Datasheet BU4506AX Datasheet (Philips)

Page 1
Philips Semiconductors Product specification
Silicon Diffused Power Transistor BU4506AX
GENERAL DESCRIPTION
Enhanced performance, new generation, high-voltage, high-speed switching npn transistor in a plastic full-pack envelope intended for use in horizontal deflection circuits of colour television receivers. Features exceptional tolerance to base drive and collector current load variations resulting in a very low worst case dissipation.
QUICK REFERENCE DATA
SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT
CESM
CEO
I
C
I
CM
tot
CEsat
I
Csat
t
f
PINNING - SOT399 PIN CONFIGURATION SYMBOL
Collector-emitter voltage peak value VBE = 0 V - 1500 V Collector-emitter voltage (open base) - 800 V Collector current (DC) - 5 A Collector current peak value - 8 A Total power dissipation Ths 25 ˚C - 45 W Collector-emitter saturation voltage IC = 3 A; IB = 0.75 A - 3.0 V Collector saturation current f = 16 kHz 3.0 - A Fall time I
= 3.0 A;f = 16 kHz 300 450 ns
Csat
PIN DESCRIPTION
case
c
1 base 2 collector
b
3 emitter
case isolated
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum Rating System (IEC 134)
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
C
I
CM
I
B
I
BM
-I P T T
CESM CEO
BM tot stg j
Collector-emitter voltage peak value VBE = 0 V - 1500 V Collector-emitter voltage (open base) - 800 V Collector current (DC) - 5 A Collector current peak value - 8 A Base current (DC) - 3 A Base current peak value - 5 A Reverse base current peak value
1
Total power dissipation Ths 25 ˚C - 45 W Storage temperature -65 150 ˚C Junction temperature - 150 ˚C
THERMAL RESISTANCES
123
e
-4A
SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT
R
th j-hs
R
th j-a
1 Turn-off current.
Junction to heatsink with heatsink compound - 2.8 K/W Junction to ambient in free air 32 - K/W
July 1999 1 Rev 1.000
Page 2
Philips Semiconductors Product specification
Silicon Diffused Power Transistor BU4506AX
ISOLATION LIMITING VALUE & CHARACTERISTIC
Ths = 25 ˚C unless otherwise specified
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
isol
C
isol
STATIC CHARACTERISTICS
Ths = 25 ˚C unless otherwise specified
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
I
CES
I
CES
BV
EBO
CEOsust
CEsat
BEsat
h
FE
h
FE
Repetitive peak voltage from all R.H. 65 % ; clean and dustfree - - 2500 V three terminals to external heatsink
Capacitance from T2 to external f = 1 MHz - 22 - pF heatsink
Collector cut-off current
2
VBE = 0 V; VCE = V VBE = 0 V; VCE = V Tj = 125 ˚C
CESMmax
; - - 2.0 mA
CESMmax
- - 1.0 mA
Emitter-base breakdown voltage IB = 1 mA 7.5 13.5 - V Collector-emitter sustaining voltage IB = 0 A; IC = 100 mA; 800 - - V
L = 25 mH Collector-emitter saturation voltage IC = 3.0 A; IB = 0.75 A - - 3.0 V Base-emitter saturation voltage IC = 3.0 A; IB = 0.75 A 0.8 0.89 0.98 V DC current gain IC = 0.5 A; VCE = 5 V - 10 -
IC = 3 A; VCE = 5 V 4.2 5.5 7.3
DYNAMIC CHARACTERISTICS
Ths = 25 ˚C unless otherwise specified
SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT
t
s
t
f
30-60 Hz
Switching times (16kHz line I deflection circuit) Turn-off storage time 3.7 4.6 µs Turn-off fall time 300 450 ns
+ 50v
. Fig.2. Oscilloscope display for V
100R
6V
Fig.1. Test circuit for V
100-200R
Horizontal
Oscilloscope
Vertical
1R
CEOsust
= 3.0 A; IB1 = 0.6 A; (IB2 = -1.5 A)
Csat
IC / mA
250 200
100
0
VCE / V
min
VCEOsust
CEOsust
.
2 Measured with half sine-wave voltage (curve tracer).
July 1999 2 Rev 1.000
Page 3
Philips Semiconductors Product specification
Silicon Diffused Power Transistor BU4506AX
ICsat
t
IB1
t
IB2
t
VCE
TRANSISTOR
IC
IB
DIODE
26us20us
64us
Fig.3. Switching times waveforms (16 kHz).
ICsat
90 %
IC
10 %
IB
ts
IB1
tf
t
hFE
100
VCE = 1 V
10
1
0.01 0.1 1 10
Ths = 25 C Ths = 85 C
IC / A
Fig.6. High and low DC current gain.
hFE
100
VCE = 5 V
10
Ths = 25 C Ths = 85 C
IBend
-VBB
- IB2
Fig.4. Switching times definitions.
+ 150 v nominal adjust for ICsat
Lc
LB
T.U.T.
Cfb
Fig.5. Switching times test circuit
t
1
0.01 0.1 1 10
IC / A
Fig.7. High and low DC current gain.
VCESAT / V
1
0.8
0.6
0.4
0.2
0
0.1 1 10
.
Fig.8. Typical collector-emitter saturation voltage.
Ths = 25 C Ths = 85 C
IC / A
July 1999 3 Rev 1.000
Page 4
Philips Semiconductors Product specification
Silicon Diffused Power Transistor BU4506AX
VBESAT / V
1.2
1.1
1
0.9
IC = 3 A
0.8
0.7
0.6 01234
Ths = 25 C Ths = 85 C
IB / A
Fig.9. Typical base-emitter saturation voltage.
ts/tf/ us
10
8
6
4
2
0
0 0.5 1 1.5 2
ICsat = 3 A
Ths = 85 C
Freq = 16 kHz
IB / A
Fig.10. Typical collector storage and fall time.
IC =3 A; Tj = 85˚C; f = 16kHz
PD%
120 110 100
90 80 70 60 50 40 30 20 10
0
0 20 40 60 80 100 120 140
Normalised Power Derating
with heatsink compound
Ths / C
Fig.11. Normalised power dissipation.
PD% = 100⋅PD/P
Zth (K/W)
`
10
D = 0.5
1
0.2
0.1
0.05
0.1
0.02
D = 0
0.01
0.001 1E-06 1E-05 1E-04 1E-03 1E-02 1E-01 1E+00 1E+01
t / s
D 25˚C
BU4506DF/DX
P
D
tp
D = tp/T
T
Fig.12. Transient thermal impedance.
t
July 1999 4 Rev 1.000
Page 5
Philips Semiconductors Product specification
Silicon Diffused Power Transistor BU4506AX
MECHANICAL DATA
Dimensions in mm Net Mass: 5.88 g
4.5
16.0 max
10.0
0.7
3.3
5.8 max
3.0
27
max
22.5 max
18.1 min
5.45 5.45
Fig.13. SOT399; The seating plane is electrically isolated from all terminals.
Notes
1. Refer to mounting instructions for F-pack envelopes.
2. Epoxy meets UL94 V0 at 1/8".
25
25.1
25.7
5.1
2.2 max
4.5
1.1
0.4 M 2
0.9 max
3.3
July 1999 5 Rev 1.000
Page 6
Philips Semiconductors Product specification
Silicon Diffused Power Transistor BU4506AX
DEFINITIONS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
Philips Electronics N.V. 1999
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
July 1999 6 Rev 1.000
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