base) - 800 V
Collector current (DC) - 12 A
Collector current peak value - 30 A
Total power dissipation Ths ≤ 25 ˚C - 45 W
Collector-emitter saturation voltage IC = 9.0 A; IB = 2.25 A - 3.0 V
Collector saturation current f = 16 kHz 9.0 - A
f = 70 kHz 7.0 - A
Fall time I
= 9.0 A;f = 16 kHz 0.4 0.55 µs
Csat
I
= 7.0 A;f = 70 kHz 0.15 - µs
Csat
PINNING - SOT399 PIN CONFIGURATION SYMBOL
PIN DESCRIPTION
1 base
2 collector
case
c
b
3 emitter
case isolated
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum Rating System (IEC 134)
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
V
I
C
I
CM
I
B
I
BM
-I
P
T
T
CESM
CEO
BM
tot
stg
j
Collector-emitter voltage peak value VBE = 0 V - 1500 V
Collector-emitter voltage (open base) - 800 V
Collector current (DC) - 12 A
Collector current peak value - 30 A
Base current (DC) - 8 A
Base current peak value - 12 A
Reverse base current peak value
1
Total power dissipation Ths ≤ 25 ˚C - 45 W
Storage temperature -55 150 ˚C
Junction temperature - 150 ˚C
123
e
-7A
THERMAL RESISTANCES
SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT
R
th j-hs
R
th j-a
1 Turn-off current.
May 1998 1 Rev 1.000
Junction to heatsink with heatsink compound - 2.8 K/W
Junction to ambient in free air 35 - K/W
Page 2
Philips Semiconductors Product specification
Silicon Diffused Power Transistor BU4525AX
ISOLATION LIMITING VALUE & CHARACTERISTIC
Ths = 25 ˚C unless otherwise specified
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
isol
C
isol
STATIC CHARACTERISTICS
Ths = 25 ˚C unless otherwise specified
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
I
CES
I
CES
I
EBO
BV
EBO
V
CEOsust
V
CEsat
V
BEsat
h
FE
h
FE
Repetitive peak voltage from all R.H. ≤ 65 % ; clean and dustfree - - 2500 V
three terminals to external
heatsink
Capacitance from T2 to external f = 1 MHz - 22 - pF
heatsink
Collector cut-off current
2
VBE = 0 V; VCE = V
VBE = 0 V; VCE = V
Tj = 125 ˚C
CESMmax
; - - 2.0 mA
CESMmax
- - 1.0 mA
Emitter cut-off current VEB = 6.0 V; IC = 0 A - - 100 µA
Emitter-base breakdown voltage IB = 1 mA 7.5 13.5 - V
Collector-emitter sustaining voltage IB = 0 A; IC = 100 mA; 800 - - V
L = 25 mH
Collector-emitter saturation voltage IC = 9.0 A;IB = 2.25A - - 3.0 V
Base-emitter saturation voltage IC = 9.0 A;IB = 2.25A 0.96 1.01 1.06 V
DC current gain IC = 1.0 A; VCE = 5 V - 12 -
IC = 9.0 A; VCE = 5 V 4.2 5.8 7.6
DYNAMIC CHARACTERISTICS
Ths = 25 ˚C unless otherwise specified
SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT
C
c
t
s
t
f
t
s
t
f
Collector capacitance IE = 0 A; VCB = 10 V; f = 1 MHz 145 - pF
Switching times (16 kHz line I
deflection circuit) (IB2 = -4.5 A)
= 9.0 A;IB1 = 1.8 A
Csat
Turn-off storage time 3.7 4.5 µs
Turn-off fall time 0.4 0.55 µs
Switching times (70 kHz line I
deflection circuit) (IB2 = -4.5 A)
= 7.0 A;IB1 = 1.4 A
Csat
Turn-off storage time 2 - µs
Turn-off fall time 0.15 - µs
2 Measured with half sine-wave voltage (curve tracer).
May 1998 2 Rev 1.000
Page 3
Philips Semiconductors Product specification
Silicon Diffused Power Transistor BU4525AX
30-60 Hz
IC / mA
250
200
100R
6V
Fig.1. Test circuit for V
100-200R
Horizontal
Oscilloscope
Vertical
1R
.
