Datasheet BU4522AX Datasheet (Philips)

Page 1
Philips Semiconductors Product specification
Silicon Diffused Power Transistor BU4522AX
GENERAL DESCRIPTION
New generation, high-voltage, high-speed switching npn transistor in a plastic full-pack envelope intended for use in horizontal deflection circuits of colour TV receivers and PC monitors.
QUICK REFERENCE DATA
SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT
V
V
CEO
I
C
I
CM
P
tot
V
CEsat
I
Csat
t
f
PINNING - SOT399 PIN CONFIGURATION SYMBOL
Collector-emitter voltage peak value VBE = 0 V - 1500 V Collector-emitter voltage (open base) - 800 V Collector current (DC) - 10 A Collector current peak value - 25 A Total power dissipation Ths 25 ˚C - 45 W Collector-emitter saturation voltage IC = 7 A; IB = 1.75 A - 3.0 V Collector saturation current (Fig 17) f = 16 kHz 7 - A
f = 64 kHz 6 - A
Fall time I
= 7 A; f = 16 kHz 285 400 ns
Csat
I
= 6 A; f = 64 kHz 170 230 ns
Csat
PIN DESCRIPTION
case
c
1 base 2 collector
b
3 emitter
case isolated
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum Rating System (IEC 134)
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V V I
C
I
CM
I
B
I
BM
-I P T T
BM tot stg j
Collector-emitter voltage peak value VBE = 0 V - 1500 V Collector-emitter voltage (open base) - 800 V Collector current (DC) - 10 A Collector current peak value - 25 A Base current (DC) - 6 A Base current peak value - 9 A Reverse base current peak value
1
Total power dissipation Ths 25 ˚C - 45 W Storage temperature -55 150 ˚C Junction temperature - 150 ˚C
THERMAL RESISTANCES
123
e
-6A
SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT
R
th j-hs
R
th j-a
1 Turn-off current.
Junction to heatsink with heatsink compound - 2.8 K/W Junction to ambient in free air 35 - K/W
December 1997 1 Rev 1.000
Page 2
Philips Semiconductors Product specification
Silicon Diffused Power Transistor BU4522AX
ISOLATION LIMITING VALUE & CHARACTERISTIC
Ths = 25 ˚C unless otherwise specified
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
isol
C
isol
STATIC CHARACTERISTICS
Ths = 25 ˚C unless otherwise specified
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
I
CES
I
CES
I
EBO
BV
EBO
V
CEOsust
V
CEsat
V
BEsat
h
FE
h
FE
Repetitive peak voltage from all R.H. 65 % ; clean and dustfree - - 2500 V three terminals to external heatsink
Capacitance from T2 to external f = 1 MHz - 22 - pF heatsink
Collector cut-off current
2
VBE = 0 V; VCE = V VBE = 0 V; VCE = V Tj = 125 ˚C
CESMmax
; - - 2.0 mA
CESMmax
- - 1.0 mA
Emitter cut-off current VEB = 7.5 V; IC = 0 A - - 1.0 mA Emitter-base breakdown voltage IB = 1 mA 7.5 13.5 - V Collector-emitter sustaining voltage IB = 0 A; IC = 100 mA; 800 - - V
L = 25 mH Collector-emitter saturation voltage IC = 7 A; IB = 1.75 A - - 3.0 V Base-emitter saturation voltage IC = 7 A; IB = 1.75 A 0.85 0.94 1.03 V DC current gain IC = 1 A; VCE = 5 V - 10 -
IC = 7 A; VCE = 5 V 4.2 5.8 7.3
DYNAMIC CHARACTERISTICS
Ths = 25 ˚C unless otherwise specified
SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT
Switching times (16 kHz line f = 16 kHz; I deflection circuit) (IB2 = -3.5 A)
t
s
t
f
Turn-off storage time 3.5 4.3 µs Turn-off fall time 285 400 ns
Switching times (64 kHz line f = 64 kHz; I deflection circuit) (IB2 = -3.6 A)
t
s
t
f
Turn-off storage time 2.3 2.7 µs Turn-off fall time 170 230 ns
= 7 A; IB1 = 1.4 A;
Csat
= 6 A; IB1 = 1.2 A;
Csat
2 Measured with half sine-wave voltage (curve tracer).
December 1997 2 Rev 1.000
Page 3
Philips Semiconductors Product specification
Silicon Diffused Power Transistor BU4522AX
30-60 Hz
IC / mA
250 200
100
100R
6V
Fig.1. Test circuit for V
100-200R
Horizontal
Oscilloscope
Vertical
1R
.