CEOsust
+ 50v
ICsat
90 %
IC
10 %
IB
ts
IB1
tf
- IB2
Fig.4. Switching times definitions.
+ 150 v nominal
adjust for ICsat
Lc
t
t
100
0
VCE / V
Fig.2. Oscilloscope display for V
TRANSISTOR
IC
IB
VCE
DIODE
26us20us
64us
min
VCEOsust
CEOsust
ICsat
IB1
IB2
Fig.3. Switching times waveforms (16 kHz).
IBend
LB
T.U.T.
Cfb
-VBB
.
t
t
t
Fig.5. Switching times test circuit
hFE
100
VCE = 1V
10
1
0.01 0.1 1 10 100
Ths = 25 C
Ths = 85 C
IC / A
.
BU4525 1V
Fig.6. High and low DC current gain.
May 1998 3 Rev 1.000
Page 4
Philips Semiconductors Product specification
Silicon Diffused Power Transistor BU4525AX
hFE
100
VCE = 5V
10
1
0.01 0.1 1 10 100
Ths = 25 C
Ths = 85 C
BU4525 5V
IC / A
Fig.7. High and low DC current gain.
1.2
1.1
1
0.9
VBEsat / V
IC = 9 A
BU4525AF/X/W
Ths = 25 C
Ths = 85 C
120
110
PD%
Normalised Power Derating
with heatsink compound
100
90
80
70
60
50
40
30
20
10
0
0 20 40 60 80 100 120 140
Ths / C
Fig.10. Normalised power dissipation.
10
0.1
Zth K/W
1
PD% = 100⋅PD/P
0.5
0.2
0.1
0.05
0.02
D 25˚C
BU4525AF
0.8
0.7
0.6
01234
IC = 7 A
IB / A
Fig.8. Typical base-emitter saturation voltage.
ts/tf / us
10
8
6
ts
ICsat = 9 A
Ths = 85 C
Freq = 16 kHz
4
2
0
01234
tf
IB / A
Fig.9. Typical collector storage and fall time.
IC =9 A; Tj = 85˚C; f = 16kHz
p
p
t
t / s
P
D
0.01
0.001
0
1.0E-07 1.0E-05 1.0E-03 1.0E-01 1.0E+01
t
D =
T
t
T
Fig.11. Transient thermal impedance.
Ic(sat) (A)
10
8
6
4
2
0
0 20406080100
Fig.12. I
during normal running vs. frequency of
Csat
operation for optimum performance
Frequency (kHz)
May 1998 4 Rev 1.000
Page 5
Philips Semiconductors Product specification
Silicon Diffused Power Transistor BU4525AX
MECHANICAL DATA
Dimensions in mm
Net Mass: 5.88 g
4.5
16.0 max
10.0
0.7
3.3
5.8 max
3.0
27
max
22.5
max
18.1
min
5.45 5.45
Fig.13. SOT399; The seating plane is electrically isolated from all terminals.
Notes
1. Refer to mounting instructions for F-pack envelopes.
2. Epoxy meets UL94 V0 at 1/8".
25
25.1
25.7
5.1
2.2 max
4.5
1.1
0.4 M
2
0.9 max
3.3
May 1998 5 Rev 1.000
Page 6
Philips Semiconductors Product specification
Silicon Diffused Power Transistor BU4525AX
DEFINITIONS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and
operation of the device at these or at any other conditions above those given in the Characteristics sections of
this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
Philips Electronics N.V. 1998
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the
copyright owner.
The information presented in this document does not form part of any quotation or contract, it is believed to be
accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under patent or other
industrial or intellectual property rights.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices or systems where malfunction of these
products can be reasonably expected to result in personal injury. Philips customers using or selling these products
for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting
from such improper use or sale.
May 1998 6 Rev 1.000
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