CEOsust
+ 50v
I
TRANSISTOR
C
DIODE
ICsat
t
I
B
IB1
t
6.5 us5 us
IB2
16 us
V
CE
t
Fig.4. Switching times waveforms (64 kHz).
ICsat
90 %
IC
10 %
IB
ts
IB1
tf
t
0
VCE / V
Fig.2. Oscilloscope display for V
TRANSISTOR
IC
IB
VCE
DIODE
26us20us
64us
min
VCEOsust
CEOsust
ICsat
IB1
IB2
.
t
t
t
Fig.3. Switching times waveforms (16 kHz).
IBend
-VBB
- IB2
Fig.5. Switching times definitions.
+ 150 v nominal adjust for ICsat
Lc
LB
T.U.T.
Cfb
Fig.6. Switching times test circuit
t
.
December 1997 3 Rev 1.000
Page 4
Philips Semiconductors Product specification
Silicon Diffused Power Transistor BU4522AX
hFE
100
VCE = 1 V
10
1
0.01 0.1 1 10 100
BU4522AF/X
Ths = 25 C Ths = 85 C
IC / A
Fig.7. High and low DC current gain.
100
hFE
VCE = 5 V
10
BU4522AF/X
Ths = 25 C Ths = 85 C
VBEsat \ V
1.3
1.2
1.1
1
0.9
0.8
0.7
0.6 01234
IC = 7 A
IC = 6 A
Ths = 25 C Ths = 85 C
IB / A
Fig.10. Typical base-emitter saturation voltage.
ts/tf/ us
5
4
3
2
BU4522AF/X 16kHz
ICsat = 7 A Ths = 85 C Freq = 16 kHz
1
0.01 0.1 1 10 100
IC / A
Fig.8. High and low DC current gain.
VCEsat (V)
10
Ths = 25 C Ths = 85 C
1
0.1
0.01
0.1 1 10 100
IC/IB = 5
BU4522AF/X
IC / A
Fig.9. Typical collector-emitter saturation voltage.
1
0
0
0.5 1 1.5 2
IBend / A
Fig.11. Typical collector storage and fall time.
IC =7 A; Tj = 85˚C; f = 16kHz
ts/tf/ us
5
4
3
2
1
0
0 0.5 1 1.5 2
BU4522AF/X 64kHz
ICsat = 6 A
Ths = 85 C
Freq = 64 kHz
IB / A
Fig.12. Typical collector storage and fall time.
IC = 6 A; Tj = 85˚C; f = 64 kHz
December 1997 4 Rev 1.000
Page 5
Philips Semiconductors Product specification
Silicon Diffused Power Transistor BU4522AX
120 110
PD%
Normalised Power Derating
with heatsink compound
100
90 80 70 60 50 40 30 20 10
0
0 20 40 60 80 100 120 140
Ths / C
Fig.13. Normalised power dissipation.
PD% = 100⋅PD/P
Zth / (K/W)
10
0.5
1
0.2
0.1
0.05
0.1
0.02
0.01
0
0.001
1.0E-07 1.0E-05 1.0E-03 1.0E-01 1.0E-01
t / s
D 25˚C
BU4522AF
p
t
p
P
D
t
D =
T
t
T
Fig.14. Transient thermal impedance.
30
IC / A
BU2522AF
20
10
0
0
500 1000 1500
VCE / V
Fig.16. Reverse bias safe operating area. Tj ≤ T
Ic(sat) (A)
10
9 8 7 6 5 4 3 2 1 0
0 20406080100
Fig.17. I
10 30 50 70 90
Csat
operation for optimum performance
Horizontal frequency (kHz)
during normal running vs. frequency of
jmax
VCC
LC
IBend
-VBB
LB
T.U.T.
VCL
CFB
Fig.15. Test Circuit RBSOA.
December 1997 5 Rev 1.000
Page 6
Philips Semiconductors Product specification
Silicon Diffused Power Transistor BU4522AX
MECHANICAL DATA
Dimensions in mm Net Mass: 5.88 g
4.5
16.0 max
10.0
0.7
3.3
5.8 max
3.0
27
max
22.5 max
18.1 min
5.45 5.45
Fig.18. SOT399; The seating plane is electrically isolated from all terminals.
Notes
1. Refer to mounting instructions for F-pack envelopes.
2. Epoxy meets UL94 V0 at 1/8".
25
25.1
25.7
5.1
2.2 max
4.5
1.1
0.4 M 2
0.95 max
3.3
December 1997 6 Rev 1.000
Page 7
Philips Semiconductors Product specification
Silicon Diffused Power Transistor BU4522AX
DEFINITIONS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
Philips Electronics N.V. 1998
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
December 1997 7 Rev 1.000
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